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 PIC18F87J72 Family Data Sheet
80-Pin, High-Performance Microcontrollers with Dual Channel AFE, LCD Driver and nanoWatt Technology
2010 Microchip Technology Inc.
Preliminary
DS39979A
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-314-1
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
DS39979A-page 2
Preliminary
2010 Microchip Technology Inc.
PIC18F87J72 FAMILY
80-Pin, High-Performance Microcontrollers with Dual-Channel AFE, LCD Driver and nanoWatt Technology
Analog Features:
* Dual-Channel, 24-Bit Analog Front End (AFE): - 90 dB SINAD, -101 dBc THD (to 35th harmonic), 103 dB SFDR for each channel - 10 ppm INL - Differential voltage input pins - Low drift internal voltage reference (12 ppm/C) - Programmable data rate to 64 ksps - High-gain PGA on each channel (up to 32 V/V) - Phase delay compensation between channels (1 s resolution) * 12-Bit, 12-Channel SAR A/D Converter: - Auto-acquisition - Conversion available during Sleep * Two Analog Comparators * Programmable Reference Voltage for Comparators * Charge Time Measurement Unit (CTMU): - Capacitance measurement - Time measurement with 1 ns typical resolution - Temperature sensing
Low-Power Features:
* Power-Managed modes: - Run: CPU on, peripherals on - Idle: CPU off, peripherals on - Sleep: CPU off, peripherals off * Two-Speed Oscillator Start-up
Peripheral Highlights:
* High-Current Sink/Source 25 mA/25 mA (PORTB and PORTC) * Up to Four External Interrupts * Four 8-Bit/16-Bit Timer/Counter modules * Two Capture/Compare/PWM (CCP) modules * Master Synchronous Serial Port (MSSP) module with Two Modes of Operation: - 3-wire/4-wire SPI (supports all four SPI modes) - I2CTM Master and Slave mode * One Addressable USART module * One Enhanced Addressable USART module: - LIN/J2602 support - Auto-wake-up on Start bit and Break character - Auto-Baud Detect (ABD) * Hardware Real-Time Clock and Calendar (RTCC) with Clock, Calendar and Alarm Functions
LCD Driver and Keypad Interface Features:
* Direct LCD Panel Drive Capability: - Can drive LCD panel while in Sleep mode - Wake-up from interrupt * Up to 33 Segments and 132 Pixels: Software Selectable * Programmable LCD Timing module: - Multiple LCD timing sources available - Up to four commons: static, 1/2, 1/3 or 1/4 multiplex - Static, 1/2 or 1/3 bias configuration * On-Chip LCD Boost Voltage Regulator for Contrast Control * CTMU for Capacitive Touch Sensing * ADC for Resistive Touch Sensing
Special Microcontroller Features:
* 10,000 Erase/Write Cycle Flash Program Memory, Typical * Flash Retention 20 Years, Minimum * Self-Programmable under Software Control * Word Write Capability for Flash Program Memory for Data EEPROM Emulators * Priority Levels for Interrupts * 8 x 8 Single-Cycle Hardware Multiplier * Extended Watchdog Timer (WDT): - Programmable period from 4 ms to 131s * Selectable Open-Drain Configuration for Serial Communication and CCP pins for Driving Outputs up to 5V * In-Circuit Serial ProgrammingTM (ICSPTM) via Two Pins * In-Circuit Debug via Two Pins * Operating Voltage Range: 4.5V to 5.5V (ADC), 2.0V to 3.6V (digital and SAR ADC) * 5.5V Tolerant Input (digital pins only) * On-Chip 2.5V Regulator
Flexible Oscillator Structure:
* External Crystal and Clock modes, with operation up to 48 MHz * 4x Phase Lock Loop (PLL) * Internal Oscillator Block with PLL: - Eight user-selectable frequencies from 31.25 kHz to 8 MHz * Secondary Oscillator using Timer1 at 32 kHz * Fail-Safe Clock Monitor (FSCM): - Allows for safe shutdown if peripheral clock fails
Target Applications:
* * * * Energy Metering Power Measurement and Monitoring Portable Instrumentation Medical Monitoring
2010 Microchip Technology Inc.
Preliminary
DS39979A-page 3
PIC18F87J72 FAMILY
Comparators A/EUSART 12-Bit SAR (channels) 24-bit AFE (channels) Device Flash Program Memory (bytes) 64K 128K SRAM Data LCD Memory (Pixels) (bytes) 3,923 3,923 132 132 Timers 8-bit/16-bit BOR/LVD A/D I/O CTMU Y Y MSSP RTCC Y Y CCP 2 2
PIC18F86J72 PIC18F87J72
51 51
12 12
2 2
2 2
Y Y
1 1
1/1 1/1
1/3 1/3
Pin Diagram
RE7/CCP2(2)/SEG31
RE2/LCDBIAS3
RE3/COM0
RE4/COM1
RE5/COM2
RE6/COM3
80-Pin TQFP(1)
RD0/SEG0/CTPLS
RD1/SEG1
RD2/SEG2
RD3/SEG3
RD4/SEG4
RD5/SEG5
RD6/SEG6
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 CH0+ CH0RE1/LCDBIAS2 RE0/LCDBIAS1 RG0/LCDBIAS0 RG1/TX2/CK2 RG2/RX2/DT2/VLCAP1 RG3/VLCAP2 MCLR RG4/SEG26/RTCC VSS VDDCORE/VCAP RF7/AN5/SS/SEG25 RF6/AN11/SEG24/C1INA RF5/AN10/CVREF/SEG23/C1INB RF4/AN9/SEG22/C2INA RF3/AN8/SEG21/C2INB RF2/AN7/C1OUT/SEG20 CH1CH1+ 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 SDOA SCKA CSA RB0/INT0/SEG30 RB1/INT1/SEG8 RB2/INT2/SEG9/CTED1 RB3/INT3/SEG10/CTED2 RB4/KBI0/SEG11 RB5/KBI1/SEG29 RB6/KBI2/PGC VSS OSC2/CLKO/RA6 OSC1/CLKI/RA7 VDD RB7/KBI3/PGD RC5/SDO/SEG12 RC4/SDI/SDA/SEG16 RC3/SCK/SCL/SEG17 RC2/CCP1/SEG13 CLKIA
PIC18F86J72 PIC18F87J72
RA3/AN3/VREF+
REFIN+/OUT
RC0/T1OSO/T13CKI
AVDD
RC1/T1OSI/CCP2(2)I/SEG32
RF1/AN6/C2OUT/SEG19
Pins are tolerant up to 5.5 V
Dedicated 24-bit AFE pins
Note 1: 2:
Pinouts are subject to change. The CCP2 pin placement depends on the setting of the CCP2MX Configuration bit.
DS39979A-page 4
Preliminary
RC7/RX1/DT1/SEG28
RC6/TX1/CK1/SEG27
ENVREG
RA4/T0CKI/SEG14
RA1/AN1/SEG18
RA0/AN0
RA5/AN4/SEG15
REFIN-
AVSS
SAVSS
VSS
RA2/AN2/VREF-
SVSS
DR
RD7/SEG7
ARESET
SAVDD
SVDD
SDIA
VDD
VSS
2010 Microchip Technology Inc.
PIC18F87J72 FAMILY
Typical Application Circuit: Single-Phase Power Meter
LN
10 MHz
32 kHz
MAIN OSC CH0+ CH0CH1+ CH1-
H/W RTCC Up to 33 SEG/4 COM
Current Sensor(s)(1)
24-Bit AFE with PGA
SEG/COM
LCD Glass
PIC18F87J72(2)
CTMU Line Voltage Measurement Low-Voltage Detect RF/PLC EEPROM 12-Bit A/D Digital I/O UART1 UART2 SPI/I2CTM Temperature Sensor Touch Keypad
Indicator LEDs Anti-tamper sensors
RS-485
Note 1: 2:
Generic current sense configuration shown. Many circuit configurations using current and/or voltage sensing are possible, including the use of shunts, transformers or Rogowski coils. Power metering, with the measurement of active and reactive power, is done with the power metering firmware application available through Microchip Technology.
2010 Microchip Technology Inc.
Preliminary
DS39979A-page 5
PIC18F87J72 FAMILY
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9 2.0 Guidelines for Getting Started with PIC18FJ Microcontrollers ................................................................................................... 21 3.0 Oscillator Configurations ............................................................................................................................................................ 25 4.0 Power-Managed Modes ............................................................................................................................................................. 35 5.0 Reset .......................................................................................................................................................................................... 43 6.0 Memory Organization ................................................................................................................................................................. 55 7.0 Flash Program Memory .............................................................................................................................................................. 77 8.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 87 9.0 Interrupts .................................................................................................................................................................................... 89 10.0 I/O Ports ................................................................................................................................................................................... 105 11.0 Timer0 Module ......................................................................................................................................................................... 123 12.0 Timer1 Module ......................................................................................................................................................................... 127 13.0 Timer2 Module ......................................................................................................................................................................... 133 14.0 Timer3 Module ......................................................................................................................................................................... 135 15.0 Real-Time Clock and Calendar (RTCC) ................................................................................................................................... 139 16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 157 17.0 Liquid Crystal Display (LCD) Driver Module ............................................................................................................................. 167 18.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 195 19.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 239 20.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART) ........................................................... 259 21.0 12-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 273 22.0 Dual-Channel, 24-Bit Analog Front End (AFE)......................................................................................................................... 283 23.0 Comparator Module.................................................................................................................................................................. 293 24.0 Comparator Voltage Reference Module ................................................................................................................................... 299 25.0 Charge Time Measurement Unit (CTMU) ................................................................................................................................ 303 26.0 Special Features of the CPU .................................................................................................................................................... 319 27.0 Instruction Set Summary .......................................................................................................................................................... 333 28.0 Development Support............................................................................................................................................................... 385 29.0 Electrical Characteristics .......................................................................................................................................................... 389 30.0 Packaging Information.............................................................................................................................................................. 429 Appendix A: Revision History............................................................................................................................................................. 433 Appendix B: Dual-Channel, 24-Bit AFE Reference............................................................................................................................ 434 The Microchip Web Site ..................................................................................................................................................................... 477 Customer Change Notification Service .............................................................................................................................................. 477 Customer Support .............................................................................................................................................................................. 477 Reader Response .............................................................................................................................................................................. 478 Product Identification System............................................................................................................................................................. 479
DS39979A-page 6
Preliminary
2010 Microchip Technology Inc.
PIC18F87J72 FAMILY
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:
* Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
2010 Microchip Technology Inc.
Preliminary
DS39979A-page 7
PIC18F87J72 FAMILY
NOTES:
DS39979A-page 8
Preliminary
2010 Microchip Technology Inc.
PIC18F87J72 FAMILY
1.0 DEVICE OVERVIEW
This document contains device-specific information for the following devices: * PIC18F86J72 * PIC18F87J72 This family combines the traditional advantages of all PIC18 microcontrollers - namely, high computational performance and a rich feature set - with a versatile on-chip LCD driver and a high-performance, high-accuracy analog front end. These features make the PIC18F87J72 family a logical choice for many high-performance power and metering applications where price is a primary consideration. The internal oscillator block provides a stable reference source that gives the family additional features for robust operation: * Fail-Safe Clock Monitor: This option constantly monitors the main clock source against a reference signal provided by the internal oscillator. If a clock failure occurs, the controller is switched to the internal oscillator, allowing for continued low-speed operation or a safe application shutdown. * Two-Speed Start-up: This option allows the internal oscillator to serve as the clock source from Power-on Reset, or wake-up from Sleep mode, until the primary clock source is available.
1.1.3
MEMORY OPTIONS
1.1
1.1.1
Core Features
nanoWatt TECHNOLOGY
All of the devices in the PIC18F87J72 family incorporate a range of features that can significantly reduce power consumption during operation. Key items include: * Alternate Run Modes: By clocking the controller from the Timer1 source or the internal RC oscillator, power consumption during code execution can be reduced by as much as 90%. * Multiple Idle Modes: The controller can also run with its CPU core disabled but the peripherals still active. In these states, power consumption can be reduced even further, to as little as 4% of normal operation requirements. * On-the-Fly Mode Switching: The power-managed modes are invoked by user code during operation, allowing the user to incorporate power-saving ideas into their application's software design.
The PIC18F87J72 family provides ample room for application code with 128 Kbytes of code space. The Flash cells for program memory are rated to last up to 10,000 erase/write cycles. Data retention without refresh is conservatively estimated to be greater than 20 years. The Flash program memory is readable and writable. During normal operation, the PIC18F87J72 family also provides plenty of room for dynamic application data with up to 3,923 bytes of data RAM.
1.1.4
EXTENDED INSTRUCTION SET
The PIC18F87J72 family implements the optional extension to the PIC18 instruction set, adding 8 new instructions and an Indexed Addressing mode. Enabled as a device configuration option, the extension has been specifically designed to optimize re-entrant application code originally developed in high-level languages, such as `C'.
1.1.2
OSCILLATOR OPTIONS AND FEATURES
1.1.5
EASY MIGRATION
All of the devices in the PIC18F87J72 family offer six different oscillator options, allowing users a range of choices in developing application hardware. These include: * Two Crystal modes using crystals or ceramic resonators. * Two External Clock modes offering the option of a divide-by-4 clock output. * A Phase Lock Loop (PLL) frequency multiplier, available to the external oscillator modes which allows clock speeds of up to 40 MHz. PLL can also be used with the internal oscillator. * An internal oscillator block which provides an 8 MHz clock (2% accuracy) and an INTRC source (approximately 31 kHz, stable over temperature and VDD), as well as a range of six user-selectable clock frequencies, between 125 kHz to 4 MHz, for a total of eight clock frequencies. This option frees the two oscillator pins for use as additional general purpose I/O.
Regardless of the memory size, all devices share the same rich set of peripherals, allowing for a smooth migration path as applications grow and evolve. The consistent pinout scheme used throughout the entire family also aids in migrating to the next larger device. The PIC18F87J72 family is also largely pin compatible with other PIC18 families, such as the PIC18F8720 and PIC18F8722, the PIC18F85J11, and the PIC18F8490 and PIC18F85J90 families of microcontrollers with LCD drivers. This allows a new dimension to the evolution of applications, allowing developers to select different price points within Microchip's PIC18 portfolio, while maintaining a similar feature set.
2010 Microchip Technology Inc.
Preliminary
DS39979A-page 9
PIC18F87J72 FAMILY
1.2 Analog Features 1.4 Other Special Features
* Dual-Channel, 24-Bit ADC Front End (AFE): This module contains two synchronous sampling, Analog-to-Digital (A/D) Converters, plus supporting Programmable Gain Amplifiers (PGAs) and an internal voltage reference, to perform high-accuracy and low noise analog conversions. The AFE is controlled, and its data read, through a dedicated, high-speed (20 MHz) SPI interface. * 12-Bit A/D Converter: In addition to the AFE, PIC18F87J72 family devices also include a standard SAR A/D Converter with 12 independent analog inputs. The module incorporates programmable acquisition time, allowing for a channel to be selected and a conversion to be initiated without waiting for a sampling period and thus, reducing code overhead. * Charge Time Measurement Unit (CTMU): The CTMU is a flexible analog module that provides accurate differential time measurement between pulse sources, as well as asynchronous pulse generation. Together with other on-chip analog modules, the CTMU can precisely measure time, measure capacitance or relative changes in capacitance, or generate output pulses that are independent of the system clock. * Communications: The PIC18F87J72 family incorporates a range of serial communication peripherals, including an Addressable USART, a separate Enhanced USART that supports LIN/J2602 specification 1.2, and one Master SSP module capable of both SPI and I2CTM (Master and Slave) modes of operation. * CCP Modules: All devices in the family incorporate two Capture/Compare/PWM (CCP) modules. Up to four different time bases may be used to perform several different operations at once. * Extended Watchdog Timer (WDT): This enhanced version incorporates a 16-bit prescaler, allowing an extended time-out range that is stable across operating voltage and temperature. See Section 29.0 "Electrical Characteristics" for time-out periods. * Real Time Clock and Calendar Module (RTCC): The RTCC module is intended for applications requiring that accurate time be maintained for extended periods of time with minimum to no intervention from the CPU. The module is a 100-year clock and calendar with automatic leap year detection. The range of the clock is from 00:00:00 (midnight) on January 1, 2000 to 23:59:59 on December 31, 2099.
1.3
LCD Driver
The on-chip LCD driver includes many features that make the integration of displays in low-power applications easier. These include an integrated voltage regulator with charge pump that allows contrast control in software and display operation above device VDD.
DS39979A-page 10
Preliminary
2010 Microchip Technology Inc.
PIC18F87J72 FAMILY
1.5 Details on Individual Family Members
The devices are differentiated in that PIC18F86J72 devices have a Flash program memory of 64 Kbytes and PIC18F87J72 devices memory is 128 Kbytes All other features for the devices are identical. These are summarized in Table 1-1. The pinouts for all devices are listed in Table 1-2.
Devices in the PIC18F87J72 family are available in 80-pin packages. Block diagrams for the two groups are shown in Figure 1-1.
TABLE 1-1:
DEVICE FEATURES FOR THE PIC18F8XJ72 (80-PIN DEVICES)
Features PIC18F86J72 DC - 48 MHz 64K 32,768 3,923 29 Ports A, B, C, D, E, F, G 132 (33 SEGs x 4 COMs) 4 2 Yes Yes 2 MSSP, Addressable USART, Enhanced USART 12 Input Channels Yes POR, BOR, RESET Instruction, Stack Full, Stack Underflow, MCLR, WDT (PWRT, OST) 75 Instructions, 83 with Extended Instruction Set Enabled 80-Pin TQFP 128K 65,536 3,923 PIC18F87J72
Operating Frequency Program Memory (Bytes) Program Memory (Instructions) Data Memory (Bytes) Interrupt Sources I/O Ports LCD Driver (available pixels to drive) Timers Comparators CTMU RTCC Capture/Compare/PWM Modules Serial Communications 12-Bit Analog-to-Digital Module Dual-Channel 24-Bit Analog Front End Resets (and Delays) Instruction Set Packages
2010 Microchip Technology Inc.
Preliminary
DS39979A-page 11
PIC18F87J72 FAMILY
FIGURE 1-1: PIC18F8XJ72 (80-PIN) BLOCK DIAGRAM
Table Pointer<21> inc/dec logic 21 20 8
PCLATU PCLATH
Data Bus<8> Data Latch Data Memory (2.0, 3.9 Kbytes) Address Latch PCU PCH PCL Program Counter 31-Level Stack PORTB 12 Data Address<12> 4 BSR 12 FSR0 FSR1 FSR2 inc/dec logic PORTD 4 Access Bank 12 RB0:RB7(1) PORTA RA0:RA7(1,2)
8
Address Latch Program Memory (96 Kbytes) Data Latch 8 STKPTR
PORTC RC0:RC7(1)
Table Latch
Instruction Bus <16>
ROM Latch
Address Decode
RD0:RD7(1)
IR 8 PORTE RE0:RE1, RE3:RE7(1)
Instruction Decode and Control
State Machine Control Signals
PRODH PRODL 3 BITOP 8 8 ALU<8> 8 8 x 8 Multiply 8 W 8 8 PORTF RF1:RF7(1)
OSC2/CLKO OSC1/CLKI
Timing Generation INTRC Oscillator 8 MHz Oscillator Precision Band Gap Reference
Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer BOR and LVD(3)
8
PORTG RG0:RG4(1)
ENVREG
Voltage Regulator
VDDCORE/VCAP
VDD, VSS
MCLR
SDIA CHn+ SDOA CHn- CSA CLKIA DR
Timer0
Timer1
Timer2
Timer3
CTMU
ADC 12-Bit
Comparators Dual-Channel AFE
CCP1
CCP2
AUSART
EUSART
RTCC
MSSP
LCD Driver
SVDD SAVDD ARESET SVSS SAVSS
Note 1: 2: 3:
See Table 1-2 for I/O port pin descriptions. RA6 and RA7 are only available as digital I/O in select oscillator modes. See Section 3.0 "Oscillator Configurations" for more information Brown-out Reset and Low-Voltage Detect functions are provided when the on-board voltage regulator is enabled.
DS39979A-page 12
Preliminary
2010 Microchip Technology Inc.
PIC18F87J72 FAMILY
TABLE 1-2:
Pin Name MCLR OSC1/CLKI/RA7 OSC1 CLKI
PIC18F8XJ72 PINOUT I/O DESCRIPTIONS
Pin Number TQFP 9 48 I I CMOS CMOS Pin Buffer Type Type I ST Description Master Clear (input) or programming voltage (input). This pin is an active-low Reset to the device. Oscillator crystal or external clock input. Oscillator crystal input. External clock source input. Always associated with pin function, OSC1. (See related OSC1/CLKI, OSC2/CLKO pins.) General purpose I/O pin. Oscillator crystal or clock output. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In EC modes, OSC2 pin outputs CLKO, which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. General purpose I/O pin. PORTA is a bidirectional I/O port.
RA7 OSC2/CLKO/RA6 OSC2 CLKO 49
I/O O O
TTL -- --
RA6 RA0/AN0 RA0 AN0 RA1/AN1/SEG18 RA1 AN1 SEG18 RA2/AN2/VREFRA2 AN2 VREFRA3/AN3/VREF+ RA3 AN3 VREF+ RA4/T0CKI/SEG14 RA4 T0CKI SEG14 RA5/AN4/SEG15 RA5 AN4 SEG15 RA6 RA7 31
I/O
TTL
I/O I 30 I/O I O 27 I/O I I 25 I/O I I 34 I/O I O 33 I/O I O
TTL Analog TTL Analog Analog TTL Analog Analog TTL Analog Analog ST ST Analog TTL Analog Analog
Digital I/O. Analog Input 0. Digital I/O. Analog Input 1. SEG18 output for LCD. Digital I/O. Analog Input 2. A/D reference voltage (low) input. Digital I/O. Analog Input 3. A/D reference voltage (high) input. Digital I/O. Timer0 external clock input. SEG14 output for LCD. Digital I/O. Analog Input 4. SEG15 output for LCD. See the OSC2/CLKO/RA6 pin. See the OSC1/CLKI/RA7 pin.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input OD = Open-Drain (no P diode to VDD) I2C = I2C/SMBus compatible input I = Input O = Output P = Power Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set. 2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
2010 Microchip Technology Inc.
Preliminary
DS39979A-page 13
PIC18F87J72 FAMILY
TABLE 1-2:
Pin Name
PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number TQFP Pin Buffer Type Type Description PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs.
RB0/INT0/SEG30 RB0 INT0 SEG30 RB1/INT1/SEG8 RB1 INT1 SEG8 RB2/INT2/SEG9/ CTED1 RB2 INT2 CTED1 SEG9 RB3/INT3/SEG10/ CTED2 RB3 INT3 SEG10 CTED2 RB4/KBI0/SEG11 RB4 KBI0 SEG11 RB5/KBI1/SEG29 RB5 KBI1 SEG29 RB6/KBI2/PGC RB6 KBI2 PGC RB7/KBI3/PGD RB7 KBI3 PGD
57 I/O I O 56 I/O I O 55 I/O I I O 54 I/O I O I 53 I/O I O 52 I/O I O 51 I/O I I/O 46 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming data pin. TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSPTM programming clock pin. TTL TTL Analog Digital I/O. Interrupt-on-change pin. SEG29 output for LCD. TTL TTL Analog Digital I/O. Interrupt-on-change pin. SEG11 output for LCD. TTL ST Analog ST Digital I/O. External Interrupt 3. SEG10 output for LCD. CTMU Edge 2 input. TTL ST ST Analog Digital I/O. External Interrupt 2. CTMU Edge 1 input. SEG9 output for LCD. TTL ST Analog Digital I/O. External Interrupt 1. SEG8 output for LCD. TTL ST Analog Digital I/O. External Interrupt 0. SEG30 output for LCD.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input OD = Open-Drain (no P diode to VDD) I2C = I2C/SMBus compatible input I = Input O = Output P = Power Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set. 2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
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TABLE 1-2:
Pin Name
PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number TQFP Pin Buffer Type Type Description PORTC is a bidirectional I/O port.
RC0/T1OSO/T13CKI RC0 T1OSO T13CKI RC1/T1OSI/CCP2/ SEG32 RC1 T1OSI CCP2(1) SEG32 RC2/CCP1/SEG13 RC2 CCP1 SEG13 RC3/SCK/SCL/SEG17 RC3 SCK SCL SEG17 RC4/SDI/SDA/SEG16 RC4 SDI SDA SEG16 RC5/SDO/SEG12 RC5 SDO SEG12 RC6/TX1/CK1/SEG27 RC6 TX1 CK1 SEG27 RC7/RX1/DT1/SEG28 RC7 RX1 DT1 SEG28
37 I/O O I 35 I/O I I/O O 42 I/O I/O O 43 I/O I/O I/O O 44 I/O I I/O O 45 I/O O O 38 I/O O I/O O 39 I/O I I/O O ST ST ST Analog Digital I/O. EUSART asynchronous receive. EUSART synchronous data (see related TX1/CK1). SEG28 output for LCD. ST -- ST Analog Digital I/O. EUSART asynchronous transmit. EUSART synchronous clock (see related RX1/DT1). SEG27 output for LCD. ST -- Analog Digital I/O. SPI data out. SEG12 output for LCD. ST ST I2C Analog Digital I/O. SPI data in. I2C data I/O. SEG16 output for LCD. ST ST I2C Analog Digital I/O. Synchronous serial clock input/output for SPI mode. Synchronous serial clock input/output for I2CTM mode. SEG17 output for LCD. ST ST Analog Digital I/O. Capture 1 input/Compare 1 output/PWM1 output. SEG13 output for LCD. ST CMOS ST Analog Digital I/O. Timer1 oscillator input. Capture 2 input/Compare 2 output/PWM2 output. SEG32 output for LCD. ST -- ST Digital I/O. Timer1 oscillator output. Timer1/Timer3 external clock input.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input OD = Open-Drain (no P diode to VDD) I2C = I2C/SMBus compatible input I = Input O = Output P = Power Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set. 2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
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Preliminary
DS39979A-page 15
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TABLE 1-2:
Pin Name
PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number TQFP Pin Buffer Type Type Description PORTD is a bidirectional I/O port.
RD0/SEG0/CTPLS RD0 SEG0 CTPLS RD1/SEG1 RD1 SEG1 RD2/SEG2 RD2 SEG2 RD3/SEG3 RD3 SEG3 RD4/SEG4 RD4 SEG4 RD5/SEG5 RD5 SEG5 RD6/SEG6 RD6 SEG6 RD7/SEG7 RD7 SEG7
73 I/O O O 68 I/O O 67 I/O O 66 I/O O 65 I/O O 63 I/O O 62 I/O O 61 I/O O ST Analog Digital I/O. SEG7 output for LCD. ST Analog Digital I/O. SEG6 output for LCD. ST Analog Digital I/O. SEG5 output for LCD. ST Analog Digital I/O. SEG4 output for LCD. ST Analog Digital I/O. SEG3 output for LCD. ST Analog Digital I/O. SEG2 output for LCD. ST Analog Digital I/O. SEG1 output for LCD. ST Analog -- Digital I/O. SEG0 output for LCD. CTMU pulse generator output.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input OD = Open-Drain (no P diode to VDD) I2C = I2C/SMBus compatible input I = Input O = Output P = Power Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set. 2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
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2010 Microchip Technology Inc.
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TABLE 1-2:
Pin Name
PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number TQFP Pin Buffer Type Type Description PORTE is a bidirectional I/O port.
RE0/LCDBIAS1 RE0 LCDBIAS1 RE1/LCDBIAS2 RE1 LCDBIAS2 RE2/LCDBIAS3 RE2 LCDBIAS3 RE3/COM0 RE3 COM0 RE4/COM1 RE4 COM1 RE5/COM2 RE5 COM2 RE6/COM3 RE6 COM3 RE7/CCP2/SEG31 RE7 CCP2(2) SEG31
4 I/O I 3 I/O I 80 I/O I 79 I/O O 78 I/O O 77 I/O O 76 I/O O 75 I/O I/O O ST ST Analog Digital I/O. Capture 2 input/Compare 2 output/PWM2 output. SEG31 output for LCD. ST Analog Digital I/O. COM3 output for LCD. ST Analog Digital I/O. COM2 output for LCD. ST Analog Digital I/O. COM1 output for LCD. ST Analog Digital I/O. COM0 output for LCD. ST Analog Digital I/O. BIAS3 input for LCD. ST Analog Digital I/O. BIAS2 input for LCD. ST Analog Digital I/O. BIAS1 input for LCD.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input OD = Open-Drain (no P diode to VDD) I2C = I2C/SMBus compatible input I = Input O = Output P = Power Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set. 2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
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Preliminary
DS39979A-page 17
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TABLE 1-2:
Pin Name
PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number TQFP Pin Buffer Type Type Description PORTF is a bidirectional I/O port.
RF1/AN6/C2OUT/ SEG19 RF1 AN6 C2OUT SEG19 RF2/AN7/C1OUT/ SEG20 RF2 AN7 C1OUT SEG20 RF3/AN8/SEG21/ C2INB RF3 AN8 SEG21 C2INB RF4/AN9/SEG22/ C2INA RF4 AN9 SEG22 C2INA RF5/AN10/CVREF/ SEG23/C1INB RF5 AN10 CVREF SEG23 C1INB RF6/AN11/SEG24/ C1INA RF6 AN11 SEG24 C1INA RF7/AN5/SS/SEG25 RF7 AN5 SS SEG25
21 I/O I O O 18 I/O I O O 17 I/O I O I 16 I/O I O I 15 I/O I O O I 14 I/O I O I 13 I/O O I O ST Analog TTL Analog Digital I/O. Analog Input 5. SPI slave select input. SEG25 output for LCD. ST Analog Analog Analog Digital I/O. Analog Input 11. SEG24 output for LCD Comparator 1 Input A. ST Analog Analog Analog Analog Digital I/O. Analog Input 10. Comparator reference voltage output. SEG23 output for LCD. Comparator 1 Input B. ST Analog Analog Analog Digital I/O. Analog Input 9. SEG22 output for LCD Comparator 2 Input A. ST Analog Analog Analog Digital I/O. Analog Input 8. SEG21 output for LCD. Comparator 2 Input B. ST Analog -- Analog Digital I/O. Analog Input 7. Comparator 1 output. SEG20 output for LCD. ST Analog -- Analog Digital I/O. Analog Input 6. Comparator 2 output. SEG19 output for LCD.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input OD = Open-Drain (no P diode to VDD) I2C = I2C/SMBus compatible input I = Input O = Output P = Power Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set. 2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
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TABLE 1-2:
Pin Name
PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number TQFP Pin Buffer Type Type Description PORTG is a bidirectional I/O port.
RG0/LCDBIAS0 RG0 LCDBIAS0 RG1/TX2/CK2 RG1 TX2 CK2 RG2/RX2/DT2/VLCAP1 RG2 RX2 DT2 VLCAP1 RG3/VLCAP2 RG3 VLCAP2 RG4/SEG26/RTCC RG4 SEG26 RTCC VSS VDD AVSS AVDD ENVREG VDDCORE/VCAP VDDCORE VCAP
5 I/O I 6 I/O O I/O 7 I/O I I/O I 8 I/O I 10 I/O O O 11,32,50, 71 47, 72 24 23 22 12 P P -- -- P P P P I ST Analog -- -- -- -- -- ST Digital I/O. SEG26 output for LCD. RTCC output. Ground reference for logic and I/O pins. Positive supply for logic and I/O pins. Ground reference for analog modules. Positive supply for analog modules. Enable for on-chip voltage regulator. Core logic power or external filter capacitor connection. Positive supply for microcontroller core logic (regulator disabled). External filter capacitor connection (regulator enabled). ST Analog Digital I/O. LCD charge pump capacitor input. ST ST ST Analog Digital I/O. AUSART asynchronous receive. AUSART synchronous data (see related TX2/CK2). LCD charge pump capacitor input. ST -- ST Digital I/O. AUSART asynchronous transmit. AUSART synchronous clock (see related RX2/DT2). ST Analog Digital I/O. BIAS0 input for LCD.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input OD = Open-Drain (no P diode to VDD) I2C = I2C/SMBus compatible input I = Input O = Output P = Power Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set. 2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
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Preliminary
DS39979A-page 19
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TABLE 1-2:
Pin Name RESET SVDD SAVDD CH0+ CH0CH1CH1+ SAVSS REFIN+/OUT REFIN+ REFOUT REFINSVSS DR CLKIA CSA SCKA SDOA SDIA
PIC18F8XJ72 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number TQFP 69 70 74 1 2 19 20 26 28 I O 29 36 40 41 58 59 60 64 I I I O I I P Analog Analog -- -- TTL TTL TTL TTL AFE non-inverting voltage reference input. Internal reference output pin. AFE digital ground pin (return path for digital circuitry). AFE data ready signal output pin. AFE serial interface chip select pin. AFE serial interface clock pin. AFE serial interface data output pin. AFE serial interface data input pin. Pin Buffer Type Type I P P I I I I P ST -- -- Description AFE Master Reset logic input pin. AFE digital power supply pin. AFE analog power supply reference pin.
Analog Channel 0 non-inverting analog input pin. Analog Channel 0 inverting analog input pin. Analog Channel 1 inverting analog input pin. Analog Channel 1 Non-Inverting Analog Input Pin -- AFE analog ground pin (return path for analog circuitry).
Analog Inverting voltage reference input pin.
CMOS AFE oscillator crystal connection pin or external clock input pin.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input OD = Open-Drain (no P diode to VDD) I2C = I2C/SMBus compatible input I = Input O = Output P = Power Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set. 2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared.
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Preliminary
2010 Microchip Technology Inc.
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2.0 GUIDELINES FOR GETTING STARTED WITH PIC18FJ MICROCONTROLLERS
Basic Connection Requirements
FIGURE 2-1: RECOMMENDED MINIMUM CONNECTIONS
C2(2) VDD
VDD VSS
2.1
Getting started with the PIC18F87J72 family family of 8-bit microcontrollers requires attention to a minimal set of device pin connections before proceeding with development. The following pins must always be connected: * All VDD and VSS pins (see Section 2.2 "Power Supply Pins") * All AVDD and AVSS pins, regardless of whether or not the analog device features are used (see Section 2.2 "Power Supply Pins") * MCLR pin (see Section 2.3 "Master Clear (MCLR) Pin") * ENVREG (if implemented) and VCAP/VDDCORE pins (see Section 2.4 "Voltage Regulator Pins (ENVREG and VCAP/VDDCORE)") These pins must also be connected if they are being used in the end application: * PGC/PGD pins used for In-Circuit Serial ProgrammingTM (ICSPTM) and debugging purposes (see Section 2.5 "ICSP Pins") * OSCI and OSCO pins when an external oscillator source is used (see Section 2.6 "External Oscillator Pins") Additionally, the following pins may be required: * VREF+/VREF- pins are used when external voltage reference for analog modules is implemented Note: The AVDD and AVSS pins must always be connected, regardless of whether any of the analog modules are being used.
R1 R2
MCLR
(1) (1)
ENVREG VCAP/VDDCORE
C1 PIC18FXXJXX C6(2)
VSS VDD VDD
C7
C3(2)
VSS AVDD AVSS VDD VSS
C5(2)
C4(2)
Key (all values are recommendations): C1 through C6: 0.1 F, 20V ceramic C7: 10 F, 6.3V or greater, tantalum or ceramic R1: 10 k R2: 100 to 470 Note 1: See Section 2.4 "Voltage Regulator Pins (ENVREG and VCAP/VDDCORE)" for explanation of ENVREG pin connections. The example shown is for a PIC18F device with five VDD/VSS and AVDD/AVSS pairs. Other devices may have more or less pairs; adjust the number of decoupling capacitors appropriately.
2:
The minimum mandatory connections are shown in Figure 2-1.
2010 Microchip Technology Inc.
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2.2
2.2.1
Power Supply Pins
DECOUPLING CAPACITORS
2.3
Master Clear (MCLR) Pin
The use of decoupling capacitors on every pair of power supply pins, such as VDD, VSS, AVDD and AVSS, is required. Consider the following criteria when using decoupling capacitors: * Value and type of capacitor: A 0.1 F (100 nF), 10-20V capacitor is recommended. The capacitor should be a low-ESR device, with a resonance frequency in the range of 200 MHz and higher. Ceramic capacitors are recommended. * Placement on the printed circuit board: The decoupling capacitors should be placed as close to the pins as possible. It is recommended to place the capacitors on the same side of the board as the device. If space is constricted, the capacitor can be placed on another layer on the PCB using a via; however, ensure that the trace length from the pin to the capacitor is no greater than 0.25 inch (6 mm). * Handling high-frequency noise: If the board is experiencing high-frequency noise (upward of tens of MHz), add a second ceramic type capacitor in parallel to the above described decoupling capacitor. The value of the second capacitor can be in the range of 0.01 F to 0.001 F. Place this second capacitor next to each primary decoupling capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as close to the power and ground pins as possible (e.g., 0.1 F in parallel with 0.001 F). * Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to the decoupling capacitors first, and then to the device pins. This ensures that the decoupling capacitors are first in the power chain. Equally important is to keep the trace length between the capacitor and the power pins to a minimum, thereby reducing PCB trace inductance.
The MCLR pin provides two specific device functions: Device Reset, and Device Programming and Debugging. If programming and debugging are not required in the end application, a direct connection to VDD may be all that is required. The addition of other components, to help increase the application's resistance to spurious Resets from voltage sags, may be beneficial. A typical configuration is shown in Figure 2-1. Other circuit designs may be implemented, depending on the application's requirements. During programming and debugging, the resistance and capacitance that can be added to the pin must be considered. Device programmers and debuggers drive the MCLR pin. Consequently, specific voltage levels (VIH and VIL) and fast signal transitions must not be adversely affected. Therefore, specific values of R1 and C1 will need to be adjusted based on the application and PCB requirements. For example, it is recommended that the capacitor, C1, be isolated from the MCLR pin during programming and debugging operations by using a jumper (Figure 2-2). The jumper is replaced for normal run-time operations. Any components associated with the MCLR pin should be placed within 0.25 inch (6 mm) of the pin.
FIGURE 2-2:
VDD R1
EXAMPLE OF MCLR PIN CONNECTIONS
R2 JP C1
MCLR PIC18FXXJXX
2.2.2
TANK CAPACITORS
Note 1:
On boards with power traces running longer than six inches in length, it is suggested to use a tank capacitor for integrated circuits, including microcontrollers, to supply a local power source. The value of the tank capacitor should be determined based on the trace resistance that connects the power supply source to the device, and the maximum current drawn by the device in the application. In other words, select the tank capacitor so that it meets the acceptable voltage sag at the device. Typical values range from 4.7 F to 47 F.
R1 10 k is recommended. A suggested starting value is 10 k. Ensure that the MCLR pin VIH and VIL specifications are met. R2 470 will limit any current flowing into MCLR from the external capacitor, C, in the event of MCLR pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). Ensure that the MCLR pin VIH and VIL specifications are met.
2:
DS39979A-page 22
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PIC18F87J72 FAMILY
2.4 Voltage Regulator Pins (ENVREG and VCAP/VDDCORE) 2.5 ICSP Pins
The PGC and PGD pins are used for In-Circuit Serial ProgrammingTM (ICSPTM) and debugging purposes. It is recommended to keep the trace length between the ICSP connector and the ICSP pins on the device as short as possible. If the ICSP connector is expected to experience an ESD event, a series resistor is recommended, with the value in the range of a few tens of ohms, not to exceed 100. Pull-up resistors, series diodes, and capacitors on the PGC and PGD pins are not recommended as they will interfere with the programmer/debugger communications to the device. If such discrete components are an application requirement, they should be removed from the circuit during programming and debugging. Alternatively, refer to the AC/DC characteristics and timing requirements information in the respective device Flash programming specification for information on capacitive loading limits, and pin input voltage high (VIH) and input low (VIL) requirements. For device emulation, ensure that the "Communication Channel Select" (i.e., PGCx/PGDx pins) programmed into the device matches the physical connections for the ICSP to the Microchip debugger/emulator tool. For more information on available Microchip development tools connection requirements, refer to Section 28.0 "Development Support".
The on-chip voltage regulator enable pin, ENVREG, must always be connected directly to either a supply voltage or to ground. Tying ENVREG to VDD enables the regulator, while tying it to ground disables the regulator. Refer to Section 26.3 "On-Chip Voltage Regulator" for details on connecting and using the on-chip regulator. When the regulator is enabled, a low-ESR (< 5) capacitor is required on the VCAP/VDDCORE pin to stabilize the voltage regulator output voltage. The VCAP/VDDCORE pin must not be connected to VDD and must use a capacitor of 10 F connected to ground. The type can be ceramic or tantalum. A suitable example is the Murata GRM21BF50J106ZE01 (10 F, 6.3V) or equivalent. Designers may use Figure 2-3 to evaluate ESR equivalence of candidate devices. It is recommended that the trace length not exceed 0.25 inch (6 mm). Refer to Section 29.0 "Electrical Characteristics" for additional information. When the regulator is disabled, the VCAP/VDDCORE pin must be tied to a voltage supply at the VDDCORE level. Refer to Section 29.0 "Electrical Characteristics" for information on VDD and VDDCORE. Note that the "LF" versions of some low pin count PIC18FJ parts (e.g., the PIC18LF45J10) do not have the ENVREG pin. These devices are provided with the voltage regulator permanently disabled; they must always be provided with a supply voltage on the VDDCORE pin.
FIGURE 2-3:
FREQUENCY vs. ESR PERFORMANCE FOR SUGGESTED VCAP
10
1 ESR ()
0.1
0.01
0.001
0.01
0.1
1 10 100 Frequency (MHz)
1000 10,000
Note:
Data for Murata GRM21BF50J106ZE01 shown. Measurements at 25C, 0V DC bias.
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DS39979A-page 23
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2.6 External Oscillator Pins
FIGURE 2-4:
Many microcontrollers have options for at least two oscillators: a high-frequency primary oscillator and a low-frequency secondary oscillator (refer to Section 3.0 "Oscillator Configurations" for details). The oscillator circuit should be placed on the same side of the board as the device. Place the oscillator circuit close to the respective oscillator pins with no more than 0.5 inch (12 mm) between the circuit components and the pins. The load capacitors should be placed next to the oscillator itself, on the same side of the board. Use a grounded copper pour around the oscillator circuit to isolate it from surrounding circuits. The grounded copper pour should be routed directly to the MCU ground. Do not run any signal traces or power traces inside the ground pour. Also, if using a two-sided board, avoid any traces on the other side of the board where the crystal is placed. Layout suggestions are shown in Figure 2-4. In-line packages may be handled with a single-sided layout that completely encompasses the oscillator pins. With fine-pitch packages, it is not always possible to completely surround the pins and components. A suitable solution is to tie the broken guard sections to a mirrored ground layer. In all cases, the guard trace(s) must be returned to ground. In planning the application's routing and I/O assignments, ensure that adjacent port pins and other signals in close proximity to the oscillator are benign (i.e., free of high frequencies, short rise and fall times, and other similar noise). For additional information and design guidance on oscillator circuits, please refer to these Microchip Application Notes, available at the corporate web site (www.microchip.com): * AN826, "Crystal Oscillator Basics and Crystal Selection for rfPICTM and PICmicro(R) Devices" * AN849, "Basic PICmicro(R) Oscillator Design" * AN943, "Practical PICmicro(R) Oscillator Analysis and Design" * AN949, "Making Your Oscillator Work"
SUGGESTED PLACEMENT OF THE OSCILLATOR CIRCUIT
Single-Sided and In-Line Layouts:
Copper Pour (tied to ground) Primary Oscillator Crystal DEVICE PINS
Primary Oscillator C1 C2
OSC1 OSC2 GND T1OSO
Timer1 Oscillator Crystal
T1OS I
T1 Oscillator: C1
T1 Oscillator: C2
Fine-Pitch (Dual-Sided) Layouts:
Top Layer Copper Pour (tied to ground) Bottom Layer Copper Pour (tied to ground) OSCO C2 GND Oscillator Crystal C1 OSCI
2.7
Unused I/Os
DEVICE PINS
Unused I/O pins should be configured as outputs and driven to a logic low state. Alternatively, connect a 1 k to 10 k resistor to VSS on unused pins and drive the output to logic low.
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3.0
3.1
OSCILLATOR CONFIGURATIONS
Oscillator Types
All of these modes are selected by the user by programming the FOSC<2:0> Configuration bits. In addition, PIC18F87J72 family devices can switch between different clock sources, either under software control or automatically under certain conditions. This allows for additional power savings by managing device clock speed in real time without resetting the application. The clock sources for the PIC18F87J72 family of devices are shown in Figure 3-1.
The PIC18F87J72 family of devices can be operated in eight different oscillator modes: 1. OSC1/OSC2 as primary; ECPLL oscillator with PLL enabled, CLKO on RA6 EC OSC1/OSC2 as primary; external clock with FOSC/4 output HSPLL OSC1/OSC2 as primary; high-speed crystal/resonator with software PLL control HS OSC1/OSC2 as primary; high-speed crystal/resonator INTPLL1 Internal oscillator block with software PLL control, FOSC/4 output on RA6 and I/O on RA7 INTIO1 Internal oscillator block with FOSC/4 output on RA6 and I/O on RA7 INTPLL2 Internal oscillator block with software PLL control and I/O on RA6 and RA7 INTIO2 Internal oscillator block with I/O on RA6 and RA7 ECPLL
2. 3.
4. 5.
6. 7. 8.
FIGURE 3-1:
PIC18F87J72 FAMILY CLOCK DIAGRAM
OSC2
Primary Oscillator Sleep OSCTUNE<6> 4 x PLL Secondary Oscillator T1OSCEN Enable Oscillator OSCCON<6:4> Internal Oscillator Block 8 MHz Source 8 MHz (INTOSC)
HS, EC HSPLL, ECPLL, INTPLL T1OSC Peripherals
OSC1 T1OSO
T1OSI
OSCCON<6:4> 8 MHz 4 MHz 2 MHz Postscaler 1 MHz 500 kHz 250 kHz 125 kHz Internal Oscillator 111 110 101 011 010 001 MUX 100 Clock Control FOSC<2:0> OSCCON<1:0> IDLEN CPU
1 31 kHz 000 0 INTRC Source 31 kHz (INTRC) OSCTUNE<7>
Clock Source Option for Other Modules
WDT, PWRT, FSCM and Two-Speed Start-up
2010 Microchip Technology Inc.
Preliminary
MUX
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3.2 Control Registers
The OSCCON register (Register 3-1) controls the main aspects of the device clock's operation. It selects the oscillator type to be used, which of the power-managed modes to invoke and the output frequency of the INTOSC source. It also provides status on the oscillators. The OSCTUNE register (Register 3-2) controls the tuning and operation of the internal oscillator block. It also implements the PLLEN bits which control the operation of the Phase Locked Loop (PLL) (see Section 3.4.3 "PLL Frequency Multiplier").
REGISTER 3-1:
R/W-0 IDLEN bit 7 Legend: R = Readable bit -n = Value at POR bit 7
OSCCON: OSCILLATOR CONTROL REGISTER(1)
R/W-1 R/W-1 IRCF1
(3)
R/W-0 IRCF0
(3)
R(2) OSTS
R-0 IOFS
R/W-0 SCS1
(5)
R/W-0 SCS0(5) bit 0
IRCF2
(3)
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
IDLEN: Idle Enable bit 1 = Device enters an Idle mode when a SLEEP instruction is executed 0 = Device enters Sleep mode when a SLEEP instruction is executed IRCF<2:0>: INTOSC Source Frequency Select bits(3) 111 = 8 MHz (INTOSC drives clock directly) 110 = 4 MHz (default) 101 = 2 MHz 100 = 1 MHz 011 = 500 kHz 010 = 250 kHz 001 = 125 kHz 000 = 31 kHz (from either INTOSC/256 or INTRC)(4) OSTS: Oscillator Start-up Timer Time-out Status bit(2) 1 = Oscillator Start-up Timer (OST) time-out has expired; primary oscillator is running 0 = Oscillator Start-up Timer (OST) time-out is running; primary oscillator is not ready IOFS: INTOSC Frequency Stable bit 1 = Fast RC oscillator frequency is stable 0 = Fast RC oscillator frequency is not stable SCS<1:0>: System Clock Select bits(5) 11 = Internal oscillator block 10 = Primary oscillator 01 = Timer1 oscillator 00 = Default primary oscillator (as defined by FOSC<2:0> Configuration bits) Default (legacy) SFR at this address; available when WDTCON<4> = 0. Reset state depends on the state of the IESO Configuration bit. Modifying these bits will cause an immediate clock frequency switch if the internal oscillator is providing the device clocks. Source selected by the INTSRC bit (OSCTUNE<7>), see text. Modifying these bits will cause an immediate clock source switch.
bit 6-4
bit 3
bit 2
bit 1-0
Note 1: 2: 3: 4: 5:
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REGISTER 3-2:
R/W-0 INTSRC bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
OSCTUNE: OSCILLATOR TUNING REGISTER
R/W-0 PLLEN R/W-0 TUN5 R/W-0 TUN4 R/W-0 TUN3 R/W-0 TUN2 R/W-0 TUN1 R/W-0 TUN0 bit 0
INTSRC: Internal Oscillator Low-Frequency Source Select bit 1 = 31.25 kHz device clock derived from 8 MHz INTOSC source (divide-by-256 enabled) 0 = 31 kHz device clock derived from INTRC 31 kHz oscillator PLLEN: Frequency Multiplier PLL Enable bit 1 = PLL is enabled 0 = PLL is disabled TUN<5:0>: Fast RC Oscillator (INTOSC) Frequency Tuning bits 011111 = Maximum frequency * * * * 000001 000000 = Center frequency. Fast RC oscillator is running at the calibrated frequency. 111111 * * * * 100000 = Minimum frequency
bit 6
bit 5-0
3.3
Clock Sources and Oscillator Switching
Essentially, PIC18F87J72 family devices have three independent clock sources: * Primary oscillators * Secondary oscillators * Internal oscillator The primary oscillators can be thought of as the main device oscillators. These are any external oscillators connected to the OSC1 and OSC2 pins, and include the External Crystal and Resonator modes and the External Clock modes. If selected by the FOSC<2:0> Configuration bits, the internal oscillator block (either the 31 kHz INTRC or the 8 MHz INTOSC source) may be considered a primary oscillator. The particular mode is defined by the FOSC Configuration bits. The details of these modes are covered in Section 3.4 "External Oscillator Modes". The secondary oscillators are external clock sources that are not connected to the OSC1 or OSC2 pins. These sources may continue to operate even after the
controller is placed in a power-managed mode. PIC18F87J72 family devices offer the Timer1 oscillator as a secondary oscillator source. This oscillator, in all power-managed modes, is often the time base for functions such as a Real-Time Clock (RTC). The Timer1 oscillator is discussed in greater detail in Section 12.0 "Timer1 Module". In addition to being a primary clock source in some circumstances, the internal oscillator is available as a power-managed mode clock source. The INTRC source is also used as the clock source for several special features, such as the WDT and Fail-Safe Clock Monitor. The internal oscillator block is discussed in more detail in Section 3.5 "Internal Oscillator Block". The PIC18F87J72 family includes features that allow the device clock source to be switched from the main oscillator, chosen by device configuration, to one of the alternate clock sources. When an alternate clock source is enabled, various power-managed operating modes are available.
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3.3.1 CLOCK SOURCE SELECTION 3.3.1.1
The System Clock Select bits, SCS<1:0> (OSCCON<1:0>), select the clock source. The available clock sources are the primary clock defined by the FOSC<2:0> Configuration bits, the secondary clock (Timer1 oscillator) and the internal oscillator. The clock source changes after one or more of the bits is written to, following a brief clock transition interval. The OSTS (OSCCON<3>) and T1RUN (T1CON<6>) bits indicate which clock source is currently providing the device clock. The OSTS bit indicates that the Oscillator Start-up Timer (OST) has timed out and the primary clock is providing the device clock in primary clock modes. The T1RUN bit indicates when the Timer1 oscillator is providing the device clock in secondary clock modes. In power-managed modes, only one of these bits will be set at any time. If neither of these bits is set, the INTRC is providing the clock or the internal oscillator has just started and is not yet stable. The IDLEN bit determines if the device goes into Sleep mode or one of the Idle modes when the SLEEP instruction is executed. The use of the flag and control bits in the OSCCON register is discussed in more detail in Section 4.0 "Power-Managed Modes". Note 1: The Timer1 oscillator must be enabled to select the secondary clock source. The Timer1 oscillator is enabled by setting the T1OSCEN bit in the Timer1 Control register (T1CON<3>). If the Timer1 oscillator is not enabled, then any attempt to select a secondary clock source when executing a SLEEP instruction will be ignored. 2: It is recommended that the Timer1 oscillator be operating and stable before executing the SLEEP instruction or a very long delay may occur while the Timer1 oscillator starts.
System Clock Selection and Device Resets
Since the SCS bits are cleared on all forms of Reset, this means the primary oscillator defined by the FOSC<2:0> Configuration bits is used as the primary clock source on device Resets. This could either be the internal oscillator block by itself or one of the other primary clock source (HS, EC, HSPLL, ECPLL1/2 or INTPLL1/2). In those cases, when the internal oscillator block without PLL, is the default clock on Reset, the Fast RC oscillator (INTOSC) will be used as the device clock source. It will initially start at 1 MHz, which is the postscaler selection that corresponds to the Reset value of the IRCF<2:0> bits (`100'). Regardless of which primary oscillator is selected, INTRC will always be enabled on device power-up. It serves as the clock source until the device has loaded its configuration values from memory. It is at this point that the FOSC Configuration bits are read and the oscillator selection of the operational mode is made. Note that either the primary clock source, or the internal oscillator, will have two bit setting options for the possible values of the SCS<1:0> bits at any given time.
3.3.2
OSCILLATOR TRANSITIONS
PIC18F87J72 family devices contain circuitry to prevent clock "glitches" when switching between clock sources. A short pause in the device clock occurs during the clock switch. The length of this pause is the sum of two cycles of the old clock source and three to four cycles of the new clock source. This formula assumes that the new clock source is stable. Clock transitions are discussed in greater detail in Section 4.1.2 "Entering Power-Managed Modes".
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3.4
3.4.1
External Oscillator Modes
CRYSTAL OSCILLATOR/CERAMIC RESONATORS (HS MODES)
TABLE 3-2:
CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR
Crystal Freq. 4 MHz 8 MHz 20 MHz Typical Capacitor Values Tested: C1 27 pF 22 pF 15 pF C2 27 pF 22 pF 15 pF
In HS or HSPLL Oscillator modes, a crystal or ceramic resonator is connected to the OSC1 and OSC2 pins to establish oscillation. Figure 3-2 shows the pin connections. The oscillator design requires the use of a crystal rated for parallel resonant operation. Note: Use of a crystal rated for series resonant operation may give a frequency out of the crystal manufacturer's specifications.
Osc Type HS
Capacitor values are for design guidance only. Different capacitor values may be required to produce acceptable oscillator operation. The user should test the performance of the oscillator over the expected VDD and temperature range for the application. Refer to the Microchip application notes cited in Table 3-1 for oscillator specific information. Also see the notes following this table for additional information.
TABLE 3-1:
CAPACITOR SELECTION FOR CERAMIC RESONATORS
Freq. 8.0 MHz 16.0 MHz OSC1 27 pF 22 pF OSC2 27 pF 22 pF
Typical Capacitor Values Used: Mode HS
Capacitor values are for design guidance only. Different capacitor values may be required to produce acceptable oscillator operation. The user should test the performance of the oscillator over the expected VDD and temperature range for the application. Refer to the following application notes for oscillator specific information: * AN588, "PIC(R) Microcontroller Oscillator Design Guide" * AN826, "Crystal Oscillator Basics and Crystal Selection for rfPIC(R) and PIC(R) Devices" * AN849, "Basic PIC(R) Oscillator Design" * AN943, "Practical PIC(R) Oscillator Analysis and Design" * AN949, "Making Your Oscillator Work" See the notes following Table 3-2 for additional information.
Note 1: Higher capacitance increases the stability of oscillator but also increases the start-up time. 2: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. 3: Rs may be required to avoid overdriving crystals with low drive level specification. 4: Always verify oscillator performance over the VDD and temperature range that is expected for the application.
FIGURE 3-2:
CRYSTAL/CERAMIC RESONATOR OPERATION (HS OR HSPLL CONFIGURATION)
OSC1 To Internal Logic Sleep
C1(1)
XTAL OSC2 C2(1) Note 1: 2: 3: RS(2)
RF(3)
PIC18F87J72
See Table 3-1 and Table 3-2 for initial values of C1 and C2. A series resistor (RS) may be required for AT strip cut crystals. RF varies with the oscillator mode chosen.
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3.4.2 EXTERNAL CLOCK INPUT (EC MODES) 3.4.3.1 HSPLL and ECPLL Modes
The EC and ECPLL Oscillator modes require an external clock source to be connected to the OSC1 pin. There is no oscillator start-up time required after a Power-on Reset or after an exit from Sleep mode. In the EC Oscillator mode, the oscillator frequency divided by 4 is available on the OSC2 pin. This signal may be used for test purposes or to synchronize other logic. Figure 3-3 shows the pin connections for the EC Oscillator mode. The HSPLL and ECPLL modes provide the ability to selectively run the device at 4 times the external oscillating source to produce frequencies up to 40 MHz. The PLL is enabled by programming the FOSC<2:0> Configuration bits to either `111' (for ECPLL) or `101' (for HSPLL). In addition, the PLLEN bit (OSCTUNE<6>) must also be set. Clearing PLLEN disables the PLL, regardless of the chosen oscillator configuration. It also allows additional flexibility for controlling the application's clock speed in software.
FIGURE 3-3:
EXTERNAL CLOCK INPUT OPERATION (EC CONFIGURATION)
OSC1/CLKI
FIGURE 3-5:
PLL BLOCK DIAGRAM
HSPLL or ECPLL (CONFIG2L) PLL Enable (OSCTUNE)
Clock from Ext. System FOSC/4
PIC18F87J72
OSC2/CLKO
OSC2 HS or EC Mode OSC1 FIN FOUT Phase Comparator
FIGURE 3-4:
EXTERNAL CLOCK INPUT OPERATION (HS OSC CONFIGURATION)
OSC1
3.4.3.2
PLL and INTOSC
Clock from Ext. System Open
PIC18F87J72
(HS Mode) OSC2
The PLL is also available to the internal oscillator block when the internal oscillator block is configured as the primary clock source. In this configuration, the PLL is enabled in software and generates a clock output of up to 32 MHz. The operation of INTOSC with the PLL is described in Section 3.5.2 "INTPLL Modes".
3.4.3
PLL FREQUENCY MULTIPLIER
A Phase Locked Loop (PLL) circuit is provided as an option for users who want to use a lower frequency oscillator circuit, or to clock the device up to its highest rated frequency from a crystal oscillator. This may be useful for customers who are concerned with EMI due to high-frequency crystals, or users who require higher clock speeds from an internal oscillator.
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MUX
An external clock source may also be connected to the OSC1 pin in the HS mode, as shown in Figure 3-4. In this configuration, the divide-by-4 output on OSC2 is not available. Current consumption in this configuration will be somewhat higher than EC mode, as the internal oscillator's feedback circuitry will be enabled (in EC mode, the feedback circuit is disabled).
Loop Filter
4
VCO
SYSCLK
PIC18F87J72 FAMILY
3.5 Internal Oscillator Block
FIGURE 3-6:
RA7
INTIO1 OSCILLATOR MODE
I/O (OSC1)
The PIC18F87J72 family of devices includes an internal oscillator block which generates two different clock signals; either can be used as the microcontroller's clock source. This may eliminate the need for an external oscillator circuit on the OSC1 and/or OSC2 pins. The main output is the Fast RC oscillator, or INTOSC, an 8 MHz clock source which can be used to directly drive the device clock. It also drives a postscaler, which can provide a range of clock frequencies from 31 kHz to 4 MHz. INTOSC is enabled when a clock frequency from 125 kHz to 8 MHz is selected. The INTOSC output can also be enabled when 31 kHz is selected, depending on the INTSRC bit (OSCTUNE<7>). The other clock source is the Internal RC (INTRC) oscillator, which provides a nominal 31 kHz output. INTRC is enabled if it is selected as the device clock source. It is also enabled automatically when any of the following are enabled: * * * * Power-up Timer Fail-Safe Clock Monitor Watchdog Timer Two-Speed Start-up
PIC18F87J72
FOSC/4 OSC2
FIGURE 3-7:
RA7
INTIO2 OSCILLATOR MODE
I/O (OSC1)
PIC18F87J72
RA6 I/O (OSC2)
3.5.2
INTPLL MODES
The 4x Phase Locked Loop (PLL) can be used with the internal oscillator block to produce faster device clock speeds than are normally possible with the internal oscillator sources. When enabled, the PLL produces a clock speed of 16 MHz or 32 MHz. PLL operation is controlled through software. The control bit, PLLEN (OSCTUNE<6>), is used to enable or disable its operation. The PLL is available only to INTOSC when the device is configured to use one of the INTPLL modes as the primary clock source (FOSC<2:0> = 011 or 001). Additionally, the PLL will only function when the selected output frequency is either 4 MHz or 8 MHz (OSCCON<6:4> = 111 or 110). Like the INTIO modes, there are two distinct INTPLL modes available: * In INTPLL1 mode, the OSC2 pin outputs FOSC/4, while OSC1 functions as RA7 for digital input and output. Externally, this is identical in appearance to INTIO1 (Figure 3-6). * In INTPLL2 mode, OSC1 functions as RA7 and OSC2 functions as RA6, both for digital input and output. Externally, this is identical to INTIO2 (Figure 3-7).
These features are discussed in greater detail in Section 26.0 "Special Features of the CPU". The clock source frequency (INTOSC direct, INTOSC with postscaler or INTRC direct) is selected by configuring the IRCF bits of the OSCCON register. The default frequency on device Resets is 4 MHz.
3.5.1
INTIO MODES
Using the internal oscillator as the clock source eliminates the need for up to two external oscillator pins, which can then be used for digital I/O. Two distinct oscillator configurations, which are determined by the FOSC Configuration bits, are available: * In INTIO1 mode, the OSC2 pin outputs FOSC/4 while OSC1 functions as RA7 (see Figure 3-6) for digital input and output. * In INTIO2 mode, OSC1 functions as RA7 and OSC2 functions as RA6 (see Figure 3-7), both for digital input and output.
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3.5.3 INTERNAL OSCILLATOR OUTPUT FREQUENCY AND TUNING 3.5.4.2 Compensating with the Timers
The internal oscillator block is calibrated at the factory to produce an INTOSC output frequency of 8 MHz. It can be adjusted in the user's application by writing to TUN<5:0> (OSCTUNE<5:0>) in the OSCTUNE register (Register 3-2). When the OSCTUNE register is modified, the INTOSC frequency will begin shifting to the new frequency. The oscillator will stabilize within 1 ms. Code execution continues during this shift and there is no indication that the shift has occurred. The INTRC oscillator operates independently of the INTOSC source. Any changes in INTOSC across voltage and temperature are not necessarily reflected by changes in INTRC or vice versa. The frequency of INTRC is not affected by OSCTUNE. This technique compares device clock speed to some reference clock. Two timers may be used; one timer is clocked by the peripheral clock, while the other is clocked by a fixed reference source, such as the Timer1 oscillator. Both timers are cleared, but the timer clocked by the reference generates interrupts. When an interrupt occurs, the internally clocked timer is read and both timers are cleared. If the internally clocked timer value is much greater than expected, then the internal oscillator block is running too fast. To adjust for this, decrement the OSCTUNE register.
3.5.4.3
Compensating with the CCP Module in Capture Mode
3.5.4
INTOSC FREQUENCY DRIFT
The INTOSC frequency may drift as VDD or temperature changes and can affect the controller operation in a variety of ways. It is possible to adjust the INTOSC frequency by modifying the value in the OSCTUNE register. Depending on the device, this may have no effect on the INTRC clock source frequency. Tuning INTOSC requires knowing when to make the adjustment, in which direction it should be made, and in some cases, how large a change is needed. Three compensation techniques are shown here.
A CCP module can use free-running Timer1 (or Timer3), clocked by the internal oscillator block and an external event with a known period (i.e., AC power frequency). The time of the first event is captured in the CCPRxH:CCPRxL registers and is recorded for use later. When the second event causes a capture, the time of the first event is subtracted from the time of the second event. Since the period of the external event is known, the time difference between events can be calculated. If the measured time is much greater than the calculated time, the internal oscillator block is running too fast. To compensate, decrement the OSCTUNE register. If the measured time is much less than the calculated time, the internal oscillator block is running too slow. To compensate, increment the OSCTUNE register.
3.5.4.1
Compensating with the EUSART
An adjustment may be required when the EUSART begins to generate framing errors or receives data with errors while in Asynchronous mode. Framing errors indicate that the device clock frequency is too high. To adjust for this, decrement the value in OSCTUNE to reduce the clock frequency. On the other hand, errors in data may suggest that the clock speed is too low. To compensate, increment OSCTUNE to increase the clock frequency.
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3.6 Effects of Power-Managed Modes on the Various Clock Sources
Timer1 oscillator may be operating to support a RealTime Clock (RTC). Other features may be operating that do not require a device clock source (i.e., MSSP slave, INTx pins and others). Peripherals that may add significant current consumption are listed in Section 29.2 "DC Characteristics: Power-Down and Supply Current PIC18F87J72 Family (Industrial)".
When PRI_IDLE mode is selected, the designated primary oscillator continues to run without interruption. For all other power-managed modes, the oscillator using the OSC1 pin is disabled. The OSC1 pin (and OSC2 pin if used by the oscillator) will stop oscillating. In secondary clock modes (SEC_RUN and SEC_IDLE), the Timer1 oscillator is operating and providing the device clock. The Timer1 oscillator may also run in all power-managed modes if required to clock Timer1 or Timer3. In RC_RUN and RC_IDLE modes, the internal oscillator provides the device clock source. The 31 kHz INTRC output can be used directly to provide the clock and may be enabled to support various special features, regardless of the power-managed mode (see Section 26.2 "Watchdog Timer (WDT)" through Section 26.5 "Fail-Safe Clock Monitor" for more information on WDT, Fail-Safe Clock Monitor and Two-Speed Start-up). If the Sleep mode is selected, all clock sources are stopped. Since all the transistor switching currents have been stopped, Sleep mode achieves the lowest current consumption of the device (only leakage currents). Enabling any on-chip feature that will operate during Sleep will increase the current consumed during Sleep. The INTRC is required to support WDT operation. The
3.7
Power-up Delays
Power-up delays are controlled by two timers, so that no external Reset circuitry is required for most applications. The delays ensure that the device is kept in Reset until the device power supply is stable under normal circumstances, and the primary clock is operating and stable. For additional information on power-up delays, see Section 5.6 "Power-up Timer (PWRT)". The first timer is the Power-up Timer (PWRT), which provides a fixed delay on power-up (parameter 33, Table 29-11); it is always enabled. The second timer is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable (HS modes). The OST does this by counting 1024 oscillator cycles before allowing the oscillator to clock the device. There is a delay of interval, TCSD (parameter 38, Table 29-11), following POR, while the controller becomes ready to execute instructions.
TABLE 3-3:
EC, ECPLL HS, HSPLL
OSC1 AND OSC2 PIN STATES IN SLEEP MODE
OSC1 Pin Floating, pulled by external clock Feedback inverter disabled at quiescent voltage level I/O pin, RA6, direction controlled by TRISA<6> OSC2 Pin At logic low (clock/4 output) Feedback inverter disabled at quiescent voltage level I/O pin, RA6, direction controlled by TRISA<7>
Oscillator Mode
INTOSC, INTPLL1/2 Note:
See Section 5.0 "Reset" for time-outs due to Sleep and MCLR Reset.
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NOTES:
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4.0 POWER-MANAGED MODES
4.1.1 CLOCK SOURCES
The PIC18F87J72 family devices provide the ability to manage power consumption by simply managing clocking to the CPU and the peripherals. In general, a lower clock frequency and a reduction in the number of circuits being clocked constitutes lower consumed power. For the sake of managing power in an application, there are three primary modes of operation: * Run mode * Idle mode * Sleep mode These modes define which portions of the device are clocked and at what speed. The Run and Idle modes may use any of the three available clock sources (primary, secondary or internal oscillator block); the Sleep mode does not use a clock source. The power-managed modes include several power-saving features offered on previous PIC(R) devices. One is the clock switching feature, offered in other PIC18 devices, allowing the controller to use the Timer1 oscillator in place of the primary oscillator. Also included is the Sleep mode, offered by all PIC devices, where all device clocks are stopped. The SCS<1:0> bits allow the selection of one of three clock sources for power-managed modes. They are: * the primary clock, as defined by the FOSC<2:0> Configuration bits * the secondary clock (Timer1 oscillator) * the internal oscillator
4.1.2
ENTERING POWER-MANAGED MODES
Switching from one power-managed mode to another begins by loading the OSCCON register. The SCS<1:0> bits select the clock source and determine which Run or Idle mode is to be used. Changing these bits causes an immediate switch to the new clock source, assuming that it is running. The switch may also be subject to clock transition delays. These are discussed in Section 4.1.3 "Clock Transitions and Status Indicators" and subsequent sections. Entry to the power-managed Idle or Sleep modes is triggered by the execution of a SLEEP instruction. The actual mode that results depends on the status of the IDLEN bit. Depending on the current mode and the mode being switched to, a change to a power-managed mode does not always require setting all of these bits. Many transitions may be done by changing the oscillator select bits, or changing the IDLEN bit, prior to issuing a SLEEP instruction. If the IDLEN bit is already configured correctly, it may only be necessary to perform a SLEEP instruction to switch to the desired mode.
4.1
Selecting Power-Managed Modes
Selecting a power-managed mode requires two decisions: if the CPU is to be clocked or not and which clock source is to be used. The IDLEN bit (OSCCON<7>) controls CPU clocking, while the SCS<1:0> bits (OSCCON<1:0>) select the clock source. The individual modes, bit settings, clock sources and affected modules are summarized in Table 4-1.
TABLE 4-1:
Mode Sleep PRI_RUN SEC_RUN RC_RUN PRI_IDLE SEC_IDLE RC_IDLE Note 1:
POWER-MANAGED MODES
OSCCON Bits IDLEN<7>(1) 0 N/A N/A N/A 1 1 1 SCS<1:0> N/A 10 01 11 10 01 11 Module Clocking CPU Off Clocked Clocked Clocked Off Off Off Peripherals Off Clocked Clocked Clocked Clocked Clocked Clocked Available Clock and Oscillator Source None - All clocks are disabled Primary - HS, EC, HSPLL, ECPLL; this is the normal full-power execution mode Secondary - Timer1 Oscillator Internal Oscillator Primary - HS, EC, HSPLL, ECPLL Secondary - Timer1 Oscillator Internal Oscillator
IDLEN reflects its value when the SLEEP instruction is executed.
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4.1.3 CLOCK TRANSITIONS AND STATUS INDICATORS
4.2
Run Modes
The length of the transition between clock sources is the sum of two cycles of the old clock source and three to four cycles of the new clock source. This formula assumes that the new clock source is stable. Two bits indicate the current clock source and its status: OSTS (OSCCON<3>) and T1RUN (T1CON<6>). In general, only one of these bits will be set while in a given power-managed mode. When the OSTS bit is set, the primary clock is providing the device clock. When the T1RUN bit is set, the Timer1 oscillator is providing the clock. If neither of these bits is set, INTRC is clocking the device. Note: Executing a SLEEP instruction does not necessarily place the device into Sleep mode. It acts as the trigger to place the controller into either the Sleep mode, or one of the Idle modes, depending on the setting of the IDLEN bit.
In the Run modes, clocks to both the core and peripherals are active. The difference between these modes is the clock source.
4.2.1
PRI_RUN MODE
The PRI_RUN mode is the normal, full-power execution mode of the microcontroller. This is also the default mode upon a device Reset unless Two-Speed Start-up is enabled (see Section 26.4 "Two-Speed Start-up" for details). In this mode, the OSTS bit is set (see Section 3.2 "Control Registers").
4.2.2
SEC_RUN MODE
The SEC_RUN mode is the compatible mode to the "clock switching" feature offered in other PIC18 devices. In this mode, the CPU and peripherals are clocked from the Timer1 oscillator. This gives users the option of lower power consumption while still using a high-accuracy clock source. SEC_RUN mode is entered by setting the SCS<1:0> bits to `01'. The device clock source is switched to the Timer1 oscillator (see Figure 4-1), the primary oscillator is shut down, the T1RUN bit (T1CON<6>) is set and the OSTS bit is cleared. Note: The Timer1 oscillator should already be running prior to entering SEC_RUN mode. If the T1OSCEN bit is not set when the SCS<1:0> bits are set to `01', entry to SEC_RUN mode will not occur. If the Timer1 oscillator is enabled, but not yet running, device clocks will be delayed until the oscillator has started. In such situations, initial oscillator operation is far from stable and unpredictable operation may result.
4.1.4
MULTIPLE SLEEP COMMANDS
The power-managed mode that is invoked with the SLEEP instruction is determined by the setting of the IDLEN bit at the time the instruction is executed. If another SLEEP instruction is executed, the device will enter the power-managed mode specified by IDLEN at that time. If IDLEN has changed, the device will enter the new power-managed mode specified by the new setting.
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On transitions from SEC_RUN mode to PRI_RUN mode, the peripherals and CPU continue to be clocked from the Timer1 oscillator while the primary clock is started. When the primary clock becomes ready, a clock switch back to the primary clock occurs (see Figure 4-2). When the clock switch is complete, the T1RUN bit is cleared, the OSTS bit is set and the primary clock is providing the clock. The IDLEN and SCS bits are not affected by the wake-up; the Timer1 oscillator continues to run.
FIGURE 4-1:
TRANSITION TIMING FOR ENTRY TO SEC_RUN MODE
Q1 Q2 Q3 Q4 Q1 Q2 1 2 3 Clock Transition n-1 n Q3 Q4 Q1 Q2 Q3
T1OSI OSC1 CPU Clock Peripheral Clock Program Counter PC
PC + 2
PC + 4
FIGURE 4-2:
TRANSITION TIMING FROM SEC_RUN MODE TO PRI_RUN MODE (HSPLL)
Q1 T1OSI OSC1 TOST(1) TPLL(1) 1 2 n-1 n Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3
PLL Clock Output CPU Clock Peripheral Clock Program Counter SCS<1:0> Bits Changed PC OSTS bit Set
Clock Transition
PC + 2
PC + 4
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
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4.2.3 RC_RUN MODE
In RC_RUN mode, the CPU and peripherals are clocked from the internal oscillator; the primary clock is shut down. This mode provides the best power conservation of all the Run modes while still executing code. It works well for user applications which are not highly timing-sensitive or do not require high-speed clocks at all times. This mode is entered by setting SCS bits to `11'. When the clock source is switched to the INTRC (see Figure 4-3), the primary oscillator is shut down and the OSTS bit is cleared. On transitions from RC_RUN mode to PRI_RUN mode, the device continues to be clocked from the INTRC while the primary clock is started. When the primary clock becomes ready, a clock switch to the primary clock occurs (see Figure 4-4). When the clock switch is complete, the OSTS bit is set and the primary clock is providing the device clock. The IDLEN and SCS bits are not affected by the switch. The INTRC source will continue to run if either the WDT or the Fail-Safe Clock Monitor is enabled.
FIGURE 4-3:
TRANSITION TIMING TO RC_RUN MODE
Q1 Q2 Q3 Q4 Q1 Q2 1 2 3 Clock Transition n-1 n Q3 Q4 Q1 Q2 Q3
INTRC OSC1 CPU Clock Peripheral Clock Program Counter PC
PC + 2
PC + 4
FIGURE 4-4:
TRANSITION TIMING FROM RC_RUN MODE TO PRI_RUN MODE
Q1 INTRC OSC1 TOST(1) TPLL(1) 1 2 n-1 n Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3
PLL Clock Output CPU Clock Peripheral Clock Program Counter SCS<1:0> Bits Changed PC OSTS Bit Set
Clock Transition
PC + 2
PC + 4
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
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4.3 Sleep Mode 4.4 Idle Modes
The power-managed Sleep mode is identical to the legacy Sleep mode offered in all other PIC devices. It is entered by clearing the IDLEN bit (the default state on device Reset) and executing the SLEEP instruction. This shuts down the selected oscillator (Figure 4-5). All clock source status bits are cleared. Entering the Sleep mode from any other mode does not require a clock switch. This is because no clocks are needed once the controller has entered Sleep. If the WDT is selected, the INTRC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run. When a wake event occurs in Sleep mode (by interrupt, Reset or WDT time-out), the device will not be clocked until the clock source selected by the SCS<1:0> bits becomes ready (see Figure 4-6), or it will be clocked from the internal oscillator if either the Two-Speed Start-up or the Fail-Safe Clock Monitor is enabled (see Section 26.0 "Special Features of the CPU"). In either case, the OSTS bit is set when the primary clock is providing the device clocks. The IDLEN and SCS bits are not affected by the wake-up. The Idle modes allow the controller's CPU to be selectively shut down while the peripherals continue to operate. Selecting a particular Idle mode allows users to further manage power consumption. If the IDLEN bit is set to a `1' when a SLEEP instruction is executed, the peripherals will be clocked from the clock source selected using the SCS<1:0> bits; however, the CPU will not be clocked. The clock source status bits are not affected. Setting IDLEN and executing a SLEEP instruction provides a quick method of switching from a given Run mode to its corresponding Idle mode. If the WDT is selected, the INTRC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run. Since the CPU is not executing instructions, the only exits from any of the Idle modes are by interrupt, WDT time-out or a Reset. When a wake event occurs, CPU execution is delayed by an interval of TCSD (parameter 38, Table 29-11) while it becomes ready to execute code. When the CPU begins executing code, it resumes with the same clock source for the current Idle mode. For example, when waking from RC_IDLE mode, the internal oscillator block will clock the CPU and peripherals (in other words, RC_RUN mode). The IDLEN and SCS bits are not affected by the wake-up. While in any Idle mode or the Sleep mode, a WDT time-out will result in a WDT wake-up to the Run mode currently specified by the SCS<1:0> bits.
FIGURE 4-5:
OSC1 CPU Clock Peripheral Clock Sleep Program Counter PC
TRANSITION TIMING FOR ENTRY TO SLEEP MODE
Q1 Q2 Q3 Q4 Q1
PC + 2
FIGURE 4-6:
TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL)
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1 PLL Clock Output CPU Clock Peripheral Clock Program Counter Wake Event PC OSTS Bit Set PC + 2 PC + 4 PC + 6 TOST(1) TPLL(1)
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
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4.4.1 PRI_IDLE MODE 4.4.2 SEC_IDLE MODE
This mode is unique among the three low-power Idle modes, in that it does not disable the primary device clock. For timing-sensitive applications, this allows for the fastest resumption of device operation with its more accurate primary clock source, since the clock source does not have to "warm up" or transition from another oscillator. PRI_IDLE mode is entered from PRI_RUN mode by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, set IDLEN first, then set the SCS bits to `10' and execute SLEEP. Although the CPU is disabled, the peripherals continue to be clocked from the primary clock source specified by the FOSC<1:0> Configuration bits. The OSTS bit remains set (see Figure 4-7). When a wake event occurs, the CPU is clocked from the primary clock source. A delay of interval, TCSD, is required between the wake event and when code execution starts. This is required to allow the CPU to become ready to execute instructions. After the wake-up, the OSTS bit remains set. The IDLEN and SCS bits are not affected by the wake-up (see Figure 4-8). In SEC_IDLE mode, the CPU is disabled but the peripherals continue to be clocked from the Timer1 oscillator. This mode is entered from SEC_RUN by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, set IDLEN first, then set SCS<1:0> to `01' and execute SLEEP. When the clock source is switched to the Timer1 oscillator, the primary oscillator is shut down, the OSTS bit is cleared and the T1RUN bit is set. When a wake event occurs, the peripherals continue to be clocked from the Timer1 oscillator. After an interval of TCSD, following the wake event, the CPU begins executing code being clocked by the Timer1 oscillator. The IDLEN and SCS bits are not affected by the wake-up; the Timer1 oscillator continues to run (see Figure 4-8). Note: The Timer1 oscillator should already be running prior to entering SEC_IDLE mode. If the T1OSCEN bit is not set when the SLEEP instruction is executed, the SLEEP instruction will be ignored and entry to SEC_IDLE mode will not occur. If the Timer1 oscillator is enabled, but not yet running, peripheral clocks will be delayed until the oscillator has started. In such situations, initial oscillator operation is far from stable and unpredictable operation may result.
FIGURE 4-7:
TRANSITION TIMING FOR ENTRY TO IDLE MODE
Q1 Q2 Q3 Q4 Q1
OSC1 CPU Clock Peripheral Clock Program Counter PC PC + 2
FIGURE 4-8:
TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE
Q1 Q2 Q3 Q4
OSC1 CPU Clock Peripheral Clock Program Counter Wake Event PC TCSD
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4.4.3 RC_IDLE MODE 4.5.2 EXIT BY WDT TIME-OUT
In RC_IDLE mode, the CPU is disabled but the peripherals continue to be clocked from the internal oscillator. This mode allows for controllable power conservation during Idle periods. From RC_RUN, this mode is entered by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, first set IDLEN, then clear the SCS bits and execute SLEEP. When the clock source is switched to the INTRC, the primary oscillator is shut down and the OSTS bit is cleared. When a wake event occurs, the peripherals continue to be clocked from the INTOSC. After a delay of TCSD, following the wake event, the CPU begins executing code being clocked by the INTOSC. The IDLEN and SCS bits are not affected by the wake-up. The INTOSC source will continue to run if either the WDT or the Fail-Safe Clock Monitor is enabled. A WDT time-out will cause different actions depending on which power-managed mode the device is in when the time-out occurs. If the device is not executing code (all Idle modes and Sleep mode), the time-out will result in an exit from the power-managed mode (see Section 4.2 "Run Modes" and Section 4.3 "Sleep Mode"). If the device is executing code (all Run modes), the time-out will result in a WDT Reset (see Section 26.2 "Watchdog Timer (WDT)"). The Watchdog Timer and postscaler are cleared by one of the following events: * executing a SLEEP or CLRWDT instruction * the loss of a currently selected clock source (if the Fail-Safe Clock Monitor is enabled)
4.5.3
EXIT BY RESET
4.5
Exiting Idle and Sleep Modes
Exiting an Idle or Sleep mode by Reset automatically forces the device to run from the INTRC.
An exit from Sleep mode, or any of the Idle modes, is triggered by an interrupt, a Reset or a WDT time-out. This section discusses the triggers that cause exits from power-managed modes. The clocking subsystem actions are discussed in each of the power-managed mode sections (see Section 4.2 "Run Modes", Section 4.3 "Sleep Mode" and Section 4.4 "Idle Modes").
4.5.4
EXIT WITHOUT AN OSCILLATOR START-UP DELAY
Certain exits from power-managed modes do not invoke the OST at all. There are two cases: * PRI_IDLE mode, where the primary clock source is not stopped; and * the primary clock source is either the EC or ECPLL mode. In these instances, the primary clock source either does not require an oscillator start-up delay, since it is already running (PRI_IDLE), or normally does not require an oscillator start-up delay (EC). However, a fixed delay of interval, TCSD, following the wake event is still required when leaving Sleep and Idle modes to allow the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay.
4.5.1
EXIT BY INTERRUPT
Any of the available interrupt sources can cause the device to exit from an Idle mode, or the Sleep mode, to a Run mode. To enable this functionality, an interrupt source must be enabled by setting its enable bit in one of the INTCON or PIE registers. The exit sequence is initiated when the corresponding interrupt flag bit is set. On all exits from Idle or Sleep modes, by interrupt, code execution branches to the interrupt vector if the GIE/GIEH bit (INTCON<7>) is set. Otherwise, code execution continues or resumes without branching (see Section 9.0 "Interrupts"). A fixed delay of interval, TCSD, following the wake event is required when leaving Sleep and Idle modes. This delay is required for the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay.
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NOTES:
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5.0 RESET
5.1 RCON Register
The PIC18F87J72 family of devices differentiates between various kinds of Reset: * * * * * * * * * Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during power-managed modes Watchdog Timer (WDT) Reset (during execution) Brown-out Reset (BOR) Configuration Mismatch (CM) RESET Instruction Stack Full Reset Stack Underflow Reset Device Reset events are tracked through the RCON register (Register 5-1). The lower five bits of the register indicate that a specific Reset event has occurred. In most cases, these bits can only be set by the event and must be cleared by the application after the event. The state of these flag bits, taken together, can be read to indicate the type of Reset that just occurred. This is described in more detail in Section 5.7 "Reset State of Registers". The RCON register also has a control bit for setting interrupt priority (IPEN). Interrupt priority is discussed in Section 9.0 "Interrupts".
This section discusses Resets generated by MCLR, POR and BOR, and covers the operation of the various start-up timers. Stack Reset events are covered in Section 6.1.4.4 "Stack Full and Underflow Resets". WDT Resets are covered in Section 26.2 "Watchdog Timer (WDT)". A simplified block diagram of the on-chip Reset circuit is shown in Figure 5-1.
FIGURE 5-1:
RESET Instruction Configuration Word Mismatch Stack Pointer
SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Stack Full/Underflow Reset
External Reset MCLR
IDLE Sleep WDT Time-out VDD Rise Detect POR Pulse
VDD
Brown-out Reset(1)
S
PWRT 32 s (typical) INTRC PWRT 65.5 ms (typical) Chip_Reset R Q
11-Bit Ripple Counter
Note 1:
The ENVREG pin must be tied high to enable Brown-out Reset. The Brown-out Reset is provided by the on-chip voltage regulator when there is insufficient source voltage to maintain regulation.
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REGISTER 5-1:
R/W-0 IPEN bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
RCON: RESET CONTROL REGISTER
U-0 -- R/W-1 CM R/W-1 RI R-1 TO R-1 PD R/W-0 POR R/W-0 BOR bit 0
IPEN: Interrupt Priority Enable bit 1 = Enable priority levels on interrupts 0 = Disable priority levels on interrupts (PIC16XXXX Compatibility mode) Unimplemented: Read as `0' CM: Configuration Mismatch (CM) Flag bit 1 = A Configuration Mismatch has not occurred 0 = A Configuration Mismatch has occurred (Must be set in software after a Configuration Mismatch Reset occurs.) RI: RESET Instruction Flag bit 1 = The RESET instruction was not executed (set by firmware only) 0 = The RESET instruction was executed causing a device Reset (must be set in software after a Brown-out Reset occurs) TO: Watchdog Time-out Flag bit 1 = Set by power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred PD: Power-Down Detection Flag bit 1 = Set by power-up or by the CLRWDT instruction 0 = Set by execution of the SLEEP instruction POR: Power-on Reset Status bit 1 = A Power-on Reset has not occurred (set by firmware only) 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) BOR: Brown-out Reset Status bit 1 = A Brown-out Reset has not occurred (set by firmware only) 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
bit 6 bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
Note 1: It is recommended that the POR bit be set after a Power-on Reset has been detected, so that subsequent Power-on Resets may be detected. 2: If the on-chip voltage regulator is disabled, BOR remains `0' at all times. See Section 5.4.1 "Detecting BOR" for more information. 3: Brown-out Reset is said to have occurred when BOR is `0' and POR is `1' (assuming that POR was set to `1' by software immediately after a Power-on Reset).
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5.2 Master Clear (MCLR)
FIGURE 5-2:
The MCLR pin provides a method for triggering a hard external Reset of the device. A Reset is generated by holding the pin low. PIC18 extended microcontroller devices have a noise filter in the MCLR Reset path which detects and ignores small pulses. The MCLR pin is not driven low by any internal Resets, including the WDT.
EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP)
VDD
VDD D
R R1 C MCLR
5.3
Power-on Reset (POR)
Note 1:
PIC18F87J72
A Power-on Reset condition is generated on-chip whenever VDD rises above a certain threshold. This allows the device to start in the initialized state when VDD is adequate for operation. To take advantage of the POR circuitry, tie the MCLR pin through a resistor (1 k to 10 k) to VDD. This will eliminate external RC components usually needed to create a Power-on Reset delay. A minimum rise rate for VDD is specified (parameter D004). For a slow rise time, see Figure 5-2. When the device starts normal operation (i.e., exits the Reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. Power-on Reset events are captured by the POR bit (RCON<1>). The state of the bit is set to `0' whenever a Power-on Reset occurs; it does not change for any other Reset event. POR is not reset to `1' by any hardware event. To capture multiple events, the user manually resets the bit to `1' in software following any Power-on Reset.
External Power-on Reset circuit is required only if the VDD power-up slope is too slow. The diode, D, helps discharge the capacitor quickly when VDD powers down. R < 40 k is recommended to make sure that the voltage drop across R does not violate the device's electrical specification. R1 1 k will limit any current flowing into MCLR from external capacitor, C, in the event of MCLR/VPP pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS).
2:
3:
5.4.1
DETECTING BOR
The BOR bit always resets to `0' on any Brown-out Reset or Power-on Reset event. This makes it difficult to determine if a Brown-out Reset event has occurred just by reading the state of BOR alone. A more reliable method is to simultaneously check the state of both POR and BOR. This assumes that the POR bit is reset to `1' in software immediately after any Power-on Reset event. If BOR is `0' while POR is `1', it can be reliably assumed that a Brown-out Reset event has occurred. If the voltage regulator is disabled, Brown-out Reset functionality is disabled. In this case, the BOR bit cannot be used to determine a Brown-out Reset event. The BOR bit is still cleared by a Power-on Reset event.
5.4
Brown-out Reset (BOR)
The PIC18F87J72 family of devices incorporates a simple BOR function when the internal regulator is enabled (ENVREG pin is tied to VDD). The voltage regulator will trigger a Brown-out Reset when output of the regulator to the device core approaches the voltage at which the device is unable to run at full speed. The BOR circuit also keeps the device in Reset as VDD rises, until the regulator's output level is sufficient for full-speed operation. Once a BOR has occurred, the Power-up Timer will keep the chip in Reset for TPWRT (parameter 33). If VDD drops below the threshold for full-speed operation while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be initialized. Once VDD rises to the point where regulator output is sufficient, the Power-up Timer will execute the additional time delay.
5.5
Configuration Mismatch (CM)
The Configuration Mismatch (CM) Reset is designed to detect, and attempt to recover from, random memory corrupting events. These include Electrostatic Discharge (ESD) events that can cause widespread, single bit changes throughout the device and result in catastrophic failure. In PIC18F87J72 family Flash devices, the device Configuration registers (located in the configuration memory space) are continuously monitored during operation by comparing their values to complimentary shadow registers. If a mismatch is detected between the two sets of registers, a CM Reset automatically occurs. These events are captured by the CM bit (RCON<5>). The state of the bit is set to `0' whenever a CM event occurs. The bit does not change for any other Reset event.
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5.6 Power-up Timer (PWRT)
5.6.1 TIME-OUT SEQUENCE
PIC18F87J72 family devices incorporate an on-chip Power-up Timer (PWRT) to help regulate the Power-on Reset process. The PWRT is always enabled. The main function is to ensure that the device voltage is stable before code is executed. The Power-up Timer (PWRT) of the PIC18F87J72 family devices is an 11-bit counter which uses the INTRC source as the clock input. This yields an approximate time interval of 2048 x 32 s = 65.6 ms. While the PWRT is counting, the device is held in Reset. The power-up time delay depends on the INTRC clock and will vary from chip to chip due to temperature and process variation. See DC Parameter 33 for details. If enabled, the PWRT time-out is invoked after the POR pulse has cleared. The total time-out will vary based on the status of the PWRT. Figure 5-3, Figure 5-4, Figure 5-5 and Figure 5-6 all depict time-out sequences on power-up with the Power-up Timer enabled. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the PWRT will expire. Bringing MCLR high will begin execution immediately (Figure 5-5). This is useful for testing purposes, or to synchronize more than one PIC18FXXXX device operating in parallel.
FIGURE 5-3:
TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT)
VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT
INTERNAL RESET
FIGURE 5-4:
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
VDD MCLR INTERNAL POR
TPWRT
PWRT TIME-OUT
INTERNAL RESET
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FIGURE 5-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT
INTERNAL RESET
FIGURE 5-6:
SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT)
3.3V VDD MCLR 0V 1V
INTERNAL POR TPWRT PWRT TIME-OUT INTERNAL RESET
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5.7 Reset State of Registers
Most registers are unaffected by a Reset. Their status is unknown on POR and unchanged by all other Resets. The other registers are forced to a "Reset state" depending on the type of Reset that occurred. Most registers are not affected by a WDT wake-up, since this is viewed as the resumption of normal operation. Status bits from the RCON register, RI, TO, PD, POR and BOR, are set or cleared differently in different Reset situations, as indicated in Table 5-1. These bits are used in software to determine the nature of the Reset. Table 5-2 describes the Reset states for all of the Special Function Registers. These are categorized by Power-on and Brown-out Resets, Master Clear and WDT Resets and WDT wake-ups.
TABLE 5-1:
STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION FOR RCON REGISTER
Program Counter(1) 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h 0000h PC + 2 RCON Register RI 1 0 1 u u u u u u u u TO 1 u 1 1 1 0 u u u u 0 PD 1 u 1 u 0 u u u u u 0 POR 0 u u u u u u u u u u BOR 0 u 0 u u u u u u u u STKPTR Register STKFUL 0 u u u u u u 1 u u u STKUNF 0 u u u u u u u 1 1 u
Condition Power-on Reset RESET Instruction Brown-out Reset MCLR during power-managed Run modes MCLR during power-managed Idle modes and Sleep mode WDT time-out during full power or power-managed Run modes MCLR during full power execution Stack Full Reset (STVREN = 1) Stack Underflow Reset (STVREN = 1) Stack Underflow Error (not an actual Reset, STVREN = 0) WDT time-out during power-managed Idle or Sleep modes Interrupt exit from power-managed modes
PC + 2
u
u
0
u
u
u
u
Legend: u = unchanged Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bit is set, the PC is loaded with the interrupt vector (0008h or 0018h).
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TABLE 5-2:
Register
INITIALIZATION CONDITIONS FOR ALL REGISTERS
Applicable Devices PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 Power-on Reset, Brown-out Reset ---0 0000 0000 0000 0000 0000 uu-0 0000 ---0 0000 0000 0000 0000 0000 --00 0000 0000 0000 0000 0000 0000 0000 xxxx xxxx xxxx xxxx 0000 000x 1111 1111 1100 0000 N/A N/A N/A N/A N/A ---- xxxx xxxx xxxx xxxx xxxx N/A N/A N/A N/A N/A MCLR Resets WDT Reset RESET Instruction Stack Resets ---0 0000 0000 0000 0000 0000 00-0 0000 ---0 0000 0000 0000 0000 0000 --00 0000 0000 0000 0000 0000 0000 0000 uuuu uuuu uuuu uuuu 0000 000u 1111 1111 1100 0000 N/A N/A N/A N/A N/A ---- uuuu uuuu uuuu uuuu uuuu N/A N/A N/A N/A N/A Wake-up via WDT or Interrupt ---0 uuuu(1) uuuu uuuu(1) uuuu uuuu(1) uu-u uuuu(1) ---u uuuu uuuu uuuu PC + 2(2) --uu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu(3) uuuu uuuu(3) uuuu uuuu(3) N/A N/A N/A N/A N/A ---- uuuu uuuu uuuu uuuu uuuu N/A N/A N/A N/A N/A
TOSU TOSH TOSL STKPTR PCLATU PCLATH PCL TBLPTRU TBLPTRH TBLPTRL TABLAT PRODH PRODL INTCON INTCON2 INTCON3 INDF0 POSTINC0 POSTDEC0 PREINC0 PLUSW0 FSR0H FSR0L WREG INDF1 POSTINC1 POSTDEC1 PREINC1 PLUSW1
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as `0', q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 4: See Table 5-1 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read as `0'.
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TABLE 5-2:
Register
INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Applicable Devices PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 Power-on Reset, Brown-out Reset ---- xxxx xxxx xxxx ---- 0000 N/A N/A N/A N/A N/A ---- xxxx xxxx xxxx ---x xxxx 0000 0000 xxxx xxxx 1111 1111 0110 q000 -011 1100 0--- ---0 0-11 11q0 xxxx xxxx xxxx xxxx 0000 0000 0000 0000 1111 1111 -000 0000 xxxx xxxx 0000 0000 0000 0000 0000 0000 0000 0000 MCLR Resets WDT Reset RESET Instruction Stack Resets ---- uuuu uuuu uuuu ---- 0000 N/A N/A N/A N/A N/A ---- uuuu uuuu uuuu ---u uuuu 0000 0000 uuuu uuuu 1111 1111 0110 q000 -011 1000 0--- ---0 0-0q qquu uuuu uuuu uuuu uuuu u0uu uuuu 0000 0000 1111 1111 -000 0000 uuuu uuuu 0000 0000 0000 0000 0000 0000 0000 0000 Wake-up via WDT or Interrupt ---- uuuu uuuu uuuu ---- uuuu N/A N/A N/A N/A N/A ---- uuuu uuuu uuuu ---u uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu quuu -uuu uuuu u--- ---u u-uu qquu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu 1111 1111 -uuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu
FSR1H FSR1L BSR INDF2 POSTINC2 POSTDEC2 PREINC2 PLUSW2 FSR2H FSR2L STATUS TMR0H TMR0L T0CON OSCCON LCDREG WDTCON RCON(4) TMR1H TMR1L T1CON TMR2 PR2 T2CON SSPBUF SSPADD SSPSTAT SSPCON1 SSPCON2
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as `0', q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 4: See Table 5-1 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read as `0'.
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TABLE 5-2:
Register
INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Applicable Devices PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 Power-on Reset, Brown-out Reset xxxx xxxx xxxx xxxx 0-00 0000 0-00 0000 0-00 0000 ---- ---x xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx ---- ---0 0000 0000 0000 0000 0000 0000 0000 0000 0000 0111 xxxx xxxx xxxx xxxx 0000 0000 0000 0000 0000 0000 0000 0000 0000 0010 0000 000x 0000 0000 0000 0000 000- 0000 ---- ------0 x00MCLR Resets WDT Reset RESET Instruction Stack Resets uuuu uuuu uuuu uuuu 0-00 0000 0-00 0000 0-00 0000 ---- ---u uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu ---- ---u uuuu uuuu uuuu uuuu uuuu uuuu 0000 0000 0000 0111 uuuu uuuu uuuu uuuu uuuu uuuu 0000 0000 0000 0000 0000 0000 0000 0010 0000 000x 0000 0000 uuuu uuuu 000- 0000 ---- ------0 u00Wake-up via WDT or Interrupt uuuu uuuu uuuu uuuu u-uu uuuu u-uu uuuu u-uu uuuu ---- ---u uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu ---- ---u uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuu- uuuu ---- ------0 u00-
ADRESH ADRESL ADCON0 ADCON1 ADCON2 LCDDATA4 LCDDATA3 LCDDATA2 LCDDATA1 LCDDATA0 LCDSE4 LCDSE3 LCDSE2 LCDSE1 CVRCON CMCON TMR3H TMR3L T3CON SPBRG1 RCREG1 TXREG1 TXSTA1 RCSTA1 LCDPS LCDSE0 LCDCON EECON2 EECON1
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as `0', q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 4: See Table 5-1 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read as `0'.
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TABLE 5-2:
Register
INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Applicable Devices PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 Power-on Reset, Brown-out Reset -111 1111 -000 0000 -000 0000 11-- 11100-- 00000-- 000-111 1-11 -000 0-00 -000 0-00 0000 0000 0001 1111 1111 1111111 1-11 1111 1111 1111 1111 1111 1111 1111 1111(5) 00-x xxxx xxxx xxxxxxx x-xx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx(5) 000x xxxx xxxx xxxxxxx x-xx xxxx xxxx xxxx xxxx xxxx xxxx xx0x 0000(5) MCLR Resets WDT Reset RESET Instruction Stack Resets -111 1111 -000 0000 -000 0000 11-- 11100-- 00000-- 000-111 1-11 -000 0-00 -000 0-00 0000 0000 0001 1111 1111 1111111 1-11 1111 1111 1111 1111 1111 1111 1111 1111(5) 00-u uuuu uuuu uuuuuuu u-uu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu(5) 000u uuuu uuuu uuuuuuu u-uu uuuu uuuu uuuu uuuu uuuu uuuu uu0u 0000(5) Wake-up via WDT or Interrupt -uuu 1111 -uuu 0000(3) -uuu 0000 uu-- uuuuu-- uuu-(3) uu-- uuu-uuu u-uu -uuu u-uu(3) -uuu u-uu uuuu uuuu uuuu uuuu uuuu uuuuuuu u-uu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu(5) uu-u uuuu uuuu uuuuuuu u-uu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu(5) 000u uuuu uuuu uuuuuuu u-uu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu(5)
IPR3 PIR3 PIE3 IPR2 PIR2 PIE2 IPR1 PIR1 PIE1 OSCTUNE TRISG TRISF TRISE TRISD TRISC TRISB TRISA LATG LATF LATE LATD LATC LATB LATA(5) PORTG PORTF PORTE PORTD PORTC PORTB PORTA
(5) (5)
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as `0', q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 4: See Table 5-1 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read as `0'.
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TABLE 5-2:
Register
INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Applicable Devices PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 Power-on Reset, Brown-out Reset 0000 0000 0100 0-00 ---- ---x xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx ---- ---x xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx ---- ---x xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx --00 0000 xxxx xxxx xxxx xxxx --00 0000 MCLR Resets WDT Reset RESET Instruction Stack Resets 0000 0000 0100 0-00 ---- ---u uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu ---- ---u uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu ---- ---u uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu --00 0000 uuuu uuuu uuuu uuuu --00 0000 Wake-up via WDT or Interrupt uuuu uuuu uuuu u-uu ---- ---u uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu ---- ---u uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu ---- ---u uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu --uu uuuu uuuu uuuu uuuu uuuu --uu uuuu
SPBRGH1 BAUDCON1 LCDDATA22 LCDDATA22 LCDDATA21 LCDDATA20 LCDDATA19 LCDDATA18 LCDDATA16 LCDDATA16 LCDDATA15 LCDDATA14 LCDDATA13 LCDDATA12 LCDDATA10 LCDDATA10 LCDDATA9 LCDDATA8 LCDDATA7 LCDDATA6 CCPR1H CCPR1L CCP1CON CCPR2H CCPR2L CCP2CON
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as `0', q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 4: See Table 5-1 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read as `0'.
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TABLE 5-2:
Register
INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Applicable Devices PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 PIC18F8XJ72 Power-on Reset, Brown-out Reset 0000 0000 0000 0000 0000 0000 0000 -010 0000 000x 0-00 0000 0000 0000 xxxx xxxx xxxx xxxx 0000 0000 0000 0000 xxxx xxxx xxxx xxxx 0-00 0000 0000 0000 0000 0000 ---- -00MCLR Resets WDT Reset RESET Instruction Stack Resets 0000 0000 0000 0000 0000 0000 0000 -010 0000 000x 0-00 0000 0000 0000 uuuu uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu 0-00 0000 0000 0000 0000 0000 ---- -00Wake-up via WDT or Interrupt uuuu uuuu uuuu uuuu uuuu uuuu uuuu -uuu uuuu uuuu u-uu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu u-uu uuuu uuuu uuuu uuuu uuuu ---- -uu-
SPBRG2 RCREG2 TXREG2 TXSTA2 RCSTA2 RTCCFG RTCCAL RTCVALH RTCVALL ALRMCFG ALRMRPT ALRMVALH ALRMVALL CTMUCONH CTMUCONL CTMUICONH PADCFG1
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as `0', q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 4: See Table 5-1 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read as `0'.
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6.0 MEMORY ORGANIZATION
6.1 Program Memory Organization
There are two types of memory in PIC18 Flash microcontroller devices: * Program Memory * Data RAM As Harvard architecture devices, the data and program memories use separate busses; this allows for concurrent access of the two memory spaces. Additional detailed information on the operation of the Flash program memory is provided in Section 7.0 "Flash Program Memory". PIC18 microcontrollers implement a 21-bit program counter which is capable of addressing a 2-Mbyte program memory space. Accessing a location between the upper boundary of the physically implemented memory and the 2-Mbyte address will return all `0's (a NOP instruction). The PIC18F87J72 family has a Flash program memory size of 128 Kbytes (65,536 single-word instructions). The program memory maps for individual family members are shown in Figure 6-1.
FIGURE 6-1:
MEMORY MAPS FOR PIC18F87J72 FAMILY DEVICES
PC<20:0> 21
CALL, CALLW, RCALL, RETURN, RETFIE, RETLW, ADDULNK, SUBULNK
Stack Level 1 Stack Level 31
PIC18F86J72 On-Chip Memory
PIC18F87J72 On-Chip Memory
000000h
Config. Words
00FFFFh
Config. Words
01FFFFh
Unimplemented Read as `0'
Unimplemented Read as `0'
1FFFFFh Note: Sizes of memory areas are not to scale. Sizes of program memory areas are enhanced to show detail.
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User Memory Space
PIC18F87J72 FAMILY
6.1.1 HARD MEMORY VECTORS 6.1.2 FLASH CONFIGURATION WORDS
All PIC18 devices have a total of three hard-coded return vectors in their program memory space. The Reset vector address is the default value to which the program counter returns on all device Resets; it is located at 0000h. PIC18 devices also have two interrupt vector addresses for the handling of high-priority and low-priority interrupts. The high-priority interrupt vector is located at 0008h and the low-priority interrupt vector is at 0018h. Their locations in relation to the program memory map are shown in Figure 6-2. Because PIC18F87J72 family devices do not have persistent configuration memory, the top four words of on-chip program memory are reserved for configuration information. On Reset, the configuration information is copied into the Configuration registers. The Configuration Words are stored in their program memory location in numerical order, starting with the lower byte of CONFIG1 at the lowest address and ending with the upper byte of CONFIG4. For these devices, only Configuration Words, CONFIG1 through CONFIG3, are used; CONFIG4 is reserved. The actual addresses of the Flash Configuration Word for devices in the PIC18F87J72 family are shown in Table 6-1. Their location in the memory map is shown with the other memory vectors in Figure 6-2. Additional details on the device Configuration Words are provided in Section 26.1 "Configuration Bits".
FIGURE 6-2:
HARD VECTOR AND CONFIGURATION WORD LOCATIONS FOR PIC18F87J72 FAMILY FAMILY DEVICES
0000h 0008h 0018h
Reset Vector High-Priority Interrupt Vector Low-Priority Interrupt Vector
TABLE 6-1:
FLASH CONFIGURATION WORD FOR PIC18F87J72 FAMILY DEVICES
Program Memory (Kbytes) 64 128 Configuration Word Addresses FFF8h to FFFFh 1FFF8h to 1FFFFh
Device PIC18F86J72 PIC18F87J72
On-Chip Program Memory
Flash Configuration Words
(Top of Memory-7) (Top of Memory)
Read `0'
1FFFFFh Legend: (Top of Memory) represents upper boundary of on-chip program memory space (see Figure 6-1 for device-specific values). Shaded area represents unimplemented memory. Areas are not shown to scale.
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6.1.3 PROGRAM COUNTER
The Program Counter (PC) specifies the address of the instruction to fetch for execution. The PC is 21 bits wide and is contained in three separate 8-bit registers. The low byte, known as the PCL register, is both readable and writable. The high byte, or PCH register, contains the PC<15:8> bits; it is not directly readable or writable. Updates to the PCH register are performed through the PCLATH register. The upper byte is called PCU. This register contains the PC<20:16> bits; it is also not directly readable or writable. Updates to the PCU register are performed through the PCLATU register. The contents of PCLATH and PCLATU are transferred to the program counter by any operation that writes PCL. Similarly, the upper two bytes of the program counter are transferred to PCLATH and PCLATU by an operation that reads PCL. This is useful for computed offsets to the PC (see Section 6.1.6.1 "Computed GOTO"). The PC addresses bytes in the program memory. To prevent the PC from becoming misaligned with word instructions, the Least Significant bit (LSb) of PCL is fixed to a value of `0'. The PC increments by 2 to address sequential instructions in the program memory. The CALL, RCALL, GOTO and program branch instructions write to the program counter directly. For these instructions, the contents of PCLATH and PCLATU are not transferred to the program counter. The stack operates as a 31-word by 21-bit RAM and a 5-bit Stack Pointer, STKPTR. The stack space is not part of either program or data space. The Stack Pointer is readable and writable and the address on the top of the stack is readable and writable through the Top-of-Stack Special Function Registers. Data can also be pushed to, or popped from the stack, using these registers. A CALL type instruction causes a push onto the stack. The Stack Pointer is first incremented and the location pointed to by the Stack Pointer is written with the contents of the PC (already pointing to the instruction following the CALL). A RETURN type instruction causes a pop from the stack. The contents of the location pointed to by the STKPTR are transferred to the PC and then the Stack Pointer is decremented. The Stack Pointer is initialized to `00000' after all Resets. There is no RAM associated with the location corresponding to a Stack Pointer value of `00000'; this is only a Reset value. Status bits indicate if the stack is full, has overflowed or has underflowed.
6.1.4.1
Top-of-Stack Access
6.1.4
RETURN ADDRESS STACK
The return address stack allows any combination of up to 31 program calls and interrupts to occur. The PC is pushed onto the stack when a CALL or RCALL instruction is executed, or an interrupt is Acknowledged. The PC value is pulled off the stack on a RETURN, RETLW or a RETFIE instruction (and on ADDULNK and SUBULNK instructions if the extended instruction set is enabled). PCLATU and PCLATH are not affected by any of the RETURN or CALL instructions.
Only the top of the return address stack (TOS) is readable and writable. A set of three registers, TOSU:TOSH:TOSL, holds the contents of the stack location pointed to by the STKPTR register (Figure 6-3). This allows users to implement a software stack if necessary. After a CALL, RCALL or interrupt (and ADDULNK and SUBULNK instructions if the extended instruction set is enabled), the software can read the pushed value by reading the TOSU:TOSH:TOSL registers. These values can be placed on a user-defined software stack. At return time, the software can return these values to TOSU:TOSH:TOSL and do a return. The user must disable the global interrupt enable bits while accessing the stack to prevent inadvertent stack corruption.
FIGURE 6-3:
RETURN ADDRESS STACK AND ASSOCIATED REGISTERS
Return Address Stack <20:0> Top-of-Stack Registers TOSU 00h TOSH 1Ah TOSL 34h 11111 11110 11101 Stack Pointer STKPTR<4:0> 00010
Top-of-Stack
001A34h 000D58h
00011 00010 00001 00000
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6.1.4.2 Return Stack Pointer (STKPTR)
The STKPTR register (Register 6-1) contains the Stack Pointer value, the STKFUL (Stack Full) status bit and the STKUNF (Stack Underflow) status bits. The value of the Stack Pointer can be 0 through 31. The Stack Pointer increments before values are pushed onto the stack and decrements after values are popped off the stack. On Reset, the Stack Pointer value will be zero. The user may read and write the Stack Pointer value. This feature can be used by a Real-Time Operating System (RTOS) for return stack maintenance. After the PC is pushed onto the stack 31 times (without popping any values off the stack), the STKFUL bit is set. The STKFUL bit is cleared by software or by a POR. The action that takes place when the stack becomes full depends on the state of the STVREN (Stack Overflow Reset Enable) Configuration bit. (Refer to Section 26.1 "Configuration Bits" for a description of the device Configuration bits.) If STVREN is set (default), the 31st push will push the (PC + 2) value onto the stack, set the STKFUL bit and reset the device. The STKFUL bit will remain set and the Stack Pointer will be set to zero. If STVREN is cleared, the STKFUL bit will be set on the 31st push and the Stack Pointer will increment to 31. Any additional pushes will not overwrite the 31st push and the STKPTR will remain at 31. When the stack has been popped enough times to unload the stack, the next pop will return a value of zero to the PC and set the STKUNF bit while the Stack Pointer remains at zero. The STKUNF bit will remain set until cleared by software or until a POR occurs. Note: Returning a value of zero to the PC on an underflow has the effect of vectoring the program to the Reset vector, where the stack conditions can be verified and appropriate actions can be taken. This is not the same as a Reset, as the contents of the SFRs are not affected.
6.1.4.3
PUSH and POP Instructions
Since the Top-of-Stack is readable and writable, the ability to push values onto the stack and pull values off the stack, without disturbing normal program execution, is a desirable feature. The PIC18 instruction set includes two instructions, PUSH and POP, that permit the TOS to be manipulated under software control. TOSU, TOSH and TOSL can be modified to place data or a return address on the stack. The PUSH instruction places the current PC value onto the stack. This increments the Stack Pointer and loads the current PC value onto the stack. The POP instruction discards the current TOS by decrementing the Stack Pointer. The previous value pushed onto the stack then becomes the TOS value.
REGISTER 6-1:
R/C-0 STKFUL(1) bit 7 Legend: R = Readable bit -n = Value at POR bit 7
STKPTR: STACK POINTER REGISTER
R/C-0 U-0 -- R/W-0 SP4 R/W-0 SP3 R/W-0 SP2 R/W-0 SP1 R/W-0 SP0 bit 0 C = Clearable bit W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
STKUNF(1)
STKFUL: Stack Full Flag bit(1) 1 = Stack became full or overflowed 0 = Stack has not become full or overflowed STKUNF: Stack Underflow Flag bit(1) 1 = Stack underflow occurred 0 = Stack underflow did not occur Unimplemented: Read as `0' SP<4:0>: Stack Pointer Location bits Bit 7 and bit 6 are cleared by user software or by a POR.
bit 6
bit 5 bit 4-0 Note 1:
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6.1.4.4 Stack Full and Underflow Resets 6.1.6
Device Resets on stack overflow and stack underflow conditions are enabled by setting the STVREN bit in Configuration Register 1L. When STVREN is set, a full or underflow condition will set the appropriate STKFUL or STKUNF bit and then cause a device Reset. When STVREN is cleared, a full or underflow condition will set the appropriate STKFUL or STKUNF bit, but not cause a device Reset. The STKFUL or STKUNF bits are cleared by the user software or a Power-on Reset.
LOOK-UP TABLES IN PROGRAM MEMORY
There may be programming situations that require the creation of data structures, or look-up tables, in program memory. For PIC18 devices, look-up tables can be implemented in two ways: * Computed GOTO * Table Reads
6.1.6.1
Computed GOTO
6.1.5
FAST REGISTER STACK
A Fast Register Stack is provided for the STATUS, WREG and BSR registers to provide a "fast return" option for interrupts. This stack is only one level deep and is neither readable nor writable. It is loaded with the current value of the corresponding register when the processor vectors for an interrupt. All interrupt sources will push values into the Stack registers. The values in the registers are then loaded back into the working registers if the RETFIE, FAST instruction is used to return from the interrupt. If both low and high-priority interrupts are enabled, the Stack registers cannot be used reliably to return from low-priority interrupts. If a high-priority interrupt occurs while servicing a low-priority interrupt, the Stack register values stored by the low-priority interrupt will be overwritten. In these cases, users must save the key registers in software during a low-priority interrupt. If interrupt priority is not used, all interrupts may use the Fast Register Stack for returns from interrupt. If no interrupts are used, the Fast Register Stack can be used to restore the STATUS, WREG and BSR registers at the end of a subroutine call. To use the Fast Register Stack for a subroutine call, a CALL label, FAST instruction must be executed to save the STATUS, WREG and BSR registers to the Fast Register Stack. A RETURN, FAST instruction is then executed to restore these registers from the Fast Register Stack. Example 6-1 shows a source code example that uses the Fast Register Stack during a subroutine call and return.
A computed GOTO is accomplished by adding an offset to the program counter. An example is shown in Example 6-2. A look-up table can be formed with an ADDWF PCL instruction and a group of RETLW nn instructions. The W register is loaded with an offset into the table before executing a call to that table. The first instruction of the called routine is the ADDWF PCL instruction. The next instruction executed will be one of the RETLW nn instructions that returns the value `nn' to the calling function. The offset value (in WREG) specifies the number of bytes that the program counter should advance and should be multiples of 2 (LSb = 0). In this method, only one data byte may be stored in each instruction location and room on the return address stack is required.
EXAMPLE 6-2:
MOVF CALL nn00h ADDWF RETLW RETLW RETLW . . .
COMPUTED GOTO USING AN OFFSET VALUE
OFFSET, W TABLE PCL nnh nnh nnh
ORG TABLE
6.1.6.2
Table Reads
EXAMPLE 6-1:
CALL SUB1, FAST SUB1 RETURN FAST
FAST REGISTER STACK CODE EXAMPLE
;STATUS, WREG, BSR ;SAVED IN FAST REGISTER ;STACK
A better method of storing data in program memory allows two bytes of data to be stored in each instruction location. Look-up table data may be stored, two bytes per program word, while programming. The Table Pointer (TBLPTR) specifies the byte address and the Table Latch (TABLAT) contains the data that is read from the program memory. Data is transferred from program memory, one byte at a time. Table read operation is discussed further Section 7.1 "Table Reads and Table Writes". in
;RESTORE VALUES SAVED ;IN FAST REGISTER STACK
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6.2
6.2.1
PIC18 Instruction Cycle
CLOCKING SCHEME
6.2.2
INSTRUCTION FLOW/PIPELINING
The microcontroller clock input, whether from an internal or external source, is internally divided by four to generate four non-overlapping quadrature clocks (Q1, Q2, Q3 and Q4). Internally, the program counter is incremented on every Q1; the instruction is fetched from the program memory and latched into the Instruction Register (IR) during Q4. The instruction is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow are shown in Figure 6-4.
An "Instruction Cycle" consists of four Q cycles, Q1 through Q4. The instruction fetch and execute are pipelined in such a manner that a fetch takes one instruction cycle, while the decode and execute take another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the program counter to change (e.g., GOTO), then two cycles are required to complete the instruction (Example 6-3). A fetch cycle begins with the Program Counter (PC) incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3 and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write).
FIGURE 6-4:
OSC1 Q1 Q2 Q3 Q4 PC OSC2/CLKO (RC mode)
CLOCK/INSTRUCTION CYCLE
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Internal Phase Clock
PC
PC + 2
PC + 4
Execute INST (PC - 2) Fetch INST (PC)
Execute INST (PC) Fetch INST (PC + 2)
Execute INST (PC + 2) Fetch INST (PC + 4)
EXAMPLE 6-3:
INSTRUCTION PIPELINE FLOW
TCY0 TCY1 Execute 1 Fetch 2 Execute 2 Fetch 3 Execute 3 Fetch 4 Flush (NOP) Fetch SUB_1 Execute SUB_1 TCY2 TCY3 TCY4 TCY5
1. MOVLW 55h 2. MOVWF PORTB 3. BRA 4. BSF SUB_1
Fetch 1
PORTA, BIT3 (Forced NOP)
5. Instruction @ address SUB_1
All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction is "flushed" from the pipeline while the new instruction is being fetched and then executed.
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6.2.3 INSTRUCTIONS IN PROGRAM MEMORY
The program memory is addressed in bytes. Instructions are stored as two bytes or four bytes in program memory. The Least Significant Byte (LSB) of an instruction word is always stored in a program memory location with an even address (LSB = 0). To maintain alignment with instruction boundaries, the PC increments in steps of 2 and the LSB will always read `0' (see Section 6.1.3 "Program Counter"). Figure 6-5 shows an example of how instruction words are stored in the program memory. The CALL and GOTO instructions have the absolute program memory address embedded into the instruction. Since instructions are always stored on word boundaries, the data contained in the instruction is a word address. The word address is written to PC<20:1>, which accesses the desired byte address in program memory. Instruction #2 in Figure 6-5 shows how the instruction, GOTO 0006h, is encoded in the program memory. Program branch instructions, which encode a relative address offset, operate in the same manner. The offset value stored in a branch instruction represents the number of single-word instructions that the PC will be offset by. Section 27.0 "Instruction Set Summary" provides further details of the instruction set.
FIGURE 6-5:
INSTRUCTIONS IN PROGRAM MEMORY
LSB = 1 Program Memory Byte Locations LSB = 0 Word Address 000000h 000002h 000004h 000006h 000008h 00000Ah 00000Ch 00000Eh 000010h 000012h 000014h
Instruction 1: Instruction 2: Instruction 3:
MOVLW GOTO MOVFF
055h 0006h 123h, 456h
0Fh EFh F0h C1h F4h
55h 03h 00h 23h 56h
6.2.4
TWO-WORD INSTRUCTIONS
The standard PIC18 instruction set has four two-word instructions: CALL, MOVFF, GOTO and LSFR. In all cases, the second word of the instructions always has `1111' as its four Most Significant bits; the other 12 bits are literal data, usually a data memory address. The use of `1111' in the 4 MSbs of an instruction specifies a special form of NOP. If the instruction is executed in proper sequence - immediately after the first word - the data in the second word is accessed
and used by the instruction sequence. If the first word is skipped for some reason and the second word is executed by itself, a NOP is executed instead. This is necessary for cases when the two-word instruction is preceded by a conditional instruction that changes the PC. Example 6-4 shows how this works. Note: See Section 6.5 "Program Memory and the Extended Instruction Set" for information on two-word instructions in the extended instruction set.
EXAMPLE 6-4:
CASE 1: Object Code
TWO-WORD INSTRUCTIONS
Source Code
0110 0110 0000 0000 1100 0001 0010 0011 1111 0100 0101 0110 0010 0100 0000 0000
CASE 2: Object Code
TSTFSZ MOVFF ADDWF
Source Code
REG1
; is RAM location 0? ; Execute this word as a NOP
REG1, REG2 ; No, skip this word REG3 ; continue code
0110 0110 0000 0000 1100 0001 0010 0011 1111 0100 0101 0110 0010 0100 0000 0000
TSTFSZ MOVFF ADDWF
REG1
; is RAM location 0? ; 2nd word of instruction
REG1, REG2 ; Yes, execute this word REG3 ; continue code
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6.3
Note:
Data Memory Organization
The operation of some aspects of data memory are changed when the PIC18 extended instruction set is enabled. See Section 6.6 "Data Memory and the Extended Instruction Set" for more information.
6.3.1
BANK SELECT REGISTER
The data memory in PIC18 devices is implemented as static RAM. Each register in the data memory has a 12-bit address, allowing up to 4,096 bytes of data memory. The memory space is divided into as many as 16 banks that contain 256 bytes each. PIC18F86J72 and PIC18F87J72 devices implement all 16 complete banks, for a total of 4 Kbytes. Figure 6-6 and Figure 6-7 show the data memory organization for the devices. The data memory contains Special Function Registers (SFRs) and General Purpose Registers (GPRs). The SFRs are used for control and status of the controller and peripheral functions, while GPRs are used for data storage and scratchpad operations in the user's application. Any read of an unimplemented location will read as `0's. The instruction set and architecture allow operations across all banks. The entire data memory may be accessed by Direct, Indirect or Indexed Addressing modes. Addressing modes are discussed later in this section. To ensure that commonly used registers (select SFRs and select GPRs) can be accessed in a single cycle, PIC18 devices implement an Access Bank. This is a 256-byte memory space that provides fast access to select SFRs and the lower portion of GPR Bank 0 without using the BSR. Section 6.3.2 "Access Bank" provides a detailed description of the Access RAM.
Large areas of data memory require an efficient addressing scheme to make rapid access to any address possible. Ideally, this means that an entire address does not need to be provided for each read or write operation. For PIC18 devices, this is accomplished with a RAM banking scheme. This divides the memory space into 16 contiguous banks of 256 bytes. Depending on the instruction, each location can be addressed directly by its full 12-bit address, or an 8-bit low-order address and a 4-bit Bank Pointer. Most instructions in the PIC18 instruction set make use of the Bank Pointer, known as the Bank Select Register (BSR). This SFR holds the 4 Most Significant bits of a location's address; the instruction itself includes the 8 Least Significant bits. Only the four lower bits of the BSR are implemented (BSR<3:0>). The upper four bits are unused; they will always read `0' and cannot be written to. The BSR can be loaded directly by using the MOVLB instruction. The value of the BSR indicates the bank in data memory. The 8 bits in the instruction show the location in the bank and can be thought of as an offset from the bank's lower boundary. The relationship between the BSR's value and the bank division in data memory is shown in Figure 6-7. Since up to 16 registers may share the same low-order address, the user must always be careful to ensure that the proper bank is selected before performing a data read or write. For example, writing what should be program data to an 8-bit address of F9h while the BSR is 0Fh, will end up resetting the program counter. While any bank can be selected, only those banks that are actually implemented can be read or written to. Writes to unimplemented banks are ignored, while reads from unimplemented banks will return `0's. Even so, the STATUS register will still be affected as if the operation was successful. The data memory map in Figure 6-6 indicates which banks are implemented. In the core PIC18 instruction set, only the MOVFF instruction fully specifies the 12-bit address of the source and target registers. This instruction ignores the BSR completely when it executes. All other instructions include only the low-order address as an operand and must use either the BSR or the Access Bank to locate their target registers.
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FIGURE 6-6:
BSR<3:0> 00h = 0000 Bank 0 FFh 00h Bank 1 FFh 00h Bank 2 FFh 00h Bank 3 FFh 00h Bank 4 FFh 00h Bank 5 FFh 00h Bank 6 FFh 00h Bank 7 FFh 00h Bank 8 FFh 00h Bank 9 FFh 00h Bank 10 Bank 11 FFh 00h FFh 00h FFh 00h FFh 00h Bank 14 FFh 00h Bank 15 FFh GPR GPR(1) SFR EFFh F00h F5Fh F60h FFFh GPR GPR GPR 9FFh A00h AFFh B00h BFFh C00h CFFh D00h DFFh E00h GPR 8FFh 900h GPR 7FFh 800h GPR 6FFh 700h Access Bank 5Fh Access RAM High 60h (SFRs) FFh Access RAM Low 00h GPR 5FFh 600h GPR 4FFh 500h GPR GPR 2FFh 300h 3FFh 400h
DATA MEMORY MAP FOR PIC18F86J72 AND PIC18F87J72 DEVICES
When a = 0:
Data Memory Map Access RAM GPR GPR 1FFh 200h 000h 05Fh 060h 0FFh 100h
The BSR is ignored and the Access Bank is used. The first 96 bytes are general purpose RAM (from Bank 0). The second 160 bytes are Special Function Registers (from Bank 15). When a = 1: The BSR specifies the bank used by the instruction.
= 0001 = 0010
= 0011
= 0100
= 0101
= 0110
= 0111
= 1000 = 1001
= 1010 = 1011
= 1100
Bank 12
GPR GPR
= 1101
Bank 13
= 1110 = 1111
Note 1: Addresses, F5Ah through F5Fh, are also used by SFRs, but are not part of the Access RAM. Users must always use the complete address, or load the proper SBR value, to access these registers.
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FIGURE 6-7:
7 0 0 0
USE OF THE BANK SELECT REGISTER (DIRECT ADDRESSING)
BSR(1) 0 0 0 1 0 0 000h 100h Bank 1 200h 300h Bank 2
Data Memory
Bank 0 00h FFh 00h FFh 00h FFh 00h
7 1 1
From Opcode(2) 1 1 1 1 1 1 1 1
0 1 1
Bank Select(2)
Bank 3 through Bank 13
E00h Bank 14 F00h FFFh Note 1: 2: Bank 15
FFh 00h FFh 00h FFh
The Access RAM bit of the instruction can be used to force an override of the selected bank (BSR<3:0>) to the registers of the Access Bank. The MOVFF instruction embeds the entire 12-bit address in the instruction.
6.3.2
ACCESS BANK
While the use of the BSR with an embedded 8-bit address allows users to address the entire range of data memory, it also means that the user must always ensure that the correct bank is selected. Otherwise, data may be read from, or written to, the wrong location. This can be disastrous if a GPR is the intended target of an operation, but an SFR is written to instead. Verifying and/or changing the BSR for each read or write to data memory can become very inefficient. To streamline access for the most commonly used data memory locations, the data memory is configured with an Access Bank, which allows users to access a mapped block of memory without specifying a BSR. The Access Bank consists of the first 96 bytes of memory (00h-5Fh) in Bank 0 and the last 160 bytes of memory (60h-FFh) in Bank 15. The lower half is known as the "Access RAM" and is composed of GPRs. The upper half is where the device's SFRs are mapped. These two areas are mapped contiguously in the Access Bank and can be addressed in a linear fashion by an 8-bit address (Figure 6-6). The Access Bank is used by core PIC18 instructions that include the Access RAM bit (the `a' parameter in the instruction). When `a' is equal to `1', the instruction uses the BSR and the 8-bit address included in the opcode for the data memory address. When `a' is `0', however, the instruction is forced to use the Access Bank address map; the current value of the BSR is ignored entirely.
Using this "forced" addressing allows the instruction to operate on a data address in a single cycle without updating the BSR first. For 8-bit addresses of 60h and above, this means that users can evaluate and operate on SFRs more efficiently. The Access RAM below 60h is a good place for data values that the user might need to access rapidly, such as immediate computational results or common program variables. Access RAM also allows for faster and more code efficient context saving and switching of variables. The mapping of the Access Bank is slightly different when the extended instruction set is enabled (XINST Configuration bit = 1). This is discussed in more detail in Section 6.6.3 "Mapping the Access Bank in Indexed Literal Offset Mode".
6.3.3
GENERAL PURPOSE REGISTER FILE
PIC18 devices may have banked memory in the GPR area. This is data RAM which is available for use by all instructions. GPRs start at the bottom of Bank 0 (address 000h) and grow upwards towards the bottom of the SFR area. GPRs are not initialized by a Power-on Reset and are unchanged on all other Resets.
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6.3.4 SPECIAL FUNCTION REGISTERS
The Special Function Registers (SFRs) are registers used by the CPU and peripheral modules for controlling the desired operation of the device. These registers are implemented as static RAM. SFRs start at the top of data memory (FFFh) and extend downward to occupy more than the top half of Bank 15 (F60h to FFFh). A list of these registers is given in Table 6-2 and Table 6-3. The SFRs can be classified into two sets: those associated with the "core" device functionality (ALU, Resets and interrupts) and those related to the peripheral functions. The Reset and Interrupt registers are described in their respective chapters, while the ALU's STATUS register is described later in this section. Registers related to the operation of the peripheral features are described in the chapter for that peripheral. The SFRs are typically distributed among the peripherals whose functions they control. Unused SFR locations are unimplemented and read as `0's.
TABLE 6-2:
Addr.
SPECIAL FUNCTION REGISTER MAP FOR PIC18F87J72 FAMILY DEVICES
Addr.
Name TOSU TOSH TOSL STKPTR PCLATU PCLATH PCL TBLPTRU TBLPTRH TBLPTRL TABLAT PRODH PRODL INTCON INTCON2 INTCON3 INDF0(1)
Name INDF2
(1)
Addr.
Name
Addr.
Name IPR1 PIR1 PIE1 --(2) TRISJ TRISH TRISG TRISF TRISE TRISD TRISC TRISB TRISA LATJ LATH LATG LATF LATE LATD LATC LATB LATA PORTJ PORTH PORTG PORTF PORTE PORTD PORTC PORTB PORTA
Addr.
Name SPBRGH1 BAUDCON1 --(2) LCDDATA22 LCDDATA21 LCDDATA20 LCDDATA19 LCDDATA18 --(2) LCDDATA16 LCDDATA15 LCDDATA14 LCDDATA13 LCDDATA12 --(2) LCDDATA10 LCDDATA9 LCDDATA8 LCDDATA7 LCDDATA6 --(2) CCPR1H CCPR1L CCP1CON CCPR2H CCPR2L CCP2CON SPBRG2 RCREG2 TXREG2 TXSTA2 RCSTA2
Addr.
Name RTCCFG RTCCAL RTCVALH RTCVALL ALRMCFG ALRMRPT ALRMVALH ALRMVALL
FFFh FFEh FFDh FFCh FFBh FFAh FF9h FF8h FF7h FF6h FF5h FF4h FF3h FF2h FF1h FF0h FEFh
FDFh
FBFh LCDDATA4
F9Fh F9Eh F9Dh F9Ch F9Ah F99h F98h F97h F96h F95h F94h F93h F92h F91h F90h F8Fh F8Eh F8Dh F8Ch F8Bh F8Ah F89h F88h F87h F86h F85h F84h F83h F82h F81h F80h
F7Fh F7Eh F7Dh F7Ch F7Ah F79h F78h F77h F76h F75h F74h F73h F72h F71h F70h F6Fh F6Eh F6Dh F6Ch F6Bh F6Ah F69h F68h F67h F66h F65h F64h F63h F62h F61h F60h
F5Fh F5Eh F5Dh F5Ch F5Bh F5Ah F59h F58h
FDEh POSTINC2(1) FBEh LCDDATA3 FDDh POSTDEC2(1) FBDh LCDDATA2 FDCh PREINC2(1) FDBh FDAh FD9h FD8h FD7h FD6h FD5h FD4h FD3h FD2h FD1h FD0h FCFh PLUSW2(1) FSR2H FSR2L STATUS TMR0H TMR0L T0CON --
(2)
FBCh LCDDATA1 FBBh LCDDATA0 FBAh FB9h FB8h FB7h FB6h FB5h FB4h FB3h FB2h FB1h FB0h FAFh FAEh FADh FACh FABh FAAh FA9h FA8h FA7h FA6h FA5h FA4h FA3h FA2h FA1h FA0h --(2) LCDSE4 LCDSE3 LCDSE2 LCDSE1 CVRCON CMCON TMR3H TMR3L T3CON --
(2)
F9Bh OSCTUNE F7Bh
F57h CTMUCONH F56h CTMUCONL F55h CTMUICONH F54h PADCFG1
OSCCON LCDREG WDTCON RCON TMR1H TMR1L T1CON TMR2 PR2 T2CON SSPBUF SSPADD SSPSTAT SSPCON1 SSPCON2 ADRESH ADRESL ADCON0 ADCON1 ADCON2
SPBRG1 RCREG1 TXREG1 TXSTA1 RCSTA1 LCDPS LCDSE0 LCDCON EECON2 EECON1 IPR3 PIR3 PIE3 IPR2 PIR2 PIE2
FEEh POSTINC0(1) FCEh FEDh POSTDEC0(1) FCDh FECh FEAh FE9h FE8h FE7h PREINC0(1) FSR0H FSR0L WREG INDF1(1) FCCh FCBh FCAh FC9h FC8h FC7h FEBh PLUSW0(1)
FE6h POSTINC1(1) FC6h FE5h POSTDEC1(1) FC5h FE4h PREINC1(1) FE3h PLUSW1(1) FE2h FE1h FE0h Note 1: 2: FSR1H FSR1L BSR FC4h FC3h FC2h FC1h FC0h
This is not a physical register. Unimplemented registers are read as `0'.
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TABLE 6-3:
File Name TOSU TOSH TOSL STKPTR PCLATU PCLATH PCL TBLPTRU TBLPTRH TBLPTRL TABLAT PRODH PRODL INTCON INTCON2 INTCON3 INDF0 POSTINC0 POSTDEC0 PREINC0 PLUSW0 FSR0H FSR0L WREG INDF1 POSTINC1 POSTDEC1 PREINC1 PLUSW1 FSR1H FSR1L BSR INDF2 POSTINC2 POSTDEC2 PREINC2 PLUSW2 FSR2H FSR2L STATUS Legend: Note 1: 2: 3: 4:
PIC18F87J72 FAMILY REGISTER FILE SUMMARY
Bit 7 -- Bit 6 -- Bit 5 -- Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Details on POR, BOR page ---0 0000 0000 0000 0000 0000 Return Stack Pointer Holding Register for PC<20:16> uu-0 0000 ---0 0000 0000 0000 0000 0000 bit 21 Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) --00 0000 0000 0000 0000 0000 0000 0000 xxxx xxxx xxxx xxxx TMR0IE INTEDG1 INT3IE INT0IE INTEDG2 INT2IE RBIE INTEDG3 INT1IE TMR0IF TMR0IP INT3IF INT0IF INT3IP INT2IF RBIF RBIP INT1IF 0000 000x 1111 1111 1100 0000 N/A N/A N/A N/A N/A ---- xxxx xxxx xxxx xxxx xxxx N/A N/A N/A N/A N/A ---- xxxx xxxx xxxx Bank Select Register ---- 0000 N/A N/A N/A N/A N/A ---- xxxx xxxx xxxx OV Z DC C ---x xxxx 49, 57 49, 57 49, 57 49, 58 49, 57 49, 57 49, 57 49, 80 49, 80 49, 80 49, 80 49, 87 49, 87 49, 91 49, 92 49, 93 49, 72 49, 73 49, 73 49, 73 49, 73 49, 72 49, 72 49 49, 72 49, 73 49, 73 49, 73 49, 73 50, 72 50, 72 50, 62 50, 72 50, 73 50, 73 50, 73 50, 73 50, 72 50, 72 50, 70
Top-of-Stack Upper Byte (TOS<20:16>)
Top-of-Stack High Byte (TOS<15:8>) Top-of-Stack Low Byte (TOS<7:0>) STKFUL -- STKUNF -- -- bit 21(1)
Holding Register for PC<15:8> PC Low Byte (PC<7:0>) -- -- Program Memory Table Pointer High Byte (TBLPTR<15:8>) Program Memory Table Pointer Low Byte (TBLPTR<7:0>) Program Memory Table Latch Product Register High Byte Product Register Low Byte GIE/GIEH RBPU INT2IP PEIE/GIEL INTEDG0 INT1IP
Uses contents of FSR0 to address data memory - value of FSR0 not changed (not a physical register) Uses contents of FSR0 to address data memory - value of FSR0 post-incremented (not a physical register) Uses contents of FSR0 to address data memory - value of FSR0 post-decremented (not a physical register) Uses contents of FSR0 to address data memory - value of FSR0 pre-incremented (not a physical register) Uses contents of FSR0 to address data memory - value of FSR0 pre-incremented (not a physical register) - value of FSR0 offset by W -- Working Register Uses contents of FSR1 to address data memory - value of FSR1 not changed (not a physical register) Uses contents of FSR1 to address data memory - value of FSR1 post-incremented (not a physical register) Uses contents of FSR1 to address data memory - value of FSR1 post-decremented (not a physical register) Uses contents of FSR1 to address data memory - value of FSR1 pre-incremented (not a physical register) Uses contents of FSR1 to address data memory - value of FSR1 pre-incremented (not a physical register) - value of FSR1 offset by W -- -- -- -- -- -- -- -- Indirect Data Memory Address Pointer 1 High Byte Indirect Data Memory Address Pointer 1 Low Byte Uses contents of FSR2 to address data memory - value of FSR2 not changed (not a physical register) Uses contents of FSR2 to address data memory - value of FSR2 post-incremented (not a physical register) Uses contents of FSR2 to address data memory - value of FSR2 post-decremented (not a physical register) Uses contents of FSR2 to address data memory - value of FSR2 pre-incremented (not a physical register) Uses contents of FSR2 to address data memory - value of FSR2 pre-incremented (not a physical register) - value of FSR2 offset by W -- -- -- -- -- -- -- N Indirect Data Memory Address Pointer 2 High Byte Indirect Data Memory Address Pointer 2 Low Byte -- -- -- Indirect Data Memory Address Pointer 0 High Byte Indirect Data Memory Address Pointer 0 Low Byte
x = unknown, u = unchanged, - = unimplemented, q = value depends on condition, r = reserved, do not modify Bit 21 of the PC is only available in Test mode and Serial Programming modes. Alternate names and definitions for these bits when the MSSP module is operating in I2CTM Slave mode. See Section 18.4.3.2 "Address Masking" for details. The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as `0'. See Section 3.4.3 "PLL Frequency Multiplier" for details. RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal oscillator is selected as the default clock source (FOSC2 Configuration bit = 0); otherwise, they are disabled and these bits read as `0'.
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TABLE 6-3:
File Name TMR0H TMR0L T0CON OSCCON LCDREG WDTCON RCON TMR1H TMR1L T1CON TMR2 PR2 T2CON SSPBUF SSPADD SSPSTAT SSPCON1 SSPCON2 ADRESH ADRESL ADCON0 ADCON1 ADCON2 LCDDATA4 LCDDATA3 LCDDATA2 LCDDATA1 LCDDATA0 LCDSE4 LCDSE3 LCDSE2 LCDSE1 CVRCON CMCON TMR3H TMR3L T3CON Legend: Note 1: 2: 3: 4:
PIC18F87J72 FAMILY REGISTER FILE SUMMARY (CONTINUED)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Details on POR, BOR page 0000 0000 xxxx xxxx T0CS IRCF1 BIAS2 -- CM T0SE IRCF0 BIAS1 -- RI PSA OSTS BIAS0 -- TO T0PS2 IOFS MODE13 -- PD T0PS1 SCS1 CKSEL1 -- POR T0PS0 SCS0 CKSEL0 SWDTEN BOR 1111 1111 0110 q000 -011 1100 0--- ---0 0-11 11q0 xxxx xxxx xxxx xxxx T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 0000 0000 1111 1111 TMR2ON T2CKPS1 T2CKPS0 -000 0000 xxxx xxxx 0000 0000 0000 0000 0000 0000 0000 0000 xxxx xxxx xxxx xxxx CHS3 VCFG1 ACQT2 -- S29C0 S21C0 S13C0 S05C0 -- SE29 SE21 SE13 CVRR C2INV CHS2 VCFG0 ACQT1 -- S28C0 S20C0 S12C0 S04C0 -- SE28 SE20 SE12 CVRSS C1INV CHS1 PCFG3 ACQT0 -- S27C0 S19C0 S11C0 S03C0 -- SE27 SE19 SE11 CVR3 CIS CHS0 PCFG2 ADCS2 -- S26C0 S18C0 S10C0 S02C0 -- SE26 SE18 SE10 CVR2 CM2 GO/DONE PCFG1 ADCS1 -- S25C0 S17C0 S09C0 S01C0 -- SE25 SE17 SE09 CVR1 CM1 ADON PCFG0 ADCS0 S32C0 S24C0 S16C0 S08C0 S00C0 SE32 SE24 SE16 SE08 CVR0 CM0 0-00 0000 0-00 0000 0-00 0000 xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0111 xxxx xxxx xxxx xxxx T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0000 0000 50, 125 50, 125 50, 123 26, 50 50, 173 50, 326 44, 50 50, 131 50, 131 50, 127 50, 134 50, 134 50, 133 50, 203, 238 50, 238 50, 196, 205 50, 197, 206 50, 207, 208 51, 281 51, 281 51, 273 51, 274 51, 275 51, 171 51, 171 51, 171 51, 171 51, 171 51, 171 51, 171 51, 171 51, 171 51, 299 51, 293 51, 137 51, 137 51, 135
Timer0 Register High Byte Timer0 Register Low Byte TMR0ON IDLEN -- REGSLP IPEN T08BIT IRCF2 CPEN -- --
Timer1 Register High Byte Timer1 Register Low Byte RD16 Timer2 Register Timer2 Period Register -- T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 MSSP Receive Buffer/Transmit Register MSSP Address Register in I2CTM Slave mode. MSSP1 Baud Rate Reload Register in I2C Master mode. SMP WCOL GCEN GCEN CKE SSPOV ACKSTAT ACKSTAT D/A SSPEN ACKDT ADMSK5(2) P CKP ACKEN ADMSK4(2) S SSPM3 RCEN ADMSK3(2) R/W SSPM2 PEN ADMSK2(2) UA SSPM1 RSEN ADMSK1(2) BF SSPM0 SEN SEN T1RUN
A/D Result Register High Byte A/D Result Register Low Byte ADCAL TRIGSEL ADFM -- S31C0 S23C0 S15C0 S07C0 -- SE31 SE23 SE15 CVREN C2OUT -- -- -- -- S30C0 S22C0 S14C0 S06C0 -- SE30 SE22 SE14 CVROE C1OUT
Timer3 Register High Byte Timer3 Register Low Byte RD16 T3CCP2
x = unknown, u = unchanged, - = unimplemented, q = value depends on condition, r = reserved, do not modify Bit 21 of the PC is only available in Test mode and Serial Programming modes. Alternate names and definitions for these bits when the MSSP module is operating in I2CTM Slave mode. See Section 18.4.3.2 "Address Masking" for details. The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as `0'. See Section 3.4.3 "PLL Frequency Multiplier" for details. RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal oscillator is selected as the default clock source (FOSC2 Configuration bit = 0); otherwise, they are disabled and these bits read as `0'.
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TABLE 6-3:
File Name SPBRG1 RCREG1 TXREG1 TXSTA1 RCSTA1 LCDPS LCDSE0 LCDCON EECON2 EECON1 IPR3 PIR3 PIE3 IPR2 PIR2 PIE2 IPR1 PIR1 PIE1 OSCTUNE TRISG TRISF TRISE TRISD TRISC TRISB TRISA LATG LATF LATE LATD LATC LATB LATA PORTG PORTF PORTE PORTD PORTC PORTB PORTA Legend: Note 1: 2: 3: 4:
PIC18F87J72 FAMILY REGISTER FILE SUMMARY (CONTINUED)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Details on POR, BOR page 0000 0000 0000 0000 0000 0000 TXEN SREN LCDA SE05 WERR WPROG RC2IP RC2IF RC2IE -- -- -- RC1IP RC1IF RC1IE TUN5 CCP1OD TRISF5 TRISE5 TRISD5 TRISC5 TRISB5 TRISA5 -- LATF5 LATE5 LATD5 LATC5 LATB5 LATA5 RJPU(2) RF5 RE5 RD5 RC5 RB5 RA5 SYNC CREN WA SE04 -- FREE TX2IP TX2IF TX2IE -- -- -- TX1IP TX1IF TX1IE TUN4 TRISG4 TRISF4 TRISE4 TRISD4 TRISC4 TRISB4 TRISA4 LATG4 LATF4 LATE4 LATD4 LATC4 LATB4 LATA4 RG4 RF4 RE4 RD4 RC4 RB4 RA4 SENDB ADDEN LP3 SE03 CS1 WRERR CTMUIP CTMUIF CTMUIE BCLIP BCLIF BCLIE SSPIP SSPIF SSPIE TUN3 TRISG3 TRISF3 TRISE3 TRISD3 TRISC3 TRISB3 TRISA3 LATG3 LATF3 LATE3 LATD3 LATC3 LATB3 LATA3 RG3 RF3 RE3 RD3 RC3 RB3 RA3 BRGH FERR LP2 SE02 CS0 WREN CCP2IP CCP2IF CCP2IE LVDIP LVDIF LVDIE -- -- -- TUN2 TRISG2 TRISF2 -- TRISD2 TRISC2 TRISB2 TRISA2 LATG2 LATF2 -- LATD2 LATC2 LATB2 LATA2 RG2 RF2 -- RD2 RC2 RB2 RA2 TRMT OERR LP1 SE01 LMUX1 WR CCP1IP CCP1IF CCP1IE TMR3IP TMR3IF TMR3IE TMR2IP TMR2IF TMR2IE TUN1 TRISG1 TRISF1 TRISE1 TRISD1 TRISC1 TRISB1 TRISA1 LATG1 LATF1 LATE1 LATD1 LATC1 LATB1 LATA1 RG1 RF1 RE1 RD1 RC1 RB1 RA1 TX9D RX9D LP0 SE00 LMUX0 -- RTCCIP RTCCIF RTCCIE -- -- -- TMR1IP TMR1IF TMR1IE TUN0 TRISG0 -- TRISE0 TRISD0 TRISC0 TRISB0 TRISA0 LATG0 -- LATE0 LATD0 LATC0 LATB0 LATA0 RG0 -- RE0 RD0 RC0 RB0 RA0 0000 0010 0000 000x 0000 0000 0000 0000 000- 0000 ---- -----00 x00-111 1111 -000 0000 -000 0000 11-- 11100-- 00000-- 000-111 1-11 -000 0-00 -000 0-00 0000 0000 0001 1111 1111 1111111 1-11 1111 1111 1111 1111 1111 1111 1111 1111 00-x xxxx xxxx xxxxxxx x-xx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx 000x xxxx xxxx xxxxxxx x-xx xxxx xxxx xxxx xxxx xxxx xxxx xx0x 0000 51, 243 51, 251 51, 249 51, 240 51, 241 51, 169 51, 170 51, 168 51, 78 51, 78 52, 102 52, 96 52, 99 52, 101 52, 95 52, 98 52, 100 52, 94 52, 97 27, 52 52, 122 52, 120 52, 117 52, 115 52, 113 52, 110 52, 107 52, 122 52, 120 52, 117 52, 115 52, 113 52, 110 52, 107 52, 122 52, 120 52, 117 52, 115 52, 113 52, 110 52, 107
EUSART Baud Rate Generator Low Byte EUSART Receive Register EUSART Transmit Register CSRC SPEN WFT SE07 LCDEN -- -- -- -- OSCFIP OSCFIF OSCFIE -- -- -- INTSRC SPIOD TRISF7 TRISE7 TRISD7 TRISC7 TRISB7 TRISA7(4) U2OD LATF7 LATE7 LATD7 LATC7 LATB7 LATA7(4) RDPU RF7 RE7 RD7 RC7 RB7 RA7(4) TX9 RX9 BIASMD SE06 SLPEN -- LCDIP LCDIF LCDIE CMIP CMIF CMIE ADIP ADIF ADIE PLLEN(3) CCP2OD TRISF6 TRISE6 TRISD6 TRISC6 TRISB6 TRISA6(4) U1OD LATF6 LATE6 LATD6 LATC6 LATB6 LATA6(4) REPU RF6 RE6 RD6 RC6 RB6 RA6(4)
EEPROM Control Register 2 (not a physical register)
x = unknown, u = unchanged, - = unimplemented, q = value depends on condition, r = reserved, do not modify Bit 21 of the PC is only available in Test mode and Serial Programming modes. Alternate names and definitions for these bits when the MSSP module is operating in I2CTM Slave mode. See Section 18.4.3.2 "Address Masking" for details. The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as `0'. See Section 3.4.3 "PLL Frequency Multiplier" for details. RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal oscillator is selected as the default clock source (FOSC2 Configuration bit = 0); otherwise, they are disabled and these bits read as `0'.
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TABLE 6-3:
File Name SPBRGH1 BAUDCON1 LCDDATA22 LCDDATA21 LCDDATA20 LCDDATA19 LCDDATA18 LCDDATA16 LCDDATA15 LCDDATA14 LCDDATA13 LCDDATA12 LCDDATA10 LCDDATA9 LCDDATA8 LCDDATA7 LCDDATA6 CCPR1H CCPR1L CCP1CON CCPR2H CCPR2L CCP2CON SPBRG2 RCREG2 TXREG2 TXSTA2 RCSTA2 RTCCFG RTCCAL RTCVALH RTCVALL ALRMCFG ALRMRPT ALRMVALH ALRMVALL CTMUCONH CTMUCONL CTMUICON PADCFG1 Legend: Note 1: 2: 3: 4:
PIC18F87J72 FAMILY REGISTER FILE SUMMARY (CONTINUED)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Details on POR, BOR page 0000 0000 TXCKP -- S28C3 S20C3 S12C3 S04C3 -- S28C2 S20C2 S12C2 S04C2 -- S28C1 S20C1 S12C1 S04C1 BRG16 -- S27C3 S19C3 S11C3 S03C3 -- S27C2 S19C2 S11C2 S03C2 -- S27C1 S19C1 S11C1 S03C1 -- -- S26C3 S18C3 S10C3 S02C3 -- S26C2 S18C2 S10C2 S02C2 -- S26C1 S18C1 S10C1 S02C1 WUE -- S25C3 S17C3 S09C3 S01C3 -- S25C2 S17C2 S09C2 S01C2 -- S25C1 S17C1 S09C1 S01C1 ABDEN S32C3 S24C3 S16C3 S08C3 S00C3 S32C2 S24C2 S16C2 S08C2 S00C2 S32C1 S24C1 S16C1 S08C1 S00C1 0100 0-00 xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 xxxx xxxx xxxx xxxx CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 0000 0000 0000 0000 0000 0000 TXEN SREN RTCWREN CAL5 SYNC CREN RTCSYNC CAL4 -- ADDEN HALFSEC CAL3 BRGH FERR RTCOE CAL2 TRMT OERR RTCPTR1 CAL1 TX9D RX9D RTCPTR0 CAL0 0000 -010 0000 000x 0-00 0000 0000 0000 xxxx xxxx xxxx xxxx AMASK0 ARPT2 ALRMPTR1 ALRMPTR0 0000 0000 ARPT1 ARPT0 0000 0000 xxxx xxxx xxxx xxxx EDGSEQEN ITRIM0 IDISSEN IRNG1 CTTRIG IRNG0 -- 0-00 0000 0000 0000 ---- -0053, 243 53, 242 53, 171 53, 171 53, 171 53, 171 53, 171 53, 171 53, 171 53, 171 53, 171 53, 171 53, 171 53, 171 53, 171 53, 171 53, 171 53, 158 53, 158 53, 157 53, 158 53, 158 53, 157 54, 262 54, 267 54, 265 54, 260 54, 261 54, 141 54, 142 54, 144 54, 144 54, 143 54, 144 54, 147 54, 147 54, 315 54, 316 54, 317 54, 142
EUSART Baud Rate Generator High Byte ABDOVF -- S31C3 S23C3 S15C3 S07C3 -- S31C2 S23C2 S15C2 S07C2 -- S31C1 S23C1 S15C1 S07C1 RCMT -- S30C3 S22C3 S14C3 S06C3 -- S30C2 S22C2 S14C2 S06C2 -- S30C1 S22C1 S14C1 S06C1 RXDTP -- S29C3 S21C3 S13C3 S05C3 -- S29C2 S21C2 S13C2 S05C2 -- S29C1 S21C1 S13C1 S05C1
Capture/Compare/PWM Register 1 High Byte Capture/Compare/PWM Register 1 Low Byte -- -- DC1B1 DC1B0 Capture/Compare/PWM Register 2 High Byte Capture/Compare/PWM Register 2 Low Byte -- -- DC2B1 DC2B0 AUSART Baud Rate Generator Register AUSART Receive Register AUSART Transmit Register CSRC SPEN RTCEN CAL7 TX9 RX9 -- CAL6
RTCC Value High Register Window based on RTCPTR<1:0> RTCC Value Low Register Window based on RTCPTR<1:0> ALRMEN ARPT7 CHIME ARPT6 AMASK3 ARPT5 AMASK2 ARPT4 AMASK1 ARPT3
Alarm Value High Register Window based on ALRMPTR<1:0> Alarm Value Low Register Window based on ALRMPTR<1:0> CTMUEN EDG2POL ITRIM5 -- -- ITRIM4 -- CTMUSIDL ITRIM3 -- TGEN EDG1POL ITRIM2 -- EDGEN ITRIM1 -- EDG2SEL1 EDG2SEL0
EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT 0000 0000 RTSECSEL1 RTSECSEL0
x = unknown, u = unchanged, - = unimplemented, q = value depends on condition, r = reserved, do not modify Bit 21 of the PC is only available in Test mode and Serial Programming modes. Alternate names and definitions for these bits when the MSSP module is operating in I2CTM Slave mode. See Section 18.4.3.2 "Address Masking" for details. The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as `0'. See Section 3.4.3 "PLL Frequency Multiplier" for details. RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal oscillator is selected as the default clock source (FOSC2 Configuration bit = 0); otherwise, they are disabled and these bits read as `0'.
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6.3.5 STATUS REGISTER
The STATUS register, shown in Register 6-2, contains the arithmetic status of the ALU. The STATUS register can be the operand for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC, C, OV or N bits, then the write to these five bits is disabled. These bits are set or cleared according to the device logic. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS will set the Z bit but leave the other bits unchanged. The STATUS register then reads back as `000u u1uu'. It is recommended, therefore, that only BCF, BSF, SWAPF, MOVFF and MOVWF instructions are used to alter the STATUS register because these instructions do not affect the Z, C, DC, OV or N bits in the STATUS register. For other instructions not affecting any Status bits, see the instruction set summaries in Table 27-2 and Table 27-3. Note: The C and DC bits operate as a borrow and digit borrow bit respectively, in subtraction.
REGISTER 6-2:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-5 bit 4
STATUS REGISTER
U-0 -- U-0 -- R/W-x N R/W-x OV R/W-x Z R/W-x DC(1) R/W-x C(2) bit 0
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
Unimplemented: Read as `0' N: Negative bit This bit is used for signed arithmetic (2's complement). It indicates whether the result was negative (ALU MSB = 1). 1 = Result was negative 0 = Result was positive OV: Overflow bit This bit is used for signed arithmetic (2's complement). It indicates an overflow of the 7-bit magnitude which causes the sign bit (bit 7) to change state. 1 = Overflow occurred for signed arithmetic (in this arithmetic operation) 0 = No overflow occurred Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero DC: Digit Carry/Borrow bit(1) For ADDWF, ADDLW, SUBLW and SUBWF instructions: 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result C: Carry/Borrow bit(2) For ADDWF, ADDLW, SUBLW and SUBWF instructions: 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred For borrow, the polarity is reversed. A subtraction is executed by adding the 2's complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either bit 4 or bit 3 of the source register. For borrow, the polarity is reversed. A subtraction is executed by adding the 2's complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low-order bit of the source register.
bit 3
bit 2
bit 1
bit 0
Note 1: 2:
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6.4
Note:
Data Addressing Modes
The execution of some instructions in the core PIC18 instruction set are changed when the PIC18 extended instruction set is enabled. See Section 6.6 "Data Memory and the Extended Instruction Set" for more information.
The Access RAM bit, `a', determines how the address is interpreted. When `a' is `1', the contents of the BSR (Section 6.3.1 "Bank Select Register") are used with the address to determine the complete 12-bit address of the register. When `a' is `0', the address is interpreted as being a register in the Access Bank. Addressing that uses the Access RAM is sometimes also known as Direct Forced Addressing mode. A few instructions, such as MOVFF, include the entire 12-bit address (either source or destination) in their opcodes. In these cases, the BSR is ignored entirely. The destination of the operation's results is determined by the destination bit, `d'. When `d' is `1', the results are stored back in the source register, overwriting its original contents. When `d' is `0', the results are stored in the W register. Instructions without the `d' argument have a destination that is implicit in the instruction; their destination is either the target register being operated on or the W register.
While the program memory can be addressed in only one way - through the program counter - information in the data memory space can be addressed in several ways. For most instructions, the addressing mode is fixed. Other instructions may use up to three modes, depending on which operands are used and whether or not the extended instruction set is enabled. The addressing modes are: * * * * Inherent Literal Direct Indirect
6.4.3
INDIRECT ADDRESSING
An additional addressing mode, Indexed Literal Offset, is available when the extended instruction set is enabled (XINST Configuration bit = 1). Its operation is discussed in greater detail in Section 6.6.1 "Indexed Addressing with Literal Offset".
6.4.1
INHERENT AND LITERAL ADDRESSING
Many PIC18 control instructions do not need any argument at all; they either perform an operation that globally affects the device, or they operate implicitly on one register. This addressing mode is known as Inherent Addressing. Examples include SLEEP, RESET and DAW. Other instructions work in a similar way, but require an additional explicit argument in the opcode. This is known as Literal Addressing mode, because they require some literal value as an argument. Examples include ADDLW and MOVLW, which respectively, add or move a literal value to the W register. Other examples include CALL and GOTO, which include a 20-bit program memory address.
Indirect Addressing allows the user to access a location in data memory without giving a fixed address in the instruction. This is done by using File Select Registers (FSRs) as pointers to the locations to be read or written to. Since the FSRs are themselves located in RAM as Special Function Registers, they can also be directly manipulated under program control. This makes FSRs very useful in implementing data structures such as tables and arrays in data memory. The registers for Indirect Addressing are also implemented with Indirect File Operands (INDFs) that permit automatic manipulation of the pointer value with auto-incrementing, auto-decrementing or offsetting with another value. This allows for efficient code using loops, such as the example of clearing an entire RAM bank in Example 6-5. It also enables users to perform Indexed Addressing and other Stack Pointer operations for program memory in data memory.
EXAMPLE 6-5:
HOW TO CLEAR RAM (BANK 1) USING INDIRECT ADDRESSING
FSR0, 100h ; POSTINC0 ; Clear INDF ; register then ; inc pointer FSR0H, 1 ; All done with ; Bank1? NEXT ; NO, clear next ; YES, continue
6.4.2
DIRECT ADDRESSING
NEXT
Direct Addressing specifies all or part of the source and/or destination address of the operation within the opcode itself. The options are specified by the arguments accompanying the instruction. In the core PIC18 instruction set, bit-oriented and byte-oriented instructions use some version of Direct Addressing by default. All of these instructions include some 8-bit literal address as their Least Significant Byte. This address specifies either a register address in one of the banks of data RAM (Section 6.3.3 "General Purpose Register File") or a location in the Access Bank (Section 6.3.2 "Access Bank") as the data source for the instruction.
LFSR CLRF
BTFSS BRA CONTINUE
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6.4.3.1 FSR Registers and the INDF Operand
At the core of Indirect Addressing are three sets of registers: FSR0, FSR1 and FSR2. Each represents a pair of 8-bit registers, FSRnH and FSRnL. The four upper bits of the FSRnH register are not used, so each FSR pair holds a 12-bit value. This represents a value that can address the entire range of the data memory in a linear fashion. The FSR register pairs, then, serve as pointers to data memory locations. Indirect Addressing is accomplished with a set of Indirect File Operands, INDF0 through INDF2. These can be thought of as "virtual" registers: they are mapped in the SFR space but are not physically implemented. Reading or writing to a particular INDF register actually accesses its corresponding FSR register pair. A read from INDF1, for example, reads the data at the address indicated by FSR1H:FSR1L. Instructions that use the INDF registers as operands actually use the contents of their corresponding FSR as a pointer to the instruction's target. The INDF operand is just a convenient way of using the pointer. Because Indirect Addressing uses a full 12-bit address, data RAM banking is not necessary. Thus, the current contents of the BSR and the Access RAM bit have no effect on determining the target address.
FIGURE 6-8:
INDIRECT ADDRESSING
000h ADDWF, INDF1, 1 Bank 0 100h Bank 1 200h Bank 2
Using an instruction with one of the Indirect Addressing registers as the operand....
...uses the 12-bit address stored in the FSR pair associated with that register....
FSR1H:FSR1L 7 0 7 0
300h
xxxx1111
11001100
Bank 3 through Bank 13
...to determine the data memory location to be used in that operation. In this case, the FSR1 pair contains FCCh. This means the contents of location, FCCh, will be added to that of the W register and stored back in FCCh. E00h Bank 14 F00h FFFh Bank 15
Data Memory
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6.4.3.2 FSR Registers and POSTINC, POSTDEC, PREINC and PLUSW 6.4.3.3 Operations by FSRs on FSRs
In addition to the INDF operand, each FSR register pair also has four additional indirect operands. Like INDF, these are "virtual" registers that cannot be indirectly read or written to. Accessing these registers actually accesses the associated FSR register pair, but also performs a specific action on its stored value. They are: * POSTDEC: accesses the FSR value, then automatically decrements it by `1' afterwards * POSTINC: accesses the FSR value, then automatically increments it by `1' afterwards * PREINC: increments the FSR value by `1', then uses it in the operation * PLUSW: adds the signed value of the W register (range of -127 to 128) to that of the FSR and uses the new value in the operation In this context, accessing an INDF register uses the value in the FSR registers without changing them. Similarly, accessing a PLUSW register gives the FSR value offset by the value in the W register; neither value is actually changed in the operation. Accessing the other virtual registers changes the value of the FSR registers. Operations on the FSRs with POSTDEC, POSTINC and PREINC affect the entire register pair; that is, rollovers of the FSRnL register from FFh to 00h carry over to the FSRnH register. On the other hand, results of these operations do not change the value of any flags in the STATUS register (e.g., Z, N, OV, etc.). The PLUSW register can be used to implement a form of Indexed Addressing in the data memory space. By manipulating the value in the W register, users can reach addresses that are fixed offsets from pointer addresses. In some applications, this can be used to implement some powerful program control structure, such as software stacks, inside of data memory. Indirect Addressing operations that target other FSRs or virtual registers represent special cases. For example, using an FSR to point to one of the virtual registers will not result in successful operations. As a specific case, assume that the FSR0H:FSR0L registers contain FE7h, the address of INDF1. Attempts to read the value of the INDF1, using INDF0 as an operand, will return 00h. Attempts to write to INDF1, using INDF0 as the operand, will result in a NOP. On the other hand, using the virtual registers to write to an FSR pair may not occur as planned. In these cases, the value will be written to the FSR pair but without any incrementing or decrementing. Thus, writing to INDF2 or POSTDEC2 will write the same value to the FSR2H:FSR2L. Since the FSRs are physical registers mapped in the SFR space, they can be manipulated through all direct operations. Users should proceed cautiously when working on these registers, particularly if their code uses Indirect Addressing. Similarly, operations by Indirect Addressing are generally permitted on all other SFRs. Users should exercise the appropriate caution that they do not inadvertently change settings that might affect the operation of the device.
6.5
Program Memory and the Extended Instruction Set
The operation of program memory is unaffected by the use of the extended instruction set. Enabling the extended instruction set adds five additional two-word commands to the existing PIC18 instruction set: ADDFSR, CALLW, MOVSF, MOVSS and SUBFSR. These instructions are executed as described in Section 6.2.4 "Two-Word Instructions".
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6.6 Data Memory and the Extended Instruction Set
Under these conditions, the file address of the instruction is not interpreted as the lower byte of an address (used with the BSR in Direct Addressing) or as an 8-bit address in the Access Bank. Instead, the value is interpreted as an offset value to an Address Pointer specified by FSR2. The offset and the contents of FSR2 are added to obtain the target address of the operation.
Enabling the PIC18 extended instruction set (XINST Configuration bit = 1) significantly changes certain aspects of data memory and its addressing. Specifically, the use of the Access Bank for many of the core PIC18 instructions is different. This is due to the introduction of a new addressing mode for the data memory space. This mode also alters the behavior of Indirect Addressing using FSR2 and its associated operands. What does not change is just as important. The size of the data memory space is unchanged, as well as its linear addressing. The SFR map remains the same. Core PIC18 instructions can still operate in both Direct and Indirect Addressing mode; inherent and literal instructions do not change at all. Indirect Addressing with FSR0 and FSR1 also remains unchanged.
6.6.2
INSTRUCTIONS AFFECTED BY INDEXED LITERAL OFFSET MODE
Any of the core PIC18 instructions that can use Direct Addressing are potentially affected by the Indexed Literal Offset Addressing mode. This includes all byte-oriented and bit-oriented instructions, or almost one-half of the standard PIC18 instruction set. Instructions that only use Inherent or Literal Addressing modes are unaffected. Additionally, byte-oriented and bit-oriented instructions are not affected if they use the Access Bank (Access RAM bit is `1') or include a file address of 60h or above. Instructions meeting these criteria will continue to execute as before. A comparison of the different possible addressing modes when the extended instruction set is enabled is shown in Figure 6-9. Those who desire to use byte-oriented or bit-oriented instructions in the Indexed Literal Offset mode should note the changes to assembler syntax for this mode. This is described in more detail in Section 27.2.1 "Extended Instruction Syntax".
6.6.1
INDEXED ADDRESSING WITH LITERAL OFFSET
Enabling the PIC18 extended instruction set changes the behavior of Indirect Addressing using the FSR2 register pair and its associated file operands. Under the proper conditions, instructions that use the Access Bank - that is, most bit-oriented and byte-oriented instructions - can invoke a form of Indexed Addressing using an offset specified in the instruction. This special addressing mode is known as Indexed Addressing with Literal Offset, or Indexed Literal Offset mode. When using the extended instruction set, this addressing mode requires the following: * The use of the Access Bank is forced (`a' = 0); and * The file address argument is less than or equal to 5Fh.
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FIGURE 6-9: COMPARING ADDRESSING OPTIONS FOR BIT-ORIENTED AND BYTE-ORIENTED INSTRUCTIONS (EXTENDED INSTRUCTION SET ENABLED)
EXAMPLE INSTRUCTION: ADDWF, f, d, a (Opcode: 0010 01da ffff ffff)
When a = 0 and f 60h: The instruction executes in Direct Forced mode. `f' is interpreted as a location in the Access RAM between 060h and FFFh. This is the same as locations, F60h to FFFh (Bank 15), of data memory. Locations below 060h are not available in this addressing mode.
000h 060h Bank 0 100h 00h Bank 1 through Bank 14 60h Valid range for `f' Access RAM Bank 15 F40h SFRs FFFh Data Memory FFh
F00h
When a = 0 and f5Fh: The instruction executes in Indexed Literal Offset mode. `f' is interpreted as an offset to the address value in FSR2. The two are added together to obtain the address of the target register for the instruction. The address can be anywhere in the data memory space. Note that in this mode, the correct syntax is now: ADDWF [k], d where `k' is the same as `f'.
000h Bank 0 060h 100h Bank 1 through Bank 14 FSR2H F00h Bank 15 F40h SFRs FFFh Data Memory FSR2L 001001da ffffffff
When a = 1 (all values of f): The instruction executes in Direct mode (also known as Direct Long mode). `f' is interpreted as a location in one of the 16 banks of the data memory space. The bank is designated by the Bank Select Register (BSR). The address can be in any implemented bank in the data memory space.
000h Bank 0 060h 100h Bank 1 through Bank 14
BSR 00000000
001001da ffffffff
F00h Bank 15 F40h SFRs FFFh Data Memory
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6.6.3 MAPPING THE ACCESS BANK IN INDEXED LITERAL OFFSET MODE
The use of Indexed Literal Offset Addressing mode effectively changes how the lower part of Access RAM (00h to 5Fh) is mapped. Rather than containing just the contents of the bottom part of Bank 0, this mode maps the contents from Bank 0 and a user-defined "window" that can be located anywhere in the data memory space. The value of FSR2 establishes the lower boundary of the addresses mapped into the window, while the upper boundary is defined by FSR2 plus 95 (5Fh). Addresses in the Access RAM above 5Fh are mapped as previously described (see Section 6.3.2 "Access Bank"). An example of Access Bank remapping in this addressing mode is shown in Figure 6-10. Remapping of the Access Bank applies only to operations using the Indexed Literal Offset mode. Operations that use the BSR (Access RAM bit is `1') will continue to use Direct Addressing as before. Any Indirect or Indexed Addressing operation that explicitly uses any of the indirect file operands (including FSR2) will continue to operate as standard Indirect Addressing. Any instruction that uses the Access Bank, but includes a register address of greater than 05Fh, will use Direct Addressing and the normal Access Bank map.
6.6.4
BSR IN INDEXED LITERAL OFFSET MODE
Although the Access Bank is remapped when the extended instruction set is enabled, the operation of the BSR remains unchanged. Direct Addressing, using the BSR to select the data memory bank, operates in the same manner as previously described.
FIGURE 6-10:
Example Situation:
REMAPPING THE ACCESS BANK WITH INDEXED LITERAL OFFSET ADDRESSING
000h 05Fh
ADDWF f, d, a FSR2H:FSR2L = 120h Locations in the region from the FSR2 Pointer (120h) to the pointer plus 05Fh (17Fh) are mapped to the bottom of the Access RAM (000h-05Fh). Special Function Registers at F60h through FFFh are mapped to 60h through FFh, as usual. Bank 0 addresses below 5Fh are not available in this mode. They can still be addressed by using the BSR.
Not Accessible Bank 0
100h 120h 17Fh 200h
Window Bank 1 Bank 1 "Window"
00h 5Fh 60h
Bank 2 through Bank 14
SFRs FFh
Access Bank
F00h Bank 15 F60h FFFh SFRs
Data Memory
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7.0 FLASH PROGRAM MEMORY
7.1 Table Reads and Table Writes
The Flash program memory is readable, writable and erasable during normal operation over the entire VDD range. A read from program memory is executed on one byte at a time. A write to program memory is executed on blocks of 64 bytes at a time or two bytes at a time. Program memory is erased in blocks of 1,024 bytes at a time. A bulk erase operation may not be issued from user code. Writing or erasing program memory will cease instruction fetches until the operation is complete. The program memory cannot be accessed during the write or erase, therefore, code cannot execute. An internal programming timer terminates program memory writes and erases. A value written to program memory does not need to be a valid instruction. Executing a program memory location that forms an invalid instruction results in a NOP. In order to read and write program memory, there are two operations that allow the processor to move bytes between the program memory space and the data RAM: * Table Read (TBLRD) * Table Write (TBLWT) The program memory space is 16 bits wide, while the data RAM space is 8 bits wide. Table reads and table writes move data between these two memory spaces through an 8-bit register (TABLAT). Table read operations retrieve data from program memory and place it into the data RAM space. Figure 7-1 shows the operation of a table read with program memory and data RAM. Table write operations store data from the data memory space into holding registers in program memory. The procedure to write the contents of the holding registers into program memory is detailed in Section 7.5 "Writing to Flash Program Memory". Figure 7-2 shows the operation of a table write with program memory and data RAM. Table operations work with byte entities. A table block containing data, rather than program instructions, is not required to be word-aligned. Therefore, a table block can start and end at any byte address. If a table write is being used to write executable code into program memory, program instructions will need to be word-aligned.
FIGURE 7-1:
TABLE READ OPERATION
Instruction: TBLRD*
Table Pointer(1) TBLPTRU TBLPTRH TBLPTRL
Program Memory Table Latch (8-bit) TABLAT
Program Memory (TBLPTR)
Note 1:
Table Pointer register points to a byte in program memory.
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FIGURE 7-2: TABLE WRITE OPERATION
Instruction: TBLWT* Program Memory Holding Registers Table Pointer(1) TBLPTRU TBLPTRH TBLPTRL Table Latch (8-bit) TABLAT
Program Memory (TBLPTR)
Note 1:
Table Pointer actually points to one of 64 holding registers, the address of which is determined by TBLPTRL<5:0>. The process for physically writing data to the program memory array is discussed in Section 7.5 "Writing to Flash Program Memory".
7.2
Control Registers
Several control registers are used in conjunction with the TBLRD and TBLWT instructions. These include the: * * * * EECON1 register EECON2 register TABLAT register TBLPTR registers
The FREE bit, when set, will allow a program memory erase operation. When FREE is set, the erase operation is initiated on the next WR command. When FREE is clear, only writes are enabled. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set in hardware when the WR bit is set and cleared when the internal programming timer expires and the write operation is complete. Note: During normal operation, the WRERR is read as `1'. This can indicate that a write operation was prematurely terminated by a Reset, or a write operation was attempted improperly.
7.2.1
EECON1 AND EECON2 REGISTERS
The EECON1 register (Register 7-1) is the control register for memory accesses. The EECON2 register is not a physical register; it is used exclusively in the memory write and erase sequences. Reading EECON2 will read all `0's. The WPROG bit, when set, allows the user to program a single word (two bytes) upon the execution of the WR command. If this bit is cleared, the WR command programs a block of 64 bytes.
The WR control bit initiates write operations. The bit cannot be cleared, only set, in software. It is cleared in hardware at the completion of the write operation.
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REGISTER 7-1:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-6 bit 5 S = Settable bit (cannot be cleared in software) W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
EECON1: EEPROM CONTROL REGISTER 1
U-0 -- R/W-0 WPROG R/W-0 FREE R/W-x WRERR
(1)
R/W-0 WREN
R/S-0 WR
U-0 -- bit 0
Unimplemented: Read as `0' WPROG: One Word-Wide Program bit 1 = Program 2 bytes on the next WR command 0 = Program 64 bytes on the next WR command FREE: Flash Erase Enable bit 1 = Performs an erase operation on the next WR command (cleared by completion of erase operation) 0 = Perform write only WRERR: Flash Program Error Flag bit(1) 1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal operation or an improper write attempt) 0 = The write operation completed WREN: Flash Program Write Enable bit 1 = Allows write cycles to Flash program memory 0 = Inhibits write cycles to Flash program memory WR: Write Control bit 1 = Initiates a program memory erase cycle or write cycle (The operation is self-timed and the bit is cleared by hardware once write is complete. The WR bit can only be set (not cleared) in software.) 0 = Write cycle is complete Unimplemented: Read as `0' When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error condition.
bit 4
bit 3
bit 2
bit 1
bit 0 Note 1:
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7.2.2 TABLE LATCH REGISTER (TABLAT) 7.2.4 TABLE POINTER BOUNDARIES
The Table Latch (TABLAT) is an 8-bit register mapped into the SFR space. The Table Latch register is used to hold 8-bit data during data transfers between program memory and data RAM. TBLPTR is used in reads, writes and erases of the Flash program memory. When a TBLRD is executed, all 22 bits of the TBLPTR determine which byte is read from program memory into TABLAT. When a TBLWT is executed, the seven LSbs of the Table Pointer register (TBLPTR<6:0>) determine which of the 64 program memory holding registers is written to. When the timed write to program memory begins (via the WR bit), the 12 MSbs of the TBLPTR (TBLPTR<21:10>) determine which program memory block of 1,024 bytes is written to. For more detail, see Section 7.5 "Writing to Flash Program Memory". When an erase of program memory is executed, the 12 MSbs of the Table Pointer register point to the 1,024-byte block that will be erased. The Least Significant bits are ignored. Figure 7-3 describes the relevant boundaries of TBLPTR based on Flash program memory operations.
7.2.3
TABLE POINTER REGISTER (TBLPTR)
The Table Pointer (TBLPTR) register addresses a byte within the program memory. The TBLPTR is comprised of three SFR registers: Table Pointer Upper Byte, Table Pointer High Byte and Table Pointer Low Byte (TBLPTRU:TBLPTRH:TBLPTRL). These three registers join to form a 22-bit wide pointer. The low-order 21 bits allow the device to address up to 2 Mbytes of program memory space. The 22nd bit allows access to the device ID, the user ID and the Configuration bits. The Table Pointer register, TBLPTR, is used by the TBLRD and TBLWT instructions. These instructions can update the TBLPTR in one of four ways based on the table operation. These operations are shown in Table 7-1. These operations on the TBLPTR only affect the low-order 21 bits.
TABLE 7-1:
Example TBLRD* TBLWT* TBLRD*+ TBLWT*+ TBLRD*TBLWT*TBLRD+* TBLWT+*
TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS
Operation on Table Pointer TBLPTR is not modified TBLPTR is incremented after the read/write TBLPTR is decremented after the read/write TBLPTR is incremented before the read/write
FIGURE 7-3:
21
TABLE POINTER BOUNDARIES BASED ON OPERATION
TBLPTRU 16 15 TBLPTRH 8 7 TBLPTRL 0
ERASE: TBLPTR<20:10> TABLE WRITE: TBLPTR<20:6> TABLE READ: TBLPTR<21:0>
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7.3 Reading the Flash Program Memory
TBLPTR points to a byte address in program space. Executing TBLRD places the byte pointed to into TABLAT. In addition, TBLPTR can be modified automatically for the next table read operation. The internal program memory is typically organized by words. The Least Significant bit of the address selects between the high and low bytes of the word. Figure 7-4 shows the interface between the internal program memory and the TABLAT.
The TBLRD instruction is used to retrieve data from program memory and places it into data RAM. Table reads from program memory are performed one byte at a time.
FIGURE 7-4:
READS FROM FLASH PROGRAM MEMORY
Program Memory
(Even Byte Address)
(Odd Byte Address)
TBLPTR = xxxxx1
TBLPTR = xxxxx0
Instruction Register (IR)
FETCH
TBLRD
TABLAT Read Register
EXAMPLE 7-1:
READING A FLASH PROGRAM MEMORY WORD
; Load TBLPTR with the base ; address of the word
MOVLWCODE_ADDR_UPPER MOVWFTBLPTRU MOVLWCODE_ADDR_HIGH MOVWFTBLPTRH MOVLWCODE_ADDR_LOW MOVWFTBLPTRL READ_WORD TBLRD*+ MOVF TABLAT, W MOVWFWORD_EVEN TBLRD*+ MOVF TABLAT, W MOVWFWORD_ODD
; read into TABLAT and increment ; get data ; read into TABLAT and increment ; get data
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7.4 Erasing Flash Program Memory
7.4.1
The minimum erase block is 512 words or 1,024 bytes. Only through the use of an external programmer, or through ICSP control, can larger blocks of program memory be bulk erased. Word erase in the Flash array is not supported. When initiating an erase sequence from the microcontroller itself, a block of 1,024 bytes of program memory is erased. The Most Significant 12 bits of the TBLPTR<21:10> point to the block being erased. TBLPTR<9:0> are ignored. The EECON1 register commands the erase operation. The WREN bit must be set to enable write operations. The FREE bit is set to select an erase operation. For protection, the write initiate sequence for EECON2 must be used. A long write is necessary for erasing the internal Flash. Instruction execution is halted while in a long write cycle. The long write will be terminated by the internal programming timer.
FLASH PROGRAM MEMORY ERASE SEQUENCE
The sequence of events for erasing a block of internal program memory location is: 1. 2. 3. 4. 5. 6. 7. 8. Load Table Pointer register with the address being erased. Set the WREN and FREE bits (EECON1<2,4>) to enable the erase operation. Disable interrupts. Write 55h to EECON2. Write 0AAh to EECON2. Set the WR bit. This will begin the erase cycle. The CPU will stall for duration of the erase for TIE (see parameter D133B). Re-enable interrupts.
EXAMPLE 7-2:
ERASING FLASH PROGRAM MEMORY
MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF CODE_ADDR_UPPER TBLPTRU CODE_ADDR_HIGH TBLPTRH CODE_ADDR_LOW TBLPTRL EECON1, EECON1, INTCON, 55h EECON2 0AAh EECON2 EECON1, INTCON, WREN FREE GIE ; load TBLPTR with the base ; address of the memory block
ERASE BSF BSF BCF MOVLW MOVWF MOVLW MOVWF BSF BSF ; enable Erase operation ; disable interrupts ; write 55h ; write 0AAh ; start erase (CPU stall) ; re-enable interrupts
Required Sequence
WR GIE
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7.5 Writing to Flash Program Memory
The programming block is 32 words or 64 bytes. Programming one word or two bytes at a time is also supported. Table writes are used internally to load the holding registers needed to program the Flash memory. There are 64 holding registers used by the table writes for programming. Since the Table Latch (TABLAT) is only a single byte, the TBLWT instruction may need to be executed 64 times for each programming operation (if WPROG = 0). All of the table write operations will essentially be short writes because only the holding registers are written. At the end of updating the 64 holding registers, the EECON1 register must be written to in order to start the programming operation with a long write. The long write is necessary for programming the internal Flash. Instruction execution is halted while in a long write cycle. The long write will be terminated by the internal programming timer. The on-chip timer controls the write time. The write/erase voltages are generated by an on-chip charge pump, rated to operate over the voltage range of the device. Note 1: Unlike previous PIC18 Flash devices, members of the PIC18F87J72 family do not reset the holding registers after a write occurs. The holding registers must be cleared or overwritten before a programming sequence. 2: To maintain the endurance of the program memory cells, each Flash byte should not be programmed more than one time between erase operations. Before attempting to modify the contents of the target cell a second time, an erase of the target, or a bulk erase of the entire memory, must be performed.
FIGURE 7-5:
TABLE WRITES TO FLASH PROGRAM MEMORY
TABLAT Write Register
8
TBLPTR = xxxxx0 TBLPTR = xxxxx1
8
TBLPTR = xxxxx2
8
TBLPTR = xxxx3F
8
Holding Register
Holding Register
Holding Register
Holding Register
Program Memory
7.5.1
FLASH PROGRAM MEMORY WRITE SEQUENCE
The sequence of events for programming an internal program memory location should be: 1. 2. 3. 4. 5. 6. 7. Read 1,024 bytes into RAM. Update data values in RAM as necessary. Load Table Pointer register with the address being erased. Execute the erase procedure. Load Table Pointer register with the address of the first byte being written, minus 1. Write the 64 bytes into the holding registers with auto-increment. Set the WREN bit (EECON1<2>) to enable byte writes.
Disable interrupts. Write 55h to EECON2. Write 0AAh to EECON2. Set the WR bit. This will begin the write cycle. The CPU will stall for the duration of the write for TIW (parameter D133A). 13. Re-enable interrupts. 14. Repeat steps 6 through 13 until all 1,024 bytes are written to program memory. 15. Verify the memory (table read). An example of the required code is shown in Example 7-3 on the following page. Note: Before setting the WR bit, the Table Pointer address needs to be within the intended address range of the 64 bytes in the holding register.
8. 9. 10. 11. 12.
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EXAMPLE 7-3: WRITING TO FLASH PROGRAM MEMORY
MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF ERASE_BLOCK BSF BSF BCF MOVLW MOVWF MOVLW MOVWF BSF BSF MOVLW MOVWF RESTART_BUFFER MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF FILL_BUFFER ... WRITE_BUFFER MOVLW MOVWF WRITE_BYTE_TO_HREGS MOVFF MOVWF TBLWT+* D'64 COUNTER POSTINC0, WREG TABLAT ; number of bytes in holding register ; read the new data from I2C, SPI, ; PSP, USART, etc. D'64' COUNTER BUFFER_ADDR_HIGH FSR0H BUFFER_ADDR_LOW FSR0L EECON1, WREN EECON1, FREE INTCON, GIE 55h EECON2 0AAh EECON2 EECON1, WR INTCON, GIE D'16' WRITE_COUNTER ; enable write to memory ; enable Erase operation ; disable interrupts ; write 55h ; write 0AAh ; start erase (CPU stall) ; re-enable interrupts ; Need to write 16 blocks of 64 to write ; one erase block of 1024 CODE_ADDR_UPPER TBLPTRU CODE_ADDR_HIGH TBLPTRH CODE_ADDR_LOW TBLPTRL ; Load TBLPTR with the base address ; of the memory block, minus 1
; point to buffer
; ; ; ; DECFSZ COUNTER ; BRA WRITE_BYTE_TO_HREGS BSF BCF MOVLW MOVWF MOVLW MOVWF BSF BSF BCF EECON1, INTCON, 55h EECON2 0AAh EECON2 EECON1, INTCON, EECON1, WREN GIE
get low byte of buffer data present data to table latch write data, perform a short write to internal TBLWT holding register. loop until buffers are full
PROGRAM_MEMORY ; enable write to memory ; disable interrupts ; write 55h ; ; ; ; write 0AAh start program (CPU stall) re-enable interrupts disable write to memory
Required Sequence
WR GIE WREN
DECFSZ WRITE_COUNTER BRA RESTART_BUFFER
; done with one write cycle ; if not done replacing the erase block
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7.5.2 FLASH PROGRAM MEMORY WRITE SEQUENCE (WORD PROGRAMMING).
Set WPROG to enable single-word write. Set WREN to enable write to memory. Disable interrupts. Write 55h to EECON2. Write 0AAh to EECON2. Set the WR bit. This will begin the write cycle. The CPU will stall for duration of the write for TIW (see parameter D133A). 10. Re-enable interrupts. 3. 4. 5. 6. 7. 8. 9.
The PIC18F87J72 family of devices has a feature that allows programming a single word (two bytes). This feature is enabled when the WPROG bit is set. If the memory location is already erased, the following sequence is required to enable this feature: 1. 2. Load the Table Pointer register with the address of the data to be written Write the 2 bytes into the holding registers and perform a table write
EXAMPLE 7-4:
SINGLE-WORD WRITE TO FLASH PROGRAM MEMORY
MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF TBLWT*+ MOVLW MOVWF TBLWT* CODE_ADDR_UPPER TBLPTRU CODE_ADDR_HIGH TBLPTRH CODE_ADDR_LOW TBLPTRL DATA0 TABLAT DATA1 TABLAT ; Load TBLPTR with the base address
PROGRAM_MEMORY BSF BSF BCF MOVLW MOVWF MOVLW MOVWF BSF BSF BCF BCF EECON1, EECON1, INTCON, 55h EECON2 0AAh EECON2 EECON1, INTCON, EECON1, EECON1, WPROG WREN GIE ; enable single word write ; enable write to memory ; disable interrupts ; write 55h ; ; ; ; ; write 0AAh start program (CPU stall) re-enable interrupts disable single word write disable write to memory
Required Sequence
WR GIE WPROG WREN
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7.5.3 WRITE VERIFY
7.6
Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit.
Flash Program Operation During Code Protection
See Section 26.6 "Program Verification and Code Protection" for details on code protection of Flash program memory.
7.5.4
UNEXPECTED TERMINATION OF WRITE OPERATION
If a write is terminated by an unplanned event, such as loss of power or an unexpected Reset, the memory location just programmed should be verified and reprogrammed if needed. If the write operation is interrupted by a MCLR Reset or a WDT time-out Reset during normal operation, the user can check the WRERR bit and rewrite the location(s) as needed.
TABLE 7-2:
Name TBLPTRU
REGISTERS ASSOCIATED WITH PROGRAM FLASH MEMORY
Bit 7 -- Bit 6 -- Bit 5 bit 21 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page: 49 49 49 49 INT0IE FREE RBIE WRERR TMR0IF WREN INT0IF WR RBIF -- 49 51 51
Program Memory Table Pointer Upper Byte (TBLPTR<20:16>)
TBPLTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) TABLAT INTCON EECON2 EECON1 Program Memory Table Latch GIE/GIEH PEIE/GIEL -- -- TMR0IE WPROG EEPROM Control Register 2 (not a physical register)
Legend: -- = unimplemented, read as `0'. Shaded cells are not used during Flash program memory access.
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8.0
8.1
8 x 8 HARDWARE MULTIPLIER
Introduction
EXAMPLE 8-1:
MOVF MULWF ARG1, W ARG2
8 x 8 UNSIGNED MULTIPLY ROUTINE
; ; ARG1 * ARG2 -> ; PRODH:PRODL
All PIC18 devices include an 8 x 8 hardware multiplier as part of the ALU. The multiplier performs an unsigned operation and yields a 16-bit result that is stored in the product register pair, PRODH:PRODL. The multiplier's operation does not affect any flags in the STATUS register. Making multiplication a hardware operation allows it to be completed in a single instruction cycle. This has the advantages of higher computational throughput and reduced code size for multiplication algorithms and allows the PIC18 devices to be used in many applications previously reserved for digital signal processors. A comparison of various hardware and software multiply operations, along with the savings in memory and execution time, is shown in Table 8-1.
EXAMPLE 8-2:
MOVF MULWF BTFSC SUBWF MOVF BTFSC SUBWF ARG1, W ARG2 ARG2, SB PRODH, F ARG2, W ARG1, SB PRODH, F
8 x 8 SIGNED MULTIPLY ROUTINE
; ; ; ; ; ARG1 * ARG2 -> PRODH:PRODL Test Sign Bit PRODH = PRODH - ARG1
8.2
Operation
; Test Sign Bit ; PRODH = PRODH ; - ARG2
Example 8-1 shows the instruction sequence for an 8 x 8 unsigned multiplication. Only one instruction is required when one of the arguments is already loaded in the WREG register. Example 8-2 shows the sequence to do an 8 x 8 signed multiplication. To account for the sign bits of the arguments, each argument's Most Significant bit (MSb) is tested and the appropriate subtractions are done.
TABLE 8-1:
Routine
PERFORMANCE COMPARISON FOR VARIOUS MULTIPLY OPERATIONS
Multiply Method Without hardware multiply Hardware multiply Without hardware multiply Hardware multiply Without hardware multiply Hardware multiply Without hardware multiply Hardware multiply Program Memory (Words) 13 1 33 6 21 28 52 35 Cycles (Max) 69 1 91 6 242 28 254 40 Time @ 48 MHz 5.7 s 83.3 ns 7.5 s 500 ns 20.1 s 2.3 s 21.6 s 3.3 s @ 10 MHz 27.6 s 400 ns 36.4 s 2.4 s 96.8 s 11.2 s 102.6 s 16.0 s @ 4 MHz 69 s 1 s 91 s 6 s 242 s 28 s 254 s 40 s
8 x 8 unsigned 8 x 8 signed 16 x 16 unsigned 16 x 16 signed
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Example 8-3 shows the sequence to do a 16 x 16 unsigned multiplication. Equation 8-1 shows the algorithm that is used. The 32-bit result is stored in four registers (RES3:RES0).
EQUATION 8-2:
16 x 16 SIGNED MULTIPLICATION ALGORITHM
EQUATION 8-1:
16 x 16 UNSIGNED MULTIPLICATION ALGORITHM
ARG1H:ARG1L ARG2H:ARG2L (ARG1H ARG2H 216) + (ARG1H ARG2L 28) + (ARG1L ARG2H 28) + (ARG1L ARG2L)
RES3:RES0= =
RES3:RES0
= =
ARG1H:ARG1L ARG2H:ARG2L (ARG1H ARG2H 216) + (ARG1H ARG2L 28) + (ARG1L ARG2H 28) + (ARG1L ARG2L) + (-1 ARG2H<7> ARG1H:ARG1L 216) + (-1 ARG1H<7> ARG2H:ARG2L 216)
EXAMPLE 8-4:
MOVF ARG1L, W MULWFARG2L
16 x 16 SIGNED MULTIPLY ROUTINE
EXAMPLE 8-3:
MOVF MULWF MOVFF MOVFF ; MOVF MULWF MOVFF MOVFF ; MOVF MULWF MOVF ADDWF MOVF ADDWFC CLRF ADDWFC ; MOVF MULWF MOVF ADDWF MOVF ADDWFC CLRF ADDWFC
16 x 16 UNSIGNED MULTIPLY ROUTINE
; ARG1L * ARG2L-> ; PRODH:PRODL ; ; ;
ARG1L, W ARG2L PRODH, RES1 PRODL, RES0 ARG1H, W ARG2H PRODH, RES3 PRODL, RES2 ARG1L, W ARG2H PRODL, W RES1, F PRODH, W RES2, F WREG RES3, F ARG1H, W ARG2L PRODL, W RES1, F PRODH, W RES2, F WREG RES3, F
; ARG1L * ARG2L -> ; PRODH:PRODL MOVFFPRODH, RES1 ; MOVFFPRODL, RES0 ; MOVF ARG1H, W MULWFARG2H ; ARG1H * ARG2H -> ; PRODH:PRODL MOVFFPRODH, RES3 ; MOVFFPRODL, RES2 ; ; MOVF ARG1L, W MULWFARG2H MOVF PRODL, W ADDWFRES1, F MOVF PRODH, W ADDWFCRES2, F CLRF WREG ADDWFCRES3, F ; MOVF ARG1H, W MULWFARG2L MOVF PRODL, W ADDWFRES1, F MOVF PRODH, W ADDWFC RES2, F CLRF WREG ADDWFCRES3, F ; BTFSSARG2H, 7 BRA SIGN_ARG1 MOVF ARG1L, W SUBWFRES2 MOVF ARG1H, W SUBWFBRES3 ; SIGN_ARG1 BTFSSARG1H, 7 BRA CONT_CODE MOVF ARG2L, W SUBWFRES2 MOVF ARG2H, W SUBWFBRES3 ; CONT_CODE : ; ARG2H:ARG2L neg? ; no, check ARG1 ; ; ; ; ; ; ; ; ; ; ; ; ARG1H * ARG2L -> PRODH:PRODL Add cross products ; ; ; ; ; ; ; ; ARG1L * ARG2H -> PRODH:PRODL Add cross products
; ARG1H * ARG2H-> ; PRODH:PRODL ; ;
; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ;
ARG1L * ARG2H-> PRODH:PRODL Add cross products
ARG1H * ARG2L-> PRODH:PRODL Add cross products
Example 8-4 shows the sequence to do a 16 x 16 signed multiply. Equation 8-2 shows the algorithm used. The 32-bit result is stored in four registers (RES3:RES0). To account for the sign bits of the arguments, the MSb for each argument pair is tested and the appropriate subtractions are done.
; ARG1H:ARG1L neg? ; no, done ; ; ;
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9.0 INTERRUPTS
Members of the PIC18F87J72 family of devices have multiple interrupt sources and an interrupt priority feature that allows most interrupt sources to be assigned a high-priority level or a low-priority level. The high-priority interrupt vector is at 0008h and the low-priority interrupt vector is at 0018h. High-priority interrupt events will interrupt any low-priority interrupts that may be in progress. There are thirteen registers which are used to control interrupt operation. These registers are: * * * * * * * RCON INTCON INTCON2 INTCON3 PIR1, PIR2, PIR3 PIE1, PIE2, PIE3 IPR1, IPR2, IPR3 When the IPEN bit is cleared (default state), the interrupt priority feature is disabled and interrupts are compatible with PIC(R) mid-range devices. In Compatibility mode, the interrupt priority bits for each source have no effect. INTCON<6> is the PEIE bit which enables/disables all peripheral interrupt sources. INTCON<7> is the GIE bit which enables/disables all interrupt sources. All interrupts branch to address 0008h in Compatibility mode. When an interrupt is responded to, the global interrupt enable bit is cleared to disable further interrupts. If the IPEN bit is cleared, this is the GIE bit. If interrupt priority levels are used, this will be either the GIEH or GIEL bit. High-priority interrupt sources can interrupt a low-priority interrupt. Low-priority interrupts are not processed while high-priority interrupts are in progress. The return address is pushed onto the stack and the PC is loaded with the interrupt vector address (0008h or 0018h). Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bits must be cleared in software before re-enabling interrupts to avoid recursive interrupts. The "return from interrupt" instruction, RETFIE, exits the interrupt routine and sets the GIE bit (GIEH or GIEL if priority levels are used) which re-enables interrupts. For external interrupt events, such as the INTx pins or the PORTB input change interrupt, the interrupt latency will be three to four instruction cycles. The exact latency is the same for one or two-cycle instructions. Individual interrupt flag bits are set regardless of the status of their corresponding enable bit or the GIE bit. Note: Do not use the MOVFF instruction to modify any of the Interrupt Control registers while any interrupt is enabled. Doing so may cause erratic microcontroller behavior.
It is recommended that the Microchip header files supplied with MPLAB(R) IDE be used for the symbolic bit names in these registers. This allows the assembler/compiler to automatically take care of the placement of these bits within the specified register. In general, interrupt sources have three bits to control their operation. They are: * Flag bit to indicate that an interrupt event occurred * Enable bit that allows program execution to branch to the interrupt vector address when the flag bit is set * Priority bit to select high priority or low priority The interrupt priority feature is enabled by setting the IPEN bit (RCON<7>). When interrupt priority is enabled, there are two bits which enable interrupts globally. Setting the GIEH bit (INTCON<7>) enables all interrupts that have the priority bit set (high priority). Setting the GIEL bit (INTCON<6>) enables all interrupts that have the priority bit cleared (low priority). When the interrupt flag, enable bit and appropriate global interrupt enable bit are set, the interrupt will vector immediately to address 0008h or 0018h, depending on the priority bit setting. Individual interrupts can be disabled through their corresponding enable bits.
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FIGURE 9-1: PIC18F87J72 FAMILY INTERRUPT LOGIC
TMR0IF TMR0IE TMR0IP RBIF RBIE RBIP INT0IF INT0IE INT1IF INT1IE INT1IP INT2IF INT2IE INT2IP INT3IF INT3IE INT3IP Wake-up if in Idle or Sleep modes
PIR1<6:3,1:0> PIE1<6:3,1:0> IPR1<6:3,1:0> PIR2<7:6,3:1> PIE2<7:6 3:1> IPR2<7:6,3:1> PIR3<6:0> PIE3<6:0> IPR3<6:0>
Interrupt to CPU Vector to Location 0008h
GIE/GIEH
IPEN IPEN PEIE/GIEL IPEN
High-Priority Interrupt Generation Low-Priority Interrupt Generation
PIR1<6:3,1:0> PIE1<6:3,1:0> IPR1<6:3,1:0> PIR2<7:6,3:1> PIE2<7:6,3:1> IPR2<7:6,3:1> PIR3<6:0> PIE3<6:0> IPR3<6:0>
TMR0IF TMR0IE TMR0IP RBIF RBIE RBIP INT1IF INT1IE INT1IP INT2IF INT2IE INT2IP INT3IF INT3IE INT3IP
IPEN
Interrupt to CPU Vector to Location 0018h
GIE/GIEH PEIE/GIEL
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9.1 INTCON Registers
Note: The INTCON registers are readable and writable registers which contain various enable, priority and flag bits. Interrupt flag bits are set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the global interrupt enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling.
REGISTER 9-1:
R/W-0 GIE/GIEH bit 7 Legend: R = Readable bit -n = Value at POR bit 7
INTCON: INTERRUPT CONTROL REGISTER
R/W-0 R/W-0 TMR0IE R/W-0 INT0IE R/W-0 RBIE R/W-0 TMR0IF R/W-0 INT0IF R/W-x RBIF(1) bit 0
PEIE/GIEL
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
GIE/GIEH: Global Interrupt Enable bit When IPEN = 0: 1 = Enables all unmasked interrupts 0 = Disables all interrupts When IPEN = 1: 1 = Enables all high-priority interrupts 0 = Disables all interrupts PEIE/GIEL: Peripheral Interrupt Enable bit When IPEN = 0: 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts When IPEN = 1: 1 = Enables all low-priority peripheral interrupts 0 = Disables all low-priority peripheral interrupts TMR0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 overflow interrupt 0 = Disables the TMR0 overflow interrupt INT0IE: INT0 External Interrupt Enable bit 1 = Enables the INT0 external interrupt 0 = Disables the INT0 external interrupt RBIE: RB Port Change Interrupt Enable bit 1 = Enables the RB port change interrupt 0 = Disables the RB port change interrupt TMR0IF: TMR0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow INT0IF: INT0 External Interrupt Flag bit 1 = The INT0 external interrupt occurred (must be cleared in software) 0 = The INT0 external interrupt did not occur RBIF: RB Port Change Interrupt Flag bit(1) 1 = At least one of the RB<7:4> pins changed state (must be cleared in software) 0 = None of the RB<7:4> pins have changed state A mismatch condition will continue to set this bit. Reading PORTB, then waiting one instruction cycle, will end the mismatch condition and allow the bit to be cleared.
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
Note 1:
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REGISTER 9-2:
R/W-1 RBPU bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
INTCON2: INTERRUPT CONTROL REGISTER 2
R/W-1 R/W-1 INTEDG1 R/W-1 INTEDG2 R/W-1 INTEDG3 R/W-1 TMR0IP R/W-1 INT3IP R/W-1 RBIP bit 0
INTEDG0
RBPU: PORTB Pull-up Enable bit 1 = All PORTB pull-ups are disabled 0 = PORTB pull-ups are enabled by individual port latch values INTEDG0: External Interrupt 0 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge INTEDG1: External Interrupt 1 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge INTEDG2: External Interrupt 2 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge INTEDG3: External Interrupt 3 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge TMR0IP: TMR0 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority INT3IP: INT3 External Interrupt Priority bit 1 = High priority 0 = Low priority RBIP: RB Port Change Interrupt Priority bit 1 = High priority 0 = Low priority
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
Note:
Interrupt flag bits are set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the global interrupt enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling.
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REGISTER 9-3:
R/W-1 INT2IP bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
INTCON3: INTERRUPT CONTROL REGISTER 3
R/W-1 INT1IP R/W-0 INT3IE R/W-0 INT2IE R/W-0 INT1IE R/W-0 INT3IF R/W-0 INT2IF R/W-0 INT1IF bit 0
INT2IP: INT2 External Interrupt Priority bit 1 = High priority 0 = Low priority INT1IP: INT1 External Interrupt Priority bit 1 = High priority 0 = Low priority INT3IE: INT3 External Interrupt Enable bit 1 = Enables the INT3 external interrupt 0 = Disables the INT3 external interrupt INT2IE: INT2 External Interrupt Enable bit 1 = Enables the INT2 external interrupt 0 = Disables the INT2 external interrupt INT1IE: INT1 External Interrupt Enable bit 1 = Enables the INT1 external interrupt 0 = Disables the INT1 external interrupt INT3IF: INT3 External Interrupt Flag bit 1 = The INT3 external interrupt occurred (must be cleared in software) 0 = The INT3 external interrupt did not occur INT2IF: INT2 External Interrupt Flag bit 1 = The INT2 external interrupt occurred (must be cleared in software) 0 = The INT2 external interrupt did not occur INT1IF: INT1 External Interrupt Flag bit 1 = The INT1 external interrupt occurred (must be cleared in software) 0 = The INT1 external interrupt did not occur
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
Note:
Interrupt flag bits are set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the global interrupt enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling.
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9.2 PIR Registers
The PIR registers contain the individual flag bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are three Peripheral Interrupt Request (Flag) registers (PIR1, PIR2, PIR3). Note 1: Interrupt flag bits are set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE (INTCON<7>). 2: User software should ensure the appropriate interrupt flag bits are cleared prior to enabling an interrupt and after servicing that interrupt.
REGISTER 9-4:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6
PIR1: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 1
R/W-0 ADIF R-0 RC1IF R-0 TX1IF R/W-0 SSPIF U-0 -- R/W-0 TMR2IF R/W-0 TMR1IF bit 0
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
Unimplemented: Read as `0' ADIF: A/D Converter Interrupt Flag bit 1 = An A/D conversion completed (must be cleared in software) 0 = The A/D conversion is not complete RC1IF: EUSART Receive Interrupt Flag bit 1 = The EUSART receive buffer, RCREG1, is full (cleared when RCREG1 is read) 0 = The EUSART receive buffer is empty TX1IF: EUSART Transmit Interrupt Flag bit 1 = The EUSART transmit buffer, TXREG1, is empty (cleared when TXREG1 is written) 0 = The EUSART transmit buffer is full SSPIF: Master Synchronous Serial Port Interrupt Flag bit 1 = The transmission/reception is complete (must be cleared in software) 0 = Waiting to transmit/receive Unimplemented: Read as `0' TMR2IF: TMR2 to PR2 Match Interrupt Flag bit 1 = TMR2 to PR2 match occurred (must be cleared in software) 0 = No TMR2 to PR2 match occurred TMR1IF: TMR1 Overflow Interrupt Flag bit 1 = TMR1 register overflowed (must be cleared in software) 0 = TMR1 register did not overflow
bit 5
bit 4
bit 3
bit 2 bit 1
bit 0
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REGISTER 9-5:
R/W-0 OSCFIF bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
PIR2: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 2
R/W-0 CMIF U-0 -- U-0 -- R/W-0 BCLIF R/W-0 LVDIF R/W-0 TMR3IF U-0 -- bit 0
OSCFIF: Oscillator Fail Interrupt Flag bit 1 = Device oscillator failed, clock input has changed to INTOSC (must be cleared in software) 0 = Device clock operating CMIF: Comparator Interrupt Flag bit 1 = Comparator input has changed (must be cleared in software) 0 = Comparator input has not changed Unimplemented: Read as `0' BCLIF: Bus Collision Interrupt Flag bit 1 = A bus collision occurred (must be cleared in software) 0 = No bus collision occurred LVDIF: Low-Voltage Detect Interrupt Flag bit 1 = A low-voltage condition occurred (must be cleared in software) 0 = The device voltage is above the regulator's low-voltage trip point TMR3IF: TMR3 Overflow Interrupt Flag bit 1 = TMR3 register overflowed (must be cleared in software) 0 = TMR3 register did not overflow Unimplemented: Read as `0'
bit 6
bit 5-4 bit 3
bit 2
bit 1
bit 0
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REGISTER 9-6:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
PIR3: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 3
R/W-0 LCDIF R-0 RC2IF R-0 TX2IF R/W-0 CTMUIF R/W-0 CCP2IF R/W-0 CCP1IF R/W-0 RTCCIF bit 0
Unimplemented: Read as `0' LCDIF: LCD Interrupt Flag bit (valid when Type-B waveform with Non-Static mode is selected) 1 = LCD data of all COMs is output (must be cleared in software) 0 = LCD data of all COMs is not yet output RC2IF: AUSART Receive Interrupt Flag bit 1 = The AUSART receive buffer, RCREG2, is full (cleared when RCREG2 is read) 0 = The AUSART receive buffer is empty TX2IF: AUSART Transmit Interrupt Flag bit 1 = The AUSART transmit buffer, TXREG2, is empty (cleared when TXREG2 is written) 0 = The AUSART transmit buffer is full CTMUIF: CTMU Interrupt Flag bit 1 = CTMU interrupt occured (must be cleared in software) 0 = No CTMU interrupt occured CCP2IF: CCP2 Interrupt Flag bit Capture mode: 1 = A TMR1/TMR3 register capture occurred (must be cleared in software) 0 = No TMR1/TMR3 register capture occurred Compare mode: 1 = A TMR1/TMR3 register compare match occurred (must be cleared in software) 0 = No TMR1/TMR3 register compare match occurred PWM mode: Unused in this mode. CCP1IF: CCP1 Interrupt Flag bit Capture mode: 1 = A TMR1/TMR3 register capture occurred (must be cleared in software) 0 = No TMR1/TMR3 register capture occurred Compare mode: 1 = A TMR1/TMR3 register compare match occurred (must be cleared in software) 0 = No TMR1/TMR3 register compare match occurred PWM mode: Unused in this mode. RTCCIF: RTCC Interrupt Flag bit 1 = RTCC interrupt occured (must be cleared in software) 0 = No RTCC interrupt occured
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
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9.3 PIE Registers
The PIE registers contain the individual enable bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are three Peripheral Interrupt Enable registers (PIE1, PIE2, PIE3). When IPEN = 0, the PEIE bit must be set to enable any of these peripheral interrupts.
REGISTER 9-7:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6
PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
R/W-0 ADIE R/W-0 RC1IE R/W-0 TX1IE R/W-0 SSPIE U-0 -- R/W-0 TMR2IE R/W-0 TMR1IE bit 0
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
Unimplemented: Read as `0' ADIE: A/D Converter Interrupt Enable bit 1 = Enables the A/D interrupt 0 = Disables the A/D interrupt RC1IE: EUSART Receive Interrupt Enable bit 1 = Enables the EUSART receive interrupt 0 = Disables the EUSART receive interrupt TX1IE: EUSART Transmit Interrupt Enable bit 1 = Enables the EUSART transmit interrupt 0 = Disables the EUSART transmit interrupt SSPIE: Master Synchronous Serial Port Interrupt Enable bit 1 = Enables the MSSP interrupt 0 = Disables the MSSP interrupt Unimplemented: Read as `0' TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the TMR2 to PR2 match interrupt 0 = Disables the TMR2 to PR2 match interrupt TMR1IE: TMR1 Overflow Interrupt Enable bit 1 = Enables the TMR1 overflow interrupt 0 = Disables the TMR1 overflow interrupt
bit 5
bit 4
bit 3
bit 2 bit 1
bit 0
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REGISTER 9-8:
R/W-0 OSCFIE bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0 CMIE U-0 -- U-0 -- R/W-0 BCLIE R/W-0 LVDIE R/W-0 TMR3IE U-0 -- bit 0
OSCFIE: Oscillator Fail Interrupt Enable bit 1 = Enabled 0 = Disabled CMIE: Comparator Interrupt Enable bit 1 = Enabled 0 = Disabled Unimplemented: Read as `0' BCLIE: Bus Collision Interrupt Enable bit 1 = Enabled 0 = Disabled LVDIE: Low-Voltage Detect Interrupt Enable bit 1 = Enabled 0 = Disabled TMR3IE: TMR3 Overflow Interrupt Enable bit 1 = Enabled 0 = Disabled Unimplemented: Read as `0'
bit 6
bit 5-4 bit 3
bit 2
bit 1
bit 0
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REGISTER 9-9:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3
R/W-0 LCDIE R-0 RC2IE R-0 TX2IE R/W-0 CTMUIE R/W-0 CCP2IE R/W-0 CCP1IE R/W-0 RTCCIE bit 0
Unimplemented: Read as `0' LCDIE: LCD Interrupt Enable bit (valid when Type-B waveform with Non-Static mode is selected) 1 = Enabled 0 = Disabled RC2IE: AUSART Receive Interrupt Enable bit 1 = Enabled 0 = Disabled TX2IE: AUSART Transmit Interrupt Enable bit 1 = Enabled 0 = Disabled CTMUIE: CTMU Interrupt Enable bit 1 = Enabled 0 = Disabled CCP2IE: CCP2 Interrupt Enable bit 1 = Enabled 0 = Disabled CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt RTCCIE: RTCC Interrupt Enable bit 1 = Enabled 0 = Disabled
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
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9.4 IPR Registers
The IPR registers contain the individual priority bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are three Peripheral Interrupt Priority registers (IPR1, IPR2, IPR3). Using the priority bits requires that the Interrupt Priority Enable (IPEN) bit be set.
REGISTER 9-10:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6
IPR1: PERIPHERAL INTERRUPT PRIORITY REGISTER 1
R/W-1 RC1IP R/W-1 TX1IP R/W-1 SSPIP U-0 -- R/W-1 TMR2IP R/W-1 TMR1IP bit 0 ADIP
R/W-1
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
Unimplemented: Read as `0' ADIP: A/D Converter Interrupt Priority bit 1 = High priority 0 = Low priority RC1IP: EUSART Receive Interrupt Priority bit 1 = High priority 0 = Low priority TX1IP: EUSART Transmit Interrupt Priority bit 1 = High priority 0 = Low priority
bit 5
bit 4
bit 3
SSPIP: Master Synchronous Serial Port Interrupt Priority bit 1 = High priority 0 = Low priority Unimplemented: Read as `0' TMR2IP: TMR2 to PR2 Match Interrupt Priority bit 1 = High priority 0 = Low priority TMR1IP: TMR1 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority
bit 2 bit 1
bit 0
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REGISTER 9-11:
R/W-1 OSCFIP bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
IPR2: PERIPHERAL INTERRUPT PRIORITY REGISTER 2
U-0 -- U-0 -- R/W-1 BCLIP R/W-1 LVDIP R/W-1 TMR3IP U-0 -- bit 0
R/W-1 CMIP
OSCFIP: Oscillator Fail Interrupt Priority bit 1 = High priority 0 = Low priority CMIP: Comparator Interrupt Priority bit 1 = High priority 0 = Low priority Unimplemented: Read as `0' BCLIP: Bus Collision Interrupt Priority bit 1 = High priority 0 = Low priority LVDIP: Low-Voltage Detect Interrupt Priority bit 1 = High priority 0 = Low priority TMR3IP: TMR3 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority Unimplemented: Read as `0'
bit 6
bit 5-4 bit 3
bit 2
bit 1
bit 0
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REGISTER 9-12:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
IPR3: PERIPHERAL INTERRUPT PRIORITY REGISTER 3
R-1 RC2IP R-1 TX2IP R/W-1 CTMUIP R/W-1 CCP2IP R/W-1 CCP1IP R/W-1 RTCCIP bit 0
R/W-1 LCDIP
Unimplemented: Read as `0' LCDIP: LCD Interrupt Priority bit (valid when Type-B waveform with Non-Static mode is selected) 1 = High priority 0 = Low priority RC2IP: AUSART Receive Priority Flag bit 1 = High priority 0 = Low priority TX2IP: AUSART Transmit Interrupt Priority bit 1 = High priority 0 = Low priority CTMUIP: CTMU Interrupt Priority bit 1 = High priority 0 = Low priority CCP2IP: CCP2 Interrupt Priority bit 1 = High priority 0 = Low priority CCP1IP: CCP1 Interrupt Priority bit 1 = High priority 0 = Low priority RTCCIP: RTCC Interrupt Priority bit 1 = High priority 0 = Low priority
bit 5
bit 4
bit 3
bit
bit
bit 0
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9.5 RCON Register
The RCON register contains bits used to determine the cause of the last Reset or wake-up from Idle or Sleep modes. RCON also contains the bit that enables interrupt priorities (IPEN).
REGISTER 9-13:
R/W-0 IPEN bit 7 Legend: R = Readable bit -n = Value at POR bit 7
RCON: RESET CONTROL REGISTER
U-0 -- R/W-1 CM R/W-1 RI R-1 TO R-1 PD R/W-0 POR R/W-0 BOR bit 0
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
IPEN: Interrupt Priority Enable bit 1 = Enable priority levels on interrupts 0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode) Unimplemented: Read as `0' CM: Configuration Mismatch Flag bit 1 = A Configuration Mismatch Reset has not occurred 0 = A Configuration Mismatch Reset has occurred (Must be subsequently set in software.) RI: RESET Instruction Flag bit For details of bit operation, see Register 5-1. TO: Watchdog Timer Time-out Flag bit For details of bit operation, see Register 5-1. PD: Power-Down Detection Flag bit For details of bit operation, see Register 5-1. POR: Power-on Reset Status bit For details of bit operation, see Register 5-1. BOR: Brown-out Reset Status bit For details of bit operation, see Register 5-1.
bit 6 bit 5
bit 4 bit 3 bit 2 bit 1 bit 0
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9.6 INTx Pin Interrupts 9.7 TMR0 Interrupt
External interrupts on the RB0/INT0, RB1/INT1, RB2/INT2 and RB3/INT3 pins are edge-triggered. If the corresponding INTEDGx bit in the INTCON2 register is set (= 1), the interrupt is triggered by a rising edge; if the bit is clear, the trigger is on the falling edge. When a valid edge appears on the RBx/INTx pin, the corresponding flag bit, INTxIF, is set. This interrupt can be disabled by clearing the corresponding enable bit, INTxIE. Flag bit, INTxIF, must be cleared in software in the Interrupt Service Routine (ISR) before re-enabling the interrupt. All external interrupts (INT0, INT1, INT2 and INT3) can wake-up the processor from the power-managed modes if bit INTxIE was set prior to going into the power-managed modes. If the Global Interrupt Enable bit, GIE, is set, the processor will branch to the interrupt vector following wake-up. Interrupt priority for INT1, INT2 and INT3 is determined by the value contained in the interrupt priority bits, INT1IP (INTCON3<6>), INT2IP (INTCON3<7>) and INT3IP (INTCON2<1>). There is no priority bit associated with INT0. It is always a high-priority interrupt source. In 8-bit mode (which is the default), an overflow in the TMR0 register (FFh 00h) will set flag bit, TMR0IF. In 16-bit mode, an overflow in the TMR0H:TMR0L register pair (FFFFh 0000h) will set TMR0IF. The interrupt can be enabled/disabled by setting/clearing enable bit, TMR0IE (INTCON<5>). Interrupt priority for Timer0 is determined by the value contained in the interrupt priority bit, TMR0IP (INTCON2<2>). See Section 11.0 "Timer0 Module" for further details on the Timer0 module.
9.8
PORTB Interrupt-on-Change
An input change on PORTB<7:4> sets flag bit, RBIF (INTCON<0>). The interrupt can be enabled/disabled by setting/clearing enable bit, RBIE (INTCON<3>). Interrupt priority for PORTB interrupt-on-change is determined by the value contained in the interrupt priority bit, RBIP (INTCON2<0>).
9.9
Context Saving During Interrupts
During interrupts, the return PC address is saved on the stack. Additionally, the WREG, STATUS and BSR registers are saved on the Fast Return Stack. If a fast return from interrupt is not used (see Section 6.3 "Data Memory Organization"), the user may need to save the WREG, STATUS and BSR registers on entry to the Interrupt Service Routine. Depending on the user's application, other registers may also need to be saved. Example 9-1 saves and restores the WREG, STATUS and BSR registers during an Interrupt Service Routine.
EXAMPLE 9-1:
MOVWF MOVFF MOVFF ; ; USER ; MOVFF MOVF MOVFF
SAVING STATUS, WREG AND BSR REGISTERS IN RAM
; W_TEMP is in virtual bank ; STATUS_TEMP located anywhere ; BSR_TMEP located anywhere
W_TEMP STATUS, STATUS_TEMP BSR, BSR_TEMP ISR CODE BSR_TEMP, BSR W_TEMP, W STATUS_TEMP, STATUS
; Restore BSR ; Restore WREG ; Restore STATUS
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10.0 I/O PORTS
10.1 I/O Port Pin Capabilities
Depending on the features enabled, there are up to seven ports available. Some pins of the I/O ports are multiplexed with an alternate function from the peripheral features on the device. In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin. Each port has three memory mapped registers for its operation: * TRIS register (Data Direction register) * PORT register (reads the levels on the pins of the device) * LAT register (Output Latch register) Reading the PORT register reads the current status of the pins, whereas writing to the PORT register, writes to the Output Latch (LAT) register. Setting a TRIS bit (= 1) makes the corresponding PORT pin an input (i.e., put the corresponding output driver in a high-impedance mode). Clearing a TRIS bit (= 0) makes the corresponding PORT pin an output (i.e., put the contents of the corresponding LAT bit on the selected pin). The Output Latch (LAT register) is useful for read-modify-write operations on the value that the I/O pins are driving. Read-modify-write operations on the LAT register read and write the latched output value for the PORT register. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure 10-1. When developing an application, the capabilities of the port pins must be considered. Outputs on some pins have higher output drive strength than others. Similarly, some pins can tolerate higher than VDD input levels.
10.1.1
INPUT PINS AND VOLTAGE CONSIDERATIONS
The voltage tolerance of pins used as device inputs is dependent on the pin's input function. Most of the pins that are used as digital only inputs are able to handle DC voltages up to 5.5V, a level typical for digital logic circuits. In contrast, pins that also have analog input functions of any kind can only tolerate voltages up to VDD. Table 10-1 summarizes the input voltage capabilities of the I/O pins. Refer to Section 29.0 "Electrical Characteristics" for more details. Voltage excursions beyond VDD on these pins should be avoided.
TABLE 10-1:
PORT or Pin PORTA<7:0> PORTC<1:0> PORTF<1,0> PORTF<7:1> PORTG<3:2, 0> PORTB<7:0> PORTC<7:2> PORTD<7:0> PORTE<7:2> PORTG<4,1>
INPUT VOLTAGE TOLERANCE
Tolerated Input Description Only VDD input levels tolerated. VDD
FIGURE 10-1:
GENERIC I/O PORT OPERATION
5.5V
Tolerates input levels above VDD, useful for most standard logic.
RD LAT Data Bus WR LAT or PORT
10.1.2
D CKx Data Latch D Q Q I/O Pin
PIN OUTPUT DRIVE
When used as digital I/O, the output pin drive strengths vary for groups of pins intended to meet the needs for a variety of applications. In general, there are three classes of output pins in terms of drive capability. PORTB and PORTC, as well as PORTA<7:6>, are designed to drive higher current loads, such as LEDs. PORTD, PORTE and PORTJ can also drive LEDs but only those with smaller current requirements. PORTF, PORTG and PORTH, along with PORTA<5:0>, have the lowest drive level but are capable of driving normal digital circuit loads with a high input impedance. Regardless of which port it is located on, all output pins in LCD Segment or common-mode have sufficient output to directly drive a display. Table 10-2 summarizes the output capabilities of the ports. Refer to the "Absolute Maximum Ratings" in Section 29.0 "Electrical Characteristics" for more details.
WR TRIS
CKx TRIS Latch Input Buffer
RD TRIS
Q
D EN EN
RD PORT
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TABLE 10-2:
Low PORTA<5:0> PORTF PORTG
OUTPUT DRIVE LEVELS FOR VARIOUS PORTS
Medium PORTD PORTE High PORTA<7:6> PORTB PORTC
10.2
PORTA, TRISA and LATA Registers
PORTA is an 8-bit wide, bidirectional port. The corresponding Data Direction and Output Latch registers are TRISA and LATA. RA4/T0CKI is a Schmitt Trigger input. All other PORTA pins have TTL input levels and full CMOS output drivers. The RA4 pin is multiplexed with the Timer0 clock input and one of the LCD segment drives. RA5 and RA<3:0> are multiplexed with analog inputs for the A/D Converter. The operation of the analog inputs as A/D Converter inputs is selected by clearing or setting the PCFG<3:0> control bits in the ADCON1 register. The corresponding TRISA bits control the direction of these pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISA register are maintained set when using them as analog inputs. Note: RA5 and RA<3:0> are configured as analog inputs on any Reset and are read as `0'. RA4 is configured as a digital input.
10.1.3
PULL-UP CONFIGURATION
Four of the I/O ports (PORTB, PORTD, PORTE and PORTJ) implement configurable weak pull-ups on all pins. These are internal pull-ups that allow floating digital input signals to be pulled to a consistent level without the use of external resistors. The pull-ups are enabled with a single bit for each of the ports: RBPU (INTCON2<7>) for PORTB, and RDPU, REPU and PJPU (PORTG<7:5>) for the other ports.
10.1.4
OPEN-DRAIN OUTPUTS
The output pins for several peripherals are also equipped with a configurable, open-drain output option. This allows the peripherals to communicate with external digital logic, operating at a higher voltage level, without the use of level translators. The open-drain option is implemented on port pins specifically associated with the data and clock outputs of the USARTs, the MSSP module (in SPI mode) and the CCP modules. This option is selectively enabled by setting the open-drain control bit for the corresponding module in TRISG and LATG. Their configuration is discussed in more detail in Section 10.4 "PORTC, TRISC and LATC Registers", Section 10.6 "PORTE, TRISE and LATE Registers" and Section 10.8 "PORTG, TRISG and LATG Registers". When the open-drain option is required, the output pin must also be tied through an external pull-up resistor provided by the user to a higher voltage level, up to 5V (Figure 10-2). When a digital logic high signal is output, it is pulled up to the higher voltage level.
OSC2/CLKO/RA6 and OSC1/CLKI/RA7 normally serve as the external circuit connections for the external (primary) oscillator circuit (HS Oscillator modes) or the external clock input and output (EC Oscillator modes). In these cases, RA6 and RA7 are not available as digital I/O and their corresponding TRIS and LAT bits are read as `0'. When the device is configured to use INTOSC or INTRC as the default oscillator mode (FOSC2 Configuration bit is `0'), RA6 and RA7 are automatically configured as digital I/O. The oscillator and clock in/clock out functions are disabled. RA1, RA4 and RA5 are multiplexed with LCD segment drives, controlled by bits in the LCDSE1 and LCDSE2 registers. I/O port functionality is only available when the LCD segments are disabled.
EXAMPLE 10-1:
CLRF CLRF MOVLW MOVWF MOVLW MOVWF ; ; LATA ; ; 07h ; ADCON1 ; 0BFh ; ; TRISA ; ; PORTA
INITIALIZING PORTA
Initialize PORTA by clearing output latches Alternate method to clear output data latches Configure A/D for digital inputs Value used to initialize data direction Set RA<7, 5:0> as inputs, RA<6> as output
FIGURE 10-2:
USING THE OPEN-DRAIN OUTPUT (USART SHOWN AS EXAMPLE)
+5V
3.3V PIC18F87J72
VDD
TXX (at logic `1')
3.3V
5V
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TABLE 10-3:
Pin Name RA0/AN0
PORTA FUNCTIONS
Function RA0 AN0 TRIS Setting 0 1 1 0 1 AN1 SEG18 1 x 0 1 AN2 VREF1 1 0 1 AN3 VREF+ 1 1 0 1 T0CKI SEG14 x x 0 1 AN4 SEG15 1 x x x 0 1 x x 0 1 I/O O I I O I I O O I I I O I I I O I I O O I I O O O O I I I O I I/O Type DIG TTL ANA DIG TTL ANA ANA DIG TTL ANA ANA DIG TTL ANA ANA DIG ST ST ANA DIG TTL ANA ANA ANA DIG DIG TTL ANA ANA DIG TTL Description LATA<0> data output; not affected by analog input. PORTA<0> data input; disabled when analog input is enabled. A/D Input Channel 0. Default input configuration on POR; does not affect digital output. LATA<1> data output; not affected by analog input. PORTA<1> data input; disabled when analog input is enabled. A/D Input Channel 1. Default input configuration on POR; does not affect digital output. LCD Segment 18 output; disables all other pin functions. LATA<2> data output; not affected by analog input. PORTA<2> data input; disabled when analog functions are enabled. A/D Input Channel 2. Default input configuration on POR. A/D and comparator low reference voltage input. LATA<3> data output; not affected by analog input. PORTA<3> data input; disabled when analog input is enabled. A/D Input Channel 3. Default input configuration on POR. A/D and comparator high reference voltage input. LATA<4> data output. PORTA<4> data input. Default configuration on POR. Timer0 clock input. LCD Segment 14 output; disables all other pin functions. LATA<5> data output; not affected by analog input. PORTA<5> data input; disabled when analog input is enabled. A/D Input Channel 4. Default configuration on POR. LCD Segment 15 output; disables all other pin functions. Main oscillator feedback output connection (HS and HSPLL modes). System cycle clock output (FOSC/4) (EC and ECPLL modes). LATA<6> data output; disabled when FOSC2 Configuration bit is set. PORTA<6> data input; disabled when FOSC2 Configuration bit is set. Main oscillator input connection (HS and HSPLL modes). Main external clock source input (EC and ECPLL modes). LATA<7> data output; disabled when FOSC2 Configuration bit is set. PORTA<7> data input; disabled when FOSC2 Configuration bit is set.
RA1/AN1/SEG18
RA1
RA2/AN2/VREF-
RA2
RA3/AN3/VREF+
RA3
RA4/T0CKI/ SEG14
RA4
RA5/AN4/SEG15
RA5
OSC2/CLKO/RA6
OSC2 CLKO RA6
OSC1/CLKI/RA7
OSC1 CLKI RA7
Legend:
O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input, TTL = TTL Buffer Input, x = Don't care (TRIS bit does not affect port direction or is overridden for this option).
TABLE 10-4:
Name PORTA LATA TRISA ADCON1 LCDSE1 LCDSE2 Legend: Note 1:
SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
Bit 6 RA6(1) LATA6(1) TRISA6 -- SE14 SE22
(1)
Bit 7 RA7(1) LATA7(1) TRISA7 SE15 SE23
(1)
Bit 5 RA5 LATA5 TRISA5 VCFG1 SE13 SE21
Bit 4 RA4 LATA4 TRISA4 VCFG0 SE12 SE20
Bit 3 RA3 LATA3 TRISA3 PCFG3 SE11 SE19
Bit 2 RA2 LATA2 TRISA2 PCFG2 SE10 SE18
Bit 1 RA1 LATA1 TRISA1 PCFG1 SE09 SE17
Bit 0 RA0 LATA0 TRISA0 PCFG0 SE08 SE16
Reset Values on page 52 52 52 51 51 51
TRIGSEL
-- = unimplemented, read as `0'. Shaded cells are not used by PORTA. These bits are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read as `x'.
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10.3 PORTB, TRISB and LATB Registers
Four of the PORTB pins (RB<7:4>) have an interrupt-on-change feature. Only pins configured as inputs can cause this interrupt to occur (i.e., any RB<7:4> pin configured as an output is excluded from the interrupt-on-change comparison). The input pins (of RB<7:4>) are compared with the old value latched on the last read of PORTB. The "mismatch" outputs of RB<7:4> are ORed together to generate the RB Port Change Interrupt with Flag bit, RBIF (INTCON<0>). This interrupt can wake the device from power-managed modes. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) Any read or write of PORTB (except with the MOVFF (ANY), PORTB instruction). This will end the mismatch condition. Wait one instruction cycle. Clear flag bit, RBIF.
PORTB is an 8-bit wide, bidirectional port. The corresponding Data Direction and Output Latch registers are TRISB and LATB. All pins on PORTB are digital only and tolerate voltages up to 5.5V.
EXAMPLE 10-2:
CLRF PORTB ; ; ; ; ; ; ; ; ; ; ; ;
INITIALIZING PORTB
Initialize PORTB by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RB<3:0> as inputs RB<5:4> as outputs RB<7:6> as inputs
CLRF
LATB
MOVLW
0CFh
MOVWF
TRISB
b) c)
Each of the PORTB pins has a weak internal pull-up. A single control bit can turn on all the pull-ups. This is performed by clearing bit, RBPU (INTCON2<7>). The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset.
A mismatch condition will continue to set flag bit, RBIF. Reading PORTB will end the mismatch condition and allow flag bit, RBIF, to be cleared after a delay of one TCY. The interrupt-on-change feature is recommended for wake-up on key depression operation and operations where PORTB is only used for the interrupt-on-change feature. Polling of PORTB is not recommended while using the interrupt-on-change feature. RB<3:2> are multiplexed as CTMU edge inputs. RB<5:0> are also multiplexed with LCD segment drives, controlled by bits in the LCDSE1 and LCDSE3 registers. I/O port functionality is only available when the LCD segments are disabled.
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TABLE 10-5:
Pin Name RB0/INT0/SEG30
PORTB FUNCTIONS
Function RB0 INT0 SEG30 TRIS Setting 0 1 1 x 0 1 INT1 SEG8 1 x 0 1 INT2 SEG9 CTED1 1 x x 0 1 INT3 SEG10 CTED2 1 x x 0 1 KBI0 SEG11 1 x 0 1 KBI1 SEG29 1 x 0 1 KBI2 PGC 1 x 0 1 KBI3 PGD 1 x x I/O O I I O O I I O O I I O I O I I O I O I I O O I I O O I I I O I I O I I/O Type DIG TTL ST ANA DIG TTL ST ANA DIG TTL ST ANA ST DIG TTL ST ANA ST DIG TTL TTL ANA DIG TTL TTL ANA DIG TTL TTL ST DIG TTL TTL DIG ST LATB<0> data output. PORTB<0> data input; weak pull-up when RBPU bit is cleared. External Interrupt 0 input. LCD Segment 30 output; disables all other pin functions. LATB<1> data output. PORTB<1> data input; weak pull-up when RBPU bit is cleared. External Interrupt 1 input. LCD Segment 8 output; disables all other pin functions. LATB<2> data output. PORTB<2> data input; weak pull-up when RBPU bit is cleared. External Interrupt 2 input. LCD Segment 9 output; disables all other pin functions. CTMU Edge 1 input. LATB<3> data output. PORTB<3> data input; weak pull-up when RBPU bit is cleared. External Interrupt 3 input. LCD Segment 10 output; disables all other pin functions. CTMU Edge 2 input. LATB<4> data output. PORTB<4> data input; weak pull-up when RBPU bit is cleared. Interrupt-on-pin change. LCD Segment 11 output; disables all other pin functions. LATB<5> data output. PORTB<5> data input; weak pull-up when RBPU bit is cleared. Interrupt-on-pin change. LCD Segment 29 output; disables all other pin functions. LATB<6> data output. PORTB<6> data input; weak pull-up when RBPU bit is cleared. Interrupt-on-pin change. Serial execution (ICSPTM) clock input for ICSP and ICD operation. LATB<7> data output. PORTB<7> data input; weak pull-up when RBPU bit is cleared. Interrupt-on-pin change. Serial execution data output for ICSPTM and ICD operation. Serial execution data input for ICSP and ICD operation. Description
RB1/INT1/SEG8
RB1
RB2/INT2/SEG9/ CTED1
RB2
RB3/INT3/SEG10/ CTED2
RB3
RB4/KBI0/SEG11
RB4
RB5/KBI1/SEG29
RB5
RB6/KBI2/PGC
RB6
RB7/KBI3/PGD
RB7
Legend:
O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input, TTL = TTL Buffer Input, x = Don't care (TRIS bit does not affect port direction or is overridden for this option).
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TABLE 10-6:
Name PORTB LATB TRISB INTCON INTCON2 INTCON3 LCDSE1 LCDSE3 Legend:
SUMMARY OF REGISTERS ASSOCIATED WITH PORTB
Bit 7 RB7 LATB7 TRISB7 Bit 6 RB6 LATB6 TRISB6 PEIE/GIEL INTEDG0 INT1IP SE14 SE30 Bit 5 RB5 LATB5 TRISB5 TMR0IE INTEDG1 INT3IE SE13 SE29 Bit 4 RB4 LATB4 TRISB4 INT0IE INTEDG2 INT2IE SE12 SE28 Bit 3 RB3 LATB3 TRISB3 RBIE INTEDG3 INT1IE SE11 SE27 Bit 2 RB2 LATB2 TRISB2 TMR0IF TMR0IP INT3IF SE10 SE26 Bit 1 RB1 LATB1 TRISB1 INT0IF INT3IP INT2IF SE09 SE25 Bit 0 RB0 LATB0 TRISB0 RBIF RBIP INT1IF SE08 SE24 Reset Values on page 52 52 52 49 49 49 51 51
GIE/GIEH RBPU INT2IP SE15 SE31
Shaded cells are not used by PORTB.
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10.4 PORTC, TRISC and LATC Registers
The contents of the TRISC register are affected by peripheral overrides. Reading TRISC always returns the current contents, even though a peripheral device may be overriding one or more of the pins. RC<7:1> pins are multiplexed with LCD segment drives, controlled by bits in the LCDSE1, LCDSE2, LCDSE3 and LCDSE4 registers. I/O port functionality is only available when the LCD segments are disabled.
PORTC is an 8-bit wide, bidirectional port. The corresponding Data Direction and Output Latch registers are TRISC and LATC. Only PORTC pins, RC2 through RC7, are digital only pins and can tolerate input voltages up to 5.5V. PORTC is multiplexed with CCP, MSSP and EUSART peripheral functions (Table 10-7). The pins have Schmitt Trigger input buffers. The pins for CCP, SPI and EUSART are also configurable for open-drain output whenever these functions are active. Open-drain configuration is selected by setting the SPIOD, CCPxOD, and U1OD control bits (TRISG<7:5> and LATG<6>, respectively). RC1 is normally configured as the default peripheral pin for the CCP2 module. Assignment of CCP2 is controlled by Configuration bit, CCP2MX (default state, CCP2MX = 1). When enabling peripheral functions, care should be taken in defining TRIS bits for each PORTC pin. Some peripherals override the TRIS bit to make a pin an output, while other peripherals override the TRIS bit to make a pin an input. The user should refer to the corresponding peripheral section for the correct TRIS bit settings. Note: These pins are configured as digital inputs on any device Reset.
EXAMPLE 10-3:
CLRF PORTC ; ; ; ; ; ; ; ; ; ; ; ;
INITIALIZING PORTC
Initialize PORTC by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RC<3:0> as inputs RC<5:4> as outputs RC<7:6> as inputs
CLRF
LATC
MOVLW
0CFh
MOVWF
TRISC
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TABLE 10-7:
Pin Name RC0/T1OSO/ T13CKI
PORTC FUNCTIONS
Function RC0 T1OSO T13CKI TRIS Setting 0 1 x 1 0 1 T1OSI CCP2(1) SEG32 x 0 1 x 0 1 CCP1 SEG13 0 1 x 0 1 SCK SCL SEG17 0 1 0 1 x 0 1 SDI SDA SEG16 1 1 x 0 1 SDO SEG12 0 x 0 1 TX1 CK1 SEG27 1 1 1 x 0 1 RX1 DT1 SEG28 1 1 1 x I/O O I O I O I I O I O O I O I O O I O I O I O O I I O I O O I O O O I O O I O O I I O I O I/O Type DIG ST ANA ST DIG ST ANA DIG ST ANA DIG ST DIG ST ANA DIG ST DIG ST DIG I2C ANA DIG ST ST DIG I2C ANA DIG ST DIG ANA DIG ST DIG DIG ST ANA DIG ST ST DIG ST ANA LATC<0> data output. PORTC<0> data input. Timer1 oscillator output; enabled when Timer1 oscillator is enabled. Disables digital I/O and LCD segment driver. Timer1/Timer3 counter input. LATC<1> data output. PORTC<1> data input. Timer1 oscillator input. CCP2 Compare/PWM output. CCP2 Capture input. LCD Segment 32 output; disables all other pin functions. LATC<2> data output. PORTC<2> data input. CCP1 Compare/PWM output; takes priority over port data. CCP1 Capture input. LCD Segment 13 output; disables all other pin functions. LATC<3> data output. PORTC<3> data input. SPI clock output (MSSP module); takes priority over port data. SPI clock input (MSSP module). I2CTM clock output (MSSP module); takes priority over port data. I2C clock input (MSSP module); input type depends on module setting. LCD Segment 17 output; disables all other pin functions. LATC<4> data output. PORTC<4> data input. SPI data input (MSSP module). I2C data output (MSSP module); takes priority over port data. I2C data input (MSSP module); input type depends on module setting. LCD Segment 16 output; disables all other pin functions. LATC<5> data output. PORTC<5> data input. SPI data output (MSSP module). LCD Segment 12 output; disables all other pin functions. LATC<6> data output. PORTC<6> data input. Synchronous serial data output (EUSART module); takes priority over port data. Synchronous serial data input (EUSART module); user must configure as an input. Synchronous serial clock input (EUSART module). LCD Segment 27 output; disables all other pin functions. LATC<7> data output. PORTC<7> data input. Asynchronous serial receive data input (EUSART module). Synchronous serial data output (EUSART module); takes priority over port data. Synchronous serial data input (EUSART module); user must configure as an input. LCD Segment 28 output; disables all other pin functions. Description
RC1/T1OSI/ CCP2/SEG32
RC1
RC2/CCP1/ SEG13
RC2
RC3/SCK/SCL/ SEG17
RC3
RC4/SDI/SDA/ SEG16
RC4
RC5/SDO/ SEG12
RC5
RC6/TX1/CK1/ SEG27
RC6
RC7/RX1/DT1/ SEG28
RC7
Legend: Note 1:
O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input, TTL = TTL Buffer Input, I2C = I2C/SMBus Buffer Input, x = Don't care (TRIS bit does not affect port direction or is overridden for this option). Default assignment for CCP2 when CCP2MX Configuration bit is set.
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TABLE 10-8:
Name PORTC LATC TRISC LATG TRISG LCDSE1 LCDSE2 LCDSE3 LCDSE4
SUMMARY OF REGISTERS ASSOCIATED WITH PORTC
Bit 7 RC7 LATC7 TRISC7 U2OD SPIOD SE15 SE23 SE31 -- Bit 6 RC6 LATBC6 TRISC6 U1OD SE14 SE22 SE30 -- Bit 5 RC5 LATC5 TRISC5 -- SE13 SE21 SE29 -- Bit 4 RC4 LATCB4 TRISC4 LATG4 TRISG4 SE12 SE20 SE28 -- Bit 3 RC3 LATC3 TRISC3 LATG3 TRISG3 SE11 SE19 SE27 -- Bit 2 RC2 LATC2 TRISC2 LATG2 TRISG2 SE10 SE18 SE26 -- Bit 1 RC1 LATC1 TRISC1 LATG1 TRISG1 SE09 SE17 SE25 -- Bit 0 RC0 LATC0 TRISC0 LATG0 TRISG0 SE08 SE16 SE24 SE32 Reset Values on page 52 52 52 52 52 51 51 51 51
CCP2OD CCP1OD
Legend: Shaded cells are not used by PORTC.
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10.5 PORTD, TRISD and LATD Registers
All of the PORTD pins are multiplexed with LCD segment drives, controlled by bits in the LCDSE0 register. RD0 is multiplexed with the CTMU Pulse Generator output. I/O port functionality is only available when the LCD segments are disabled.
PORTD is an 8-bit wide, bidirectional port. The corresponding Data Direction and Output Latch registers are TRISD and LATD. All pins on PORTD are digital only and tolerate voltages up to 5.5V. All pins on PORTD are implemented with Schmitt Trigger input buffers. Each pin is individually configurable as an input or output. Note: These pins are configured as digital inputs on any device Reset.
EXAMPLE 10-4:
CLRF PORTD ; ; ; ; ; ; ; ; ; ; ; ;
INITIALIZING PORTD
Initialize PORTD by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RD<3:0> as inputs RD<5:4> as outputs RD<7:6> as inputs
CLRF
LATD
Each of the PORTD pins has a weak internal pull-up. A single control bit can turn off all the pull-ups. This is performed by clearing bit, RDPU (PORTG<7>). The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on all device Resets.
MOVLW
0CFh
MOVWF
TRISD
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TABLE 10-9:
Pin Name RD0/SEG0/ CTPLS
PORTD FUNCTIONS
Function RD0 SEG0 CTPLS TRIS Setting 0 1 x x 0 1 SEG1 x 0 1 SEG2 x 0 1 SEG3 x 0 1 SEG4 x 0 1 SEG5 x 0 1 SEG6 x 0 1 SEG7 x I/O O I O O O I O O I O O I O O I O O I O O I O O I I I/O Type DIG ST ANA DIG DIG ST ANA DIG ST ANA DIG ST ANA DIG ST ANA DIG ST ANA DIG ST ANA DIG ST ANA LATD<0> data output. PORTD<0> data input. LCD Segment 0 output; disables all other pin functions. CTMU Pulse Generator output LATD<1> data output. PORTD<1> data input. LCD Segment 1 output; disables all other pin functions. LATD<2> data output. PORTD<2> data input. LCD Segment 2 output; disables all other pin functions. LATD<3> data output. PORTD<3> data input. LCD Segment 3 output; disables all other pin functions. LATD<4> data output. PORTD<4> data input. LCD Segment 4 output; disables all other pin functions. LATD<5> data output. PORTD<5> data input. LCD Segment 5 output; disables all other pin functions. LATD<6> data output. PORTD<6> data input. LCD Segment 6 output; disables all other pin functions. LATD<7> data output. PORTD<7> data input. LCD Segment 7 output; disables all other pin functions. Description
RD1/SEG1
RD1
RD2/SEG2
RD2
RD3/SEG3
RD3
RD4/SEG4
RD4
RD5/SEG5
RD5
RD6/SEG6
RD6
RD7/SEG7
RD7
Legend:
O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input, x = Don't care (TRIS bit does not affect port direction or is overridden for this option).
TABLE 10-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD
Name PORTD LATD TRISD PORTG LCDSE0 Bit 7 RD7 LATD7 TRISD7 RDPU SE07 Bit 6 RD6 LATD6 TRISD6 REPU SE06 Bit 5 RD5 LATD5 TRISD5 RJPU SE05 Bit 4 RD4 LATD4 TRISD4 RG4 SE04 Bit 3 RD3 LATD3 TRISD3 RG3 SE03 Bit 2 RD2 LATD2 TRISD2 RG2 SE02 Bit 1 RD1 LATD1 TRISD1 RG1 SE01 Bit 0 RD0 LATD0 TRISD0 RG0 SE00 Reset Values on page 52 52 52 52 51
Legend: Shaded cells are not used by PORTD.
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10.6 PORTE, TRISE and LATE Registers
Pins, RE1 and RE0, are multiplexed with the functions of LCDBIAS2 and LCDBIAS1. When LCD bias generation is required (i.e., any application where the device is connected to an external LCD), these pins cannot be used as digital I/O. Note: The pin corresponding to RE2 of other PIC18F parts has the function of LCDBIAS3 in this device. It cannot be used as digital I/O.
PORTE is a 7-bit wide, bidirectional port. The corresponding Data Direction and Output Latch registers are TRISE and LATE. All pins on PORTE are digital only and tolerate voltages up to 5.5V. All pins on PORTE are implemented with Schmitt Trigger input buffers. Each pin is individually configurable as an input or output. The RE7 pin is also configurable for open-drain output when CCP2 is active on this pin. Open-drain configuration is selected by setting the CCP2OD control bit (TRISG<6>) Note: These pins are configured as digital inputs on any device Reset.
RE7 is multiplexed with the LCD segment drive (SEG31) controlled by the LCDSE3<7> bit. I/O port function is only available when the segment is disabled. RE7 can also be configured as the alternate peripheral pin for the CCP2 module. This is done by clearing the CCP2MX Configuration bit.
Each of the PORTE pins has a weak internal pull-up. A single control bit can turn off all the pull-ups. This is performed by clearing bit, REPU (PORTG<6>). The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on any device Reset. Pins, RE<6:3>, are multiplexed with the LCD common drives. I/O port functions are only available on those PORTE pins depending on which commons are active. The configuration is determined by the LMUX<1:0> control bits (LCDCON<1:0>). The availability is summarized in Table 10-11.
EXAMPLE 10-5:
CLRF CLRF MOVLW MOVWF PORTE LATE 03h TRISE ; ; ; ; ; ; ; ; ; ; ;
INITIALIZING PORTE
Initialize PORTE by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RE<1:0> as inputs RE<7:2> as outputs
TABLE 10-11: PORTE PINS AVAILABLE IN DIFFERENT LCD DRIVE CONFIGURATIONS
LCDCON <1:0> 00 01 10 11 Active LCD Commons COM0 COM0, COM1 COM0, COM1 and COM2 All (COM0 through COM3) PORTE Available for I/O RE6, RE5, RE4 RE6, RE5 RE6 None
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TABLE 10-12: PORTE FUNCTIONS
Pin Name RE0/LCDBIAS1 Function RE0 LCDBIAS1 RE1/LCDBIAS2 RE1 LCDBIAS2 RE3/COM0 RE3 COM0 RE4/COM1 RE4 COM1 RE5/COM2 RE5 COM2 RE6/COM3 RE6 COM3 RE7/CCP2/ SEG31 RE7 CCP2(1) SEG31 Legend: Note 1: TRIS Setting 0 1 -- 0 1 -- 0 1 x 0 1 x 0 1 x 0 1 x 0 1 0 1 x I/O O I I O I I O I O O I O O I O O I O O I O I O I/O Type DIG ST ANA DIG ST ANA DIG ST ANA DIG ST ANA DIG ST ANA DIG ST ANA DIG ST DIG ST ANA LATE<0> data output. PORTE<0> data input. LCD module bias voltage input. LATE<1> data output. PORTE<1> data input. LCD module bias voltage input. LATE<3> data output. PORTE<3> data input. LCD Common 0 output; disables all other outputs. LATE<4> data output. PORTE<4> data input. LCD Common 1 output; disables all other outputs. LATE<5> data output. PORTE<5> data input. LCD Common 2 output; disables all other outputs. LATE<6> data output. PORTE<6> data input. LCD Common 3 output; disables all other outputs. LATE<7> data output. PORTE<7> data input. CCP2 Compare/PWM output; takes priority over port data. CCP2 Capture input. Segment 31 analog output for LCD; disables digital output. Description
O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input, x = Don't care (TRIS bit does not affect port direction or is overridden for this option). Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
TABLE 10-13: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE
Name PORTE LATE TRISE PORTG TRISG LCDCON LCDSE3 Bit 7 RE7 LATE7 TRISE7 RDPU SPIOD LCDEN SE31 Bit 6 RE6 LATE6 TRISE6 REPU CCP2OD SLPEN SE30 Bit 5 RE5 LATE5 TRISE5 RJPU CCP1OD WERR SE29 Bit 4 RE4 LATE4 TRISE4 RG4 TRISG4 -- SE28 Bit 3 RE3 LATE3 TRISE3 RG3 TRISG3 CS1 SE27 Bit 2 -- -- -- RG2 TRISG2 CS0 SE26 Bit 1 RE1 LATE1 TRISE1 RG1 TRISG1 LMUX1 SE25 Bit 0 RE0 LATE0 TRISE0 RG0 TRISG0 LMUX0 SE24 Reset Values on page 52 52 52 52 52 51 51
Legend: Shaded cells are not used by PORTE.
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10.7 PORTF, LATF and TRISF Registers
PORTF is a 7-bit wide, bidirectional port. The corresponding Data Direction and Output Latch registers are TRISF and LATF. All pins on PORTF are implemented with Schmitt Trigger input buffers. Each pin is individually configurable as an input or output. PORTF is multiplexed with analog peripheral functions, as well as LCD segments. Pins, RF1 through RF6, may be used as comparator inputs or outputs by setting the appropriate bits in the CMCON register. To use RF<6:3> as digital inputs, it is also necessary to turn off the comparators. Note 1: On device Resets, pins, RF<6:1>, are configured as analog inputs and are read as `0'. 2: To configure PORTF as digital I/O, turn off comparators and set ADCON1 value. PORTF is also multiplexed with LCD segment drives controlled by bits in the LCDSE2 and LCDSE3 registers. I/O port functions are only available when the segments are disabled.
EXAMPLE 10-6:
CLRF ; ; ; LATF ; ; ; 07h ; CMCON ; 0Fh ; ADCON1 ; 0CEh ; ; ; TRISF ; ; ; PORTF
INITIALIZING PORTF
Initialize PORTF by clearing output data latches Alternate method to clear output data latches Turn off comparators Set PORTF as digital I/O Value used to initialize data direction Set RF3:RF1 as inputs RF5:RF4 as outputs RF7:RF6 as inputs
CLRF
MOVLW MOVWF MOVLW MOVWF MOVLW
MOVWF
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TABLE 10-14: PORTF FUNCTIONS
Pin Name RF1/AN6/C2OUT/ SEG19 Function RF1 AN6 C2OUT SEG19 RF2/AN7/C1OUT/ SEG20 RF2 AN7 C1OUT SEG20 RF3/AN8/SEG21/ C2INB RF3 AN8 SEG21 C2INB RF4/AN9/SEG22/ C2INA RF4 AN9 SEG22 C2INA RF5/AN10/CVREF/ SEG23/C1INB RF5 TRIS Setting 0 1 1 0 x 0 1 1 0 x 0 1 1 x 1 0 1 1 x 1 0 1 AN10 CVREF SEG23 C1INB RF6/AN11/SEG24/ C1INA RF6 AN11 SEG24 C1INA RF7/AN5/SS/ SEG25 RF7 AN5 SS SEG25 Legend: 1 x x 1 0 1 1 x 1 0 1 1 1 x I/O O I I O O O I I O O O I I O I O I I O I O I I O O I O I I O I O I I I O I/O Type DIG ST ANA DIG ANA DIG ST ANA DIG ANA DIG ST ANA ANA ANA DIG ST ANA ANA ANA DIG ST ANA ANA ANA ANA DIG ST ANA ANA ANA DIG ST ANA TTL ANA Description LATF<1> data output; not affected by analog input. PORTF<1> data input; disabled when analog input is enabled. A/D Input Channel 6. Default configuration on POR. Comparator 2 output; takes priority over port data. LCD Segment 19 output; disables all other pin functions. LATF<2> data output; not affected by analog input. PORTF<2> data input; disabled when analog input is enabled. A/D Input Channel 7. Default configuration on POR. Comparator 1 output; takes priority over port data. LCD Segment 20 output; disables all other pin functions. LATF<3> data output; not affected by analog input. PORTF<3> data input; disabled when analog input is enabled. A/D Input Channel 8 and Comparator C2+ input. Default input configuration on POR; not affected by analog output. LCD Segment 21 output; disables all other pin functions. Comparator 2 Input B. LATF<4> data output; not affected by analog input. PORTF<4> data input; disabled when analog input is enabled. A/D Input Channel 9 and Comparator C2- input. Default input configuration on POR; does not affect digital output. LCD Segment 22 output; disables all other pin functions. Comparator 2 Input A. LATF<5> data output; not affected by analog input. Disabled when CVREF output is enabled. PORTF<5> data input; disabled when analog input is enabled. Disabled when CVREF output is enabled. A/D Input Channel 10 and Comparator C1+ input. Default input configuration on POR. Comparator voltage reference output. Enabling this feature disables digital I/O. LCD Segment 23 output; disables all other pin functions. Comparator 1 Input B. LATF<6> data output; not affected by analog input. PORTF<6> data input; disabled when analog input is enabled. A/D Input Channel 11 and Comparator C1- input. Default input configuration on POR; does not affect digital output. LCD Segment 24 output; disables all other pin functions. Comparator 1 Input A. LATF<7> data output; not affected by analog input. PORTF<7> data input; disabled when analog input is enabled. A/D Input Channel 5. Default configuration on POR. Slave select input for MSSP module. LCD Segment 25 output; disables all other pin functions.
O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input, TTL = TTL Buffer Input, x = Don't care (TRIS bit does not affect port direction or is overridden for this option).
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TABLE 10-15: SUMMARY OF REGISTERS ASSOCIATED WITH PORTF
Name PORTF LATF TRISF ADCON1 CMCON CVRCON LCDSE2 LCDSE3 Bit 7 RF7 LATF7 TRISF7 TRIGSEL C2OUT CVREN SE23 SE31 Bit 6 RF6 LATF6 TRISF6 -- C1OUT CVROE SE22 SE30 Bit 5 RF5 LATF5 TRISF5 VCFG1 C2INV CVRR SE21 SE29 Bit 4 RF4 LATF4 TRISF4 VCFG0 C1INV CVRSS SE20 SE28 Bit 3 RF3 LATF3 TRISF3 PCFG3 CIS CVR3 SE19 SE27 Bit 2 RF2 LATF2 TRISF2 PCFG2 CM2 CVR2 SE18 SE26 Bit 1 RF1 LATF1 TRISF1 PCFG1 CM1 CVR1 SE17 SE25 Bit 0 -- -- -- PCFG0 CM0 CVR0 SE16 SE24 Reset Values on page 52 52 52 51 51 51 51 51
Legend: -- = unimplemented, read as `0'. Shaded cells are not used by PORTF.
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10.8 PORTG, TRISG and LATG Registers
Although the port itself is only five bits wide, the PORTG<7:5> bits are still implemented to control the weak pull-ups on the I/O ports associated with PORTD, PORTE and PORTJ. Clearing these bits enables the respective port pull-ups. By default, all pull-ups are disabled on device Resets. Most of the corresponding TRISG and LATG bits are implemented as open-drain control bits for CCP1, CCP2 and SPI (TRISG<7:5>), and the USARTs (LATG<7:6>). Setting these bits configures the output pin for the corresponding peripheral for open-drain operation. LATG<5> is not implemented.
PORTG is a 5-bit wide, bidirectional port. The corresponding Data Direction and Output Latch registers are TRISG and LATG. All pins on PORTG are digital only and tolerate voltages up to 5.5V. PORTG is multiplexed with both AUSART and LCD functions (Table 10-16). When operating as I/O, all PORTG pins have Schmitt Trigger input buffers. The RG1 pin is also configurable for open-drain output when the AUSART is active. Open-drain configuration is selected by setting the U2OD control bit (LATG<7>). RG4 is multiplexed with LCD segment drives controlled by bits in the LCDSE2 register and as the RTCC pin. The I/O port function is only available when the segments are disabled. RG3 and RG2 are multiplexed with VLCAP pins for the LCD charge pump and RG0 is multiplexed with the LCDBIAS0 bias voltage input. When these pins are used for LCD bias generation, the I/O and other functions are unavailable. When enabling peripheral functions, care should be taken in defining TRIS bits for each PORTG pin. Some peripherals override the TRIS bit to make a pin an output, while other peripherals override the TRIS bit to make a pin an input. The user should refer to the corresponding peripheral section for the correct TRIS bit settings. The pin override value is not loaded into the TRIS register. This allows read-modify-write of the TRIS register without concern due to peripheral overrides.
EXAMPLE 10-7:
CLRF PORTG ; ; ; ; ; ; ; ; ; ; ; ;
INITIALIZING PORTG
Initialize PORTG by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RG1:RG0 as outputs RG2 as input RG4:RG3 as inputs
CLRF
LATG
MOVLW
04h
MOVWF
TRISG
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TABLE 10-16: PORTG FUNCTIONS
Pin Name RG0/LCDBIAS0 Function RG0 LCDBIAS0 RG1/TX2/CK2 RG1 TX2 CK2 TRIS Setting 0 1 x 0 1 1 1 1 RG2/RX2/DT2/ VLCAP1 RG2 RX2 DT2 0 1 1 1 1 VLCAP1 RG3/VLCAP2 RG3 VLCAP2 RG4/SEG26/ RTCC RG4 SEG26 RTCC x 0 1 x 0 1 x x I/O O I I O I O O I O I I O I I O I I O I O O I/O Type DIG ST ANA DIG ST DIG DIG ST DIG ST ST DIG ST ANA DIG ST ANA DIG ST ANA DIG LATG<0> data output. PORTG<0> data input. LCD module bias voltage input. LATG<1> data output. PORTG<1> data input. Synchronous serial data output (AUSART module); takes priority over port data. Synchronous serial data input (AUSART module); user must configure as an input. Synchronous serial clock input (AUSART module). LATG<2> data output. PORTG<2> data input. Asynchronous serial receive data input (AUSART module). Synchronous serial data output (AUSART module); takes priority over port data. Synchronous serial data input (AUSART module); user must configure as an input. LCD charge pump capacitor input. LATG<3> data output. PORTG<3> data input. LCD charge pump capacitor input. LATG<4> data output. PORTG<4> data input. LCD Segment 26 output; disables all other pin functions. RTCC output. Description
Legend: O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Trigger Buffer Input, x = Don't care (TRIS bit does not affect port direction or is overridden for this option).
TABLE 10-17: SUMMARY OF REGISTERS ASSOCIATED WITH PORTG
Name PORTG LATG TRISG LCDSE3 Bit 7 RDPU U2OD SPIOD SE31 Bit 6 REPU U1OD SE30 Bit 5 RJPU -- SE29 Bit 4 RG4 LATG4 SE28 Bit 3 RG3 LATG3 TRISG3 SE27 Bit 2 RG2 LATG2 TRISG2 SE26 Bit 1 RG1 LATG1 TRISG1 SE25 Bit 0 RG0 LATG0 TRISG0 SE24 Reset Values on page 52 52 52 51
CCP2OD CCP1OD TRISG4
Legend: -- = unimplemented, read as `0'. Shaded cells are not used by PORTG.
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11.0 TIMER0 MODULE
The Timer0 module incorporates the following features: * Software selectable operation as a timer or counter in both 8-bit or 16-bit modes * Readable and writable registers * Dedicated 8-bit, software programmable prescaler * Selectable clock source (internal or external) * Edge select for external clock * Interrupt-on-overflow The T0CON register (Register 11-1) controls all aspects of the module's operation, including the prescale selection; it is both readable and writable. A simplified block diagram of the Timer0 module in 8-bit mode is shown in Figure 11-1. Figure 11-2 shows a simplified block diagram of the Timer0 module in 16-bit mode.
REGISTER 11-1:
R/W-1 TMR0ON bit 7 Legend: R = Readable bit -n = Value at POR bit 7
T0CON: TIMER0 CONTROL REGISTER
R/W-1 T0CS R/W-1 T0SE R/W-1 PSA R/W-1 T0PS2 R/W-1 T0PS1 R/W-1 T0PS0 bit 0
R/W-1 T08BIT
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
TMR0ON: Timer0 On/Off Control bit 1 = Enables Timer0 0 = Stops Timer0 T08BIT: Timer0 8-Bit/16-Bit Control bit 1 = Timer0 is configured as an 8-bit timer/counter 0 = Timer0 is configured as a 16-bit timer/counter T0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin input edge 0 = Internal clock (2/4) T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin PSA: Timer0 Prescaler Assignment bit 1 = TImer0 prescaler is not assigned. Timer0 clock input bypasses prescaler. 0 = Timer0 prescaler is assigned. Timer0 clock input comes from prescaler output. T0PS<2:0>: Timer0 Prescaler Select bits 111 = 1:256 Prescale value 110 = 1:128 Prescale value 101 = 1:64 Prescale value 100 = 1:32 Prescale value 011 = 1:16 Prescale value 010 = 1:8 Prescale value 001 = 1:4 Prescale value 000 = 1:2 Prescale value
bit 6
bit 5
bit 4
bit 3
bit 2-0
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11.1 Timer0 Operation
Timer0 can operate as either a timer or a counter. The mode is selected with the T0CS bit (T0CON<5>). In Timer mode (T0CS = 0), the module increments on every clock by default unless a different prescaler value is selected (see Section 11.3 "Prescaler"). If the TMR0 register is written to, the increment is inhibited for the following two instruction cycles. The user can work around this by writing an adjusted value to the TMR0 register. The Counter mode is selected by setting the T0CS bit (= 1). In this mode, Timer0 increments either on every rising or falling edge of pin, RA4/T0CKI. The incrementing edge is determined by the Timer0 Source Edge Select bit, T0SE (T0CON<4>); clearing this bit selects the rising edge. Restrictions on the external clock input are discussed below. An external clock source can be used to drive Timer0, however, it must meet certain requirements to ensure that the external clock can be synchronized with the internal phase clock (TOSC). There is a delay between synchronization and the onset of incrementing the timer/counter.
11.2
Timer0 Reads and Writes in 16-Bit Mode
TMR0H is not the actual high byte of Timer0 in 16-bit mode. It is actually a buffered version of the real high byte of Timer0, which is not directly readable nor writable (refer to Figure 11-2). TMR0H is updated with the contents of the high byte of Timer0 during a read of TMR0L. This provides the ability to read all 16 bits of Timer0 without having to verify that the read of the high and low byte were valid, due to a rollover between successive reads of the high and low byte. Similarly, a write to the high byte of Timer0 must also take place through the TMR0H Buffer register. The high byte is updated with the contents of TMR0H when a write occurs to TMR0L. This allows all 16 bits of Timer0 to be updated at once.
FIGURE 11-1:
TIMER0 BLOCK DIAGRAM (8-BIT MODE)
FOSC/4 0 1 1 Sync with Internal Clocks (2 TCY Delay) 8 8 Internal Data Bus TMR0L Set TMR0IF on Overflow
T0CKI Pin T0SE T0CS T0PS<2:0> PSA
Programmable Prescaler 3
0
Note:
Upon Reset, Timer0 is enabled in 8-bit mode with the clock input from T0CKI max. prescale.
FIGURE 11-2:
FOSC/4
TIMER0 BLOCK DIAGRAM (16-BIT MODE)
0 1 1 Sync with Internal Clocks (2 TCY Delay) Read TMR0L Write TMR0L 8 8 TMR0H 8 8 Internal Data Bus TMR0L TMR0 High Byte 8 Set TMR0IF on Overflow
T0CKI Pin T0SE T0CS T0PS<2:0> PSA
Programmable Prescaler 3
0
Note:
Upon Reset, Timer0 is enabled in 8-bit mode with the clock input from T0CKI max. prescale.
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11.3 Prescaler
11.3.1
An 8-bit counter is available as a prescaler for the Timer0 module. The prescaler is not directly readable or writable. Its value is set by the PSA and T0PS<2:0> bits (T0CON<3:0>) which determine the prescaler assignment and prescale ratio. Clearing the PSA bit assigns the prescaler to the Timer0 module. When it is assigned, prescale values from 1:2 through 1:256, in power-of-2 increments, are selectable. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF TMR0, MOVWF TMR0, BSF TMR0, etc.) clear the prescaler count. Note: Writing to TMR0 when the prescaler is assigned to Timer0 will clear the prescaler count but will not change the prescaler assignment.
SWITCHING PRESCALER ASSIGNMENT
The prescaler assignment is fully under software control and can be changed "on-the-fly" during program execution.
11.4
Timer0 Interrupt
The TMR0 interrupt is generated when the TMR0 register overflows from FFh to 00h in 8-bit mode or from FFFFh to 0000h in 16-bit mode. This overflow sets the TMR0IF flag bit. The interrupt can be masked by clearing the TMR0IE bit (INTCON<5>). Before re-enabling the interrupt, the TMR0IF bit must be cleared in software by the Interrupt Service Routine. Since Timer0 is shut down in Sleep mode, the TMR0 interrupt cannot awaken the processor from Sleep.
TABLE 11-1:
Name TMR0L TMR0H INTCON T0CON TRISA
REGISTERS ASSOCIATED WITH TIMER0
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page 50 50 INT0IE T0SE TRISA4 RBIE PSA TRISA3 TMR0IF T0PS2 TRISA2 INT0IF T0PS1 TRISA1 RBIF T0PS0 TRISA0 49 50 52 T0CS TRISA5
Timer0 Register Low Byte Timer0 Register High Byte GIE/GIEH PEIE/GIEL TMR0IE TMR0ON T08BIT TRISA7(1) TRISA6(1)
Legend: -- = unimplemented, read as `0'. Shaded cells are not used by Timer0. Note 1: RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal oscillator is selected as the default clock source (FOSC2 Configuration bit = 0); otherwise, they are disabled and these bits read as `0'.
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NOTES:
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12.0 TIMER1 MODULE
The Timer1 timer/counter module incorporates these features: * Software selectable operation as a 16-bit timer or counter * Readable and writable 8-bit registers (TMR1H and TMR1L) * Selectable clock source (internal or external) with device clock or Timer1 oscillator internal options * Interrupt-on-overflow * Reset on CCP Special Event Trigger * Device clock status flag (T1RUN) A simplified block diagram of the Timer1 module is shown in Figure 12-1. A block diagram of the module's operation in Read/Write mode is shown in Figure 12-2. The module incorporates its own low-power oscillator to provide an additional clocking option. The Timer1 oscillator can also be used as a low-power clock source for the microcontroller in power-managed operation. Timer1 can also be used to provide Real-Time Clock (RTC) functionality to applications with only a minimal addition of external components and code overhead. Timer1 is controlled through the T1CON Control register (Register 12-1). It also contains the Timer1 Oscillator Enable bit (T1OSCEN). Timer1 can be enabled or disabled by setting or clearing control bit, TMR1ON (T1CON<0>).
REGISTER 12-1:
R/W-0 RD16 bit 7 Legend: R = Readable bit -n = Value at POR bit 7
T1CON: TIMER1 CONTROL REGISTER
R-0 R/W-0 T1CKPS1 R/W-0 T1CKPS0 R/W-0 T1OSCEN R/W-0 T1SYNC R/W-0 TMR1CS R/W-0 TMR1ON bit 0
T1RUN
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
RD16: 16-Bit Read/Write Mode Enable bit 1 = Enables register read/write of TImer1 in one 16-bit operation 0 = Enables register read/write of Timer1 in two 8-bit operations T1RUN: Timer1 System Clock Status bit 1 = Device clock is derived from Timer1 oscillator 0 = Device clock is derived from another source T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value T1OSCEN: Timer1 Oscillator Enable bit 1 = Timer1 oscillator is enabled 0 = Timer1 oscillator is shut off The oscillator inverter and feedback resistor are turned off to eliminate power drain. T1SYNC: Timer1 External Clock Input Synchronization Select bit When TMR1CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input When TMR1CS = 0: This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0. TMR1CS: Timer1 Clock Source Select bit 1 = External clock from pin, RC0/T1OSO/T13CKI (on the rising edge) 0 = Internal clock (FOSC/4) TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1
bit 6
bit 5-4
bit 3
bit 2
bit 1
bit 0
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12.1 Timer1 Operation
Timer1 can operate in one of these modes: * Timer * Synchronous Counter * Asynchronous Counter The operating mode is determined by the clock select bit, TMR1CS (T1CON<1>). When TMR1CS is cleared (= 0), Timer1 increments on every internal instruction cycle (FOSC/4). When the bit is set, Timer1 increments on every rising edge of the Timer1 external clock input or the Timer1 oscillator, if enabled. When Timer1 is enabled, the RC1/T1OSI/SEG32 and RC0/T1OSO/T13CKI pins become inputs. This means the values of TRISC<1:0> are ignored and the pins are read as `0'.
FIGURE 12-1:
TIMER1 BLOCK DIAGRAM (8-BIT MODE)
Timer1 Oscillator On/Off Timer1 Clock Input 1 FOSC/4 Internal Clock T1OSCEN(1) T1CKPS<1:0> T1SYNC TMR1ON Set TMR1IF on Overflow TMR1CS Prescaler 1, 2, 4, 8 0 2 Sleep Input Timer1 On/Off 1 Synchronize Detect
T1OSO/T13CKI
0
T1OSI
Clear TMR1 (CCP Special Event Trigger)
TMR1L
TMR1 High Byte
Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.
FIGURE 12-2:
TIMER1 BLOCK DIAGRAM (16-BIT READ/WRITE MODE)
Timer1 Oscillator Timer1 Clock Input 1 1 FOSC/4 Internal Clock T1OSCEN(1) T1CKPS<1:0> T1SYNC TMR1ON TMR1CS Prescaler 1, 2, 4, 8 0 2 Sleep Input Timer1 On/Off
T1OSO/T13CKI
Synchronize Detect
0
T1OSI
Clear TMR1 (CCP Special Event Trigger)
TMR1L
TMR1 High Byte 8
Set TMR1IF on Overflow
Read TMR1L Write TMR1L 8 8 TMR1H 8 8 Internal Data Bus Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.
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12.2 Timer1 16-Bit Read/Write Mode
TABLE 12-1:
Timer1 can be configured for 16-bit reads and writes (see Figure 12-2). When the RD16 control bit (T1CON<7>) is set, the address for TMR1H is mapped to a buffer register for the high byte of Timer1. A read from TMR1L will load the contents of the high byte of Timer1 into the Timer1 High Byte Buffer register. This provides the user with the ability to accurately read all 16 bits of Timer1 without having to determine whether a read of the high byte, followed by a read of the low byte, has become invalid due to a rollover between reads. A write to the high byte of Timer1 must also take place through the TMR1H Buffer register. The Timer1 high byte is updated with the contents of TMR1H when a write occurs to TMR1L. This allows a user to write all 16 bits to both the high and low bytes of Timer1 at once. The high byte of Timer1 is not directly readable or writable in this mode. All reads and writes must take place through the Timer1 High Byte Buffer register. Writes to TMR1H do not clear the Timer1 prescaler. The prescaler is only cleared on writes to TMR1L.
CAPACITOR SELECTION FOR THE TIMER1 OSCILLATOR(2,3,4)
Freq. C1 27 pF(1) C2 27 pF(1)
Oscillator Type LP
32.768 kHz
Note 1: Microchip suggests these values as a starting point in validating the oscillator circuit. 2: Higher capacitance increases the stability of the oscillator but also increases the start-up time. 3: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. 4: Capacitor values are for design guidance only.
12.3.1
12.3
Timer1 Oscillator
USING TIMER1 AS A CLOCK SOURCE
An on-chip crystal oscillator circuit is incorporated between pins, T1OSI (input) and T1OSO (amplifier output). It is enabled by setting the Timer1 Oscillator Enable bit, T1OSCEN (T1CON<3>). The oscillator is a low-power circuit rated for 32 kHz crystals. It will continue to run during all power-managed modes. The circuit for a typical LP oscillator is shown in Figure 12-3. Table 12-1 shows the capacitor selection for the Timer1 oscillator. The user must provide a software time delay to ensure proper start-up of the Timer1 oscillator.
The Timer1 oscillator is also available as a clock source in power-managed modes. By setting the System Clock Select bits, SCS<1:0> (OSCCON<1:0>), to `01', the device switches to SEC_RUN mode. Both the CPU and peripherals are clocked from the Timer1 oscillator. If the IDLEN bit (OSCCON<7>) is cleared and a SLEEP instruction is executed, the device enters SEC_IDLE mode. Additional details are available in Section 4.0 "Power-Managed Modes". Whenever the Timer1 oscillator is providing the clock source, the Timer1 system clock status flag, T1RUN (T1CON<6>), is set. This can be used to determine the controller's current clocking mode. It can also indicate the clock source being currently used by the Fail-Safe Clock Monitor. If the Clock Monitor is enabled and the Timer1 oscillator fails while providing the clock, polling the T1RUN bit will indicate whether the clock is being provided by the Timer1 oscillator or another source.
FIGURE 12-3:
EXTERNAL COMPONENTS FOR THE TIMER1 LP OSCILLATOR
PIC18F87J72
T1OSI XTAL 32.768 kHz T1OSO
C1 27 pF
C2 27 pF Note: See the Notes with Table 12-1 for additional information about capacitor selection.
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12.3.2 TIMER1 OSCILLATOR LAYOUT CONSIDERATIONS
12.5
Resetting Timer1 Using the CCP Special Event Trigger
The Timer1 oscillator circuit draws very little power during operation. Due to the low-power nature of the oscillator, it may also be sensitive to rapidly changing signals in close proximity. The oscillator circuit, shown in Figure 12-3, should be located as close as possible to the microcontroller. There should be no circuits passing within the oscillator circuit boundaries other than VSS or VDD. If a high-speed circuit must be located near the oscillator (such as the CCP1 pin in Output Compare or PWM mode, or the primary oscillator using the OSC2 pin), a grounded guard ring around the oscillator circuit, as shown in Figure 12-4, may be helpful when used on a single-sided PCB or in addition to a ground plane.
If CCP1 or CCP2 is configured to use Timer1 and to generate a Special Event Trigger in Compare mode (CCPxM<3:0> = 1011), this signal will reset Timer3. The trigger from CCP2 will also start an A/D conversion if the A/D module is enabled (see Section 16.3.4 "Special Event Trigger" for more information). The module must be configured as either a timer or a synchronous counter to take advantage of this feature. When used this way, the CCPRxH:CCPRxL register pair effectively becomes a period register for Timer1. If Timer1 is running in Asynchronous Counter mode, this Reset operation may not work. In the event that a write to Timer1 coincides with a Special Event Trigger, the write operation will take precedence. Note: The Special Event Triggers from the CCPx module will not set the TMR1IF interrupt flag bit (PIR1<0>).
FIGURE 12-4:
OSCILLATOR CIRCUIT WITH GROUNDED GUARD RING
VDD VSS OSC1 OSC2
12.6
Using Timer1 as a Real-Time Clock
RC0 RC1
Adding an external LP oscillator to Timer1 (such as the one described in Section 12.3 "Timer1 Oscillator" above) gives users the option to include RTC functionality to their applications. This is accomplished with an inexpensive watch crystal to provide an accurate time base and several lines of application code to calculate the time. When operating in Sleep mode and using a battery or supercapacitor as a power source, it can completely eliminate the need for a separate RTC device and battery backup. The application code routine, RTCisr, shown in Example 12-1, demonstrates a simple method to increment a counter at one-second intervals using an Interrupt Service Routine. Incrementing the TMR1 register pair to overflow triggers the interrupt and calls the routine which increments the seconds counter by one. Additional counters for minutes and hours are incremented as the previous counter overflows. Since the register pair is 16 bits wide, counting up to overflow the register directly from a 32.768 kHz clock would take 2 seconds. To force the overflow at the required one-second intervals, it is necessary to preload it. The simplest method is to set the MSb of TMR1H with a BSF instruction. Note that the TMR1L register is never preloaded or altered; doing so may introduce cumulative error over many cycles. For this method to be accurate, Timer1 must operate in Asynchronous mode and the Timer1 overflow interrupt must be enabled (PIE1<0> = 1) as shown in the routine, RTCinit. The Timer1 oscillator must also be enabled and running at all times.
RC2 Note: Not drawn to scale.
12.4
Timer1 Interrupt
The TMR1 register pair (TMR1H:TMR1L) increments from 0000h to FFFFh and rolls over to 0000h. The Timer1 interrupt, if enabled, is generated on overflow which is latched in interrupt flag bit, TMR1IF (PIR1<0>). This interrupt can be enabled or disabled by setting or clearing the Timer1 Interrupt Enable bit, TMR1IE (PIE1<0>).
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EXAMPLE 12-1:
RTCinit MOVLW MOVWF CLRF MOVLW MOVWF CLRF CLRF MOVLW MOVWF BSF RETURN RTCisr BSF BCF INCF MOVLW CPFSGT RETURN CLRF INCF MOVLW CPFSGT RETURN CLRF INCF MOVLW CPFSGT RETURN CLRF RETURN TMR1H, 7 PIR1, TMR1IF secs, F .59 secs secs mins, F .59 mins mins hours, F .23 hours hours ; ; ; ; ; ; ; ; ; ; ; ; Preload for 1 sec overflow Clear interrupt flag Increment seconds 60 seconds elapsed? No, done Clear seconds Increment minutes 60 minutes elapsed? No, done clear minutes Increment hours 24 hours elapsed? 80h TMR1H TMR1L b'00001111' T1CON secs mins .12 hours PIE1, TMR1IE ; Preload TMR1 register pair ; for 1 second overflow ; Configure for external clock, ; Asynchronous operation, external oscillator ; Initialize timekeeping registers ;
IMPLEMENTING A REAL-TIME CLOCK USING A TIMER1 INTERRUPT SERVICE
; Enable Timer1 interrupt
; No, done ; Reset hours ; Done
TABLE 12-2:
Name INTCON PIR1 PIE1 IPR1 TMR1L TMR1H T1CON
REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER
Bit 7 Bit 6 Bit 5 TMR0IE RC1IF RC1IE RC1IP Bit 4 INT0IE TX1IF TX1IE TX1IP Bit 3 RBIE SSPIF SSPIE SSPIP Bit 2 TMR0IF -- -- -- Bit 1 INT0IF TMR2IF TMR2IE TMR2IP Bit 0 RBIF TMR1IF TMR1IE TMR1IP Reset Values on page 49 52 52 52 50 50 TMR1CS TMR1ON 50
GIE/GIEH PEIE/GIEL -- -- -- ADIF ADIE ADIP
Timer1 Register Low Byte Timer1 Register High Byte RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC
Legend: Shaded cells are not used by the Timer1 module.
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13.0 TIMER2 MODULE
13.1 Timer2 Operation
The Timer2 module incorporates the following features: * 8-bit Timer and Period registers (TMR2 and PR2, respectively) * Readable and writable (both registers) * Software programmable prescaler (1:1, 1:4 and 1:16) * Software programmable postscaler (1:1 through 1:16) * Interrupt on TMR2 to PR2 match * Optional use as the shift clock for the MSSP module The module is controlled through the T2CON register (Register 13-1), which enables or disables the timer and configures the prescaler and postscaler. Timer2 can be shut off by clearing control bit, TMR2ON (T2CON<2>), to minimize power consumption. A simplified block diagram of the module is shown in Figure 13-1. In normal operation, TMR2 is incremented from 00h on each clock (FOSC/4). A 4-bit counter/prescaler on the clock input gives direct input, divide-by-4 and divide-by-16 prescale options. These are selected by the prescaler control bits, T2CKPS<1:0> (T2CON<1:0>). The value of TMR2 is compared to that of the Period register, PR2, on each clock cycle. When the two values match, the comparator generates a match signal as the timer output. This signal also resets the value of TMR2 to 00h on the next cycle and drives the output counter/postscaler (see Section 13.2 "Timer2 Interrupt"). The TMR2 and PR2 registers are both directly readable and writable. The TMR2 register is cleared on any device Reset, while the PR2 register initializes at FFh. Both the prescaler and postscaler counters are cleared on the following events: * a write to the TMR2 register * a write to the T2CON register * any device Reset (Power-on Reset, MCLR Reset, Watchdog Timer Reset or Brown-out Reset) TMR2 is not cleared when T2CON is written.
REGISTER 13-1:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6-3
T2CON: TIMER2 CONTROL REGISTER
R/W-0 T2OUTPS2 R/W-0 T2OUTPS1 R/W-0 T2OUTPS0 R/W-0 TMR2ON R/W-0 T2CKPS1 R/W-0 T2CKPS0 bit 0
R/W-0 T2OUTPS3
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
Unimplemented: Read as `0' T2OUTPS<3:0>: Timer2 Output Postscale Select bits 0000 = 1:1 Postscale 0001 = 1:2 Postscale * * * 1111 = 1:16 Postscale TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off T2CKPS<1:0>: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 1x = Prescaler is 16
bit 2
bit 1-0
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13.2 Timer2 Interrupt 13.3 Timer2 Output
Timer2 can also generate an optional device interrupt. The Timer2 output signal (TMR2 to PR2 match) provides the input for the 4-bit output counter/postscaler. This counter generates the TMR2 match interrupt flag which is latched in TMR2IF (PIR1<1>). The interrupt is enabled by setting the TMR2 Match Interrupt Enable bit, TMR2IE (PIE1<1>). A range of 16 postscale options (from 1:1 through 1:16 inclusive) can be selected with the postscaler control bits, T2OUTPS<3:0> (T2CON<6:3>). The unscaled output of TMR2 is available primarily to the CCP modules, where it is used as a time base for operations in PWM mode. Timer2 can be optionally used as the shift clock source for the MSSP module operating in SPI mode. Additional information is provided in Section 18.0 "Master Synchronous Serial Port (MSSP) Module".
FIGURE 13-1:
TIMER2 BLOCK DIAGRAM
4 2 TMR2/PR2 Match Comparator
8
T2OUTPS<3:0> T2CKPS<1:0>
1:1 to 1:16 Postscaler
Set TMR2IF TMR2 Output (to PWM or MSSP)
FOSC/4
1:1, 1:4, 1:16 Prescaler
Reset TMR2
8
PR2
8
Internal Data Bus
TABLE 13-1:
Name
REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER
Bit 6 Bit 5 TMR0IE RC1IF RC1IE RC1IP Bit 4 INT0IE TX1IF TX1IE TX1IP Bit 3 RBIE SSPIF SSPIE SSPIP Bit 2 TMR0IF -- -- -- Bit 1 INT0IF TMR2IF TMR2IE TMR2IP Bit 0 RBIF TMR1IF TMR1IE TMR1IP Reset Values on page 49 52 52 52 50 T2CKPS1 T2CKPS0 50 50
Bit 7
INTCON GIE/GIEH PEIE/GIEL PIR1 PIE1 IPR1 TMR2 T2CON PR2 -- -- -- -- ADIF ADIE ADIP
Timer2 Register T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON Timer2 Period Register
Legend: -- = unimplemented, read as `0'. Shaded cells are not used by the Timer2 module.
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14.0 TIMER3 MODULE
The Timer3 timer/counter module incorporates these features: * Software selectable operation as a 16-bit timer or counter * Readable and writable 8-bit registers (TMR3H and TMR3L) * Selectable clock source (internal or external) with device clock or Timer1 oscillator internal options * Interrupt-on-overflow * Module Reset on CCP Special Event Trigger A simplified block diagram of the Timer3 module is shown in Figure 14-1. A block diagram of the module's operation in Read/Write mode is shown in Figure 14-2. The Timer3 module is controlled through the T3CON register (Register 14-1). It also selects the clock source options for the CCP modules. See Section 16.2.2 "Timer1/Timer3 Mode Selection" for more information.
REGISTER 14-1:
R/W-0 RD16 bit 7 Legend: R = Readable bit -n = Value at POR bit 7
T3CON: TIMER3 CONTROL REGISTER
R/W-0 T3CKPS1 R/W-0 T3CKPS0 R/W-0 T3CCP1 R/W-0 T3SYNC R/W-0 TMR3CS R/W-0 TMR3ON bit 0
R/W-0 T3CCP2
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
RD16: 16-Bit Read/Write Mode Enable bit 1 = Enables register read/write of Timer3 in one 16-bit operation 0 = Enables register read/write of Timer3 in two 8-bit operations T3CCP<2:1>: Timer3 and Timer1 to CCPx Enable bits 1x = Timer3 is the capture/compare clock source for the CCP modules 01 = Timer3 is the capture/compare clock source for CCP2; Timer1 is the capture/compare clock source for CCP1 00 = Timer1 is the capture/compare clock source for the CCP modules T3CKPS<1:0>: Timer3 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value T3SYNC: Timer3 External Clock Input Synchronization Control bit (Not usable if the device clock comes from Timer1/Timer3.) When TMR3CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input When TMR3CS = 0: This bit is ignored. Timer3 uses the internal clock when TMR3CS = 0. TMR3CS: Timer3 Clock Source Select bit 1 = External clock input from Timer1 oscillator or T13CKI (on the rising edge after the first falling edge) 0 = Internal clock (FOSC/4) TMR3ON: Timer3 On bit 1 = Enables Timer3 0 = Stops Timer3
bit 6,3
bit 5-4
bit 2
bit 1
bit 0
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14.1 Timer3 Operation
Timer3 can operate in one of three modes: * Timer * Synchronous Counter * Asynchronous Counter The operating mode is determined by the clock select bit, TMR3CS (T3CON<1>). When TMR3CS is cleared (= 0), Timer3 increments on every internal instruction cycle (FOSC/4). When the bit is set, Timer3 increments on every rising edge of the Timer1 external clock input or the Timer1 oscillator, if enabled. As with Timer1, the RC1/T1OSI/SEG32 and RC0/T1OSO/T13CKI pins become inputs when the Timer1 oscillator is enabled. This means the values of TRISC<1:0> are ignored and the pins are read as `0'.
FIGURE 14-1:
TIMER3 BLOCK DIAGRAM (8-BIT MODE)
Timer1 Oscillator Timer1 Clock Input 1 FOSC/4 Internal Clock T1OSCEN(1) T3CKPS<1:0> T3SYNC TMR3ON TMR3CS Prescaler 1, 2, 4, 8 0 2 Sleep Input Timer3 On/Off 1 Synchronize Detect
T1OSO/T13CKI
0
T1OSI
CCPx Special Event Trigger CCPx Select from T3CON<6,3>
Clear TMR3
TMR3L
TMR3 High Byte
Set TMR3IF on Overflow
Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.
FIGURE 14-2:
TIMER3 BLOCK DIAGRAM (16-BIT READ/WRITE MODE)
Timer1 Oscillator Timer1 Clock Input 1 FOSC/4 Internal Clock T1OSCEN(1) T3CKPS<1:0> T3SYNC TMR3ON CCPx Special Event Trigger CCPx Select from T3CON<6,3> Clear TMR3 TMR3L TMR3 High Byte 8 TMR3CS Prescaler 1, 2, 4, 8 0 2 Sleep Input Timer3 On/Off 1 Synchronize Detect 0
T13CKI/T1OSO
T1OSI
Set TMR3IF on Overflow
Read TMR3L Write TMR3L 8 8 TMR3H 8 8 Internal Data Bus Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.
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14.2 Timer3 16-Bit Read/Write Mode 14.4 Timer3 Interrupt
Timer3 can be configured for 16-bit reads and writes (see Figure 14-2). When the RD16 control bit (T3CON<7>) is set, the address for TMR3H is mapped to a buffer register for the high byte of Timer3. A read from TMR3L will load the contents of the high byte of Timer3 into the Timer3 High Byte Buffer register. This provides the user with the ability to accurately read all 16 bits of Timer1 without having to determine whether a read of the high byte, followed by a read of the low byte, has become invalid due to a rollover between reads. A write to the high byte of Timer3 must also take place through the TMR3H Buffer register. The Timer3 high byte is updated with the contents of TMR3H when a write occurs to TMR3L. This allows a user to write all 16 bits to both the high and low bytes of Timer3 at once. The high byte of Timer3 is not directly readable or writable in this mode. All reads and writes must take place through the Timer3 High Byte Buffer register. Writes to TMR3H do not clear the Timer3 prescaler. The prescaler is only cleared on writes to TMR3L. The TMR3 register pair (TMR3H:TMR3L) increments from 0000h to FFFFh and overflows to 0000h. The Timer3 interrupt, if enabled, is generated on overflow and is latched in interrupt flag bit, TMR3IF (PIR2<1>). This interrupt can be enabled or disabled by setting or clearing the Timer3 Interrupt Enable bit, TMR3IE (PIE2<1>).
14.5
Resetting Timer3 Using the CCP Special Event Trigger
If CCP1 or CCP2 is configured to use Timer3 and to generate a Special Event Trigger in Compare mode (CCPxM<3:0> = 1011), this signal will reset Timer3. The trigger from CCP2 will also start an A/D conversion if the A/D module is enabled (see Section 16.3.4 "Special Event Trigger" for more information). The module must be configured as either a timer or synchronous counter to take advantage of this feature. When used this way, the CCPRxH:CCPRxL register pair effectively becomes a period register for Timer3. If Timer3 is running in Asynchronous Counter mode, the Reset operation may not work. In the event that a write to Timer3 coincides with a Special Event Trigger from a CCP module, the write will take precedence. Note: The Special Event Triggers from the CCPx module will not set the TMR3IF interrupt flag bit (PIR2<1>).
14.3
Using the Timer1 Oscillator as the Timer3 Clock Source
The Timer1 internal oscillator may be used as the clock source for Timer3. The Timer1 oscillator is enabled by setting the T1OSCEN (T1CON<3>) bit. To use it as the Timer3 clock source, the TMR3CS bit must also be set. As previously noted, this also configures Timer3 to increment on every rising edge of the oscillator source. The Timer1 oscillator is described in Section 12.0 "Timer1 Module".
TABLE 14-1:
Name INTCON PIR2 PIE2 IPR2 TMR3L TMR3H T1CON T3CON
REGISTERS ASSOCIATED WITH TIMER3 AS A TIMER/COUNTER
Bit 7 Bit 6 Bit 5 TMR0IE -- -- -- Bit 4 INT0IE -- -- -- Bit 3 RBIE BCLIF BCLIE BCLIP Bit 2 TMR0IF LVDIF LVDIE LVDIP Bit 1 INT0IF TMR3IF TMR3IE TMR3IP Bit 0 RBIF -- -- -- Reset Values on page 49 52 52 52 51 51 TMR1CS TMR3CS TMR1ON TMR3ON 50 51 T3CCP1 T3SYNC
GIE/GIEH PEIE/GIEL OSCFIF OSCFIE OSCFIP CMIF CMIE CMIP
Timer3 Register Low Byte Timer3 Register High Byte RD16 RD16 T1RUN T3CCP2 T1CKPS1 T1CKPS0 T1OSCEN T1SYNC T3CKPS1 T3CKPS0
Legend: -- = unimplemented, read as `0'. Shaded cells are not used by the Timer3 module.
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15.0 REAL-TIME CLOCK AND CALENDAR (RTCC)
The RTCC module is intended for applications, where accurate time must be maintained for an extended period with minimum to no intervention from the CPU. The module is optimized for low-power usage in order to provide extended battery life while keeping track of time. The module is a 100-year clock and calendar with automatic leap year detection. The range of the clock is from 00:00:00 (midnight) on January 1, 2000 to 23:59:59 on December 31, 2099. Hours are measured in 24-hour (military time) format. The clock provides a granularity of one second with half-second visibility to the user.
The key features of the Real-Time Clock and Calendar (RTCC) module are: * * * * * * * * * * * * Time: hours, minutes and seconds 24-hour format (military time) Calendar: weekday, date, month and year Alarm configurable Year range: 2000 to 2099 Leap year correction BCD format for compact firmware Optimized for low-power operation User calibration with auto-adjust Calibration range: 2.64 seconds error per month Requirements: external 32.768 kHz clock crystal Alarm pulse or seconds clock output on RTCC pin
FIGURE 15-1:
RTCC BLOCK DIAGRAM
RTCC Clock Domain CPU Clock Domain
32.768 kHz Input from Timer1 Oscillator RTCC Prescalers Internal RC 0.5s RTCC Timer Alarm Event
RTCCFG ALRMRPT YEAR MTHDY WKDYHR MINSEC Comparator ALMTHDY Compare Registers with Masks ALRMVALx ALWDHR ALMINSEC Repeat Counter
RTCVALx
RTCC Interrupt RTCC Interrupt Logic Alarm Pulse RTCC Pin
RTCOE
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15.1 RTCC MODULE REGISTERS
Alarm Value Registers
* ALRMVALH and ALRMVALL - Can access the following registers: - ALRMMNTH - ALRMDAY - ALRMWD - ALRMHR - ALRMMIN - ALRMSEC Note: The RTCVALH and RTCVALL registers can be accessed through RTCRPT<1:0>. ALRMVALH and ALRMVALL can be accessed through ALRMPTR<1:0>. The RTCC module registers are divided into following categories:
RTCC Control Registers
* * * * * RTCCFG RTCCAL PADCFG1 ALRMCFG ALRMRPT
RTCC Value Registers
* RTCVALH and RTCVALL - Can access the following registers - YEAR - MONTH - DAY - WEEKDAY - HOUR - MINUTE - SECOND
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15.1.1 RTCC CONTROL REGISTERS
RTCCFG: RTCC CONFIGURATION REGISTER(1)
U-0 -- R/W-0 RTCWREN R-0 R-0
(3)
REGISTER 15-1:
R/W-0 RTCEN bit 7 Legend: R = Readable bit -n = Value at POR bit 7
(2)
R/W-0 RTCOE
R/W-0 RTCPTR1
R/W-0 RTCPTR0 bit 0
RTCSYNC HALFSEC
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
RTCEN: RTCC Enable bit(2) 1 = RTCC module is enabled 0 = RTCC module is disabled Unimplemented: Read as `0' RTCWREN: RTCC Value Registers Write Enable bit 1 = RTCVALH and RTCVALL registers can be written to by the user 0 = RTCVALH and RTCVALL registers are locked out from being written to by the user RTCSYNC: RTCC Value Registers Read Synchronization bit 1 = RTCVALH, RTCVALL and ALRMRPT registers can change while reading due to a rollover ripple resulting in an invalid data read. If the register is read twice and results in the same data, the data can be assumed to be valid. 0 = RTCVALH, RTCVALL and ALCFGRPT registers can be read without concern over a rollover ripple HALFSEC: Half-Second Status bit(3) 1 = Second half period of a second 0 = First half period of a second RTCOE: RTCC Output Enable bit 1 = RTCC clock output is enabled 0 = RTCC clock output is disabled RTCPTR<1:0>: RTCC Value Register Window Pointer bits Points to the corresponding RTCC Value registers when reading RTCVALH and RTCVALL registers. The RTCPTR<1:0> value decrements on every read or write of RTCVALH<7:0> until it reaches `00'. RTCVALH: 00 = Minutes 01 = Weekday 10 = Month 11 = Reserved RTCVALL: 00 = Seconds 01 = Hours 10 = Day 11 = Year The RTCCFG register is only affected by a POR. For Resets other than POR, RTCC will continue to run even if the device is in Reset. A write to the RTCEN bit is only allowed when RTCWREN = 1. This bit is read-only; it is cleared to `0' on a write to the lower half of the MINSEC register.
bit 6 bit 5
bit 4
bit 3
bit 2
bit 1-0
Note 1: 2: 3:
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REGISTER 15-2:
R/W-0 CAL7 bit 7 Legend: R = Readable bit -n = Value at POR bit 7-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
RTCCAL: RTCC CALIBRATION REGISTER
R/W-0 CAL6 R/W-0 CAL5 R/W-0 CAL4 R/W-0 CAL3 R/W-0 CAL2 R/W-0 CAL1 R/W-0 CAL0 bit 0
CAL<7:0>: RTC Drift Calibration bits 01111111 = Maximum positive adjustment; adds 508 RTC clock pulses every minute . . . 00000001 = Minimum positive adjustment; adds four RTC clock pulses every minute 00000000 = No adjustment 11111111 = Minimum negative adjustment; subtracts four RTC clock pulses every minute . . . 10000000 = Maximum negative adjustment; subtracts 512 RTC clock pulses every minute
REGISTER 15-3:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-3 bit 2-1 --
PADCFG1: PAD CONFIGURATION REGISTER
U-0 U-0 -- U-0 -- U-0 -- R/W-0 R/W-0 U-0 -- bit 0 RTSECSEL1(1) RTSECSEL0(1)
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
Unimplemented: Read as `0' RTSECSEL<1:0>: RTCC Seconds Clock Output Select bits(1) 11 = Reserved; do not use 10 = RTCC source clock is selected for the RTCC pin (pin can be INTOSC or Timer1 oscillator, depending on the RTCOSC (CONFIG3L<1>) bit setting)(2) 01 = RTCC seconds clock is selected for the RTCC pin 00 = RTCC alarm pulse is selected for the RTCC pin Unimplemented: Read as `0' To enable the actual RTCC output, the RTCOE (RTCCFG<2>) bit must be set. If the Timer1 oscillator is the clock source for RTCC, T1OSCEN bit should be set (T1CON<3> = 1).
bit 0 Note 1: 2:
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REGISTER 15-4:
R/W-0 ALRMEN bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
ALRMCFG: ALARM CONFIGURATION REGISTER
R/W-0 CHIME R/W-0 AMASK3 R/W-0 AMASK2 R/W-0 AMASK1 R/W-0 AMASK0 R/W-0 ALRMPTR1 R/W-0 ALRMPTR0 bit 0
ALRMEN: Alarm Enable bit 1 = Alarm is enabled (cleared automatically after an alarm event whenever ARPT<7:0> = 00 and CHIME = 0) 0 = Alarm is disabled CHIME: Chime Enable bit 1 = Chime is enabled; ALRMPTR<1:0> bits are allowed to roll over from 00h to FFh 0 = Chime is disabled; ALRMPTR<1:0> bits stop once they reach 00h AMASK<3:0>: Alarm Mask Configuration bits 0000 = Every half second 0001 = Every second 0010 = Every 10 seconds 0011 = Every minute 0100 = Every 10 minutes 0101 = Every hour 0110 = Once a day 0111 = Once a week 1000 = Once a month 1001 = Once a year (except when configured for February 29th, once every four years) 101x = Reserved - do not use 11xx = Reserved - do not use ALRMPTR<1:0>: Alarm Value Register Window Pointer bits Points to the corresponding Alarm Value registers when reading the ALRMVALH and ALRMVALL registers. The ALRMPTR<1:0> value decrements on every read or write of ALRMVALH until it reaches `00'. ALRMVALH: 00 = ALRMMIN 01 = ALRMWD 10 = ALRMMNTH 11 = Unimplemented ALRMVALL: 00 = ALRMSEC 01 = ALRMHR 10 = ALRMDAY 11 = Unimplemented
bit 6
bit 5-2
bit 1-0
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REGISTER 15-5:
R/W-0 ARPT7 bit 7 Legend: R = Readable bit -n = Value at POR bit 7-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
ALRMRPT: ALARM CALIBRATION REGISTER
R/W-0 ARPT6 R/W-0 ARPT5 R/W-0 ARPT4 R/W-0 ARPT3 R/W-0 ARPT2 R/W-0 ARPT1 R/W-0 ARPT0 bit 0
ARPT<7:0>: Alarm Repeat Counter Value bits 11111111 = Alarm will repeat 255 more times . . . 00000000 = Alarm will not repeat The counter decrements on any alarm event. The counter is prevented from rolling over from 00h to FFh unless CHIME = 1.
15.1.2
RTCVALH AND RTCVALL REGISTER MAPPINGS RESERVED REGISTER
U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 0
REGISTER 15-6:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-0
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
Unimplemented: Read as `0'
REGISTER 15-7:
R/W-x YRTEN3 bit 7 Legend: R = Readable bit -n = Value at POR bit 7-4 bit 3-0 Note 1:
YEAR: YEAR VALUE REGISTER(1)
R/W-x R/W-x YRTEN1 R/W-x YRTEN0 R/W-x YRONE3 R/W-x YRONE2 R/W-x YRONE1 R/W-x YRONE0 bit 0
YRTEN2
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
YRTEN<3:0>: Binary Coded Decimal Value of Year's Tens Digit bits Contains a value from 0 to 9. YRONE<3:0>: Binary Coded Decimal Value of Year's Ones Digit bits Contains a value from 0 to 9. A write to the YEAR register is only allowed when RTCWREN = 1.
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REGISTER 15-8:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-5 bit 4 bit 3-0 Note 1: W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
MONTH: MONTH VALUE REGISTER(1)
U-0 -- U-0 -- R/W-x MTHTEN0 R/W-x MTHONE3 R/W-x MTHONE2 R/W-x MTHONE1 R/W-x MTHONE0 bit 0
Unimplemented: Read as `0' MTHTEN0: Binary Coded Decimal Value of Month's Tens Digit bits Contains a value of 0 or 1. MTHONE<3:0>: Binary Coded Decimal Value of Month's Ones Digit bits Contains a value from 0 to 9. A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-9:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-6 bit 5-4 bit 3-0 Note 1:
DAY: DAY VALUE REGISTER(1)
U-0 -- R/W-x DAYTEN1 R/W-x DAYTEN0 R/W-x DAYONE3 R/W-x DAYONE2 R/W-x DAYONE1 R/W-x DAYONE0 bit 0
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
Unimplemented: Read as `0' DAYTEN<1:0>: Binary Coded Decimal value of Day's Tens Digit bits Contains a value from 0 to 3. DAYONE<3:0>: Binary Coded Decimal Value of Day's Ones Digit bits Contains a value from 0 to 9. A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-10: WEEKDAY: WEEKDAY VALUE REGISTER(1)
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-3 bit 2-0 Note 1: W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- R/W-x WDAY2 R/W-x WDAY1 R/W-x WDAY0 bit 0
Unimplemented: Read as `0' WDAY<2:0>: Binary Coded Decimal Value of Weekday Digit bits Contains a value from 0 to 6. A write to this register is only allowed when RTCWREN = 1.
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REGISTER 15-11: HOUR: HOUR VALUE REGISTER(1)
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-6 bit 5-4 bit 3-0 Note 1: W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- R/W-x HRTEN1 R/W-x HRTEN0 R/W-x HRONE3 R/W-x HRONE2 R/W-x HRONE1 R/W-x HRONE0 bit 0
Unimplemented: Read as `0' HRTEN<1:0>: Binary Coded Decimal Value of Hour's Tens Digit bits Contains a value from 0 to 2. HRONE<3:0>: Binary Coded Decimal Value of Hour's Ones Digit bits Contains a value from 0 to 9. A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-12: MINUTE: MINUTE VALUE REGISTER
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6-4 bit 3-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-x MINTEN2 R/W-x MINTEN1 R/W-x MINTEN0 R/W-x MINONE3 R/W-x MINONE2 R/W-x MINONE1 R/W-x MINONE0 bit 0
Unimplemented: Read as `0' MINTEN<2:0>: Binary Coded Decimal Value of Minute's Tens Digit bits Contains a value from 0 to 5. MINONE<3:0>: Binary Coded Decimal Value of Minute's Ones Digit bits Contains a value from 0 to 9.
REGISTER 15-13: SECOND: SECOND VALUE REGISTER
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6-4 bit 3-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-x SECTEN2 R/W-x SECTEN1 R/W-x SECTEN0 R/W-x SECONE3 R/W-x SECONE2 R/W-x SECONE1 R/W-x SECONE0 bit 0
Unimplemented: Read as `0' SECTEN<2:0>: Binary Coded Decimal Value of Second's Tens Digit bits Contains a value from 0 to 5. SECONE<3:0>: Binary Coded Decimal Value of Second's Ones Digit bits Contains a value from 0 to 9.
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15.1.3 ALRMVALH AND ALRMVALL REGISTER MAPPINGS REGISTER 15-14: ALRMMNTH: ALARM MONTH VALUE REGISTER(1)
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-5 bit 4 bit 3-0 Note 1: W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-x MTHTEN0 R/W-x MTHONE3 R/W-x MTHONE2 R/W-x MTHONE1 R/W-x MTHONE0 bit 0
Unimplemented: Read as `0' MTHTEN0: Binary Coded Decimal Value of Month's Tens Digit bits Contains a value of 0 or 1. MTHONE<3:0>: Binary Coded Decimal Value of Month's Ones Digit bits Contains a value from 0 to 9. A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-15: ALRMDAY: ALARM DAY VALUE REGISTER(1)
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-6 bit 5-4 bit 3-0 Note 1: W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- R/W-x DAYTEN1 R/W-x DAYTEN0 R/W-x DAYONE3 R/W-x DAYONE2 R/W-x DAYONE1 R/W-x DAYONE0 bit 0
Unimplemented: Read as `0' DAYTEN<1:0>: Binary Coded Decimal Value of Day's Tens Digit bits Contains a value from 0 to 3. DAYONE<3:0>: Binary Coded Decimal Value of Day's Ones Digit bits Contains a value from 0 to 9. A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-16: ALRMWD: ALARM WEEKDAY VALUE REGISTER(1)
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-3 bit 2-0 Note 1: W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- R/W-x WDAY2 R/W-x WDAY1 R/W-x WDAY0 bit 0
Unimplemented: Read as `0' WDAY<2:0>: Binary Coded Decimal Value of Weekday Digit bits Contains a value from 0 to 6. A write to this register is only allowed when RTCWREN = 1.
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REGISTER 15-17: ALRMHR: ALARM HOURS VALUE REGISTER(1)
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-6 bit 5-4 bit 3-0 Note 1: W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- R/W-x HRTEN1 R/W-x HRTEN0 R/W-x HRONE3 R/W-x HRONE2 R/W-x HRONE1 R/W-x HRONE0 bit 0
Unimplemented: Read as `0' HRTEN<1:0>: Binary Coded Decimal Value of Hour's Tens Digit bits Contains a value from 0 to 2. HRONE<3:0>: Binary Coded Decimal Value of Hour's Ones Digit bits Contains a value from 0 to 9. A write to this register is only allowed when RTCWREN = 1.
REGISTER 15-18: ALRMMIN: ALARM MINUTES VALUE REGISTER
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6-4 bit 3-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-x MINTEN2 R/W-x MINTEN1 R/W-x MINTEN0 R/W-x MINONE3 R/W-x MINONE2 R/W-x MINONE1 R/W-x MINONE0 bit 0
Unimplemented: Read as `0' MINTEN<2:0>: Binary Coded Decimal Value of Minute's Tens Digit bits Contains a value from 0 to 5. MINONE<3:0>: Binary Coded Decimal Value of Minute's Ones Digit bits Contains a value from 0 to 9.
REGISTER 15-19: ALRMSEC: ALARM SECONDS VALUE REGISTER
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6-4 bit 3-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-x SECTEN2 R/W-x SECTEN1 R/W-x SECTEN0 R/W-x SECONE3 R/W-x SECONE2 R/W-x SECONE1 R/W-x SECONE0 bit 0
Unimplemented: Read as `0' SECTEN<2:0>: Binary Coded Decimal Value of Second's Tens Digit bits Contains a value from 0 to 5. SECONE<3:0>: Binary Coded Decimal Value of Second's Ones Digit bits Contains a value from 0 to 9.
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15.1.4 RTCEN BIT WRITE
15.2
15.2.1
Operation
REGISTER INTERFACE
An attempt to write to the RTCEN bit while RTCWREN = 0 will be ignored. RTCWREN must be set before a write to RTCEN can take place. Like the RTCEN bit, the RTCVALH and RTCVALL registers can only be written to when RTCWREN = 1. A write to these registers, while RTCWREN = 0, will be ignored.
The register interface for the RTCC and alarm values is implemented using the Binary Coded Decimal (BCD) format. This simplifies the firmware when using the module, as each of the digits is contained within its own 4-bit value (see Figure 15-2 and Figure 15-3).
FIGURE 15-2:
TIMER DIGIT FORMAT
Year Month Day Day of Week
0-9
0-9
0-1
0-9
0-3
0-9
0-6
Hours (24-hour format)
Minutes
Seconds
1/2 Second Bit (binary format)
0-2
0-9
0-5
0-9
0-5
0-9
0/1
FIGURE 15-3:
ALARM DIGIT FORMAT
Month Day Day of Week
0-1
0-9
0-3
0-9
0-6
Hours (24-hour format)
Minutes
Seconds
0-2
0-9
0-5
0-9
0-5
0-9
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15.2.2 CLOCK SOURCE
As mentioned earlier, the RTCC module is intended to be clocked by an external Real-Time Clock crystal oscillating at 32.768 kHz, but can also be an internal oscillator. The RTCC clock selection is decided by the RTCOSC bit (CONFIG3L<1>). Calibration of the crystal can be done through this module to yield an error of 3 seconds or less per month. (For further details, see Section 15.2.9 "Calibration".)
FIGURE 15-4:
32.768 kHz XTAL from SOSC Internal RC CONFIG 3L<1>
CLOCK SOURCE MULTIPLEXING
Half-Second Clock
1:16384 Clock Prescaler(1)
Half Second(1)
One-Second Clock
Second
Hour:Minute
Day Day of Week
Month
Year
Note 1:
Writing to the lower half of the MINSEC register resets all counters, allowing fraction of a second synchronization; clock prescaler is held in Reset when RTCEN = 0.
15.2.2.1
Real-Time Clock Enable
TABLE 15-1:
DAY OF WEEK SCHEDULE
Day of Week 0 1 2 3 4 5 6
The RTCC module can be clocked by an external, 32.768 kHz crystal (Timer1 oscillator) or the internal RC oscillator, which can be selected in CONFIG3L<1>. If the external clock is used, the Timer1 oscillator should be enabled by setting the T1OSCEN bit (T1CON<3> = 1). If INTRC is providing the clock, the INTRC clock can be brought out to the RTCC pin by the RTSECSEL<1:0> bits in the PADCFG register.
Sunday Monday Tuesday Wednesday Thursday Friday Saturday
15.2.3
DIGIT CARRY RULES
This section explains which timer values are affected when there is a rollover. * Time of Day: from 23:59:59 to 00:00:00 with a carry to the Day field * Month: from 12/31 to 01/01 with a carry to the Year field * Day of Week: from 6 to 0 with no carry (see Table 15-1) * Year Carry: from 99 to 00; this also surpasses the use of the RTCC For the day to month rollover schedule, see Table 15-2. Considering that the following values are in BCD format, the carry to the upper BCD digit will occur at a count of 10 and not at 16 (SECONDS, MINUTES, HOURS, WEEKDAY, DAYS and MONTHS).
TABLE 15-2:
Month
DAY TO MONTH ROLLOVER SCHEDULE
Maximum Day Field 31 28 or 29(1) 31 30 31 30 31 31 30 31 30 31
01 (January) 02 (February) 03 (March) 04 (April) 05 (May) 06 (June) 07 (July) 08 (August) 09 (September) 10 (October) 11 (November) 12 (December) Note 1:
See Section 15.2.4 "Leap Year".
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15.2.4 LEAP YEAR 15.2.7 WRITE LOCK
Since the year range on the RTCC module is 2000 to 2099, the leap year calculation is determined by any year divisible by 4 in the above range. Only February is effected in a leap year. February will have 29 days in a leap year and 28 days in any other year. In order to perform a write to any of the RTCC Timer registers, the RTCWREN bit (RTCCFG<5>) must be set. To avoid accidental writes to the RTCC Timer register, it is recommended that the RTCWREN bit (RTCCFG<5>) be kept clear at any time other than while writing to it. For the RTCWREN bit to be set, there is only one instruction cycle time window allowed between the 55h/AA sequence and the setting of RTCWREN. For that reason, it is recommended that users follow the code example in Example 15-1.
15.2.5
GENERAL FUNCTIONALITY
All Timer registers containing a time value of seconds or greater are writable. The user configures the time by writing the required year, month, day, hour, minutes and seconds to the Timer registers via register pointers (see Section 15.2.8 "Register Mapping"). The timer uses the newly written values and proceeds with the count from the required starting point. The RTCC is enabled by setting the RTCEN bit (RTCCFG<7>). If enabled while adjusting these registers, the timer still continues to increment. However, any time the MINSEC register is written to, both of the timer prescalers are reset to `0'. This allows fraction of a second synchronization. The Timer registers are updated in the same cycle as the write instruction's execution by the CPU. The user must ensure that when RTCEN = 1, the updated registers will not be incremented at the same time. This can be accomplished in several ways: * By checking the RTCSYNC bit (RTCCFG<4>) * By checking the preceding digits from which a carry can occur * By updating the registers immediately following the seconds pulse (or alarm interrupt) The user has visibility to the half-second field of the counter. This value is read-only and can be reset only by writing to the lower half of the SECONDS register.
EXAMPLE 15-1:
movlw movwf movlw movwf bsf
SETTING THE RTCWREN BIT
0x55 EECON2 0xAA EECON2 RTCCFG,RTCWREN
15.2.8
REGISTER MAPPING
To limit the register interface, the RTCC Timer and Alarm Timer registers are accessed through corresponding register pointers. The RTCC Value register window (RTCVALH and RTCVALL) uses the RTCPTR bits (RTCCFG<1:0>) to select the required Timer register pair. By reading or writing to the RTCVALH register, the RTCC Pointer value (RTCPTR<1:0>) decrements by `1' until it reaches `00'. Once it reaches `00', the MINUTES and SECONDS value will be accessible through RTCVALH and RTCVALL until the pointer value is manually changed.
TABLE 15-3:
RTCVALH AND RTCVALL REGISTER MAPPING
RTCC Value Register Window RTCVALH MINUTES WEEKDAY MONTH -- RTCVALL SECONDS HOURS DAY YEAR
15.2.6
SAFETY WINDOW FOR REGISTER READS AND WRITES
RTCPTR<1:0> 00 01 10 11
The RTCSYNC bit indicates a time window during which the RTCC clock domain registers can be safely read and written without concern about a rollover. When RTCSYNC = 0, the registers can be safely accessed by the CPU. Whether RTCSYNC = 1 or 0, the user should employ a firmware solution to ensure that the data read did not fall on a rollover boundary, resulting in an invalid or partial read. This firmware solution would consist of reading each register twice and then comparing the two values. If the two values matched, then a rollover did not occur.
The Alarm Value register window (ALRMVALH and ALRMVALL) uses the ALRMPTR bits (ALRMCFG<1:0>) to select the desired Alarm register pair. By reading or writing to the ALRMVALH register, the Alarm Pointer value, ALRMPTR<1:0>, decrements by `1' until it reaches `00'. Once it reaches `00', the ALRMMIN and ALRMSEC value will be accessible through ALRMVALH and ALRMVALL until the pointer value is manually changed.
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TABLE 15-4: ALRMVAL REGISTER MAPPING
Alarm Value Register Window ALRMVALH ALRMMIN ALRMWD ALRMMNTH -- ALRMVALL ALRMSEC ALRMHR ALRMDAY -- Writes to the RTCCAL register should occur only when the timer is turned off, or immediately after the rising edge of the seconds pulse. Note: In determining the crystal's error value, it is the user's responsibility to include the crystal's initial error from drift due to temperature or crystal aging.
ALRMPTR<1:0> 00 01 10 11
15.3
Alarm
The Alarm features and characteristics are:
15.2.9
CALIBRATION
The real-time crystal input can be calibrated using the periodic auto-adjust feature. When properly calibrated, the RTCC can provide an error of less than three seconds per month. To perform this calibration, find the number of error clock pulses and store the value into the lower half of the RTCCAL register. The 8-bit, signed value, loaded into RTCCAL, is multiplied by 4 and will either be added or subtracted from the RTCC timer, once every minute. To calibrate the RTCC module: 1. 2. Use another timer resource on the device to find the error of the 32.768 kHz crystal. Convert the number of error clock pulses per minute (see Equation 15-1).
* Configurable from half a second to one year * Enabled using the ALRMEN bit (ALRMCFG<7>, Register 15-4) * Offers one-time and repeat alarm options
15.3.1
CONFIGURING THE ALARM
The alarm feature is enabled using the ALRMEN bit. This bit is cleared when an alarm is issued. The bit will not be cleared if the CHIME bit = 1 or if ALRMRPT 0. The interval selection of the alarm is configured through the ALRMCFG bits (AMASK<3:0>). (See Figure 15-5.) These bits determine which and how many digits of the alarm must match the clock value for the alarm to occur. The alarm can also be configured to repeat based on a preconfigured interval. The number of times this occurs, after the alarm is enabled, is stored in the ALRMRPT register. Note: While the alarm is enabled (ALRMEN = 1), changing any of the registers, other than the RTCCAL, ALRMCFG and ALRMRPT registers, and the CHIME bit, can result in a false alarm event leading to a false alarm interrupt. To avoid this, only change the timer and alarm values while the alarm is disabled (ALRMEN = 0). It is recommended that the ALRMCFG and ALRMRPT registers and CHIME bit be changed when RTCSYNC = 0.
EQUATION 15-1:
CONVERTING ERROR CLOCK PULSES
(Ideal Frequency (32,758) - Measured Frequency) * 60 = Error Clocks per Minute * If the oscillator is faster than ideal (negative result from step 2), the RCFGCALL register value needs to be negative. This causes the specified number of clock pulses to be subtracted from the timer counter once every minute. * If the oscillator is slower than ideal (positive result from step 2), the RCFGCALL register value needs to be positive. This causes the specified number of clock pulses to be added to the timer counter once every minute. Load the RTCCAL register with the correct value.
3.
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FIGURE 15-5: ALARM MASK SETTINGS
Day of the Week Month Day Hours Minutes Seconds Alarm Mask Setting AMASK<3:0> 0000 - Every half second 0001 - Every second 0010 - Every 10 seconds 0011 - Every minute 0100 - Every 10 minutes 0101 - Every hour 0110 - Every day 0111 - Every week 1000 - Every month 1001 - Every year(1) Note 1: m m d d d d d h h h h h h h h m m m m m m m m m m m s s s s s s s s s s s s s s s
Annually, except when configured for February 29.
When ALRMCFG = 00 and the CHIME bit = 0 (ALRMCFG<6>), the repeat function is disabled and only a single alarm will occur. The alarm can be repeated up to 255 times by loading the ALRMRPT register with FFh. After each alarm is issued, the ALRMRPT register is decremented by one. Once the register has reached `00', the alarm will be issued one last time.
After the alarm is issued a last time, the ALRMEN bit is cleared automatically and the alarm turned off. Indefinite repetition of the alarm can occur if the CHIME bit = 1. When CHIME = 1, the alarm is not disabled when the ALRMRPT register reaches `00', but it rolls over to FF and continues counting indefinitely.
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15.3.2 ALARM INTERRUPT
At every alarm event, an interrupt is generated. Additionally, an alarm pulse output is provided that operates at half the frequency of the alarm. The alarm pulse output is completely synchronous with the RTCC clock and can be used as a trigger clock to other peripherals. This output is available on the RTCC pin. The output pulse is a clock with a 50% duty cycle and a frequency half that of the alarm event (see Figure 15-6). The RTCC pin can also output the seconds clock. The user can select between the alarm pulse, generated by the RTCC module, or the seconds clock output. The RTSECSEL<1:0> (PADCFG1<2:1>) bits select between these two outputs: * Alarm Pulse - RTSECSEL<1:0> = 00 * Seconds Clock - RTSECSEL<1:0> = 01
FIGURE 15-6:
RTCEN bit
TIMER PULSE GENERATION
ALRMEN bit RTCC Alarm Event
RTCC Pin
15.4
Sleep Mode
15.5.2
POWER-ON RESET (POR)
The timer and alarm continue to operate while in Sleep mode. The operation of the alarm is not affected by Sleep as an alarm event can always wake-up the CPU. The Idle mode does not affect the operation of the timer or alarm.
The RTCCFG and ALRMRPT registers are reset only on a POR. Once the device exits the POR state, the clock registers should be reloaded with the desired values. The timer prescaler values can be reset only by writing to the SECONDS register. No device Reset can affect the prescalers.
15.5
15.5.1
Reset
DEVICE RESET
When a device Reset occurs, the ALCFGRPT register is forced to its Reset state, causing the alarm to be disabled (if enabled prior to the Reset). If the RTCC was enabled, it will continue to operate when a basic device Reset occurs.
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15.6 Register Maps
Table 15-5, Table 15-6 and Table 15-7 summarize the registers associated with the RTCC module.
TABLE 15-5:
File Name RTCCFG RTCCAL PADCFG1 ALRMRPT Legend:
RTCC CONTROL REGISTERS
Bit 6 -- CAL6 -- CHIME ARPT6 Bit 5 RTCWREN CAL5 -- AMASK3 ARPT5 Bit 4 RTCSYNC CAL4 -- AMASK2 ARPT4 Bit 3 HALFSEC CAL3 -- AMASK1 ARPT3 Bit 2 RTCOE CAL2 AMASK0 ARPT2 Bit 1 RTCPTR1 CAL1 Bit 0 RTCPTR0 CAL0 -- ARPT0 All Resets on Page 54 54 54 54 54
Bit 7 RTCEN CAL7 -- ARPT7
RTSECSEL1 RTSECSEL0 ARPT1
ALRMCFG ALRMEN
ALRMPTR1 ALRMPTR0
-- = unimplemented, read as `0'. Reset values are shown in hexadecimal for 80-pin devices.
TABLE 15-6:
File Name RTCVALH RTCVALL Legend:
RTCC VALUE REGISTERS
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets on Page 54 54
RTCC Value High Register Window Based on RTCPTR<1:0> RTCC Value Low Register Window Based on RTCPTR<1:0> -- = unimplemented, read as `0'. Reset values are shown in hexadecimal for 80-pin devices.
TABLE 15-7:
File Name
ALARM VALUE REGISTERS
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets on Page 54 54
ALRMVALH Alarm Value High Register Window Based on ALRMPTR<1:0> ALRMVALL Legend: Alarm Value Low Register Window Based on ALRMPTR<1:0> -- = unimplemented, read as `0'. Reset values are shown in hexadecimal for 80-pin devices.
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NOTES:
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16.0 CAPTURE/COMPARE/PWM (CCP) MODULES
Each CCP module contains two 8-bit registers that can operate as two 8-bit Capture registers, two 8-bit Compare registers or two PWM Master/Slave Duty Cycle registers. For the sake of clarity, all CCP module operation in the following sections is described with respect to CCP2, but is equally applicable to CCP1.
PIC18F87J72 family devices have two CCP (Capture/Compare/PWM) modules, designated CCP1 and CCP2. Both modules implement standard capture, compare and Pulse-Width Modulation (PWM) modes.
REGISTER 16-1:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7-6 bit 5-4
CCPxCON: CCPx CONTROL REGISTER (CCP1, CCP2 MODULES)
U-0 -- R/W-0 DCxB1 R/W-0 DCxB0 R/W-0 CCPxM3 R/W-0 CCPxM2 R/W-0 CCPxM1 R/W-0 CCPxM0 bit 0
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
Unimplemented: Read as `0' DCxB<1:0>: PWM Duty Cycle bit 1 and bit 0 for CCPx Module Capture mode: Unused. Compare mode: Unused. PWM mode: These bits are the two Least Significant bits (bit 1 and bit 0) of the 10-bit PWM duty cycle. The eight Most Significant bits (DCx<9:2>) of the duty cycle are found in CCPRxL. CCPxM<3:0>: CCPx Module Mode Select bits 0000 = Capture/Compare/PWM disabled (resets CCPx module) 0001 = Reserved 0010 = Compare mode, toggle output on match (CCPxIF bit is set) 0011 = Reserved 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode: initialize CCPx pin low; on compare match, force CCPx pin high (CCPxIF bit is set) 1001 = Compare mode: initialize CCPx pin high; on compare match, force CCPx pin low (CCPxIF bit is set) 1010 = Compare mode: generate software interrupt on compare match (CCPxIF bit is set, CCPx pin reflects I/O state) 1011 = Compare mode: Special Event Trigger; reset timer; start A/D conversion on CCPx match (CCPxIF bit is set)(1) 11xx = PWM mode CCPxM<3:0> = 1011 will only reset the timer and not start an A/D conversion on a CCP1 match.
bit 3-0
Note 1:
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16.1 CCP Module Configuration
Each Capture/Compare/PWM module is associated with a control register (generically, CCPxCON) and a data register (CCPRx). The data register, in turn, is comprised of two 8-bit registers: CCPRxL (low byte) and CCPRxH (high byte). All registers are both readable and writable. Depending on the configuration selected, up to four timers may be active at once, with modules in the same configuration (Capture/Compare or PWM) sharing timer resources. The possible configurations are shown in Figure 16-1.
16.1.2
OPEN-DRAIN OUTPUT OPTION
16.1.1
CCP MODULES AND TIMER RESOURCES
The CCP modules utilize timers, 1, 2 or 3, depending on the mode selected. Timer1 and Timer3 are available to modules in Capture or Compare modes, while Timer2 is available for modules in PWM mode.
When operating in Output mode (i.e., in Compare or PWM modes), the drivers for the CCPx pins can be optionally configured as open-drain outputs. This feature allows the voltage level on the pin to be pulled to a higher level through an external pull-up resistor and allows the output to communicate with external circuits without the need for additional level shifters. The open-drain output option is controlled by the CCP2OD and CCP1OD bits (TRISG<6:5>). Setting the appropriate bit configures the pin for the corresponding module for open-drain operation.
TABLE 16-1:
CCP MODE - TIMER RESOURCE
Timer Resource Timer1 or Timer3 Timer1 or Timer3 Timer2
CCP Mode Capture Compare PWM
16.1.3
CCP2 PIN ASSIGNMENT
The assignment of a particular timer to a module is determined by the Timer to CCP enable bits in the T3CON register (Register 14-1). Both modules may be active at any given time and may share the same timer resource if they are configured to operate in the same mode (Capture/Compare or PWM) at the same time. The interactions between the two modules are summarized in Table 16-2.
The pin assignment for CCP2 (capture input, compare and PWM output) can change, based on device configuration. The CCP2MX Configuration bit determines which pin CCP2 is multiplexed to. By default, it is assigned to RC1 (CCP2MX = 1). If the Configuration bit is cleared, CCP2 is multiplexed with RE7. Changing the pin assignment of CCP2 does not automatically change any requirements for configuring the port pin. Users must always verify that the appropriate TRIS register is configured correctly for CCP2 operation, regardless of where it is located.
FIGURE 16-1:
CCP AND TIMER INTERCONNECT CONFIGURATIONS
T3CCP<2:1> = 01 TMR1 TMR3 T3CCP<2:1> = 1x TMR1 TMR3
T3CCP<2:1> = 00 TMR1 TMR3
CCP1 CCP2
CCP1 CCP2
CCP1 CCP2
TMR2 Timer1 is used for all capture and compare operations for all CCP modules. Timer2 is used for PWM operations for all CCP modules. Modules may share either timer resource as a common time base.
TMR2 Timer1 is used for capture and compare operations for CCP1 and Timer 3 is used for CCP2. Both the modules use Timer2 as a common time base if they are in PWM modes.
TMR2 Timer3 is used for all capture and compare operations for all CCP modules. Timer2 is used for PWM operations for all CCP modules. Modules may share either timer resource as a common time base.
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TABLE 16-2:
Capture Capture
INTERACTIONS BETWEEN CCP1 AND CCP2 FOR TIMER RESOURCES
Interaction Each module can use TMR1 or TMR3 as the time base. The time base can be different for each CCP. CCP2 can be configured for the Special Event Trigger to reset TMR1 or TMR3 (depending upon which time base is used). Automatic A/D conversions on trigger event can also be done. Operation of CCP1 could be affected if it is using the same timer as a time base. CCP1 can be configured for the Special Event Trigger to reset TMR1 or TMR3 (depending upon which time base is used). Operation of CCP2 could be affected if it is using the same timer as a time base. Either module can be configured for the Special Event Trigger to reset the time base. Automatic A/D conversions on CCP2 trigger event can be done. Conflicts may occur if both modules are using the same time base. None None None None Both PWMs will have the same frequency and update rate (TMR2 interrupt). Capture Compare
CCP1 Mode CCP2 Mode
Compare
Capture
Compare
Compare
Capture Compare PWM PWM PWM
PWM PWM Capture Compare PWM
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16.2 Capture Mode
16.2.3 SOFTWARE INTERRUPT
In Capture mode, the CCPR2H:CCPR2L register pair captures the 16-bit value of the TMR1 or TMR3 register when an event occurs on the CCP2 pin (RC1 or RE7, depending on device configuration). An event is defined as one of the following: * * * * Every falling edge Every rising edge Every 4th rising edge Every 16th rising edge When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the CCP2IE bit (PIE3<2>) clear to avoid false interrupts and should clear the flag bit, CCP2IF, following any such change in operating mode.
16.2.4
CCP PRESCALER
The event is selected by the mode select bits, CCP2M<3:0> (CCP2CON<3:0>). When a capture is made, the interrupt request flag bit, CCP2IF (PIR3<2>), is set; it must be cleared in software. If another capture occurs before the value in register, CCPR2, is read, the old captured value is overwritten by the new captured value.
There are four prescaler settings in Capture mode. They are specified as part of the operating mode selected by the mode select bits (CCP2M<3:0>). Whenever the CCP module is turned off, or the CCP module is not in Capture mode, the prescaler counter is cleared. This means that any Reset will clear the prescaler counter. Switching from one capture prescaler to another may generate an interrupt. Also, the prescaler counter will not be cleared; therefore, the first capture may be from a non-zero prescaler. Example 16-1 shows the recommended method for switching between capture prescalers. This example also clears the prescaler counter and will not generate the "false" interrupt.
16.2.1
CCP PIN CONFIGURATION
In Capture mode, the appropriate CCPx pin should be configured as an input by setting the corresponding TRIS direction bit. Note: If RC1/CCP2 or RE7/CCP2 is configured as an output, a write to the port can cause a capture condition.
EXAMPLE 16-1:
CLRF CCP2CON MOVLW NEW_CAPT_PS
CHANGING BETWEEN CAPTURE PRESCALERS
; ; ; ; ; ; Turn CCP module off Load WREG with the new prescaler mode value and CCP ON Load CCP2CON with this value
16.2.2
TIMER1/TIMER3 MODE SELECTION
MOVWF CCP2CON
The timers that are to be used with the capture feature (Timer1 and/or Timer3) must be running in Timer mode or Synchronized Counter mode. In Asynchronous Counter mode, the capture operation may not work. The timer to be used with each CCP module is selected in the T3CON register (see Section 16.1.1 "CCP Modules and Timer Resources").
FIGURE 16-2:
CAPTURE MODE OPERATION BLOCK DIAGRAM
Set CCP1IF T3CCP2 TMR3H TMR3 Enable CCPR1H TMR1 Enable TMR1H Set CCP2IF TMR3H TMR3 Enable CCPR2H TMR1 Enable T3CCP2 T3CCP1 TMR1H TMR1L CCPR2L TMR3L TMR1L CCPR1L TMR3L
CCP1 Pin Prescaler 1, 4, 16 and Edge Detect T3CCP2 CCP1CON<3:0> Q1:Q4 CCP2CON<3:0> 4 4 4 T3CCP1 T3CCP2
CCP2 Pin Prescaler 1, 4, 16 and Edge Detect
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16.3 Compare Mode
16.3.3 SOFTWARE INTERRUPT MODE
In Compare mode, the 16-bit CCPR2 register value is constantly compared against either the TMR1 or TMR3 register pair value. When a match occurs, the CCP2 pin can be: * * * * driven high driven low toggled (high-to-low or low-to-high) remain unchanged (that is, reflects the state of the I/O latch) When the Generate Software Interrupt mode is chosen (CCP2M<3:0> = 1010), the CCP2 pin is not affected. Only a CCP interrupt is generated, if enabled, and the CCP2IE bit is set.
16.3.4
SPECIAL EVENT TRIGGER
The action on the pin is based on the value of the mode select bits (CCP2M<3:0>). At the same time, the interrupt flag bit, CCP2IF, is set.
Both CCP modules are equipped with a Special Event Trigger. This is an internal hardware signal generated in Compare mode to trigger actions by other modules. The Special Event Trigger is enabled by selecting the Compare Special Event Trigger mode (CCP2M<3:0> = 1011). For either CCP module, the Special Event Trigger resets the Timer register pair for whichever timer resource is currently assigned as the module's time base. This allows the CCPRx registers to serve as a programmable period register for either timer. The Special Event Trigger for CCP2 can also start an A/D conversion. In order to do this, the A/D Converter must already be enabled. Note: The Special Event Trigger of CCP1 only resets Timer1/Timer3 and cannot start an A/D conversion even when the A/D Converter is enabled.
16.3.1
CCP PIN CONFIGURATION
The user must configure the CCPx pin as an output by clearing the appropriate TRIS bit. Note: Clearing the CCP2CON register will force the RC1 or RE7 compare output latch (depending on device configuration) to the default low level. This is not the PORTC or PORTE I/O data latch.
16.3.2
TIMER1/TIMER3 MODE SELECTION
Timer1 and/or Timer3 must be running in Timer mode, or Synchronized Counter mode, if the CCP module is using the compare feature. In Asynchronous Counter mode, the compare operation may not work.
FIGURE 16-3:
COMPARE MODE OPERATION BLOCK DIAGRAM
Set CCP1IF Special Event Trigger (Timer1 Reset) CCP1 Pin Comparator Compare Match Output Logic 4 CCP1CON<3:0> 0 TMR1H TMR1L 0 S R TRIS Output Enable Q
CCPR1H
CCPR1L
1
TMR3H T3CCP1
TMR3L
1 T3CCP2
Special Event Trigger (Timer1/Timer3 Reset, A/D Trigger)
Set CCP2IF Comparator Compare Match Output Logic 4 CCP2CON<3:0> S R Q
CCP2 Pin
CCPR2H
CCPR2L
TRIS Output Enable
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TABLE 16-3:
Name INTCON RCON PIR3 PIE3 IPR3 PIR2 PIE2 IPR2 TRISC TRISE TRISG TMR1L TMR1H T1CON TMR3H TMR3L T3CON CCPR1L CCPR1H CCP1CON CCPR2L CCPR2H CCP2CON
REGISTERS ASSOCIATED WITH CAPTURE, COMPARE, TIMER1 AND TIMER3
Bit 7 Bit 6 Bit 5 Bit 4 INT0IE RI TX2IF TX2IE TX2IP -- -- -- TRISC4 TRISE4 TRISG4 Bit 3 RBIE TO CTMUIF CTMUIE CTMUIP BCLIF BCLIE BCLIP TRISC3 TRISE3 TRISG3 Bit 2 TMR0IF PD CCP2IF CCP2IE CCP2IP LVDIF LVDIE LVDIP TRISC2 -- TRISG2 Bit 1 INT0IF POR CCP1IF CCP1IE CCP1IP TMR3IF TMR3IE TMR3IP TRISC1 TRISE1 TRISG1 Bit 0 RBIF BOR RTCCIF RTCCIE RTCCIP -- -- -- TRISC0 TRISE0 TRISG0 Reset Values on Page 49 50 52 52 52 52 52 52 52 52 52 50 50 TMR1CS TMR1ON 50 51 51 T3CCP1 T3SYNC TMR3CS TMR3ON 51 53 53 CCP1M3 CCP1M2 CCP1M1 CCP1M0 53 53 53 CCP2M3 CCP2M2 CCP2M1 CCP2M0 53
GIE/GIEH PEIE/GIEL TMR0IE IPEN -- -- -- OSCFIF OSCFIE OSCFIP TRISC7 TRISE7 SPIOD -- LCDIF LCDIE LCDIP CMIF CMIE CMIP TRISC6 TRISE6 CM RC2IF RC2IE RC2IP -- -- -- TRISC5 TRISE5
CCP2OD CCP1OD
Timer1 Register Low Byte Timer1 Register High Byte RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC Timer3 Register High Byte Timer3 Register Low Byte RD16 T3CCP2 T3CKPS1 T3CKPS0 Capture/Compare/PWM Register 1 Low Byte Capture/Compare/PWM Register 1 High Byte -- -- DC1B1 DC1B0 Capture/Compare/PWM Register 2 Low Byte Capture/Compare/PWM Register 2 High Byte -- -- DC2B1 DC2B0
Legend: -- = unimplemented, read as `0'. Shaded cells are not used by Capture/Compare, Timer1 or Timer3.
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16.4 PWM Mode
In Pulse-Width Modulation (PWM) mode, the CCP2 pin produces up to a 10-bit resolution PWM output. Since the CCP2 pin is multiplexed with a PORTC or PORTE data latch, the appropriate TRIS bit must be cleared to make the CCP2 pin an output. Note: Clearing the CCP2CON register will force the RC1 or RE7 output latch (depending on device configuration) to the default low level. This is not the PORTC or PORTE I/O data latch. A PWM output (Figure 16-5) has a time base (period) and a time that the output stays high (duty cycle). The frequency of the PWM is the inverse of the period (1/period).
FIGURE 16-5:
Period
PWM OUTPUT
Duty Cycle TMR2 = PR2 TMR2 = Duty Cycle TMR2 = PR2
Figure 16-4 shows a simplified block diagram of the CCP1 module in PWM mode. For a step-by-step procedure on how to set up the CCP module for PWM operation, see Section 16.4.3 "Setup for PWM Operation".
16.4.1
PWM PERIOD
FIGURE 16-4:
Duty Cycle Registers CCPR1L
SIMPLIFIED PWM BLOCK DIAGRAM
CCP1CON<5:4>
The PWM period is specified by writing to the PR2 register. The PWM period can be calculated using the following formula:
EQUATION 16-1:
PWM Period = (PR2) + 1] * 4 * TOSC * (TMR2 Prescale Value)
CCPR1H (Slave) R Q RC2/CCP1 TMR2 (Note 1) S TRISC<2> Clear Timer, CCP1 pin and latch D.C.
PWM frequency is defined as 1/[PWM period]. When TMR2 is equal to PR2, the following three events occur on the next increment cycle: * TMR2 is cleared * The CCP2 pin is set (exception: if PWM duty cycle = 0%, the CCP2 pin will not be set) * The PWM duty cycle is latched from CCPR2L into CCPR2H Note: The Timer2 postscalers (see Section 13.0 "Timer2 Module") are not used in the determination of the PWM frequency. The postscaler could be used to have a servo update rate at a different frequency than the PWM output.
Comparator
Comparator
PR2 Note 1:
The 8-bit TMR2 value is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler, to create the 10-bit time base.
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16.4.2 PWM DUTY CYCLE
The PWM duty cycle is specified by writing to the CCPR2L register and to the CCP2CON<5:4> bits. Up to 10-bit resolution is available. The CCPR2L contains the eight MSbs and the CCP2CON<5:4> bits contain the two LSbs. This 10-bit value is represented by CCPR2L:CCP2CON<5:4>. The following equation is used to calculate the PWM duty cycle in time: The CCPR2H register and a 2-bit internal latch are used to double-buffer the PWM duty cycle. This double-buffering is essential for glitchless PWM operation. When the CCPR2H and 2-bit latch match TMR2, concatenated with an internal 2-bit Q clock or 2 bits of the TMR2 prescaler, the CCP2 pin is cleared. The maximum PWM resolution (bits) for a given PWM frequency is given by the equation:
EQUATION 16-2:
PWM Duty Cycle = (CCPR2L:CCP2CON<5:4>) * TOSC * (TMR2 Prescale Value) CCPR2L and CCP2CON<5:4> can be written to at any time, but the duty cycle value is not latched into CCPR2H until after a match between PR2 and TMR2 occurs (i.e., the period is complete). In PWM mode, CCPR2H is a read-only register.
EQUATION 16-3:
FOSC log --------------- FPWM PWM Resolution (max) = -----------------------------bits log 2 Note: If the PWM duty cycle value is longer than the PWM period, the CCP2 pin will not be cleared.
TABLE 16-4:
EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz
2.44 kHz 16 FFh 14 9.77 kHz 4 FFh 12 39.06 kHz 1 FFh 10 156.25 kHz 1 3Fh 8 312.50 kHz 1 1Fh 7 416.67 kHz 1 17h 6.58
PWM Frequency Timer Prescaler (1, 4, 16) PR2 Value Maximum Resolution (bits)
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16.4.3 SETUP FOR PWM OPERATION
3. 4. 5. The following steps should be taken when configuring the CCP module for PWM operation: 1. 2. Set the PWM period by writing to the PR2 register. Set the PWM duty cycle by writing to the CCPR2L register and CCP2CON<5:4> bits. Make the CCP2 pin an output by clearing the appropriate TRIS bit. Set the TMR2 prescale value, then enable Timer2 by writing to T2CON. Configure the CCP2 module for PWM operation.
TABLE 16-5:
Name INTCON RCON PIR1 PIE1 IPR1 TRISC TRISE TRISG TMR2 PR2 T2CON CCPR1L CCPR1H CCP1CON CCPR2L CCPR2H CCP2CON
REGISTERS ASSOCIATED WITH PWM AND TIMER2
Bit 7 Bit 6 Bit 5 TMR0IE CM RC1IF RC1IE RC1IP TRISC5 TRISE5 CCP1OD Bit 4 INT0IE RI TX1IF TX1IE TX1IP TRISC4 TRISE4 TRISG4 Bit 3 RBIE TO SSPIF SSPIE SSPIP TRISC3 TRISE3 TRISG3 Bit 2 TMR0IF PD -- -- -- TRISC2 -- TRISG2 Bit 1 INT0IF POR TMR2IF TMR2IE TMR2IP TRISC1 TRISE1 TRISG1 Bit 0 RBIF BOR TMR1IF TMR1IE TMR1IP TRISC0 TRISE0 TRISG0 Reset Values on Page 49 50 52 52 52 52 52 52 50 50 50 53 53 CCP1M3 CCP1M2 CCP1M1 CCP1M0 53 53 53 CCP2M3 CCP2M2 CCP2M1 CCP2M0 53
GIE/GIEH PEIE/GIEL IPEN -- -- -- TRISC7 TRISE7 SPIOD -- ADIF ADIE ADIP TRISC6 TRISE6 CCP2OD
Timer2 Register Timer2 Period Register -- T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 Capture/Compare/PWM Register 1 Low Byte Capture/Compare/PWM Register 1 High Byte -- -- DC1B1 DC1B0 Capture/Compare/PWM Register 2 Low Byte Capture/Compare/PWM Register 2 High Byte -- -- DC2B1 DC2B0
Legend: -- = unimplemented, read as `0'. Shaded cells are not used by PWM or Timer2.
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NOTES:
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17.0 LIQUID CRYSTAL DISPLAY (LCD) DRIVER MODULE
The LCD driver module supports these features: * Direct driving of LCD panel * On-chip bias generator with dedicated charge pump to support a range of fixed and variable bias options * Up to four commons, with four Multiplexing modes * Up to 33 segments * Three LCD clock sources with selectable prescaler, with a fourth source available for use with the LCD charge pump A simplified block diagram of the module is shown in Figure 17-1.
The Liquid Crystal Display (LCD) driver module generates the timing control to drive a static or multiplexed LCD panel. It also provides control of the LCD pixel data. The module can drive panels of up to 132 pixels (33 segments by 4 commons).
FIGURE 17-1:
Data Bus
LCD DRIVER MODULE BLOCK DIAGRAM
LCD DATA 20 x 8 (= 4 x 40) LCDDATA22 LCDDATA21 . . . LCDDATA1 8 LCDDATA0 132 to 33 MUX 33 SEG<32:0>
Bias Voltage Timing Control LCDCON LCDPS LCDSEx LCD Bias Generation FOSC/4 T13CKI INTRC Oscillator INTOSC Oscillator COM<3:0> 4
To I/O Pins
LCD Clock Source Select
LCD Charge Pump
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17.1
* * * *
LCD Registers
The LCD driver module has 33 registers: LCD Control Register (LCDCON) LCD Phase Register (LCDPS) LCDREG Register (LCD Regulator Control) Five LCD Segment Enable Registers (LCDSE4:LCDSE0) * 20 LCD Data Registers (LCDDATAx, for x from 0 to 22, with 5, 11 and 17 not implemented)
The LCDPS register, shown in Register 17-2, configures the LCD clock source prescaler and the type of waveform: Type-A or Type-B. Details on these features are provided in Section 17.2 "LCD Clock Source", Section 17.3 "LCD Bias Generation" and Section 17.8 "LCD Waveform Generation". The LCDREG register is described in Section 17.3 "LCD Bias Generation". The LCD Segment Enable registers (LCDSEx) configure the functions of the port pins. Setting the segment enable bit for a particular segment configures that pin as an LCD driver. The prototype LCDSE register is shown in Register 17-3. There are five LCDSE registers (LCDSE4:LCDSE0), listed in Table 17-1.
17.1.1
LCD CONTROL REGISTERS
The LCDCON register, shown in Register 17-1, controls the overall operation of the module. Once the module is configured, the LCDEN (LCDCON<7>) bit is used to enable or disable the LCD module. The LCD panel can also operate during Sleep by clearing the SLPEN (LCDCON<6>) bit.
REGISTER 17-1:
R/W-0 LCDEN bit 7 Legend: R = Readable bit -n = Value at POR bit 7
LCDCON: LCD CONTROL REGISTER
R/C-0 WERR U-0 -- R/W-0 CS1 R/W-0 CS0 R/W-0 LMUX1 R/W-0 LMUX0 bit 0 C = Clearable bit W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
R/W-0 SLPEN
LCDEN: LCD Driver Enable bit 1 = LCD driver module is enabled 0 = LCD driver module is disabled SLPEN: LCD Driver Enable in Sleep mode bit 1 = LCD driver module is disabled in Sleep mode 0 = LCD driver module is enabled in Sleep mode WERR: LCD Write Failed Error bit 1 = LCDDATAx register written while LCDPS<4> = 0 (must be cleared in software) 0 = No LCD write error Unimplemented: Read as `0' CS<1:0>: Clock Source Select bits 1x = INTRC (31 kHz) 01 = T13CKI (Timer1) 00 = System clock (FOSC/4) LMUX<1:0>: Commons Select bits LMUX<1:0> 00 01 10 11 Multiplex Type Static (COM0) 1/2 (COM1:COM0) 1/3 (COM2:COM0) 1/4 (COM3:COM0) Maximum Number of Pixels 33 66 99 132 Bias Type Static 1/2 or 1/3 1/2 or 1/3 1/3
bit 6
bit 5
bit 4 bit 3-2
bit 1-0
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REGISTER 17-2:
R/W-0 WFT bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
LCDPS: LCD PHASE REGISTER
R-0 LCDA R-0 WA R/W-0 LP3 R/W-0 LP2 R/W-0 LP1 R/W-0 LP0 bit 0
R/W-0 BIASMD
WFT: Waveform Type Select bit 1 = Type-B waveform (phase changes on each frame boundary) 0 = Type-A waveform (phase changes within each common type) BIASMD: Bias Mode Select bit When LMUX<1:0> = 00: 0 = Static Bias mode (do not set this bit to `1') When LMUX<1:0> = 01 or 10: 1 = 1/2 Bias mode 0 = 1/3 Bias mode When LMUX<1:0> = 11: 0 = 1/3 Bias mode (do not set this bit to `1') LCDA: LCD Active Status bit 1 = LCD driver module is active 0 = LCD driver module is inactive WA: LCD Write Allow Status bit 1 = Write into the LCDDATAx registers is allowed 0 = Write into the LCDDATAx registers is not allowed LP<3:0>: LCD Prescaler Select bits 1111 = 1:16 1110 = 1:15 1101 = 1:14 1100 = 1:13 1011 = 1:12 1010 = 1:11 1001 = 1:10 1000 = 1:9 0111 = 1:8 0110 = 1:7 0101 = 1:6 0100 = 1:5 0011 = 1:4 0010 = 1:3 0001 = 1:2 0000 = 1:1
bit 6
bit 5
bit 4
bit 3-0
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REGISTER 17-3:
R/W-0 SE(n + 7) bit 7 Legend: R = Readable bit -n = Value at POR bit 7-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
LCDSEx: LCD SEGMENT ENABLE REGISTERS
R/W-0 SE(n + 5) R/W-0 SE(n + 4) R/W-0 SE(n + 3) R/W-0 SE(n + 2) R/W-0 SE(n + 1) R/W-0 SE(n) bit 0
R/W-0 SE(n + 6)
SEG(n + 7):SEG(n): Segment Enable bits For LCDSE0: n = 0 For LCDSE1: n = 8 For LCDSE2: n = 16 For LCDSE3: n = 24 For LCDSE4: n = 32 1 = Segment function of the pin is enabled; digital I/O disabled 0 = I/O function of the pin is enabled
TABLE 17-1:
LCDSE REGISTERS AND ASSOCIATED SEGMENTS
Register LCDSE0 LCDSE1 LCDSE2 LCDSE3 LCDSE4(1) Segments 7:0 15:8 23:16 31:24 32
Note 1:
Only LCDSE4<0> (SEG32) is implemented.
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17.1.2 LCD DATA REGISTERS
Once the module is initialized for the LCD panel, the individual bits of the LCDDATA registers are cleared or set to represent a clear or dark pixel, respectively. Specific sets of LCDDATA registers are used with specific segments and common signals. Each bit represents a unique combination of a specific segment connected to a specific common. Individual LCDDATA bits are named by the convention "SxxCy", with "xx" as the segment number and "y" as the common number. The relationship is summarized in Table 17-2. The prototype LCDDATA register is shown in Register 17-4. Note: LCDDATA5, LCDDATA11 and LCDDATA17 are not implemented.
REGISTER 17-4:
R/W-0 S(n + 7)Cy bit 7 Legend: R = Readable bit -n = Value at POR bit 7-0
LCDDATAx: LCD DATA REGISTERS(1)
R/W-0 S(n + 5)Cy R/W-0 S(n + 4)Cy R/W-0 S(n + 3)Cy R/W-0 S(n + 2)Cy R/W-0 S(n + 1)Cy R/W-0 S(n)Cy bit 0
R/W-0 S(n + 6)Cy
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
S(n + 7)Cy:S(n)Cy: Pixel On bits For LCDDATA0 through LCDDATA5: n = (8x), y = 0(1) For LCDDATA6 through LCDDATA10: n = (8(x - 6)), y = 1 For LCDDATA12 through LCDDATA16: n = (8(x - 12)), y = 2(1) For LCDDATA18 through LCDDATA22: n = (8(x - 18)), y = 3(1) 1 = Pixel on (dark) 0 = Pixel off (clear) LCDDATA5, LCDDATA11 and LCDDATA17 are not implemented.
Note 1:
TABLE 17-2:
Segments
LCDDATA REGISTERS AND BITS FOR SEGMENT AND COM COMBINATIONS
COM Lines 0 LCDDATA0 S00C0:S07C0 LCDDATA1 S08C0:S15C0 LCDDATA2 S16C0:S23C0 LCDDATA3 S24C0:S31C0 LCDDATA4(1) S32C0 1 LCDDATA6 S00C1:S07C1 LCDDATA7 S08C1:S15C1 LCDDATA8 S16C1:S23C1 LCDDATA9 S24C1:S31C1 LCDDATA10(1) S32C1 2 LCDDATA12 S00C2:S07C2 LCDDATA13 S08C2:S15C2 LCDDATA14 S16C2:S23C2 LCDDATA15 S24C2:S31C2 LCDDATA16(1) S32C2 3 LCDDATA18 S00C3:S07C3 LCDDATA19 S08C0:S15C3 LCDDATA20 S16C3:S23C3 LCDDATA21 S24C3:S31C3 LCDDATA22(1) S32C3
0 through 7 8 through 15 16 through 23 24 through 31 32 Note 1:
Only bit<0> of these registers is implemented.
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17.2 LCD Clock Source
The LCD driver module generates its internal clock from 3 possible sources: * System clock (FOSC/4) * Timer1 oscillator * INTRC source The LCD clock generator uses a configurable divide-by-32/divide-by-8192 postscaler to produce a baseline frequency of about 1 kHz nominal, regardless of the source selected. The clock source selection and the postscaler configuration are determined by the Clock Source Select bits, CS<1:0> (LCDCON<3:2>). An additional programmable prescaler is used to derive the LCD frame frequency from the 1 kHz baseline. The prescaler is configured using the LP<3:0> bits (LCDPS<3:0>) for any one of 16 options, ranging from 1:1 to 1:16. Proper timing for waveform generation is set by the LMUX<1:0> bits (LCDCON<1:0>). These bits determine which Commons Multiplexing mode is to be used, and divide down the LCD clock source as required. They also determine the configuration of the ring counter that is used to switch the LCD commons on or off. The charge pump clock can use either the Timer1 oscillator or the INTRC source, as well as the 8 MHz INTOSC source (after being divided by 256 by a prescaler). The charge pump clock source is configured using the CKSEL<1:0> bits (LCDREG<1:0>).
17.2.2
CLOCK SOURCE CONSIDERATIONS
When using the system clock as the LCD clock source, it is assumed that the system clock frequency is a nominal 32 MHz (for a FOSC/4 frequency of 8 MHz). Because the prescaler option for the FOSC/4 clock selection is fixed at divide-by-8192, system clock speeds that differ from 32 MHz will produce frame frequencies and refresh rates different than discussed in this chapter. The user will need to keep this in mind when designing the display application. The Timer1 and INTRC sources can be used as LCD clock sources when the device is in Sleep mode. To use the Timer1 oscillator, it is necessary to set the T1OSCEN bit (T1CON<3>). Selecting either Timer1 or INTRC as the LCD clock source will not automatically activate these sources. Similarly, selecting the INTOSC as the charge pump clock source will not turn the oscillator on. To use INTOSC, it must be selected as the system clock source by using the FOSC2 Configuration bit. If Timer1 is used as a clock source for the device, either as an LCD clock source or for any other purpose, LCD Segment 32 becomes unavailable.
17.2.1
LCD VOLTAGE REGULATOR CLOCK SOURCE
In addition to the clock source for LCD timing, a separate 31 kHz nominal clock is required for the LCD charge pump. This is provided from a distinct branch of the LCD clock source.
FIGURE 17-2:
LCD CLOCK GENERATION
2 LCDPS<3:0> 4 1:1 to 1:16 Programmable Prescaler /32 or /8192 /1, 2, 3, 4 Ring Counter COM0 COM1 COM2 COM3
LCDCON<3:2>
/4 System Clock (FOSC/4) Timer1 Oscillator Internal 31 kHz Source 00 /2 01
00 01 10
1x 11 2 2 11
LCDCON<1:0> LCDREG<1:0>
INTOSC 8 MHz Source
/256
10 01
31 kHz Clock to LCD Charge Pump
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17.3 LCD Bias Generation
17.3.2 LCD VOLTAGE REGULATOR
The LCD driver module is capable of generating the required bias voltages for LCD operation with a minimum of external components. This includes the ability to generate the different voltage levels required by the different bias types required by the LCD. The driver module can also provide bias voltages both above and below microcontroller VDD through the use of an on-chip LCD voltage regulator. The purpose of the LCD regulator is to provide proper bias voltage and good contrast for the LCD, regardless of VDD levels. This module contains a charge pump and internal voltage reference. The regulator can be configured by using external components to boost bias voltage above VDD. It can also operate a display at a constant voltage below VDD. The regulator can also be selectively disabled to allow bias voltages to be generated by an external resistor network. The LCD regulator is controlled through the LCDREG register (Register 17-5). It is enabled or disabled using the CKSEL<1:0> bits, while the charge pump can be selectively enabled using the CPEN bit. When the regulator is enabled, the MODE13 bit is used to select the bias type. The peak LCD bias voltage, measured as a difference between the potentials of LCDBIAS3 and LCDBIAS0, is configured with the BIAS bits.
17.3.1
LCD BIAS TYPES
PIC18F87J72 family devices support three bias types based on the waveforms generated to control segments and commons: * Static (two discrete levels) * 1/2 Bias (three discrete levels * 1/3 Bias (four discrete levels) The use of different waveforms in driving the LCD is discussed in more detail in Section 17.8 "LCD Waveform Generation".
REGISTER 17-5:
U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6
LCDREG: VOLTAGE REGULATOR CONTROL REGISTER
RW-1 BIAS2 RW-1 BIAS1 RW-1 BIAS0 RW-1 MODE13 RW-0 CKSEL1 RW-0 CKSEL0 bit 0
RW-0 CPEN
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
Unimplemented: Read as `0' CPEN: LCD Charge Pump Enable bit 1 = Charge pump enabled; highest LCD bias voltage is 3.6V 0 = Charge pump disabled; highest LCD bias voltage is AVDD BIAS<2:0>: Regulator Voltage Output Control bits 111 = 3.60V peak (offset on LCDBIAS0 of 0V) 110 = 3.47V peak (offset on LCDBIAS0 of 0.13V) 101 = 3.34V peak (offset on LCDBIAS0 of 0.26V) 100 = 3.21V peak (offset on LCDBIAS0 of 0.39V) 011 = 3.08V peak (offset on LCDBIAS0 of 0.52V) 010 = 2.95V peak (offset on LCDBIAS0 of 0.65V) 001 = 2.82V peak (offset on LCDBIAS0 of 0.78V) 000 = 2.69V peak (offset on LCDBIAS0 of 0.91V) MODE13: 1/3 LCD Bias Enable bit 1 = Regulator output supports 1/3 LCD Bias mode 0 = Regulator output supports Static LCD Bias mode CKSEL<1:0>: Regulator Clock Source Select bits 11 = INTRC 10 = INTOSC 8 MHz source 01 = Timer1 oscillator 00 = LCD regulator disabled
bit 5-3
bit 2
bit 1-0
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17.3.3 BIAS CONFIGURATIONS 17.3.3.2 M1 (Regulator without Boost)
PIC18F87J72 family devices have four distinct circuit configurations for LCD bias generation: * * * * M0: Regulator with Boost M1: Regulator without Boost M2: Resistor Ladder with Software Contrast M3: Resistor Ladder with Hardware Contrast M1 operation is similar to M0, but does not use the LCD charge pump. It can provide VBIAS up to the voltage level supplied directly to LCDBIAS3. It can be used in cases where VDD for the application is expected to never drop below a level that can provide adequate contrast for the LCD. The connection of external components is very similar to M0, except that LCDBIAS3 must be tied directly to VDD (Figure 17-3). The BIAS<2:0> bits can still be used to adjust contrast in software by changing VBIAS. As with M0, changing these bits changes the offset between LCDBIAS0 and VSS. In M1, this is reflected in the change between the LCDBIAS0 and the voltage tied to LCDBIAS3. Thus, if VDD should change, VBIAS will also change; where in M0, the level of VBIAS is constant. Like M0, M1 supports Static and 1/3 Bias types. Generation of the voltage levels for 1/3 Bias is handled automatically but must be configured in software. M1 is enabled by selecting a valid regulator clock source (CKSEL<1:0> set to any value except `00') and clearing the CPEN bit. If 1/3 Bias type is required, the MODE13 bit should also be set. Note: When the device enters Sleep mode while operating in Bias modes, M0 or M1, be sure that the bias capacitors are fully discharged in order to get the lowest Sleep current.
17.3.3.1
M0 (Regulator with Boost)
In M0 operation, the LCD charge pump feature is enabled. This allows the regulator to generate voltages up to +3.6V to the LCD (as measured at LCDBIAS3). M0 uses a flyback capacitor connected between VLCAP1 and VLCAP2, as well as filter capacitors on LCDBIAS0 through LCDBIAS3, to obtain the required voltage boost (Figure 17-3). The output voltage (VBIAS) is the difference of potential between LCDBIAS3 and LCDBIAS0. It is set by the BIAS<2:0> bits which adjust the offset between LCDBIAS0 and VSS. The flyback capacitor (CFLY) acts as a charge storage element for large LCD loads. This mode is useful in those cases where the voltage requirements of the LCD are higher than the microcontroller's VDD. It also permits software control of the display's contrast by adjustment of bias voltage by changing the value of the BIAS bits. M0 supports Static and 1/3 Bias types. Generation of the voltage levels for 1/3 Bias is handled automatically, but must be configured in software. M0 is enabled by selecting a valid regulator clock source (CKSEL<1:0> set to any value except `00') and setting the CPEN bit. If Static Bias type is required, the MODE13 bit must be cleared.
FIGURE 17-3:
LCD REGULATOR CONNECTIONS FOR M0 AND M1 CONFIGURATIONS
PIC18F87J72
AVDD VLCAP1 VLCAP2 LCDBIAS3 CFLY 0.47 F(1) VDD C3 0.47 F(1) C2 0.47 F(1) C1 0.47 F(1) C0 0.47 F(1) C2 0.47 F(1) C1 0.47 F(1) C0 0.47 F(1) CFLY 0.47 F(1) VDD VDD
LCDBIAS2
LCDBIAS1
LCDBIAS0
Mode 0 (VBIAS up to 3.6V)
Note 1:
Mode 1 (VBIAS VDD)
These values are provided for design guidance only. They should be optimized for the application by the designer based on the actual LCD specifications.
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17.3.3.3 M2 (Resistor Ladder with Software Contrast)
M2 operation also uses the LCD regulator but disables the charge pump. The regulator's internal voltage reference remains active as a way to regulate contrast. It is used in cases where the current requirements of the LCD exceed the capacity of the regulator's charge pump. In this configuration, the LCD bias voltage levels are created by an external resistor voltage divider connected across LCDBIAS0 through LCDBIAS3, with the top of the divider tied to VDD (Figure 17-4). The potential at the bottom of the ladder is determined by the LCD regulator's voltage reference, tied internally to LCDBIAS0. The bias type is determined by the voltages on the LCDBIAS pins, which are controlled by the configuration of the resistor ladder. Most applications using M2 will use a 1/3 or 1/2 Bias type. While Static Bias can also be used, it offers extremely limited contrast range and additional current consumption over other bias generation modes. Like M1, the LCDBIAS bits can be used to control contrast, limited by the level of VDD supplied to the device. Also, since there is no capacitor required across VLCAP1 and VLCAP2, these pins are available as digital I/O ports, RG2 and RG3. M2 is selected by clearing the CKSEL<1:0> bits and setting the CPEN bit.
FIGURE 17-4:
RESISTOR LADDER CONNECTIONS FOR M2 CONFIGURATION
PIC18F87J72
VDD
AVDD
LCDBIAS3 10 k(1) LCDBIAS2 10 k(1) LCDBIAS1 10 k(1) LCDBIAS0 10 k(1) 10 k(1)
1/2 Bias
1/3 Bias
Bias Level at Pin LCDBIAS0 LCDBIAS1 LCDBIAS2 LCDBIAS3 Note 1:
Bias Type 1/2 Bias (Internal low reference voltage) 1/2 VBIAS 1/2 VBIAS VBIAS (up to AVDD) 1/3 Bias (Internal low reference voltage) 1/3 VBIAS 2/3 VBIAS VBIAS (up to AVDD)
These values are provided for design guidance only; they should be optimized for the application by the designer based on the actual LCD specifications.
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17.3.3.4 M3 (Hardware Contrast)
In M3, the LCD regulator is completely disabled. Like M2, LCD bias levels are tied to AVDD, and are generated using an external divider. The difference is that the internal voltage reference is also disabled and the bottom of the ladder is tied to ground (VSS); see Figure 17-5. The value of the resistors, and the difference between VSS and VDD, determine the contrast range; no software adjustment is possible. This configuration is also used where the LCD's current requirements exceed the capacity of the charge pump and software contrast control is not needed. Depending on the bias type required, resistors are connected between some or all of the pins. A potentiometer can also be connected between LCDBIAS3 and VDD to allow for hardware controlled contrast adjustment. M3 is selected by clearing the CKSEL<1:0> and CPEN bits.
FIGURE 17-5:
RESISTOR LADDER CONNECTIONS FOR M3 CONFIGURATION
PIC18F87J72
VDD
AVDD
(2)
LCDBIAS3 10 k(1) LCDBIAS2 10 k(1) LCDBIAS1 10 k(1) LCDBIAS0 10 k(1) 10 k(1)
Static Bias
1/2 Bias
1/3 Bias
Bias Level at Pin LCDBIAS0 LCDBIAS1 LCDBIAS2 LCDBIAS3 Note 1: 2:
Bias Type Static AVSS AVSS AVDD AVDD 1/2 Bias AVSS 1/2 AVDD 1/2 AVDD AVDD 1/3 Bias AVSS 1/3 AVDD 2/3 AVDD AVDD
These values are provided for design guidance only; they should be optimized for the application by the designer based on the actual LCD specifications. Potentiometer for manual contrast adjustment is optional; it may be omitted entirely.
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17.3.4 DESIGN CONSIDERATIONS FOR THE LCD CHARGE PUMP
17.4
LCD Multiplex Types
When designing applications that use the LCD regulator with the charge pump enabled, users must always consider both the dynamic current and RMS (static) current requirements of the display, and what the charge pump can deliver. Both dynamic and static current can be determined by Equation 17-1:
The LCD driver module can be configured into four multiplex types: * * * * Static (only COM0 used) 1/2 Multiplex (COM0 and COM1 are used) 1/3 Multiplex (COM0, COM1 and COM2 are used) 1/4 Multiplex (all COM0, COM1, COM2 and COM3 are used)
EQUATION 17-1:
I=Cx dV dT
For dynamic current, C is the value of the capacitors attached to LCDBIAS3 and LCDBIAS2. The variable, dV, is the voltage drop allowed on C2 and C3 during a voltage switch on the LCD display, and dT is the duration of the transient current after a clock pulse occurs. For practical design purposes, these will be assumed to be 0.047 F for C, 0.1V for dV and 1 s for dT. This yields a dynamic current of 4.7 mA for 1 s. RMS current is determined by the value of CFLY for C, the voltage across VLCAP1 and VLCAP2 for dV and the regulator clock period (TPER) for dT. Assuming CFLY of 0.047 F, a value of 1.02V across CFLY and TPER of 30 s, the maximum theoretical static current will be 1.8 mA. Since the charge pump must charge five capacitors, the maximum current becomes 360 A. For a real-world assumption of 50% efficiency, this yields a practical current of 180 A. Users should compare the calculated current capacity against the requirements of the LCD. While dV and dT are relatively fixed by device design, the values of CFLY and the capacitors on the LCDBIAS pins can be changed to increase or decrease current. As always, any changes should be evaluated in the actual circuit for its impact on the application.
The number of active commons used is configured by the LMUX<1:0> bits (LCDCON<1:0>), which determines the function of the PORTE<6:4> pins (see Table 17-3 for details). If the pin is configured as a COM drive, the port I/O function is disabled and the TRIS setting of that pin is overridden. Note: On a Power-on Reset, the LMUX<1:0> bits are `00'.
TABLE 17-3:
00 01 10 11
PORTE<6:4> FUNCTION
PORTE<5> Digital I/O Digital I/O PORTE<4> Digital I/O COM1 Driver Digital I/O Digital I/O Digital I/O
LMUX<1:0> PORTE<6>
COM2 Driver COM1 Driver
COM3 Driver COM2 Driver COM1 Driver
17.5
Segment Enables
The LCDSEx registers are used to select the pin function for each segment pin. Setting a bit configures the corresponding pin to function as a segment driver. LCDSEx registers do not override the TRIS bit settings, so the TRIS bits must be configured as input for that pin. Note: On a Power-on Reset, these pins are configured as digital I/O.
17.6
Pixel Control
The LCDDATAx registers contain bits which define the state of each pixel. Each bit defines one unique pixel. Table 17-2 shows the correlation of each bit in the LCDDATAx registers to the respective common and segment signals. Any LCD pixel location not being used for display can be used as general purpose RAM.
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17.7 LCD Frame Frequency 17.8 LCD Waveform Generation
The rate at which the COM and SEG outputs change is called the LCD frame frequency. Frame frequency is set by the LP<3:0> bits (LCDPS<3:0>) and is also affected by the Multiplex mode being used. The relationship between the Multiplex mode, LP bits setting and frame rate is shown in Table 17-4 and Table 17-5. LCD waveform generation is based on the principle that the net AC voltage across the dark pixel should be maximized and the net AC voltage across the clear pixel should be minimized. The net DC voltage across any pixel should be zero. The COM signal represents the time slice for each common, while the SEG contains the pixel data. The pixel signal (COM-SEG) will have no DC component and it can take only one of the two rms values. The higher rms value will create a dark pixel and a lower rms value will create a clear pixel. As the number of commons increases, the delta between the two rms values decreases. The delta represents the maximum contrast that the display can have. The LCDs can be driven by two types of waveform: Type-A and Type-B. In the Type-A waveform, the phase changes within each common type, whereas in the Type-B waveform, the phase changes on each frame boundary. Thus, the Type-A waveform maintains 0 VDC over a single frame, whereas the Type-B waveform takes two frames. Note 1: If the power-managed Sleep mode is invoked while the LCD Sleep bit is set (LCDCON<6> is `1'), take care to execute Sleep only when the VDC on all the pixels is `0'. 2: When the LCD clock source is the system clock, the LCD module will go to Sleep if the microcontroller goes into Sleep mode, regardless of the setting of the SPLEN bit. Thus, always take care to see that the VDC on all pixels is `0' whenever Sleep mode is invoked. Figure 17-6 through Figure 17-16 provide waveforms for static, half multiplex, one-third multiplex and quarter multiplex drives for Type-A and Type-B waveforms.
TABLE 17-4:
Multiplex Mode Static 1/2 1/3 1/4
FRAME FREQUENCY FORMULAS
Frame Frequency (Hz) Clock source/(4 x 1 x (LP<3:0> + 1)) Clock source/(2 x 2 x (LP<3:0> + 1)) Clock source/(1 x 3 x (LP<3:0> + 1)) Clock source/(1 x 4 x (LP<3:0> + 1))
TABLE 17-5:
APPROXIMATE FRAME FREQUENCY (IN Hz) FOR LP PRESCALER SETTINGS
Multiplex Mode 1/2 125 83 62 50 42 36 31 1/3 167 111 83 67 56 48 42 1/4 125 83 62 50 42 36 31
LP<3:0> 1 2 3 4 5 6 7
Static 125 83 62 50 42 36 31
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FIGURE 17-6: TYPE-A/TYPE-B WAVEFORMS IN STATIC DRIVE
COM0 COM0
V1 V0
V1 SEG0 V0
SEG1
V1 V0
SEG7 SEG6 SEG5 SEG4 SEG3
SEG2
SEG1 SEG0
V1 COM0-SEG0 V0 -V1
COM0-SEG1
V0
1 Frame
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FIGURE 17-7: TYPE-A WAVEFORMS IN 1/2 MUX, 1/2 BIAS DRIVE
V2 COM0 COM1 V1 V0
COM0
V2 COM1 V1 V0
V2 SEG0 V1 V0
V2 SEG3 SEG2 SEG1 SEG0 SEG1 V1 V0
V2 V1 COM0-SEG0 V0 -V1 -V2
V2 V1 COM0-SEG1 V0 -V1 -V2 1 Frame
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FIGURE 17-8: TYPE-B WAVEFORMS IN 1/2 MUX, 1/2 BIAS DRIVE
V2 COM1 COM0 V1 V0 COM0 V2 COM1 V1 V0
SEG0
V2 V1 V0
SEG3
SEG2
SEG1
SEG0
SEG1
V2 V1 V0
V2 V1 COM0-SEG0 V0 -V1 -V2
V2 V1 COM0-SEG1 V0 -V1 -V2 2 Frames
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FIGURE 17-9: TYPE-A WAVEFORMS IN 1/2 MUX, 1/3 BIAS DRIVE
V3 COM0 COM1 V2 V1 V0 COM0 COM1 V3 V2 V1 V0 V3 SEG0 V2 V1 V0 V3 SEG3 SEG2 SEG1 SEG0 SEG1 V2 V1 V0
V3 V2 V1 COM0-SEG0 V0 -V1 -V2 -V3
V3 V2 V1 COM0-SEG1 V0 -V1 -V2 1 Frame -V3
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FIGURE 17-10: TYPE-B WAVEFORMS IN 1/2 MUX, 1/3 BIAS DRIVE
V3 COM0 COM1 V2 V1 V0 COM0 COM1 V3 V2 V1 V0 V3 SEG0 V2 V1 V0 V3 SEG3 SEG2 SEG1 SEG0 SEG1 V2 V1 V0
V3 V2 V1 COM0-SEG0 V0 -V1 -V2 -V3
V3 V2 V1 COM0-SEG1 V0 -V1 -V2 2 Frames -V3
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FIGURE 17-11: TYPE-A WAVEFORMS IN 1/3 MUX, 1/2 BIAS DRIVE
V2 COM0 V1 V0
COM2 COM1 COM1 COM0 COM2
V2 V1 V0 V2 V1 V0
V2 SEG0 SEG2 V1 V0 SEG2 SEG1 SEG0
V2 SEG1 V1 V0
V2 V1 COM0-SEG0 V0 -V1 -V2
V2 V1 COM0-SEG1 V0 -V1 -V2
1 Frame
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FIGURE 17-12: TYPE-B WAVEFORMS IN 1/3 MUX, 1/2 BIAS DRIVE
COM0
V2 V1 V0
COM2 COM1 COM1 COM0 V2 V1 V0
COM2
V2 V1 V0
SEG0 SEG2 SEG1 SEG0
V2 V1 V0
SEG1
V2 V1 V0
V2 V1 COM0-SEG0 V0 -V1 -V2
V2 V1 COM0-SEG1 V0 -V1 -V2
2 Frames
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FIGURE 17-13: TYPE-A WAVEFORMS IN 1/3 MUX, 1/3 BIAS DRIVE
V3 COM0 V2 V1 V0 COM2 COM1 COM1 COM0 V3 V2 V1 V0 V3 COM2 V2 V1 V0 V3 V2 SEG0 SEG2 SEG2 SEG1 SEG0 V1 V0 V3 SEG1 V2 V1 V0 V3 V2 V1 COM0-SEG0 V0 -V1 -V2 -V3 V3 V2 V1 COM0-SEG1 V0 -V1 -V2 -V3 1 Frame
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FIGURE 17-14: TYPE-B WAVEFORMS IN 1/3 MUX, 1/3 BIAS DRIVE
V3 COM0 V2 V1 V0 COM2 COM1 COM1 COM0 V3 V2 V1 V0 V3 COM2 V2 V1 V0 V3 SEG0 V2 V1 V0 V3 SEG1 V2 V1 V0 V3 V2 V1 COM0-SEG0 V0 -V1 -V2 -V3 V3 V2 V1 COM0-SEG1 V0 -V1 -V2 -V3 2 Frames
SEG2
SEG1
SEG0
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FIGURE 17-15:
COM3 COM2 COM0
TYPE-A WAVEFORMS IN 1/4 MUX, 1/3 BIAS DRIVE
V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 -V1 -V2 -V3 V3 V2 V1 V0 -V1 -V2 -V3
COM1 COM0
COM1
COM2
COM3
SEG0 SEG1 SEG0
SEG1
COM0-SEG0
COM0-SEG1
1 Frame
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FIGURE 17-16:
COM3 COM2 COM0
TYPE-B WAVEFORMS IN 1/4 MUX, 1/3 BIAS DRIVE
V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 -V1 -V2 -V3 V3 V2 V1 V0 -V1 -V2 -V3
COM1 COM0
COM1
COM2
COM3
SEG0 SEG1 SEG0
SEG1
COM0-SEG0
COM0-SEG1
2 Frames
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17.9 LCD Interrupts
The LCD timing generation provides an interrupt that defines the LCD frame timing. This interrupt can be used to coordinate the writing of the pixel data with the start of a new frame. Writing pixel data at the frame boundary allows a visually crisp transition of the image. This interrupt can also be used to synchronize external events to the LCD. For example, the interface to an external segment driver can be synchronized for segment data update to the LCD frame. A new frame is defined to begin at the leading edge of the COM0 common signal. The interrupt will be set immediately after the LCD controller completes accessing all pixel data required for a frame. This will occur at a fixed interval before the frame boundary (TFINT), as shown in Figure 17-17. The LCD controller will begin to access data for the next frame within the interval from the interrupt to when the controller begins to access data after the interrupt (TFWR). New data must be written within TFWR, as this is when the LCD controller will begin to access the data for the next frame. When the LCD driver is running with Type-B waveforms, and the LMUX<1:0> bits are not equal to `00', there are some additional issues that must be addressed. Since the DC voltage on the pixel takes two frames to maintain zero volts, the pixel data must not change between subsequent frames. If the pixel data were allowed to change, the waveform for the odd frames would not necessarily be the complement of the waveform generated in the even frames and a DC component would be introduced into the panel. Therefore, when using Type-B waveforms, the user must synchronize the LCD pixel updates to occur within a subframe after the frame interrupt. To correctly sequence writing while in Type-B, the interrupt will only occur on complete phase intervals. If the user attempts to write when the write is disabled, the WERR (LCDCON<5>) bit is set. Note: The interrupt is not generated when the Type-A waveform is selected and when the Type-B with no multiplex (static) is selected.
FIGURE 17-17:
EXAMPLE WAVEFORMS AND INTERRUPT TIMING IN QUARTER DUTY CYCLE DRIVE
LCD Interrupt Occurs Controller Accesses Next Frame Data V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0 V3 V2 V1 V0
COM0
COM1
COM2
COM3
2 Frames TFINT Frame Boundary TFWR = TFRAME/2 * (LMUX<1:0> + 1) + TCY/2 TFINT = (TFWR/2 - (2 TCY + 40 ns)) Minimum = 1.5(TFRAME/4) - (2 TCY + 40 ns) (TFWR/2 - (1 TCY + 40 ns)) Maximum = 1.5(TFRAME/4) - (1 TCY + 40 ns) Frame Boundary TFWR Frame Boundary
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17.10 Operation During Sleep
The LCD module can operate during Sleep. The selection is controlled by the SLPEN bit (LCDCON<6>). Setting the SLPEN bit allows the LCD module to go to Sleep. Clearing the SLPEN bit allows the module to continue to operate during Sleep. If a SLEEP instruction is executed and SLPEN = 1, the LCD module will cease all functions and go into a very low-current consumption mode. The module will stop operation immediately and drive the minimum LCD voltage on both segment and common lines. Figure 17-18 shows this operation. To ensure that no DC component is introduced on the panel, the SLEEP instruction should be executed immediately after a LCD frame boundary. The LCD interrupt can be used to determine the frame boundary. See Section 17.9 "LCD Interrupts" for the formulas to calculate the delay. If a SLEEP instruction is executed and SLPEN = 0, the module will continue to display the current contents of the LCDDATA registers. To allow the module to continue operation while in Sleep, the clock source must be either the Timer1 oscillator or one of the internal oscillators (either INTRC or INTOSC as the default system clock). While in Sleep, the LCD data cannot be changed. The LCD module current consumption will not decrease in this mode; however, the overall consumption of the device will be lower due to shutdown of the core and other peripheral functions. If the system clock is selected and the module is not configured for Sleep operation, the module will ignore the SLPEN bit and stop operation immediately. The minimum LCD voltage will then be driven onto the segments and commons
17.10.1
USING THE LCD REGULATOR DURING SLEEP
Applications that use the LCD regulator for bias generation may not achieve the same degree of power reductions in Sleep mode when compared to applications using Mode 3 (resistor ladder) biasing. This is particularly true with Mode 0 operation, where the charge pump is active. If Modes 0, 1 or 2 are used for bias generation, software contrast control will not be available.
FIGURE 17-18:
SLEEP ENTRY/EXIT WHEN SLPEN = 1 OR CS<1:0> = 00
V3 V2 V1
COM0
V0 V3 V2 V1
COM1
V0 V3 V2 V1
COM2
V0 V3 V2 V1
SEG0
V0 2 Frames
SLEEP Instruction Execution
Wake-up
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17.11 Configuring the LCD Module
The following is the sequence of steps to configure the LCD module. 1. 2. 3. 4. Select the frame clock prescale using bits, LP<3:0> (LCDPS<3:0>). Configure the appropriate pins to function as segment drivers using the LCDSEx registers. Configure the appropriate pins as inputs using the TRISx registers. Configure the LCD module for the following using the LCDCON register: * Multiplex and Bias mode (LMUX<1:0>) * Timing source (CS<1:0>) * Sleep mode (SLPEN) Write initial values to pixel data registers, LCDDATA0 through LCDDATA23. 6. Configure the LCD regulator: a) If M2 or M3 bias configuration is to be used, turn off the regulator by setting CKSEL<1:0> (LCDREG<1:0>) to `00'. Set or clear the CPEN bit (LCDREG<6>) to select Mode 2 or Mode 3, as appropriate. b) If M0 or M1 bias generation is to be used: * Set the VBIAS level using the BIAS<2:0> bits (LCDREG<5:3>). * Set or clear the CPEN bit to enable or disable the charge pump. * Set or clear the MODE13 bit (LCDREG<2>) to select the Bias mode. * Select a regulator clock source using the CKSEL<1:0> bits. Clear LCD Interrupt Flag, LCDIF (PIR3<6>), and if desired, enable the interrupt by setting the LCDIE bit (PIE3<6>). Enable the LCD module by setting the LCDEN bit (LCDCON<7>).
5.
7.
8.
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TABLE 17-6:
Name INTCON PIR3 PIE3 IPR3 RCON LCDDATA22 LCDDATA21 LCDDATA20 LCDDATA19 LCDDATA18 LCDDATA16 LCDDATA15 LCDDATA14 LCDDATA13 LCDDATA12 LCDDATA10 LCDDATA9 LCDDATA8 LCDDATA7 LCDDATA6 LCDDATA4 LCDDATA3 LCDDATA2 LCDDATA1 LCDDATA0 LCDSE4 LCDSE3 LCDSE2 LCDSE1 LCDSE0 LCDCON LCDPS LCDREG
REGISTERS ASSOCIATED WITH LCD OPERATION
Bit 7 Bit 6 Bit 5 Bit 4 INT0IE TX2IF TX2IE TX2IP RI -- S28C3 S20C3 S12C3 S04C3 -- S28C2 S20C2 S12C2 S04C2 -- S28C1 S20C1 S12C1 S04C1 -- S28C0 S20C0 S12C0 S04C0 -- SE28 SE20 SE12 SE04 -- WA BIAS1 Bit 3 RBIE CTMUIF CTMUIE CTMUIP TO -- S27C3 S19C3 S11C3 S03C3 -- S27C2 S19C2 S11C2 S03C2 -- S27C1 S19C1 S11C1 S03C1 -- S27C0 S19C0 S11C0 S03C0 -- SE27 SE19 SE11 SE03 CS1 LP3 BIAS0 Bit 2 TMR0IF CCP2IF CCP2IE CCP2IP PD -- S26C3 S18C3 S10C3 S02C3 -- S26C2 S18C2 S10C2 S02C2 -- S26C1 S18C1 S10C1 S02C1 -- S26C0 S18C0 S10C0 S02C0 -- SE26 SE18 SE10 SE02 CS0 LP2 MODE13 Bit 1 INT0IF CCP1IF CCP1IE CCP1IP POR -- S25C3 S17C3 S09C3 S01C3 -- S25C2 S17C2 S09C2 S01C2 -- S25C1 S17C1 S09C1 S01C1 -- S25C0 S17C0 S09C0 S01C0 -- SE25 SE17 SE09 SE01 LMUX1 LP1 CKSEL1 Bit 0 RBIF RTCCIF RTCCIE RTCCIP BOR S32C3 S24C3 S16C3 S08C3 S00C3 S32C2 S24C2 S16C2 S08C2 S00C2 S32C1 S24C1 S16C1 S08C1 S00C1 S32C0 S24C0 S16C0 S08C0 S00C0 SE32 SE24 SE16 SE08 SE00 LMUX0 LP0 CKSEL0 Reset Values on Page 49 52 52 52 50 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 51 51 51 51 51 51 51 51 51 51 51 51 50
GIE/GIEH PEIE/GIEL TMR0IE -- -- -- IPEN -- S31C3 S23C3 S15C3 S07C3 -- S31C2 S23C2 S15C2 S07C2 -- S31C1 S23C1 S15C1 S07C1 -- S31C0 S23C0 S15C0 S07C0 -- SE31 SE23 SE15 SE07 LCDEN WFT -- LCDIF LCDIE LCDIP -- -- S30C3 S22C3 S14C3 S06C3 -- S30C2 S22C2 S14C2 S06C2 -- S30C1 S22C1 S14C1 S06C1 -- S30C0 S22C0 S14C0 S06C0 -- SE30 SE22 SE14 SE06 SLPEN BIASMD CPEN RC2IF RC2IE RC2IP CM -- S29C3 S21C3 S13C3 S05C3 -- S29C2 S21C2 S13C2 S05C2 -- S29C1 S21C1 S13C1 S05C1 -- S29C0 S21C0 S13C0 S05C0 -- SE29 SE21 SE13 SE05 WERR LCDA BIAS2
Legend: -- = unimplemented, read as `0'. Shaded cells are not used for LCD operation. Note 1: These registers or individual bits are unimplemented on PIC18F86J72 devices.
Note:
When the device enters Sleep mode while operating in Bias modes, M0 or M1, be sure that the bias capacitors are fully discharged in order to get the lowest Sleep current.
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NOTES:
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18.0 MASTER SYNCHRONOUS SERIAL PORT (MSSP) MODULE
Master SSP (MSSP) Module Overview 18.3 SPI Mode
The SPI mode allows 8 bits of data to be synchronously transmitted and received simultaneously. All four modes of SPI are supported. To accomplish communication, typically three pins are used: * Serial Data Out (SDO) - RC5/SDO/SEG12 * Serial Data In (SDI) - RC4/SDI/SDA/SEG16 * Serial Clock (SCK) - RC3/SCK/SCL/SEG17 Additionally, a fourth pin may be used when in a Slave mode of operation: * Slave Select (SS) - RF7/AN5/SS/SEG25 Figure 18-1 shows the block diagram of the MSSP module when operating in SPI mode.
18.1
The Master Synchronous Serial Port (MSSP) module is a serial interface, useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, shift registers, display drivers, A/D Converters, etc. The MSSP module can operate in one of two modes: * Serial Peripheral Interface (SPI) * Inter-Integrated Circuit (I2CTM) - Full Master mode - Slave mode (with general address call) The I2C interface supports the following modes in hardware: * Master mode * Multi-Master mode * Slave mode
FIGURE 18-1:
MSSP BLOCK DIAGRAM (SPI MODE)
Internal Data Bus Read SSPBUF reg Write
18.2
Control Registers
SDI SSPSR reg SDO bit 0 Shift Clock
Each MSSP module has three associated control registers. These include a status register (SSPSTAT) and two control registers (SSPCON1 and SSPCON2). The use of these registers and their individual bits differ significantly depending on whether the MSSP module is operated in SPI or I2C mode. Additional details are provided under the individual sections.
SS
SS Control Enable Edge Select 2 Clock Select SSPM<3:0> SMP:CKE 4 TMR2 Output 2 2
SCK
(
)
Edge Select
Prescaler TOSC 4, 16, 64
Data to TXx/RXx in SSPSR TRIS bit
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18.3.1 REGISTERS
Each MSSP module has four registers for SPI mode operation. These are: * * * * MSSP Control Register 1 (SSPCON1) MSSP Status Register (SSPSTAT) Serial Receive/Transmit Buffer Register (SSPBUF) MSSP Shift Register (SSPSR) - Not directly accessible SSPSR is the shift register used for shifting data in or out. SSPBUF is the buffer register to which data bytes are written to or read from. In receive operations, SSPSR and SSPBUF together, create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not double-buffered. A write to SSPBUF will write to both SSPBUF and SSPSR.
SSPCON1 and SSPSTAT are the control and status registers in SPI mode operation. The SSPCON1 register is readable and writable. The lower 6 bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write.
REGISTER 18-1:
R/W-0 SMP bit 7 Legend: R = Readable bit -n = Value at POR bit 7
SSPSTAT: MSSP STATUS REGISTER (SPI MODE)
R-0 D/A R-0 P R-0 S R-0 R/W R0 UA R-0 BF bit 0
(1)
R/W-0 CKE
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
SMP: Sample bit SPI Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time SPI Slave mode: SMP must be cleared when SPI is used in Slave mode. CKE: SPI Clock Select bit(1) 1 = Transmit occurs on transition from active to Idle clock state 0 = Transmit occurs on transition from Idle to active clock state D/A: Data/Address bit Used in I2CTM mode only. P: Stop bit Used in I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared. S: Start bit Used in I2C mode only. R/W: Read/Write Information bit Used in I2C mode only. UA: Update Address bit Used in I2C mode only. BF: Buffer Full Status bit (Receive mode only) 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty Polarity of clock state is set by the CKP bit (SSPCON1<4>).
bit 6
bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
Note 1:
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REGISTER 18-2:
R/W-0 WCOL bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
SSPCON1: MSSP CONTROL REGISTER 1 (SPI MODE)
R/W-0 SSPEN(2) R/W-0 CKP R/W-0 SSPM3(3) R/W-0 SSPM2(3) R/W-0 SSPM1(3) R/W-0 SSPM0(3) bit 0
R/W-0 SSPOV(1)
WCOL: Write Collision Detect bit (Transmit mode only) 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision SSPOV: Receive Overflow Indicator bit(1) SPI Slave mode: 1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. The user must read the SSPBUF, even if only transmitting data, to avoid setting overflow (must be cleared in software). 0 = No overflow SSPEN: Master Synchronous Serial Port Enable bit(2) 1 = Enables serial port and configures SCK, SDO, SDI and SS as serial port pins 0 = Disables serial port and configures these pins as I/O port pins CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level 0 = Idle state for clock is a low level SSPM<3:0>: Master Synchronous Serial Port Mode Select bits(3) 0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as an I/O pin 0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled 0011 = SPI Master mode, clock = TMR2 output/2 0010 = SPI Master mode, clock = FOSC/64 0001 = SPI Master mode, clock = FOSC/16 0000 = SPI Master mode, clock = FOSC/4 In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. When enabled, these pins must be properly configured as input or output. Bit combinations not specifically listed here are either reserved or implemented in I2CTM mode only.
bit 6
bit 5
bit 4
bit 3-0
Note 1: 2: 3:
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18.3.2 OPERATION
When initializing the SPI, several options need to be specified. This is done by programming the appropriate control bits (SSPCON1<5:0> and SSPSTAT<7:6>). These control bits allow the following to be specified: Master mode (SCK is the clock output) Slave mode (SCK is the clock input) Clock Polarity (Idle state of SCK) Data Input Sample Phase (middle or end of data output time) * Clock Edge (output data on rising/falling edge of SCK) * Clock Rate (Master mode only) * Slave Select mode (Slave mode only) Each MSSP consists of a transmit/receive shift register (SSPSR) and a buffer register (SSPBUF). The SSPSR shifts the data in and out of the device, MSb first. The SSPBUF holds the data that was written to the SSPSR until the received data is ready. Once the 8 bits of data have been received, that byte is moved to the SSPBUF register. Then, the Buffer Full detect bit, BF (SSPSTAT<0>), and the interrupt flag bit, SSPIF, are set. This double-buffering of the received data (SSPBUF) allows the next byte to start reception before reading the data that was just received. Any write to the SSPBUF register during transmission/reception of data * * * * will be ignored and the Write Collision detect bit, WCOL (SSPCON1<7>), will be set. User software must clear the WCOL bit so that it can be determined if the following write(s) to the SSPBUF register completed successfully. When the application software is expecting to receive valid data, the SSPBUF should be read before the next byte of data to transfer is written to the SSPBUF. The Buffer Full bit, BF (SSPSTAT<0>), indicates when SSPBUF has been loaded with the received data (transmission is complete). When the SSPBUF is read, the BF bit is cleared. This data may be irrelevant if the SPI is only a transmitter. Generally, the MSSP interrupt is used to determine when the transmission/reception has completed. The SSPBUF must be read and/or written. If the interrupt method is not going to be used, then software polling can be done to ensure that a write collision does not occur. Example 18-1 shows the loading of the SSPBUF (SSPSR) for data transmission. Note: To prevent lost data in Master mode, read SSPBUF after each transmission to clear the BF bit.
The SSPSR is not directly readable or writable and can only be accessed by addressing the SSPBUF register. Additionally, the SSPSTAT register indicates the various status conditions.
EXAMPLE 18-1:
LOOP BTFSS BRA MOVF MOVWF MOVF MOVWF
LOADING THE SSPBUF (SSPSR) REGISTER
SSPSTAT, BF LOOP SSPBUF, W RXDATA TXDATA, W SSPBUF ;Has data been received (transmit complete)? ;No ;WREG reg = contents of SSPBUF ;Save in user RAM, if data is meaningful ;W reg = contents of TXDATA ;New data to xmit
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18.3.3 ENABLING SPI I/O
To enable the serial port, MSSP Enable bit, SSPEN (SSPCON1<5>), must be set. To reset or reconfigure SPI mode, clear the SSPEN bit, reinitialize the SSPCON registers and then set the SSPEN bit. This configures the SDI, SDO, SCK and SS pins as serial port pins. For the pins to behave as the serial port function, some must have their data direction bits (in the TRIS register) appropriately programmed as follows: * SDI is automatically controlled by the SPI module * SDO must have TRISC<5> bit cleared * SCK (Master mode) must have TRISC<3> bit cleared * SCK (Slave mode) must have TRISC<3> bit set * SS must have TRISF<7> bit set Any serial port function that is not desired may be overridden by programming the corresponding data direction (TRIS) register to the opposite value. to a higher level through an external pull-up resistor, and allows the output to communicate with external circuits without the need for additional level shifters. The open-drain output option is controlled by the SPIOD bit (TRISG<7>). Setting the bit configures both pins for open-drain operation.
18.3.5
TYPICAL CONNECTION
Figure 18-2 shows a typical connection between two microcontrollers. The master controller (Processor 1) initiates the data transfer by sending the SCK signal. Data is shifted out of both shift registers on their programmed clock edge and latched on the opposite edge of the clock. Both processors should be programmed to the same Clock Polarity (CKP), then both controllers would send and receive data at the same time. Whether the data is meaningful (or dummy data) depends on the application software. This leads to three scenarios for data transmission: * Master sends data-Slave sends dummy data * Master sends data-Slave sends data * Master sends dummy data-Slave sends data
18.3.4
OPEN-DRAIN OUTPUT OPTION
The drivers for the SDO output and SCK clock pins can be optionally configured as open-drain outputs. This feature allows the voltage level on the pin to be pulled
FIGURE 18-2:
SPI MASTER/SLAVE CONNECTION
SPI Master SSPM<3:0> = 00xx SDO SDI
SPI Slave SSPM<3:0> = 010x
Serial Input Buffer (SSPBUF)
Serial Input Buffer (SSPBUF)
Shift Register (SSPSR) MSb LSb
SDI
SDO
Shift Register (SSPSR) MSb LSb
SCK PROCESSOR 1
Serial Clock
SCK PROCESSOR 2
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18.3.6 MASTER MODE
The master can initiate the data transfer at any time because it controls the SCK. The master determines when the slave (Processor 2, Figure 18-2) will broadcast data by the software protocol. In Master mode, the data is transmitted/received as soon as the SSPBUF register is written to. If the SPI is only going to receive, the SDO output could be disabled (programmed as an input). The SSPSR register will continue to shift in the signal present on the SDI pin at the programmed clock rate. As each byte is received, it will be loaded into the SSPBUF register as if a normal received byte (interrupts and status bits appropriately set). This could be useful in receiver applications as a "Line Activity Monitor" mode. The clock polarity is selected by appropriately programming the CKP bit (SSPCON1<4>). This, then, would give waveforms for SPI communication as shown in Figure 18-3, Figure 18-5 and Figure 18-6, where the MSB is transmitted first. In Master mode, the SPI clock rate (bit rate) is user-programmable to be one of the following: * * * * FOSC/4 (or TCY) FOSC/16 (or 4 * TCY) FOSC/64 (or 16 * TCY) Timer2 output/2
This allows a maximum data rate (at 40 MHz) of 10.00 Mbps. Figure 18-3 shows the waveforms for Master mode. When the CKE bit is set, the SDO data is valid before there is a clock edge on SCK. The change of the input sample is shown based on the state of the SMP bit. The time when the SSPBUF is loaded with the received data is shown.
FIGURE 18-3:
Write to SSPBUF SCK (CKP = 0 CKE = 0) SCK (CKP = 1 CKE = 0) SCK (CKP = 0 CKE = 1) SCK (CKP = 1 CKE = 1) SDO (CKE = 0) SDO (CKE = 1) SDI (SMP = 0) Input Sample (SMP = 0) SDI (SMP = 1) Input Sample (SMP = 1) SSPIF SSPSR to SSPBUF
SPI MODE WAVEFORM (MASTER MODE)
4 Clock Modes
bit 7 bit 7
bit 6 bit 6
bit 5 bit 5
bit 4 bit 4
bit 3 bit 3
bit 2 bit 2
bit 1 bit 1
bit 0 bit 0
bit 7
bit 0
bit 7
bit 0
Next Q4 Cycle after Q2
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18.3.7 SLAVE MODE
In Slave mode, the data is transmitted and received as the external clock pulses appear on SCK. When the last bit is latched, the SSPIF interrupt flag bit is set. Before enabling the module in SPI Slave mode, the clock line must match the proper Idle state. The clock line can be observed by reading the SCK pin. The Idle state is determined by the CKP bit (SSPCON1<4>). While in Slave mode, the external clock is supplied by the external clock source on the SCK pin. This external clock must meet the minimum high and low times as specified in the electrical specifications. While in Sleep mode, the slave can transmit/receive data. When a byte is received, the device will wake-up from Sleep. driven. When the SS pin goes high, the SDO pin is no longer driven, even if in the middle of a transmitted byte and becomes a floating output. External pull-up/pull-down resistors may be desirable depending on the application. Note 1: When the SPI is in Slave mode with SS pin control enabled (SSPCON1<3:0> = 0100), the SPI module will reset if the SS pin is set to VDD. 2: If the SPI is used in Slave mode with CKE set, then the SS pin control must be enabled. When the SPI module resets, the bit counter is forced to `0'. This can be done by either forcing the SS pin to a high level or clearing the SSPEN bit. To emulate two-wire communication, the SDO pin can be connected to the SDI pin. When the SPI needs to operate as a receiver, the SDO pin can be configured as an input. This disables transmissions from the SDO. The SDI can always be left as an input (SDI function) since it cannot create a bus conflict.
18.3.8
SLAVE SELECT SYNCHRONIZATION
The SS pin allows a Synchronous Slave mode. The SPI must be in Slave mode with SS pin control enabled (SSPCON1<3:0> = 04h). When the SS pin is low, transmission and reception are enabled and the SDO pin is
FIGURE 18-4:
SS
SLAVE SYNCHRONIZATION WAVEFORM
SCK (CKP = 0 CKE = 0) SCK (CKP = 1 CKE = 0)
Write to SSPBUF
SDO
bit 7
bit 6
bit 7
bit 0
SDI (SMP = 0) Input Sample (SMP = 0) SSPIF Interrupt Flag SSPSR to SSPBUF
bit 0 bit 7 bit 7
Next Q4 Cycle after Q2
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FIGURE 18-5:
SS Optional SCK (CKP = 0 CKE = 0) SCK (CKP = 1 CKE = 0) Write to SSPBUF SDO SDI (SMP = 0) Input Sample (SMP = 0) SSPIF Interrupt Flag SSPSR to SSPBUF bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0)
bit 7
bit 0
Next Q4 Cycle after Q2
FIGURE 18-6:
SS Not Optional SCK (CKP = 0 CKE = 1) SCK (CKP = 1 CKE = 1) Write to SSPBUF SDO SDI (SMP = 0) Input Sample (SMP = 0) SSPIF Interrupt Flag SSPSR to SSPBUF
SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1)
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
bit 7
bit 0
Next Q4 Cycle after Q2
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18.3.9 OPERATION IN POWER-MANAGED MODES
In SPI Master mode, module clocks may be operating at a different speed than when in Full-Power mode; in the case of Sleep mode, all clocks are halted. In Idle modes, a clock is provided to the peripherals. That clock should be from the primary clock source, the secondary clock (Timer1 oscillator at 32.768 kHz) or the INTRC source. See Section 3.3 "Clock Sources and Oscillator Switching" for additional information. In most cases, the speed that the master clocks SPI data is not important; however, this should be evaluated for each system. If MSSP interrupts are enabled, they can wake the controller from Sleep mode, or one of the Idle modes, when the master completes sending data. If an exit from Sleep or Idle mode is not desired, MSSP interrupts should be disabled. If the Sleep mode is selected, all module clocks are halted and the transmission/reception will remain in that state until the devices wakes. After the device returns to Run mode, the module will resume transmitting and receiving data. In SPI Slave mode, the SPI Transmit/Receive Shift register operates asynchronously to the device. This allows the device to be placed in any power-managed mode and data to be shifted into the SPI Note 1: Transmit/Receive Shift register. When all 8 bits have been received, the MSSP interrupt flag bit will be set, and if enabled, will wake the device.
18.3.10
EFFECTS OF A RESET
A Reset disables the MSSP module and terminates the current transfer.
18.3.11
BUS MODE COMPATIBILITY
Table 18-1 shows the compatibility between the standard SPI modes and the states of the CKP and CKE control bits. There is also an SMP bit which controls when the data is sampled.
TABLE 18-1:
SPI BUS MODES
Control Bits State CKP 0 0 1 1 CKE 1 0 1 0
Standard SPI Mode Terminology 0, 0
(1)
0, 1 1, 0 1, 1
(1)
Use one of these modes when using the SPI to communicate with the AFE. See Section 22.5 "Using the AFE" for more information.
TABLE 18-2:
Name INTCON PIR1 PIE1 IPR1 TRISC TRISF TRISG SSPBUF SSPCON1 SSPSTAT
REGISTERS ASSOCIATED WITH SPI OPERATION
Bit 7 Bit 6 Bit 5 Bit 4 INT0IE TX1IF TX1IE TX1IP TRISC4 TRISF4 TRISG4 CKP P Bit 3 RBIE SSPIF SSPIE SSPIP TRISC3 TRISF3 TRISG3 SSPM3 S Bit 2 TMR0IF -- -- -- TRISC2 TRISF2 TRISG2 SSPM2 R/W Bit 1 INT0IF TMR2IF TMR2IE TMR2IP TRISC1 TRISF1 TRISG1 SSPM1 UA Bit 0 RBIF TMR1IF TMR1IE TMR1IP TRISC0 -- TRISG0 SSPM0 BF Reset Values on page 49 52 52 52 52 52 52 50 50 50
GIE/GIEH PEIE/GIEL TMR0IE -- -- -- TRISC7 TRISF7 SPIOD WCOL SMP ADIF ADIE ADIP TRISC6 TRISF6 CCP2OD SSPOV CKE RC1IF RC1IE RC1IP TRISC5 TRISF5 CCP1OD SSPEN D/A
MSSP Receive Buffer/Transmit Register
Legend: Shaded cells are not used by the MSSP module in SPI mode.
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18.4 I2C Mode
18.4.1 REGISTERS
The MSSP module in I 2C mode fully implements all master and slave functions (including general call support) and provides interrupts on Start and Stop bits in hardware to determine a free bus (multi-master function). The MSSP module implements the standard mode specifications as well as 7-bit and 10-bit addressing. Two pins are used for data transfer: * Serial clock (SCL) - RC3/SCK/SCL/SEG17 * Serial data (SDA) - RC4/SDI/SDA/SEG16 The user must configure these pins as inputs by setting the TRISC<4:3> bits. The MSSP module has six registers for I2C operation. These are: * * * * MSSP Control Register 1 (SSPCON1) MSSP Control Register 2 (SSPCON2) MSSP Status Register (SSPSTAT) Serial Receive/Transmit Buffer Register (SSPBUF) * MSSP Shift Register (SSPSR) - Not directly accessible * MSSP Address Register (SSPADD) SSPCON1, SSPCON2 and SSPSTAT are the control and status registers in I2C mode operation. The SSPCON1 and SSPCON2 registers are readable and writable. The lower 6 bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write. Many of the bits in SSPCON2 assume different functions, depending on whether the module is operating in Master or Slave mode; bits<5:2> also assume different names in Slave mode. The different aspects of SSPCON2 are shown in Register 18-5 (for Master mode) and Register 18-6 (Slave mode). SSPSR is the shift register used for shifting data in or out. SSPBUF is the buffer register to which data bytes are written to or read from.
LSb Addr Match
FIGURE 18-7:
MSSP BLOCK DIAGRAM (I2CTM MODE)
Internal Data Bus
Read SCL Shift Clock SSPSR reg MSb SSPBUF reg
Write
SDA
Match Detect Address Mask
SSPADD register holds the slave device address when the MSSP is configured in I2C Slave mode. When the MSSP is configured in Master mode, the lower seven bits of SSPADD act as the Baud Rate Generator reload value. In receive operations, SSPSR and SSPBUF together, create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not doublebuffered. A write to SSPBUF will write to both SSPBUF and SSPSR.
SSPADD reg Set, Reset S, P bits (SSPSTAT reg)
Start and Stop bit Detect
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REGISTER 18-3:
R/W-0 SMP bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
SSPSTAT: MSSP STATUS REGISTER (I2CTM MODE)
R-0 D/A R-0 P
(1)
R/W-0 CKE
R-0 S
(1)
R-0 R/W
R-0 UA
R-0 BF bit 0
SMP: Slew Rate Control bit In Master or Slave mode: 1 = Slew rate control disabled for Standard Speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for High-Speed mode (400 kHz) CKE: SMBus Select bit In Master or Slave mode: 1 = Enable SMBus specific inputs 0 = Disable SMBus specific inputs D/A: Data/Address bit In Master mode: Reserved. In Slave mode: 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address P: Stop bit(1) 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last S: Start bit(1) 1 = Indicates that a Start bit has been detected last 0 = Start bit was not detected last R/W: Read/Write Information bit (I2CTM mode only) In Slave mode:(2) 1 = Read 0 = Write In Master mode:(3) 1 = Transmit is in progress 0 = Transmit is not in progress UA: Update Address bit (10-Bit Slave mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated BF: Buffer Full Status bit In Transmit mode: 1 = SSPBUF is full 0 = SSPBUF is empty In Receive mode: 1 = SSPBUF is full (does not include the ACK and Stop bits) 0 = SSPBUF is empty (does not include the ACK and Stop bits) This bit is cleared on Reset and when SSPEN is cleared. This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit or not ACK bit. ORing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Active mode.
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
Note 1: 2: 3:
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REGISTER 18-4:
R/W-0 WCOL bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
SSPCON1: MSSP CONTROL REGISTER 1 (I2CTM MODE)
R/W-0 SSPEN(1) R/W-0 CKP R/W-0 SSPM3 R/W-0 SSPM2 R/W-0 SSPM1 R/W-0 SSPM0 bit 0
R/W-0 SSPOV
WCOL: Write Collision Detect bit In Master Transmit mode: 1 = A write to the SSPBUF register is attempted while the I2CTM conditions are not valid for a transmission to be started (must be cleared in software) 0 = No collision In Slave Transmit mode: 1 = The SSPBUF register is written while it was still transmitting the previous word (must be cleared in software) 0 = No collision In Receive mode (Master or Slave modes): This is a "don't care" bit. SSPOV: Receive Overflow Indicator bit In Receive mode: 1 = A byte is received while the SSPBUF register is still holding the previous byte (must be cleared in software) 0 = No overflow In Transmit mode: This is a "don't care" bit in Transmit mode. SSPEN: Master Synchronous Serial Port Enable bit(1) 1 = Enables the serial port and configures the SDA and SCL pins as the serial port pins 0 = Disables serial port and configures these pins as I/O port pins CKP: SCK Release Control bit In Slave mode: 1 = Releases clock 0 = Holds clock low (clock stretch); used to ensure data setup time In Master mode: Unused in this mode. SSPM<3:0>: Synchronous Serial Port Mode Select bits 1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1011 = I2C Firmware Controlled Master mode (slave Idle) 1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD + 1)) 0111 = I2C Slave mode, 10-bit address 0110 = I2C Slave mode, 7-bit address Bit combinations not specifically listed here are either reserved or implemented in SPI mode only. When enabled, the SDA and SCL pins must be configured as inputs.
bit 6
bit 5
bit 4
bit 3-0
Note 1:
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REGISTER 18-5:
R/W-0 GCEN bit 7 Legend: R = Readable bit -n = Value at POR bit 7 bit 6 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
SSPCON2: MSSP CONTROL REGISTER 2 (I2CTM MASTER MODE)
R/W-0 ACKDT
(1)
R/W-0 ACKSTAT
R/W-0 ACKEN
(2)
R/W-0 RCEN
(2)
R/W-0 PEN
(2)
R/W-0 RSEN
(2)
R/W-0 SEN(2) bit 0
GCEN: General Call Enable bit Unused in Master mode. ACKSTAT: Acknowledge Status bit (Master Transmit mode only) 1 = Acknowledge was not received from slave 0 = Acknowledge was received from slave ACKDT: Acknowledge Data bit (Master Receive mode only)(1) 1 = Not Acknowledge 0 = Acknowledge ACKEN: Acknowledge Sequence Enable bit(2) 1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence Idle RCEN: Receive Enable bit (Master Receive mode only)(2) 1 = Enables Receive mode for I2CTM 0 = Receive Idle PEN: Stop Condition Enable bit(2) 1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Stop condition Idle RSEN: Repeated Start Condition Enable bit(2) 1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Repeated Start condition Idle SEN: Start Condition Enable bit(2) 1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Start condition Idle Value that will be transmitted when the user initiates an Acknowledge sequence at the end of a receive. If the I2C module is active, these bits may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled).
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
Note 1: 2:
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REGISTER 18-6:
R/W-0 GCEN bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
SSPCON2: MSSP CONTROL REGISTER 2 (I2CTM SLAVE MODE)
R/W-0 ADMSK5 R/W-0 ADMSK4 R/W-0 ADMSK3 R/W-0 ADMSK2 R/W-0 ADMSK1 R/W-0 SEN(1) bit 0
R/W-0 ACKSTAT
GCEN: General Call Enable bit 1 = Enable interrupt when a general call address (0000h) is received in the SSPSR 0 = General call address disabled ACKSTAT: Acknowledge Status bit Unused in Slave mode. ADMSK<5:2>: Slave Address Mask Select bits 1 = Masking of corresponding bits of SSPADD is enabled 0 = Masking of corresponding bits of SSPADD is disabled ADMSK1: Slave Address Least Significant bit(s) Mask Select bit In 7-Bit Addressing mode: 1 = Masking of SSPADD<1> only is enabled 0 = Masking of SSPADD<1> only is disabled In 10-Bit Addressing mode: 1 = Masking of SSPADD<1:0> is enabled 0 = Masking of SSPADD<1:0> is disabled SEN: Stretch Enable bit(1) 1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled) 0 = Clock stretching is disabled If the I2CTM module is active, this bit may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled).
bit 6 bit 5-2
bit 1
bit 0
Note 1:
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18.4.2 OPERATION
The MSSP module functions are enabled by setting the MSSP Enable bit, SSPEN (SSPCON1<5>). The SSPCON1 register allows control of the I 2C operation. Four mode selection bits (SSPCON1<3:0>) allow one of the following I 2C modes to be selected: * I2C Master mode, clock = (FOSC/4) x (SSPADD + 1) * I 2C Slave mode (7-bit address) * I 2C Slave mode (10-bit address) * I 2C Slave mode (7-bit address) with Start and Stop bit interrupts enabled * I 2C Slave mode (10-bit address) with Start and Stop bit interrupts enabled * I 2C Firmware Controlled Master mode, slave is Idle Selection of any I 2C mode, with the SSPEN bit set, forces the SCL and SDA pins to be open-drain, provided these pins are programmed to inputs by setting the appropriate TRISC or TRISD bits. To ensure proper operation of the module, pull-up resistors must be provided externally to the SCL and SDA pins. The SCL clock input must have a minimum high and low for proper operation. The high and low times of the I2C specification, as well as the requirement of the MSSP module, are shown in timing Parameter 100 and Parameter 101.
18.4.3.1
Addressing
Once the MSSP module has been enabled, it waits for a Start condition to occur. Following the Start condition, the 8 bits are shifted into the SSPSR register. All incoming bits are sampled with the rising edge of the clock (SCL) line. The value of register, SSPSR<7:1>, is compared to the value of the SSPADD register. The address is compared on the falling edge of the eighth clock (SCL) pulse. If the addresses match and the BF and SSPOV bits are clear, the following events occur: 1. 2. 3. 4. The SSPSR register value is loaded into the SSPBUF register. The Buffer Full bit, BF, is set. An ACK pulse is generated. The MSSP Interrupt Flag bit, SSPIF, is set (and interrupt is generated, if enabled) on the falling edge of the ninth SCL pulse.
18.4.3
SLAVE MODE
In Slave mode, the SCL and SDA pins must be configured as inputs (TRISC<4:3> set). The MSSP module will override the input state with the output data when required (slave-transmitter). The I 2C Slave mode hardware will always generate an interrupt on an exact address match. In addition, address masking will also allow the hardware to generate an interrupt for more than one address (up to 31 in 7-bit addressing and up to 63 in 10-bit addressing). Through the mode select bits, the user can also choose to interrupt on Start and Stop bits. When an address is matched, or the data transfer after an address match is received, the hardware automatically will generate the Acknowledge (ACK) pulse and load the SSPBUF register with the received value currently in the SSPSR register. Any combination of the following conditions will cause the MSSP module not to give this ACK pulse: * The Buffer Full bit, BF (SSPSTAT<0>), was set before the transfer was received. * The overflow bit, SSPOV (SSPCON1<6>), was set before the transfer was received. In this case, the SSPSR register value is not loaded into the SSPBUF, but bit, SSPIF, is set. The BF bit is cleared by reading the SSPBUF register, while bit, SSPOV, is cleared through software.
In 10-Bit Addressing mode, two address bytes need to be received by the slave. The five Most Significant bits (MSbs) of the first address byte specify if this is a 10-bit address. Bit, R/W (SSPSTAT<2>), must specify a write so the slave device will receive the second address byte. For a 10-bit address, the first byte would equal `11110 A9 A8 0', where `A9' and `A8' are the two MSbs of the address. The sequence of events for 10-bit addressing is as follows, with steps 7 through 9 for the slave-transmitter: 1. 2. Receive first (high) byte of address (SSPIF, BF and UA bits (SSPSTAT<1>) are set). Update the SSPADD register with second (low) byte of address (clears UA bit and releases the SCL line). Read the SSPBUF register (clears BF bit) and clear flag bit, SSPIF. Receive second (low) byte of address (SSPIF, BF and UA bits are set). Update the SSPADD register with the first (high) byte of address. If match releases SCL line, this will clear UA bit. Read the SSPBUF register (clears BF bit) and clear flag bit, SSPIF. Receive Repeated Start condition. Receive first (high) byte of address (SSPIF and BF bits are set). Read the SSPBUF register (clears BF bit) and clear flag bit, SSPIF.
3. 4. 5.
6. 7. 8. 9.
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18.4.3.2 Address Masking
Masking an address bit causes that bit to become a "don't care". When one address bit is masked, two addresses will be Acknowledged and cause an interrupt. It is possible to mask more than one address bit at a time, which makes it possible to Acknowledge up to 31 addresses in 7-bit mode and up to 63 addresses in 10-bit mode (see Example 18-2). The I2C Slave behaves the same way whether address masking is used or not. However, when address masking is used, the I2C slave can Acknowledge multiple addresses and cause interrupts. When this occurs, it is necessary to determine which address caused the interrupt by checking SSPBUF. In 7-Bit Addressing mode, Address Mask bits, ADMSK<5:1> (SSPCON<5:1>), mask the corresponding address bits in the SSPADD register. For any ADMSK bits that are set (ADMSK = 1), the corresponding address bit is ignored (SSPADD = x). For the module to issue an address Acknowledge, it is sufficient to match only on addresses that do not have an active address mask. In 10-Bit Addressing mode, ADMSK<5:2> bits mask the corresponding address bits in the SSPADD register. In addition, ADMSK1 simultaneously masks the two LSbs of the address (SSPADD<1:0>). For any ADMSK bits that are active (ADMSK = 1), the corresponding address bit is ignored (SSPADD = x). Also note, that although in 10-Bit Addressing mode, the upper address bits reuse part of the SSPADD register bits; the address mask bits do not interact with those bits. They only affect the lower address bits. Note 1: ADMSK1 masks the two Least Significant bits of the address. 2: The two Most Significant bits of the address are not affected by address masking.
EXAMPLE 18-2:
7-Bit Addressing:
ADDRESS MASKING EXAMPLES
SSPADD<7:1> = A0h (1010000) (SSPADD<0> is assumed to be `0') ADMSK<5:1> 10-Bit Addressing: SSPADD<7:0> = A0h (10100000) (the two MSbs of the address are ignored in this example, since they are not affected by masking) ADMSK<5:1> = 00111 Addresses Acknowledged: A0h, A1h, A2h, A3h, A4h, A5h, A6h, A7h, A8h, A9h, AAh, ABh, ACh, ADh, AEh, AFh = 00111 Addresses Acknowledged: A0h, A2h, A4h, A6h, A8h, AAh, ACh, AEh
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18.4.3.3 Reception 18.4.3.4 Transmission
When the R/W bit of the address byte is clear and an address match occurs, the R/W bit of the SSPSTAT register is cleared. The received address is loaded into the SSPBUF register and the SDA line is held low (ACK). When the address byte overflow condition exists, then the no Acknowledge (ACK) pulse is given. An overflow condition is defined as either bit, BF (SSPSTAT<0>), is set or bit, SSPOV (SSPCON1<6>), is set. An MSSP interrupt is generated for each data transfer byte. The interrupt flag bit, SSPIF, must be cleared in software. The SSPSTAT register is used to determine the status of the byte. If SEN is enabled (SSPCON2<0> = 1), SCK/SCL will be held low (clock stretch) following each data transfer. The clock must be released by setting bit, CKP (SSPCON1<4>). See Section 18.4.4 "Clock Stretching" for more details. When the R/W bit of the incoming address byte is set and an address match occurs, the R/W bit of the SSPSTAT register is set. The received address is loaded into the SSPBUF register. The ACK pulse will be sent on the ninth bit and pin, RC3, is held low, regardless of SEN (see Section 18.4.4 "Clock Stretching" for more details). By stretching the clock, the master will be unable to assert another clock pulse until the slave is done preparing the transmit data. The transmit data must be loaded into the SSPBUF register which also loads the SSPSR register. Then, the RC3 pin should be enabled by setting bit, CKP (SSPCON1<4>). The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time (Figure 18-10). The ACK pulse from the master-receiver is latched on the rising edge of the ninth SCL input pulse. If the SDA line is high (not ACK), then the data transfer is complete. In this case, when the ACK is latched by the slave, the slave logic is reset and the slave monitors for another occurrence of the Start bit. If the SDA line was low (ACK), the next transmit data must be loaded into the SSPBUF register. Again, pin, RC3, must be enabled by setting bit, CKP. An MSSP interrupt is generated for each data transfer byte. The SSPIF bit must be cleared in software and the SSPSTAT register is used to determine the status of the byte. The SSPIF bit is set on the falling edge of the ninth clock pulse.
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Preliminary
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FIGURE 18-8:
DS39979A-page 212
Receiving Address A5 ACK A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 R/W = 0 Receiving Data ACK Receiving Data D1 D0 ACK 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P Bus master terminates transfer Cleared in software SSPBUF is read SSPOV is set because SSPBUF is still full. ACK is not sent.
SDA
A7
A6
SCL
S
1
2
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SSPIF (PIR1<3>)
I2CTM SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 7-BIT ADDRESSING)
Preliminary
BF (SSPSTAT<0>)
SSPOV (SSPCON1<6>)
CKP
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(CKP does not reset to `0' when SEN = 0)
FIGURE 18-9:
Receiving Address A5 ACK X A3 X X D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1
R/W = 0 Receiving Data ACK Receiving Data
ACK D0
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3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P Bus master terminates transfer Cleared in software SSPBUF is read SSPOV is set because SSPBUF is still full. ACK is not sent.
SDA
A7
A6
SCL
S
1
2
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
I2CTM SLAVE MODE TIMING WITH SEN = 0 AND ADMSK<5:1> = 01011 (RECEPTION, 7-BIT ADDRESSING)
Preliminary
SSPOV (SSPCON1<6>)
CKP
(CKP does not reset to `0' when SEN = 0)
Note
1:
x = Don't care (i.e., address bit can be either a `1' or a `0').
2:
In this example, an address equal to A7.A6.A5.X.A3.X.X will be Acknowledged and cause an interrupt.
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FIGURE 18-10:
DS39979A-page 214
R/W = 1 ACK D1 D0 D4 D3 D2 D5 D7 D6 D1 Transmitting Data D0 A1 D3 D2 ACK D5 D4 D7 D6 Transmitting Data ACK A4 A2 A3 4 SCL held low while CPU responds to SSPIF 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P Cleared in software SSPBUF is written in software Clear by reading From SSPIF ISR Cleared in software SSPBUF is written in software From SSPIF ISR
Receiving Address
SDA
A7
A6
A5
SCL
S
1
2
3
Data in sampled
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SSPIF (PIR1<3> or PIR3<7>)
I2CTM SLAVE MODE TIMING (TRANSMISSION, 7-BIT ADDRESSING)
Preliminary
CKP is set in software
BF (SSPxSTAT<0>)
CKP (SSPxCON1<4>)
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CKP is set in software
FIGURE 18-11:
Clock is held low until update of SSPADD has taken place R/W = 0 A8 D5 D4 ACK A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 ACK D3 D2 Receive Second Byte of Address Receive Data Byte Receive Data Byte D1 D0
Clock is held low until update of SSPADD has taken place ACK
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0 A9 5 6 1 2 3 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 7 8 9 4 5 6 7 8 9 P Bus master terminates transfer Cleared in software Cleared in software Cleared in software Dummy read of SSPBUF to clear BF flag SSPOV is set because SSPBUF is still full. ACK is not sent. Cleared by hardware when SSPADD is updated with low byte of address UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address
Receive First Byte of Address
SDA
1
1
1
1
SCL
S
1
2
3
4
SSPIF (PIR1<3>)
Cleared in software
BF (SSPSTAT<0>)
SSPBUF is written with contents of SSPSR
I2CTM SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 10-BIT ADDRESSING)
Preliminary
SSPOV (SSPCON1<6>)
UA (SSPSTAT<1>)
UA is set indicating that the SSPADD needs to be updated
CKP
(CKP does not reset to `0' when SEN = 0)
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FIGURE 18-12:
DS39979A-page 216
Clock is held low until update of SSPADD has taken place R/W = 0 A8 D5 D4 D3 D2 D1 D0 ACK A7 A6 A5 X A3 A2 X X D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 ACK Receive Second Byte of Address Receive Data Byte Receive Data Byte ACK Clock is held low until update of SSPADD has taken place 6 6 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 7 8 9 7 8 9 P Bus master terminates transfer Cleared in software Cleared in software Cleared in software Dummy read of SSPBUF to clear BF flag SSPOV is set because SSPBUF is still full. ACK is not sent. Cleared by hardware when SSPADD is updated with low byte of address UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address
Receive First Byte of Address
SDA
1
1
1
1
0
A9
SCL
S
1
2
3
4
5
SSPIF (PIR1<3>)
Cleared in software
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BF (SSPSTAT<0>)
SSPBUF is written with contents of SSPSR
I2CTM SLAVE MODE TIMING WITH SEN = 0 AND ADMSK<5:1> = 01001 (RECEPTION, 10-BIT ADDRESSING)
Preliminary
SSPOV (SSPCON1<6>)
UA (SSPSTAT<1>)
UA is set indicating that the SSPADD needs to be updated
CKP
(CKP does not reset to `0' when SEN = 0)
Note
1:
x = Don't care (i.e., address bit can be either a `1' or a `0').
2:
In this example, an address equal to A9.A8.A7.A6.A5.X.A3.A2.X.X will be Acknowledged and cause an interrupt.
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3:
Note that the Most Significant bits of the address are not affected by the bit masking.
FIGURE 18-13:
Bus master terminates transfer Clock is held low until CKP is set to `1' R/W = 1 ACK Transmitting Data Byte D7 D6 D5 D4 D3 D2 D1 D0 ACK
2010 Microchip Technology Inc.
Clock is held low until update of SSPADD has taken place R/W = 0 Receive Second Byte of Address Receive First Byte of Address ACK 1 1 1 1 0 A9 A8 ACK A7 A6 A5 A4 A3 A2 A1 A0 Clock is held low until update of SSPADD has taken place 0 A9 A8 5 Sr 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P Cleared in software Cleared in software Cleared in software Dummy read of SSPBUF to clear BF flag Dummy read of SSPBUF to clear BF flag Write of SSPBUF BF flag is clear initiates transmit at the end of the third address sequence Completion of data transmission clears BF flag Cleared by hardware when SSPADD is updated with low byte of address UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address. CKP is set in software CKP is automatically cleared in hardware, holding SCL low
Receive First Byte of Address
SDA
1
1
1
1
SCL
S
1
2
3
4
SSPIF (PIR1<3>)
I2CTM SLAVE MODE TIMING (TRANSMISSION, 10-BIT ADDRESSING)
Preliminary
BF (SSPSTAT<0>)
SSPBUF is written with contents of SSPSR
UA (SSPSTAT<1>)
UA is set indicating that the SSPADD needs to be updated
CKP (SSPCON1<4>)
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18.4.4 CLOCK STRETCHING
Note: Both 7-Bit and 10-Bit Slave modes implement automatic clock stretching during a transmit sequence. The SEN bit (SSPCON2<0>) allows clock stretching to be enabled during receives. Setting SEN will cause the SCL pin to be held low at the end of each data receive sequence. If the user polls the UA bit and clears it by updating the SSPADD register before the falling edge of the ninth clock occurs and if the user hasn't cleared the BF bit by reading the SSPBUF register before that time, then the CKP bit will still NOT be asserted low. Clock stretching on the basis of the state of the BF bit only occurs during a data sequence, not an address sequence.
18.4.4.1
Clock Stretching for 7-Bit Slave Receive Mode (SEN = 1)
18.4.4.3
In 7-Bit Slave Receive mode, on the falling edge of the ninth clock at the end of the ACK sequence, if the BF bit is set, the CKP bit in the SSPCON1 register is automatically cleared, forcing the SCL output to be held low. The CKP being cleared to `0' will assert the SCL line low. The CKP bit must be set in the user's ISR before reception is allowed to continue. By holding the SCL line low, the user has time to service the ISR and read the contents of the SSPBUF before the master device can initiate another receive sequence. This will prevent buffer overruns from occurring (see Figure 18-15). Note 1: If the user reads the contents of the SSPBUF before the falling edge of the ninth clock, thus clearing the BF bit, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set in software regardless of the state of the BF bit. The user should be careful to clear the BF bit in the ISR before the next receive sequence in order to prevent an overflow condition.
Clock Stretching for 7-Bit Slave Transmit Mode
The 7-Bit Slave Transmit mode implements clock stretching by clearing the CKP bit after the falling edge of the ninth clock if the BF bit is clear. This occurs regardless of the state of the SEN bit. The user's ISR must set the CKP bit before transmission is allowed to continue. By holding the SCL line low, the user has time to service the ISR and load the contents of the SSPBUF before the master device can initiate another transmit sequence (see Figure 18-10). Note 1: If the user loads the contents of SSPBUF, setting the BF bit before the falling edge of the ninth clock, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set in software regardless of the state of the BF bit.
18.4.4.4
Clock Stretching for 10-Bit Slave Transmit Mode
18.4.4.2
Clock Stretching for 10-Bit Slave Receive Mode (SEN = 1)
In 10-Bit Slave Receive mode, during the address sequence, clock stretching automatically takes place but CKP is not cleared. During this time, if the UA bit is set after the ninth clock, clock stretching is initiated. The UA bit is set after receiving the upper byte of the 10-bit address and following the receive of the second byte of the 10-bit address with the R/W bit cleared to `0'. The release of the clock line occurs upon updating SSPADD. Clock stretching will occur on each data receive sequence as described in 7-bit mode.
In 10-Bit Slave Transmit mode, clock stretching is controlled during the first two address sequences by the state of the UA bit, just as it is in 10-Bit Slave Receive mode. The first two addresses are followed by a third address sequence which contains the high-order bits of the 10-bit address and the R/W bit set to `1'. After the third address sequence is performed, the UA bit is not set, the module is now configured in Transmit mode and clock stretching is controlled by the BF flag as in 7-Bit Slave Transmit mode (see Figure 18-13).
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18.4.4.5 Clock Synchronization and the CKP bit
When the CKP bit is cleared, the SCL output is forced to `0'. However, clearing the CKP bit will not assert the SCL output low until the SCL output is already sampled low. Therefore, the CKP bit will not assert the SCL line until an external I2C master device has already asserted the SCL line. The SCL output will remain low until the CKP bit is set and all other devices on the I2C bus have deasserted SCL. This ensures that a write to the CKP bit will not violate the minimum high time requirement for SCL (see Figure 18-14).
FIGURE 18-14:
CLOCK SYNCHRONIZATION TIMING
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
SDA
DX
DX - 1
SCL
CKP
Master device asserts clock Master device deasserts clock
WR SSPCON
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Preliminary
DS39979A-page 219
FIGURE 18-15:
DS39979A-page 220
Clock is not held low because buffer full bit is clear prior to falling edge of 9th clock Clock is held low until CKP is set to `1' ACK Receiving Data D7 D6 D5 D4 D3 D2 D1 D0 D2 D1 D0 Receiving Address A5 D7 D6 D5 D4 D3 A4 A3 A2 A1 ACK R/W = 0 Receiving Data Clock is not held low because ACK = 1 ACK 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P Bus master terminates transfer Cleared in software SSPBUF is read SSPOV is set because SSPBUF is still full. ACK is not sent.
SDA
A7
A6
SCL
S
1
2
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SSPIF (PIR1<3>)
I2CTM SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 7-BIT ADDRESSING)
Preliminary
If BF is cleared prior to the falling edge of the 9th clock, CKP will not be reset to `0' and no clock stretching will occur BF is set after falling edge of the 9th clock, CKP is reset to `0' and clock stretching occurs CKP written to `1' in software
BF (SSPSTAT<0>)
SSPOV (SSPCON1<6>)
CKP
2010 Microchip Technology Inc.
FIGURE 18-16:
Clock is held low until update of SSPADD has taken place Clock is held low until CKP is set to `1' Receive Data Byte D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 R/W = 0 ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK D7 D6 D5 D4 D3 D2 Receive Second Byte of Address Receive Data Byte
Clock is held low until update of SSPADD has taken place ACK
Clock is not held low because ACK = 1
Receive First Byte of Address A9 A8
2010 Microchip Technology Inc.
6 1 2 3 4 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 5 6 7 8 9 P Cleared in software Cleared in software Cleared in software Bus master terminates transfer Dummy read of SSPBUF to clear BF flag Dummy read of SSPBUF to clear BF flag SSPOV is set because SSPBUF is still full. ACK is not sent. Cleared by hardware when SSPADD is updated with low byte of address after falling edge of ninth clock UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address after falling edge of ninth clock Note: An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA and UA will remain set. CKP written to `1' in software Note: An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA and UA will remain set.
SDA
1
1
1
1
0
SCL
S
1
2
3
4
5
SSPIF (PIR1<3>)
Cleared in software
BF (SSPSTAT<0>)
SSPBUF is written with contents of SSPSR
I2CTM SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 10-BIT ADDRESSING)
Preliminary
SSPOV (SSPCON1<6>)
UA (SSPSTAT<1>)
UA is set indicating that the SSPADD needs to be updated
CKP
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18.4.5 GENERAL CALL ADDRESS SUPPORT
The addressing procedure for the I2C bus is such that the first byte after the Start condition usually determines which device will be the slave addressed by the master. The exception is the general call address which can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledge. The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all `0's with R/W = 0. The general call address is recognized when the General Call Enable bit, GCEN, is enabled (SSPCON2<7> set). Following a Start bit detect, 8 bits are shifted into the SSPSR and the address is compared against the SSPADD. It is also compared to the general call address and fixed in hardware. If the general call address matches, the SSPSR is transferred to the SSPBUF, the BF flag bit is set (eighth bit), and on the falling edge of the ninth bit (ACK bit), the SSPIF interrupt flag bit is set. When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the SSPBUF. The value can be used to determine if the address was device-specific or a general call address. In 10-bit mode, the SSPADD is required to be updated for the second half of the address to match and the UA bit is set (SSPSTAT<1>). If the general call address is sampled when the GCEN bit is set, while the slave is configured in 10-Bit Addressing mode, then the second half of the address is not necessary, the UA bit will not be set and the slave will begin receiving data after the Acknowledge (Figure 18-17).
FIGURE 18-17:
SLAVE MODE GENERAL CALL ADDRESS SEQUENCE (7 OR 10-BIT ADDRESSING MODE)
Address is compared to General Call Address after ACK, set interrupt R/W = 0 ACK D7 D6 Receiving Data D5 D4 D3 D2 D1 D0 ACK
SDA SCL S SSPIF BF (SSPSTAT<0>)
General Call Address
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
Cleared in software SSPBUF is read SSPOV (SSPCON1<6>) GCEN (SSPCON2<7>) `1' `0'
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18.4.6 MASTER MODE
Note: Master mode is enabled by setting and clearing the appropriate SSPM bits in SSPCON1 and by setting the SSPEN bit. In Master mode, the SCL and SDA lines are manipulated by the MSSP hardware. Master mode of operation is supported by interrupt generation on the detection of the Start and Stop conditions. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I 2C bus may be taken when the P bit is set, or the bus is Idle, with both the S and P bits clear. In Firmware Controlled Master mode, user code conducts all I 2C bus operations based on Start and Stop bit conditions. Once Master mode is enabled, the user has six options. 1. 2. 3. 4. 5. 6. Assert a Start condition on SDA and SCL. Assert a Repeated Start condition on SDA and SCL. Write to the SSPBUF register initiating transmission of data/address. Configure the I2C port to receive data. Generate an Acknowledge condition at the end of a received byte of data. Generate a Stop condition on SDA and SCL. The MSSP module, when configured in I2C Master mode, does not allow queueing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPBUF register to initiate transmission before the Start condition is complete. In this case, the SSPBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPBUF did not occur.
The following events will cause the MSSP Interrupt Flag bit, SSPIF, to be set (and MSSP interrupt, if enabled): * * * * * Start condition Stop condition Data transfer byte transmitted/received Acknowledge transmit Repeated Start
FIGURE 18-18:
MSSP BLOCK DIAGRAM (I2CTM MASTER MODE)
Internal Data Bus Read SSPBUF Write Baud Rate Generator Clock Arbitrate/WCOL Detect (hold off clock source) DS39979A-page 223 Shift Clock SSPSR Receive Enable MSb LSb SSPM<3:0> SSPADD<6:0>
SDA
SDA In
SCL
SCL In Bus Collision
Start bit Detect Stop bit Detect Write Collision Detect Clock Arbitration State Counter for End of XMIT/RCV
Set/Reset S, P, WCOL (SSPSTAT, SSPCON1) Set SSPIF, BCLIF Reset ACKSTAT, PEN (SSPCON2)
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Preliminary
Clock Cntl
Start bit, Stop bit, Acknowledge Generate
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18.4.6.1 I2C Master Mode Operation
A typical transmit sequence would go as follows: 1. The user generates a Start condition by setting the Start Enable bit, SEN (SSPCON2<0>). 2. SSPIF is set. The MSSP module will wait the required start time before any other operation takes place. 3. The user loads the SSPBUF with the slave address to transmit. 4. Address is shifted out the SDA pin until all 8 bits are transmitted. 5. The MSSP module shifts in the ACK bit from the slave device and writes its value into the SSPCON2 register (SSPCON2<6>). 6. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 7. The user loads the SSPBUF with eight bits of data. 8. Data is shifted out the SDA pin until all 8 bits are transmitted. 9. The MSSP module shifts in the ACK bit from the slave device and writes its value into the SSPCON2 register (SSPCON2<6>). 10. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 11. The user generates a Stop condition by setting the Stop Enable bit, PEN (SSPCON2<2>). 12. Interrupt is generated once the Stop condition is complete. The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the Read/Write (R/W) bit. In this case, the R/W bit will be logic `0'. Serial data is transmitted, 8 bits at a time. After each byte is transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the R/W bit. In this case, the R/W bit will be logic `1'. Thus, the first byte transmitted is a 7-bit slave address followed by a `1' to indicate the receive bit. Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an Acknowledge bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. The Baud Rate Generator, used for the SPI mode operation, is used to set the SCL clock frequency for either 100 kHz, 400 kHz or 1 MHz I2C operation. See Section 18.4.7 "Baud Rate" for more detail.
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18.4.7
2
BAUD RATE
In I C Master mode, the Baud Rate Generator (BRG) reload value is placed in the lower 7 bits of the SSPADD register (Figure 18-19). When a write occurs to SSPBUF, the Baud Rate Generator will automatically begin counting. The BRG counts down to 0 and stops until another reload has taken place. The BRG count is decremented twice per instruction cycle (TCY) on the Q2 and Q4 clocks. In I2C Master mode, the BRG is reloaded automatically. Once the given operation is complete (i.e., transmission of the last data bit is followed by ACK), the internal clock will automatically stop counting and the SCL pin will remain in its last state.
Table 18-3 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. Note: A BRG value of 00h is not supported.
18.4.7.1
Baud Rate Generation in Power-Managed Modes
When the device is operating in one of the power-managed modes, the clock source to the BRG may change frequency or even stop, depending on the mode and clock source selected. Switching to a Run or Idle mode from either the secondary clock or internal oscillator is likely to change the clock rate to the BRG. In Sleep mode, the BRG will not be clocked at all.
FIGURE 18-19:
BAUD RATE GENERATOR BLOCK DIAGRAM
SSPM<3:0> SSPADD<6:0>
SSPM<3:0> SCL
Reload Control CLKO
Reload
BRG Down Counter
FOSC/4
TABLE 18-3:
FCY
I2CTM CLOCK RATE w/BRG
FCY * 2 32 MHz 20 MHz 20 MHz 20 MHz 8 MHz 8 MHz 8 MHz 2 MHz 2 MHz I2C BRG Value 03h 18h 1Fh 63h 09h 0Ch 27h 02h 09h FSCL (2 Rollovers of BRG) 1 MHz(1) 400 kHz(2) 312.5 kHz 100 kHz 400 kHz(2) 308 kHz 100 kHz 333 kHz(2) 100 kHz
16 MHz 10 MHz 10 MHz 10 MHz 4 MHz 4 MHz 4 MHz 1 MHz 1 MHz Note 1: 2:
FOSC must be at least 16 MHz for bus operation at this speed. The I2CTM interface does not conform to the 400 kHz I2C specification (which applies to rates greater than 100 kHz) in all details, but may be used with care where higher rates are required by the application.
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18.4.7.2 Clock Arbitration
Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, deasserts the SCL pin (SCL allowed to float high). When the SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure 18-20).
FIGURE 18-20:
SDA
BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
DX SCL deasserted but slave holds SCL low (clock arbitration) DX - 1 SCL allowed to transition high
SCL BRG decrements on Q2 and Q4 cycles BRG Value 03h 02h 01h 00h (hold off) 03h 02h
SCL is sampled high, reload takes place and BRG starts its count BRG Reload
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18.4.8 I2C MASTER MODE START CONDITION TIMING
Note: To initiate a Start condition, the user sets the Start Enable bit, SEN (SSPCON2<0>). If the SDA and SCL pins are sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and starts its count. If SCL and SDA are both sampled high when the Baud Rate Generator times out (TBRG), the SDA pin is driven low. The action of the SDA being driven low while SCL is high is the Start condition and causes the S bit (SSPSTAT<3>) to be set. Following this, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and resumes its count. When the Baud Rate Generator times out (TBRG), the SEN bit (SSPCON2<0>) will automatically be cleared by hardware. The Baud Rate Generator is suspended, leaving the SDA line held low and the Start condition is complete. If, at the beginning of the Start condition, the SDA and SCL pins are already sampled low, or if during the Start condition, the SCL line is sampled low before the SDA line is driven low, a bus collision occurs. The Bus Collision Interrupt Flag, BCLIF, is set, the Start condition is aborted and the I2C module is reset into its Idle state.
18.4.8.1
WCOL Status Flag
If the user writes the SSPBUF when a Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn't occur). Note: Because queueing of events is not allowed, writing to the lower 5 bits of SSPCON2 is disabled until the Start condition is complete.
FIGURE 18-21:
FIRST START BIT TIMING
Write to SEN bit occurs here Set S bit (SSPSTAT<3>) SDA = 1, SCL = 1 TBRG SDA TBRG At completion of Start bit, hardware clears SEN bit and sets SSPIF bit Write to SSPBUF occurs here 1st bit TBRG SCL S TBRG 2nd bit
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18.4.9 I2C MASTER MODE REPEATED START CONDITION TIMING
Note 1: If RSEN is programmed while any other event is in progress, it will not take effect. 2: A bus collision during the Repeated Start condition occurs if: * SDA is sampled low when SCL goes from low-to-high. * SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data `1'. Immediately following the SSPIF bit getting set, the user may write the SSPBUF with the 7-bit address in 7-bit mode or the default first address in 10-bit mode. After the first eight bits are transmitted and an ACK is received, the user may then transmit an additional eight bits of address (10-bit mode) or eight bits of data (7-bit mode). A Repeated Start condition occurs when the RSEN bit (SSPCON2<1>) is programmed high and the I2C logic module is in the Idle state. When the RSEN bit is set, the SCL pin is asserted low. When the SCL pin is sampled low, the Baud Rate Generator is loaded with the contents of SSPADD<6:0> and begins counting. The SDA pin is released (brought high) for one Baud Rate Generator count (TBRG). When the Baud Rate Generator times out, if SDA is sampled high, the SCL pin will be deasserted (brought high). When SCL is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by assertion of the SDA pin (SDA = 0) for one TBRG while SCL is high. Following this, the RSEN bit (SSPCON2<1>) will be automatically cleared and the Baud Rate Generator will not be reloaded, leaving the SDA pin held low. As soon as a Start condition is detected on the SDA and SCL pins, the S bit (SSPSTAT<3>) will be set. The SSPIF bit will not be set until the Baud Rate Generator has timed out.
18.4.9.1
WCOL Status Flag
If the user writes the SSPBUF when a Repeated Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn't occur). Note: Because queueing of events is not allowed, writing of the lower 5 bits of SSPCON2 is disabled until the Repeated Start condition is complete.
FIGURE 18-22:
REPEATED START CONDITION WAVEFORM
S bit set by hardware SDA = 1, SCL = 1
TBRG TBRG TBRG
Write to SSPCON2 occurs here: SDA = 1, SCL (no change)
At completion of Start bit, hardware clears RSEN bit and sets SSPIF
SDA RSEN bit set by hardware on falling edge of ninth clock, end of XMIT SCL
TBRG
1st bit
Write to SSPBUF occurs here
TBRG
Sr = Repeated Start
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Preliminary
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18.4.10 I2C MASTER MODE TRANSMISSION
Transmission of a data byte, a 7-bit address or the other half of a 10-bit address, is accomplished by simply writing a value to the SSPBUF register. This action will set the Buffer Full bit, BF, and allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted (see data hold time specification Parameter 106). SCL is held low for one Baud Rate Generator rollover count (TBRG). Data should be valid before SCL is released high (see data setup time specification Parameter 107). When the SCL pin is released high, it is held that way for TBRG. The data on the SDA pin must remain stable for that duration and some hold time after the next falling edge of SCL. After the eighth bit is shifted out (the falling edge of the eighth clock), the BF flag is cleared and the master releases SDA. This allows the slave device being addressed to respond with an ACK bit during the ninth bit time if an address match occurred, or if data was received properly. The status of ACK is written into the ACKDT bit on the falling edge of the ninth clock. If the master receives an Acknowledge, the Acknowledge Status bit, ACKSTAT, is cleared; if not, the bit is set. After the ninth clock, the SSPIF bit is set and the master clock (Baud Rate Generator) is suspended until the next data byte is loaded into the SSPBUF, leaving SCL low and SDA unchanged (Figure 18-23). After the write to the SSPBUF, each bit of the address will be shifted out on the falling edge of SCL until all seven address bits and the R/W bit are completed. On the falling edge of the eighth clock, the master will deassert the SDA pin, allowing the slave to respond with an Acknowledge. On the falling edge of the ninth clock, the master will sample the SDA pin to see if the address was recognized by a slave. The status of the ACK bit is loaded into the ACKSTAT status bit (SSPCON2<6>). Following the falling edge of the ninth clock transmission of the address, the SSPIF is set, the BF flag is cleared and the Baud Rate Generator is turned off until another write to the SSPBUF takes place, holding SCL low and allowing SDA to float. The user should verify that the WCOL is clear after each write to SSPBUF to ensure the transfer is correct. In all cases, WCOL must be cleared in software.
18.4.10.3
ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit (SSPCON2<6>) is cleared when the slave has sent an Acknowledge (ACK = 0) and is set when the slave does not Acknowledge (ACK = 1). A slave sends an Acknowledge when it has recognized its address (including a general call), or when the slave has properly received its data.
18.4.11
I2C MASTER MODE RECEPTION
Master mode reception is enabled by programming the Receive Enable bit, RCEN (SSPCON2<3>). Note: The MSSP module must be in an Idle state before the RCEN bit is set or the RCEN bit will be disregarded.
The Baud Rate Generator begins counting and on each rollover, the state of the SCL pin changes (high-to-low/low-to-high) and data is shifted into the SSPSR. After the falling edge of the eighth clock, the receive enable flag is automatically cleared, the contents of the SSPSR are loaded into the SSPBUF, the BF flag bit is set, the SSPIF flag bit is set and the Baud Rate Generator is suspended from counting, holding SCL low. The MSSP is now in Idle state awaiting the next command. When the buffer is read by the CPU, the BF flag bit is automatically cleared. The user can then send an Acknowledge bit at the end of reception by setting the Acknowledge Sequence Enable bit, ACKEN (SSPCON2<4>).
18.4.11.1
BF Status Flag
In receive operation, the BF bit is set when an address or data byte is loaded into SSPBUF from SSPSR. It is cleared when the SSPBUF register is read.
18.4.11.2
SSPOV Status Flag
In receive operation, the SSPOV bit is set when 8 bits are received into the SSPSR and the BF flag bit is already set from a previous reception.
18.4.10.1
BF Status Flag
18.4.11.3
WCOL Status Flag
In Transmit mode, the BF bit (SSPSTAT<0>) is set when the CPU writes to SSPBUF and is cleared when all 8 bits are shifted out.
If the user writes the SSPBUF when a receive is already in progress (i.e., SSPSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write doesn't occur).
18.4.10.2
WCOL Status Flag
If the user writes to the SSPBUF when a transmit is already in progress (i.e., SSPSR is still shifting out a data byte), the WCOL is set and the contents of the buffer are unchanged (the write doesn't occur) after 2 TCY after the SSPBUF write. If SSPBUF is rewritten within 2 TCY, the WCOL bit is set and SSPBUF is updated. This may result in a corrupted transfer.
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Preliminary
DS39979A-page 229
FIGURE 18-23:
DS39979A-page 230
Write SSPCON2<0> (SEN = 1), Start condition begins From slave, clear ACKSTAT bit (SSPCON2<6>)
R/W = 0
ACKSTAT in SSPCON2 = 1
SEN = 0 Transmit Address to Slave SDA SSPBUF written with 7-bit address and R/W start transmit SCL S 1 2 3 4 5 6 7 8 9 1 SCL held low while CPU responds to SSPIF 2 3 4 5 6 7 8 A7 ACK = 0 D7 D6 D5 D4 D3 D2 D1 A6 A5 A4 A3 A2 A1 Transmitting Data or Second Half of 10-bit Address D0
ACK
9
P
PIC18F87J72 FAMILY
SSPIF Cleared in software Cleared in software service routine from MSSP interrupt Cleared in software
I2CTM MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESSING)
Preliminary
BF (SSPSTAT<0>) SSPBUF written SEN After Start condition, SEN cleared by hardware PEN R/W
SSPBUF is written in software
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FIGURE 18-24:
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Write to SSPCON2<4> to start Acknowledge sequence, SDA = ACKDT (SSPCON2<5>) = 0 Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) ACK from Slave R/W = 1 Receiving Data from Slave ACK Receiving Data from Slave RCEN cleared automatically RCEN = 1, start next receive RCEN cleared automatically ACK ACK from Master, SDA = ACKDT = 0 Set ACKEN, start Acknowledge sequence, SDA = ACKDT = 1 PEN bit = 1 written here
Write to SSPCON2<0> (SEN = 1), begin Start condition
SEN = 0 Write to SSPBUF occurs here, start XMIT
Transmit Address to Slave
SDA
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1
D0
ACK ACK is not sent Bus master terminates transfer
SCL
Set SSPIF interrupt at end of receive
S
1 1 2 3 4
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
5
6
7
8
9
Set SSPIF at end of receive
P
Set SSPIF interrupt at end of Acknowledge sequence
Data shifted in on falling edge of CLK
SSPIF
Cleared in software Cleared in software
Set SSPIF interrupt at end of Acknowledge sequence Cleared in software Cleared in software
I 2CTM MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESSING)
Preliminary
SDA = 0, SCL = 1 while CPU responds to SSPIF
Cleared in software
Set P bit (SSPSTAT<4>) and SSPIF
BF (SSPSTAT<0>)
Last bit is shifted into SSPSR and contents are unloaded into SSPBUF
SSPOV
SSPOV is set because SSPBUF is still full
ACKEN
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18.4.12 ACKNOWLEDGE SEQUENCE TIMING 18.4.13 STOP CONDITION TIMING
An Acknowledge sequence is enabled by setting the Acknowledge Sequence Enable bit, ACKEN (SSPCON2<4>). When this bit is set, the SCL pin is pulled low and the contents of the Acknowledge data bit are presented on the SDA pin. If the user wishes to generate an Acknowledge, then the ACKDT bit should be cleared. If not, the user should set the ACKDT bit before starting an Acknowledge sequence. The Baud Rate Generator then counts for one rollover period (TBRG) and the SCL pin is deasserted (pulled high). When the SCL pin is sampled high (clock arbitration), the Baud Rate Generator counts for TBRG. The SCL pin is then pulled low. Following this, the ACKEN bit is automatically cleared, the Baud Rate Generator is turned off and the MSSP module then goes into Idle mode (Figure 18-25). A Stop bit is asserted on the SDA pin at the end of a receive/transmit by setting the Stop Sequence Enable bit, PEN (SSPCON2<2>). At the end of a receive/transmit, the SCL line is held low after the falling edge of the ninth clock. When the PEN bit is set, the master will assert the SDA line low. When the SDA line is sampled low, the Baud Rate Generator is reloaded and counts down to 0. When the Baud Rate Generator times out, the SCL pin will be brought high and one TBRG (Baud Rate Generator rollover count) later, the SDA pin will be deasserted. When the SDA pin is sampled high while SCL is high, the P bit (SSPSTAT<4>) is set. A TBRG later, the PEN bit is cleared and the SSPIF bit is set (Figure 18-26).
18.4.13.1
WCOL Status Flag
18.4.12.1
WCOL Status Flag
If the user writes the SSPBUF when an Acknowledge sequence is in progress, then WCOL is set and the contents of the buffer are unchanged (the write doesn't occur).
If the user writes the SSPBUF when a Stop sequence is in progress, then the WCOL bit is set and the contents of the buffer are unchanged (the write doesn't occur).
FIGURE 18-25:
ACKNOWLEDGE SEQUENCE WAVEFORM
Acknowledge sequence starts here, write to SSPCON2, ACKEN = 1, ACKDT = 0 SDA D0 ACKEN automatically cleared TBRG ACK TBRG
SCL
8
9
SSPIF Cleared in software SSPIF set at the end of Acknowledge sequence
SSPIF set at the end of receive Note: TBRG = one Baud Rate Generator period.
Cleared in software
FIGURE 18-26:
STOP CONDITION RECEIVE OR TRANSMIT MODE
Write to SSPCON2, set PEN Falling edge of 9th clock SCL = 1 for TBRG, followed by SDA = 1 for TBRG after SDA sampled high. P bit (SSPSTAT<4>) is set. PEN bit (SSPCON2<2>) is cleared by hardware and the SSPIF bit is set
SCL
TBRG
SDA
ACK P TBRG TBRG TBRG SCL brought high after TBRG SDA asserted low before rising edge of clock to setup Stop condition
Note: TBRG = one Baud Rate Generator period.
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18.4.14 SLEEP OPERATION
2
18.4.17
While in Sleep mode, the I C module can receive addresses or data and when an address match or complete byte transfer occurs, wake the processor from Sleep (if the MSSP interrupt is enabled).
MULTI -MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION
18.4.15
EFFECTS OF A RESET
A Reset disables the MSSP module and terminates the current transfer.
18.4.16
MULTI-MASTER MODE
In Multi-Master mode, the interrupt generation on the detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I 2C bus may be taken when the P bit (SSPSTAT<4>) is set, or the bus is Idle, with both the S and P bits clear. When the bus is busy, enabling the MSSP interrupt will generate the interrupt when the Stop condition occurs. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is the expected output level. This check is performed in hardware with the result placed in the BCLIF bit. The states where arbitration can be lost are: * * * * * Address Transfer Data Transfer A Start Condition A Repeated Start Condition An Acknowledge Condition
Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a `1' on SDA by letting SDA float high, and another master asserts a `0'. When the SCL pin floats high, data should be stable. If the expected data on SDA is a `1' and the data sampled on the SDA pin = 0, then a bus collision has taken place. The master will set the Bus Collision Interrupt Flag, BCLIF, and reset the I2C port to its Idle state (Figure 18-27). If a transmit was in progress when the bus collision occurred, the transmission is halted, the BF flag is cleared, the SDA and SCL lines are deasserted and the SSPBUF can be written to. When the user services the bus collision Interrupt Service Routine, and if the I2C bus is free, the user can resume communication by asserting a Start condition. If a Start, Repeated Start, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted, and the respective control bits in the SSPCON2 register, are cleared. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins. If a Stop condition occurs, the SSPIF bit will be set. A write to the SSPBUF will start the transmission of data at the first data bit, regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPSTAT register, or the bus is Idle and the S and P bits are cleared.
FIGURE 18-27:
BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
Data changes while SCL = 0 SDA line pulled low by another source SDA released by master Sample SDA. While SCL is high, data doesn't match what is driven by the master. Bus collision has occurred.
SDA
SCL
Set bus collision interrupt (BCLIF)
BCLIF
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18.4.17.1 Bus Collision During a Start Condition
During a Start condition, a bus collision occurs if: a) b) SDA or SCL are sampled low at the beginning of the Start condition (Figure 18-28). SCL is sampled low before SDA is asserted low (Figure 18-29). If the SDA pin is sampled low during this count, the BRG is reset and the SDA line is asserted early (Figure 18-30). If, however, a `1' is sampled on the SDA pin, the SDA pin is asserted low at the end of the BRG count. The Baud Rate Generator is then reloaded and counts down to 0. If the SCL pin is sampled as `0' during this time, a bus collision does not occur. At the end of the BRG count, the SCL pin is asserted low. Note: The reason that bus collision is not a factor during a Start condition is that no two bus masters can assert a Start condition at the exact same time. Therefore, one master will always assert SDA before the other. This condition does not cause a bus collision because the two masters must be allowed to arbitrate the first address following the Start condition. If the address is the same, arbitration must be allowed to continue into the data portion, Repeated Start or Stop conditions.
During a Start condition, both the SDA and the SCL pins are monitored. If the SDA pin is already low, or the SCL pin is already low, then all of the following occur: * the Start condition is aborted; * the BCLIF flag is set; and * the MSSP module is reset to its Idle state (Figure 18-28). The Start condition begins with the SDA and SCL pins deasserted. When the SDA pin is sampled high, the Baud Rate Generator is loaded from SSPADD<6:0> and counts down to 0. If the SCL pin is sampled low while SDA is high, a bus collision occurs, because it is assumed that another master is attempting to drive a data `1' during the Start condition.
FIGURE 18-28:
BUS COLLISION DURING START CONDITION (SDA ONLY)
SDA goes low before the SEN bit is set. Set BCLIF, S bit and SSPIF set because SDA = 0, SCL = 1.
SDA
SCL Set SEN, enable Start condition if SDA = 1, SCL = 1 SEN SDA sampled low before Start condition. Set BCLIF. S bit and SSPIF set because SDA = 0, SCL = 1. SSPIF and BCLIF are cleared in software S SEN cleared automatically because of bus collision. MSSP module reset into Idle state.
BCLIF
SSPIF SSPIF and BCLIF are cleared in software
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FIGURE 18-29: BUS COLLISION DURING START CONDITION (SCL = 0)
SDA = 0, SCL = 1
TBRG TBRG
SDA Set SEN, enable Start sequence if SDA = 1, SCL = 1 SCL = 0 before SDA = 0, bus collision occurs. Set BCLIF. SCL = 0 before BRG time-out, bus collision occurs. Set BCLIF. BCLIF Interrupt cleared in software S SSPIF `0' `0' `0' `0'
SCL
SEN
FIGURE 18-30:
BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDA = 0, SCL = 1 Set S Less than TBRG
TBRG
Set SSPIF
SDA
SDA pulled low by other master. Reset BRG and assert SDA.
SCL
S
SCL pulled low after BRG time-out Set SEN, enable Start sequence if SDA = 1, SCL = 1
SEN
BCLIF
`0'
S
SSPIF SDA = 0, SCL = 1, set SSPIF Interrupts cleared in software
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18.4.17.2 Bus Collision During a Repeated Start Condition
During a Repeated Start condition, a bus collision occurs if: a) b) A low level is sampled on SDA when SCL goes from low level to high level. SCL goes low before SDA is asserted low, indicating that another master is attempting to transmit a data `1'. If SDA is low, a bus collision has occurred (i.e., another master is attempting to transmit a data `0', see Figure 18-31). If SDA is sampled high, the BRG is reloaded and begins counting. If SDA goes from high-to-low before the BRG times out, no bus collision occurs because no two masters can assert SDA at exactly the same time. If SCL goes from high-to-low before the BRG times out and SDA has not already been asserted, a bus collision occurs. In this case, another master is attempting to transmit a data `1' during the Repeated Start condition (see Figure 18-32). If, at the end of the BRG time-out, both SCL and SDA are still high, the SDA pin is driven low and the BRG is reloaded and begins counting. At the end of the count, regardless of the status of the SCL pin, the SCL pin is driven low and the Repeated Start condition is complete.
When the user deasserts SDA and the pin is allowed to float high, the BRG is loaded with SSPADD<6:0> and counts down to `0'. The SCL pin is then deasserted and when sampled high, the SDA pin is sampled.
FIGURE 18-31:
SDA
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
SCL Sample SDA when SCL goes high. If SDA = 0, set BCLIF and release SDA and SCL. RSEN
BCLIF Cleared in software S SSPIF `0' `0'
FIGURE 18-32:
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
TBRG TBRG
SDA SCL SCL goes low before SDA, set BCLIF. Release SDA and SCL. Interrupt cleared in software RSEN S SSPIF `0'
BCLIF
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18.4.17.3 Bus Collision During a Stop Condition
Bus collision occurs during a Stop condition if: a) After the SDA pin has been deasserted and allowed to float high, SDA is sampled low after the BRG has timed out. After the SCL pin is deasserted, SCL is sampled low before SDA goes high. The Stop condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is allowed to float. When the pin is sampled high (clock arbitration), the Baud Rate Generator is loaded with SSPADD<6:0> and counts down to 0. After the BRG times out, SDA is sampled. If SDA is sampled low, a bus collision has occurred. This is due to another master attempting to drive a data `0' (Figure 18-33). If the SCL pin is sampled low before SDA is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data `0' (Figure 18-34).
b)
FIGURE 18-33:
BUS COLLISION DURING A STOP CONDITION (CASE 1)
TBRG TBRG TBRG SDA sampled low after TBRG, set BCLIF
SDA SDA asserted low SCL PEN BCLIF P SSPIF
`0' `0'
FIGURE 18-34:
BUS COLLISION DURING A STOP CONDITION (CASE 2)
TBRG TBRG TBRG
SDA Assert SDA SCL PEN BCLIF P SSPIF `0' `0' SCL goes low before SDA goes high, set BCLIF
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TABLE 18-4:
Name INTCON PIR1 PIE1 IPR1 PIR2 PIE2 IPR2 TRISC SSPBUF SSPADD SSPCON1 SSPCON2 SSPSTAT
REGISTERS ASSOCIATED WITH I2CTM OPERATION
Bit 7 Bit 6 Bit 5 TMR0IE RC1IF RC1IE RC1IP -- -- -- TRISC5 (I2CTM Bit 4 INT0IE TX1IF TX1IE TX1IP -- -- -- TRISC4 Bit 3 RBIE SSPIF SSPIE SSPIP BCLIF BCLIE BCLIP TRISC3 Bit 2 TMR0IF -- -- -- LVDIF LVDIE LVDIP TRISC2 Bit 1 INT0IF TMR2IF TMR2IE TMR2IP TMR3IF TMR3IE TMR3IP TRISC1 Bit 0 RBIF TMR1IF TMR1IE TMR1IP -- -- -- TRISC0 Reset Values on Page 49 52 52 52 52 52 52 52 50 50 SSPM2 PEN R/W SSPM1 RSEN UA I2CTM SSPM0 SEN SEN BF mode. 50 50 50
GIE/GIEH PEIE/GIEL -- -- -- OSCFIF OSCFIE OSCFIP TRISC7 ADIF ADIE ADIP CMIF CMIE CMIP TRISC6
MSSP Receive Buffer/Transmit Register MSSP Address Register Slave mode), MSSP Baud Rate Reload Register (I2C Master mode) WCOL GCEN GCEN SMP SSPOV ACKSTAT CKE SSPEN ACKDT D/A CKP ACKEN P SSPM3 RCEN S
ACKSTAT ADMSK5(1) ADMSK4(1) ADMSK3(1) ADMSK2(1) ADMSK1(1)
Legend: -- = unimplemented, read as `0'. Shaded cells are not used by the MSSP module in Note 1: Alternate bit definitions for use in I2C Slave mode operations only.
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19.0 ENHANCED UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER TRANSMITTER (EUSART)
The pins of the EUSART are multiplexed with the functions of PORTC (RC6/TX1/CK1/SEG27 and RC7/RX1/DT1/SEG28). In order to configure these pins as an EUSART: * SPEN bit (RCSTA1<7>) must be set (= 1) * TRISC<7> bit must be set (= 1) * TRISC<6> bit must be set (= 1) Note: The EUSART control will automatically reconfigure the pin from input to output as needed.
PIC18F87J72 family devices have three serial I/O modules: the MSSP module, discussed in the previous chapter and two Universal Synchronous Asynchronous Receiver Transmitter (USART) modules. (Generically, the USART is also known as a Serial Communications Interface or SCI.) The USART can be configured as a full-duplex asynchronous system that can communicate with peripheral devices, such as CRT terminals and personal computers. It can also be configured as a half-duplex synchronous system that can communicate with peripheral devices, such as A/D or D/A integrated circuits, serial EEPROMs, etc. There are two distinct implementations of the USART module in these devices: the Enhanced USART (EUSART) discussed here and the Addressable USART discussed in the next chapter. For this device family, USART1 always refers to the EUSART, while USART2 is always the AUSART. The EUSART and AUSART modules implement the same core features for serial communications; their basic operation is essentially the same. The EUSART module provides additional features, including Automatic Baud Rate Detection and calibration, automatic wake-up on Sync Break reception and 12-bit Break character transmit. These features make it ideally suited for use in Local Interconnect Network bus (LIN/J2602 bus) systems. The EUSART can be configured in the following modes: * Asynchronous (full-duplex) with: - Auto-wake-up on character reception - Auto-baud calibration - 12-bit Break character transmission * Synchronous - Master (half-duplex) with selectable clock polarity * Synchronous - Slave (half-duplex) with selectable clock polarity
The driver for the TX1 output pin can also be optionally configured as an open-drain output. This feature allows the voltage level on the pin to be pulled to a higher level through an external pull-up resistor, and allows the output to communicate with external circuits without the need for additional level shifters. The open-drain output option is controlled by the U1OD bit (LATG<6>). Setting this bit configures the pin for open-drain operation.
19.1
Control Registers
The operation of the Enhanced USART module is controlled through three registers: * Transmit Status and Control Register 1 (TXSTA1) * Receive Status and Control Register 1 (RCSTA1) * Baud Rate Control Register 1 (BAUDCON1) The registers are described Register 19-2 and Register 19-3. in Register 19-1,
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REGISTER 19-1:
R/W-0 CSRC bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
TXSTA1: EUSART TRANSMIT STATUS AND CONTROL REGISTER
R/W-0 TXEN(1) R/W-0 SYNC R/W-0 SENDB R/W-0 BRGH R-1 TRMT R/W-0 TX9D bit 0 TX9
R/W-0
CSRC: Clock Source Select bit Asynchronous mode: Don't care. Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) TX9: 9-Bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission TXEN: Transmit Enable bit(1) 1 = Transmit is enabled 0 = Transmit is disabled SYNC: EUSART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode SENDB: Send Break Character bit Asynchronous mode: 1 = Send Sync Break on next transmission (cleared by hardware upon completion) 0 = Sync Break transmission completed Synchronous mode: Don't care. BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode. TRMT: Transmit Shift Register Status bit 1 = TSR is empty 0 = TSR is full TX9D: 9th bit of Transmit Data Can be address/data bit or a parity bit. SREN/CREN overrides TXEN in Sync mode.
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
Note 1:
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REGISTER 19-2:
R/W-0 SPEN bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
RCSTA1: EUSART RECEIVE STATUS AND CONTROL REGISTER
R/W-0 SREN R/W-0 CREN R/W-0 ADDEN R-0 FERR R-0 OERR R-x RX9D bit 0 RX9
R/W-0
SPEN: Serial Port Enable bit 1 = Serial port is enabled 0 = Serial port is disabled (held in Reset) RX9: 9-Bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception SREN: Single Receive Enable bit Asynchronous mode: Don't care. Synchronous mode - Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode - Slave: Don't care. CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables receiver 0 = Disables receiver Synchronous mode: 1 = Enables continuous receive until enable bit, CREN, is cleared (CREN overrides SREN) 0 = Disables continuous receive ADDEN: Address Detect Enable bit Asynchronous mode 9-bit (RX9 = 1): 1 = Enables address detection, enables interrupt and loads the receive buffer when RSR<8> is set 0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit Asynchronous mode 9-bit (RX9 = 0): Don't care. FERR: Framing Error bit 1 = Framing error (can be cleared by reading the RCREG1 register and receiving the next valid byte) 0 = No framing error OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit, CREN) 0 = No overrun error RX9D: 9th bit of Received Data This can be address/data bit or a parity bit and must be calculated by user firmware.
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
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REGISTER 19-3:
R/W-0 ABDOVF bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
BAUDCON1: BAUD RATE CONTROL REGISTER 1
R-1 R/W - 0 RXDTP R/W-0 TXCKP R/W-0 BRG16 U-0 -- R/W-0 WUE R/W-0 ABDEN bit 0
RCMT
ABDOVF: Auto-Baud Acquisition Rollover Status bit 1 = A BRG rollover has occurred during Auto-Baud Rate Detect mode (must be cleared in software) 0 = No BRG rollover has occurred RCMT: Receive Operation Idle Status bit 1 = Receive operation is Idle 0 = Receive operation is active RXDTP: Received Data Polarity Select bit (Asynchronous mode only) 1 = RXx data is inverted 0 = RXx data is not inverted TXCKP: Clock and Data Polarity Select bit Asynchronous mode: 1 = Transmit idle state is low 0 = Transmit idle state is high Synchronous mode: 1 = CKx clock idle state is high 0 = CKx clock idle state is low BRG16: 16-Bit Baud Rate Register Enable bit 1 = 16-bit Baud Rate Generator - SPBRGH1 and SPBRG1 0 = 8-bit Baud Rate Generator - SPBRG1 only (Compatible mode), SPBRGH1 value is ignored Unimplemented: Read as `0' WUE: Wake-up Enable bit Asynchronous mode: 1 = EUSART will continue to sample the RX1 pin - interrupt generated on falling edge; bit cleared in hardware on following rising edge 0 = RX1 pin is not monitored or a rising edge detected Synchronous mode: Unused in this mode. ABDEN: Auto-Baud Detect Enable bit Asynchronous mode: 1 = Enable baud rate measurement on the next character. Requires reception of a Sync field (55h); cleared in hardware upon completion. 0 = Baud rate measurement is disabled or completed Synchronous mode: Unused in this mode.
bit 6
bit 5
bit 4
bit 3
bit 2 bit 1
bit 0
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19.2 EUSART Baud Rate Generator (BRG)
The BRG is a dedicated, 8-bit or 16-bit generator that supports both the Asynchronous and Synchronous modes of the EUSART. By default, the BRG operates in 8-bit mode; setting the BRG16 bit (BAUDCON1<3>) selects 16-bit mode. The SPBRGH1:SPBRG1 register pair controls the period of a free-running timer. In Asynchronous mode, BRGH (TXSTA1<2>) and BRG16 (BAUDCON1<3>) bits also control the baud rate. In Synchronous mode, BRGH is ignored. Table 19-1 shows the formula for computation of the baud rate for different EUSART modes that only apply in Master mode (internally generated clock). Given the desired baud rate and FOSC, the nearest integer value for the SPBRGH1:SPBRG1 registers can be calculated using the formulas in Table 19-1. From this, the error in baud rate can be determined. An example calculation is shown in Example 19-1. Typical baud rates and error values for the various Asynchronous modes are shown in Table 19-2. It may be advantageous to use the high baud rate (BRGH = 1) or the 16-bit BRG to reduce the baud rate error, or achieve a slow baud rate for a fast oscillator frequency. Writing a new value to the SPBRGH1:SPBRG1 registers causes the BRG timer to be reset (or cleared). This ensures the BRG does not wait for a timer overflow before outputting the new baud rate. SPBRGH1:SPBRG1 values of 0000h and 0001h are not supported in Synchronous mode.
19.2.1
OPERATION IN POWER-MANAGED MODES
The device clock is used to generate the desired baud rate. When one of the power-managed modes is entered, the new clock source may be operating at a different frequency. This may require an adjustment to the value in the SPBRG1 register pair.
19.2.2
SAMPLING
The data on the RX1 pin is sampled three times by a majority detect circuit to determine if a high or a low level is present at the RX1 pin.
TABLE 19-1:
BAUD RATE FORMULAS
BRG/EUSART Mode Baud Rate Formula FOSC/[64 (n + 1)] FOSC/[16 (n + 1)] FOSC/[4 (n + 1)]
Configuration Bits SYNC BRG16 BRGH
0 0 0 8-bit/Asynchronous 0 0 1 8-bit/Asynchronous 0 1 0 16-bit/Asynchronous 0 1 1 16-bit/Asynchronous 1 0 x 8-bit/Synchronous 1 1 x 16-bit/Synchronous Legend: x = Don't care, n = Value of SPBRGH1:SPBRG1 register pair
EXAMPLE 19-1:
CALCULATING BAUD RATE ERROR
For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, 8-bit BRG: Desired Baud Rate = FOSC/(64 ([SPBRGH1:SPBRG1] + 1)) Solving for SPBRGH1:SPBRG1: X = ((FOSC/Desired Baud Rate)/64) - 1 = ((16000000/9600)/64) - 1 = [25.042] = 25 Calculated Baud Rate=16000000/(64 (25 + 1)) = 9615 Error = (Calculated Baud Rate - Desired Baud Rate)/Desired Baud Rate = (9615 - 9600)/9600 = 0.16%
TABLE 19-2:
Name
REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 TX9D RX9D ABDEN Reset Values on Page 51 51 53 53 51
CSRC TX9 TXEN SYNC SENDB BRGH TRMT TXSTA1 RX9 SREN CREN ADDEN FERR OERR RCSTA1 SPEN BAUDCON1 ABDOVF RCMT RXDTP TXCKP BRG16 -- WUE SPBRGH1 EUSART Baud Rate Generator Register High Byte SPBRG1 EUSART Baud Rate Generator Register Low Byte Legend: -- = unimplemented, read as `0'. Shaded cells are not used by the BRG.
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TABLE 19-3:
BAUD RATE (K)
BAUD RATES FOR ASYNCHRONOUS MODES
SYNC = 0, BRGH = 0, BRG16 = 0 FOSC = 20.000 MHz Actual Rate (K) -- 1.221 2.404 9.766 19.531 62.500 104.167 % Error -- 1.73 0.16 1.73 1.73 8.51 -9.58 SPBRG value
(decimal)
FOSC = 40.000 MHz Actual Rate (K) -- -- 2.441 9.615 19.531 56.818 125.000 % Error -- -- 1.73 0.16 1.73 -1.36 8.51 SPBRG value
(decimal)
FOSC = 10.000 MHz Actual Rate (K) -- 1.202 2.404 9.766 19.531 52.083 78.125 % Error -- 0.16 0.16 1.73 1.73 -9.58 -32.18 SPBRG value
(decimal)
FOSC = 8.000 MHz Actual Rate (K) -- 1.201 2.403 9.615 -- -- -- % Error -- -0.16 -0.16 -0.16 -- -- -- SPBRG value
(decimal)
0.3 1.2 2.4 9.6 19.2 57.6 115.2
-- -- 255 64 31 10 4
-- 255 129 31 15 4 2
-- 129 64 15 7 2 1
-- 103 51 12 -- -- --
SYNC = 0, BRGH = 0, BRG16 = 0 BAUD RATE (K) FOSC = 4.000 MHz Actual Rate (K) 0.300 1.202 2.404 8.929 20.833 62.500 62.500 % Error 0.16 0.16 0.16 -6.99 8.51 8.51 -45.75 SPBRG value
(decimal)
FOSC = 2.000 MHz Actual Rate (K) 0.300 1.201 2.403 -- -- -- -- % Error -0.16 -0.16 -0.16 -- -- -- -- SPBRG value
(decimal)
FOSC = 1.000 MHz Actual Rate (K) 0.300 1.201 -- -- -- -- -- % Error -0.16 -0.16 -- -- -- -- -- SPBRG value
(decimal)
0.3 1.2 2.4 9.6 19.2 57.6 115.2
207 51 25 6 2 0 0
103 25 12 -- -- -- --
51 12 -- -- -- -- --
SYNC = 0, BRGH = 1, BRG16 = 0 BAUD RATE (K) FOSC = 40.000 MHz Actual Rate (K) -- -- -- 9.766 19.231 58.140 113.636 % Error -- -- -- 1.73 0.16 0.94 -1.36 SPBRG value
(decimal)
FOSC = 20.000 MHz Actual Rate (K) -- -- -- 9.615 19.231 56.818 113.636 % Error -- -- -- 0.16 0.16 -1.36 -1.36 SPBRG value
(decimal)
FOSC = 10.000 MHz Actual Rate (K) -- -- 2.441 9.615 19.531 56.818 125.000 % Error -- -- 1.73 0.16 1.73 -1.36 8.51 SPBRG value
(decimal)
FOSC = 8.000 MHz Actual Rate (K) -- -- 2.403 9.615 19.230 55.555 -- % Error -- -- -0.16 -0.16 -0.16 3.55 -- SPBRG value
(decimal)
0.3 1.2 2.4 9.6 19.2 57.6 115.2
-- -- -- 255 129 42 21
-- -- -- 129 64 21 10
-- -- 255 64 31 10 4
-- -- 207 51 25 8 --
SYNC = 0, BRGH = 1, BRG16 = 0 BAUD RATE (K) FOSC = 4.000 MHz Actual Rate (K) -- 1.202 2.404 9.615 19.231 62.500 125.000 % Error -- 0.16 0.16 0.16 0.16 8.51 8.51 SPBRG value
(decimal)
FOSC = 2.000 MHz Actual Rate (K) -- 1.201 2.403 9.615 -- -- -- % Error -- -0.16 -0.16 -0.16 -- -- -- SPBRG value
(decimal)
FOSC = 1.000 MHz Actual Rate (K) 0.300 1.201 2.403 -- -- -- -- % Error -0.16 -0.16 -0.16 -- -- -- -- SPBRG value
(decimal)
0.3 1.2 2.4 9.6 19.2 57.6 115.2
-- 207 103 25 12 3 1
-- 103 51 12 -- -- --
207 51 25 -- -- -- --
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TABLE 19-3:
BAUD RATE (K)
BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
SYNC = 0, BRGH = 0, BRG16 = 1 FOSC = 20.000 MHz Actual Rate (K) 0.300 1.200 2.399 9.615 19.231 56.818 113.636 % Error 0.02 -0.03 -0.03 0.16 0.16 -1.36 -1.36 SPBRG value
(decimal)
FOSC = 40.000 MHz Actual Rate (K) 0.300 1.200 2.402 9.615 19.231 58.140 113.636 % Error 0.00 0.02 0.06 0.16 0.16 0.94 -1.36 SPBRG value
(decimal)
FOSC = 10.000 MHz Actual Rate (K) 0.300 1.200 2.404 9.615 19.531 56.818 125.000 % Error 0.02 -0.03 0.16 0.16 1.73 -1.36 8.51 SPBRG value
(decimal)
FOSC = 8.000 MHz Actual Rate (K) 0.300 1.201 2.403 9.615 19.230 55.555 -- % Error -0.04 -0.16 -0.16 -0.16 -0.16 3.55 -- SPBRG value
(decimal)
0.3 1.2 2.4 9.6 19.2 57.6 115.2
8332 2082 1040 259 129 42 21
4165 1041 520 129 64 21 10
2082 520 259 64 31 10 4
1665 415 207 51 25 8 --
SYNC = 0, BRGH = 0, BRG16 = 1 BAUD RATE (K) FOSC = 4.000 MHz Actual Rate (K) 0.300 1.202 2.404 9.615 19.231 62.500 125.000 % Error 0.04 0.16 0.16 0.16 0.16 8.51 8.51 SPBRG value
(decimal)
FOSC = 2.000 MHz Actual Rate (K) 0.300 1.201 2.403 9.615 -- -- -- % Error -0.16 -0.16 -0.16 -0.16 -- -- -- SPBRG value
(decimal)
FOSC = 1.000 MHz Actual Rate (K) 0.300 1.201 2.403 -- -- -- -- % Error -0.16 -0.16 -0.16 -- -- -- -- SPBRG value
(decimal)
0.3 1.2 2.4 9.6 19.2 57.6 115.2
832 207 103 25 12 3 1
415 103 51 12 -- -- --
207 51 25 -- -- -- --
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 BAUD RATE (K) FOSC = 40.000 MHz Actual Rate (K) 0.300 1.200 2.400 9.606 19.193 57.803 114.943 % Error 0.00 0.00 0.02 0.06 -0.03 0.35 -0.22 SPBRG value
(decimal)
FOSC = 20.000 MHz Actual Rate (K) 0.300 1.200 2.400 9.596 19.231 57.471 116.279 % Error 0.00 0.02 0.02 -0.03 0.16 -0.22 0.94 SPBRG value
(decimal)
FOSC = 10.000 MHz Actual Rate (K) 0.300 1.200 2.402 9.615 19.231 58.140 113.636 % Error 0.00 0.02 0.06 0.16 0.16 0.94 -1.36 SPBRG value
(decimal)
FOSC = 8.000 MHz Actual Rate (K) 0.300 1.200 2.400 9.615 19.230 57.142 117.647 % Error -0.01 -0.04 -0.04 -0.16 -0.16 0.79 -2.12 SPBRG value
(decimal)
0.3 1.2 2.4 9.6 19.2 57.6 115.2
33332 8332 4165 1040 520 172 86
16665 4165 2082 520 259 86 42
8332 2082 1040 259 129 42 21
6665 1665 832 207 103 34 16
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 BAUD RATE (K) FOSC = 4.000 MHz Actual Rate (K) 0.300 1.200 2.404 9.615 19.231 58.824 111.111 % Error 0.01 0.04 0.16 0.16 0.16 2.12 -3.55 SPBRG value
(decimal)
FOSC = 2.000 MHz Actual Rate (K) 0.300 1.201 2.403 9.615 19.230 55.555 -- % Error -0.04 -0.16 -0.16 -0.16 -0.16 3.55 -- SPBRG value
(decimal)
FOSC = 1.000 MHz Actual Rate (K) 0.300 1.201 2.403 9.615 19.230 -- -- % Error -0.04 -0.16 -0.16 -0.16 -0.16 -- -- SPBRG value
(decimal)
0.3 1.2 2.4 9.6 19.2 57.6 115.2
3332 832 415 103 51 16 8
1665 415 207 51 25 8 --
832 207 103 25 12 -- --
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19.2.3 AUTO-BAUD RATE DETECT
The Enhanced USART module supports the automatic detection and calibration of baud rate. This feature is active only in Asynchronous mode and while the WUE bit is clear. The automatic baud rate measurement sequence (Figure 19-1) begins whenever a Start bit is received and the ABDEN bit is set. The calculation is self-averaging. In the Auto-Baud Rate Detect (ABD) mode, the clock to the BRG is reversed. Rather than the BRG clocking the incoming RX1 signal, the RX1 signal is timing the BRG. In ABD mode, the internal Baud Rate Generator is used as a counter to time the bit period of the incoming serial byte stream. Once the ABDEN bit is set, the state machine will clear the BRG and look for a Start bit. The Auto-Baud Rate Detect must receive a byte with the value, 55h (ASCII "U", which is also the LIN/J2602 bus Sync character), in order to calculate the proper bit rate. The measurement is taken over both a low and a high bit time in order to minimize any effects caused by asymmetry of the incoming signal. After a Start bit, the SPBRG1 begins counting up, using the preselected clock source on the first rising edge of RX1. After eight bits on the RX1 pin or the fifth rising edge, an accumulated value totalling the proper BRG period is left in the SPBRGH1:SPBRG1 register pair. Once the 5th edge is seen (this should correspond to the Stop bit), the ABDEN bit is automatically cleared. If a rollover of the BRG occurs (an overflow from FFFFh to 0000h), the event is trapped by the ABDOVF status bit (BAUDCON1<7>). It is set in hardware by BRG rollovers and can be set or cleared by the user in software. ABD mode remains active after rollover events and the ABDEN bit remains set (Figure 19-2). While calibrating the baud rate period, the BRG registers are clocked at 1/8th the preconfigured clock rate. Note that the BRG clock is configured by the BRG16 and BRGH bits. The BRG16 bit (BAUDCON1<3>) must be set to use the SPBRG1 and SPBRGH1 registers as a 16-bit counter. This allows the user to verify that no carry occurred for 8-bit modes by checking for 00h in the SPBRGH1 register. Refer to Table 19-4 for counter clock rates to the BRG. While the ABD sequence takes place, the EUSART state machine is held in Idle. The RC1IF interrupt is set once the fifth rising edge on RX1 is detected. The value in the RCREG1 needs to be read to clear the RC1IF interrupt. The contents of RCREG1 should be discarded. Note 1: If the WUE bit is set with the ABDEN bit, Auto-Baud Rate Detection will occur on the byte following the Break character. 2: It is up to the user to determine that the incoming character baud rate is within the range of the selected BRG clock source. Some combinations of oscillator frequency and EUSART baud rates are not possible due to bit error rates. Overall system timing and communication baud rates must be taken into consideration when using the Auto-Baud Rate Detection feature.
TABLE 19-4:
BRG16 0 0 1 1 Note: BRGH 0 1 0 1
BRG COUNTER CLOCK RATES
BRG Counter Clock FOSC/512 FOSC/128 FOSC/128 FOSC/32
During the ABD sequence, SPBRG1 and SPBRGH1 are both used as a 16-bit counter, independent of the BRG16 setting.
19.2.3.1
ABD and EUSART Transmission
Since the BRG clock is reversed during ABD acquisition, the EUSART transmitter cannot be used during ABD. This means that whenever the ABDEN bit is set, TXREG1 cannot be written to. Users should also ensure that ABDEN does not become set during a transmit sequence. Failing to do this may result in unpredictable EUSART operation.
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FIGURE 19-1:
BRG Value RX1 Pin
AUTOMATIC BAUD RATE CALCULATION
XXXXh 0000h Start Edge #1 bit 1 bit 0 Edge #2 bit 3 bit 2 Edge #3 bit 5 bit 4 Edge #4 bit 7 bit 6 001Ch Edge #5 Stop bit
BRG Clock Set by User ABDEN bit RC1IF bit (Interrupt) Read RCREG1 SPBRG1 SPBRGH1 XXXXh XXXXh 1Ch 00h Auto-Cleared
Note: The ABD sequence requires the EUSART module to be configured in Asynchronous mode and WUE = 0.
FIGURE 19-2:
BRG Clock ABDEN bit RX1 Pin ABDOVF bit
BRG OVERFLOW SEQUENCE
Start
bit 0
FFFFh BRG Value XXXXh 0000h 0000h
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19.3 EUSART Asynchronous Mode
The Asynchronous mode of operation is selected by clearing the SYNC bit (TXSTA1<4>). In this mode, the EUSART uses standard Non-Return-to-Zero (NRZ) format (one Start bit, eight or nine data bits and one Stop bit). The most common data format is 8 bits. An on-chip dedicated 8-bit/16-bit Baud Rate Generator can be used to derive standard baud rate frequencies from the oscillator. The EUSART transmits and receives the LSb first. The EUSART's transmitter and receiver are functionally independent, but use the same data format and baud rate. The Baud Rate Generator produces a clock, either x16 or x64 of the bit shift rate, depending on the BRGH and BRG16 bits (TXSTA1<2> and BAUDCON1<3>). Parity is not supported by the hardware but can be implemented in software and stored as the 9th data bit. When operating in Asynchronous mode, the EUSART module consists of the following important elements: * * * * * * * Baud Rate Generator Sampling Circuit Asynchronous Transmitter Asynchronous Receiver Auto-Wake-up on Sync Break Character 12-Bit Break Character Transmit Auto-Baud Rate Detection Once the TXREG1 register transfers the data to the TSR register (occurs in one TCY), the TXREG1 register is empty and the TX1IF flag bit (PIR1<4>) is set. This interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TX1IE (PIE1<4>). TX1IF will be set regardless of the state of TX1IE; it cannot be cleared in software. TX1IF is also not cleared immediately upon loading TXREG1, but becomes valid in the second instruction cycle following the load instruction. Polling TX1IF immediately following a load of TXREG1 will return invalid results. While TX1IF indicates the status of the TXREG1 register, another bit, TRMT (TXSTA1<1>), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR register is empty. No interrupt logic is tied to this bit, so the user has to poll this bit in order to determine if the TSR register is empty. Note 1: The TSR register is not mapped in data memory so it is not available to the user. 2: Flag bit, TX1IF, is set when enable bit, TXEN, is set. To set up an Asynchronous Transmission: 1. Initialize the SPBRGH1:SPBRG1 registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. Enable the asynchronous serial port by clearing bit, SYNC, and setting bit, SPEN. If interrupts are desired, set enable bit, TX1IE. If 9-bit transmission is desired, set transmit bit, TX9; can be used as address/data bit. Enable the transmission by setting bit, TXEN, which will also set bit, TX1IF. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Load data to the TXREG1 register (starts transmission). If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set.
2. 3. 4. 5. 6. 7. 8.
19.3.1
EUSART ASYNCHRONOUS TRANSMITTER
The EUSART transmitter block diagram is shown in Figure 19-3. The heart of the transmitter is the Transmit (Serial) Shift register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register, TXREG1. The TXREG1 register is loaded with data in software. The TSR register is not loaded until the Stop bit has been transmitted from the previous load. As soon as the Stop bit is transmitted, the TSR is loaded with new data from the TXREG1 register (if available).
FIGURE 19-3:
EUSART TRANSMIT BLOCK DIAGRAM
Data Bus TX1IF TX1IE MSb (8) Interrupt TXEN Baud Rate CLK TRMT SPEN TSR Register TXREG1 Register 8 LSb 0 Pin Buffer and Control TX1 Pin
BRG16
SPBRGH1
SPBRG1
TX9 TX9D
Baud Rate Generator
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FIGURE 19-4:
Write to TXREG1 BRG Output (Shift Clock) TX1 (pin) TX1IF bit (Transmit Buffer Reg. Empty Flag)
ASYNCHRONOUS TRANSMISSION
Word 1
Start bit 1 TCY
bit 0
bit 1 Word 1
bit 7/8
Stop bit
TRMT bit (Transmit Shift Reg. Empty Flag)
Word 1 Transmit Shift Reg
FIGURE 19-5:
Write to TXREG1
ASYNCHRONOUS TRANSMISSION (BACK TO BACK)
Word 1 Word 2
BRG Output (Shift Clock) TX1 (pin) TX1IF bit (Interrupt Reg. Flag) 1 TCY 1 TCY Word 1 Transmit Shift Reg. Word 2 Transmit Shift Reg. Start bit bit 0 bit 1 Word 1 bit 7/8 Stop bit Start bit Word 2 bit 0
TRMT bit (Transmit Shift Reg. Empty Flag) Note:
This timing diagram shows two consecutive transmissions.
TABLE 19-5:
Name INTCON PIR1 PIE1 IPR1 RCSTA1 TXREG1 TXSTA1 BAUDCON1 SPBRGH1 SPBRG1 LATG
REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
Bit 7 Bit 6 Bit 5 TMR0IE RC1IF RC1IE RC1IP SREN TXEN RXDTP Bit 4 INT0IE TX1IF TX1IE TX1IP CREN SYNC TXCKP Bit 3 RBIE SSPIF SSPIE SSPIP ADDEN SENDB BRG16 Bit 2 TMR0IF -- -- -- FERR BRGH -- Bit 1 INT0IF TMR2IF TMR2IE TMR2IP OERR TRMT WUE Bit 0 RBIF TMR1IF TMR1IE TMR1IP RX9D TX9D ABDEN Reset Values on Page 49 52 52 52 51 51 51 53 53 51 LATG2 LATG1 LATG0 52
GIE/GIEH PEIE/GIEL -- -- -- SPEN CSRC ABDOVF ADIF ADIE ADIP RX9 TX9 RCMT
EUSART Transmit Register
EUSART Baud Rate Generator Register High Byte EUSART Baud Rate Generator Register Low Byte U2OD U1OD -- LATG4 LATG3
Legend: -- = unimplemented locations read as `0'. Shaded cells are not used for asynchronous transmission.
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19.3.2 EUSART ASYNCHRONOUS RECEIVER 19.3.3 SETTING UP 9-BIT MODE WITH ADDRESS DETECT
The receiver block diagram is shown in Figure 19-6. The data is received on the RX1 pin and drives the data recovery block. The data recovery block is actually a high-speed shifter operating at x16 times the baud rate, whereas the main receive serial shifter operates at the bit rate or at FOSC. This mode would typically be used in RS-232 systems. To set up an Asynchronous Reception: 1. Initialize the SPBRGH1:SPBRG1 registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing bit, SYNC, and setting bit, SPEN. 3. If interrupts are desired, set enable bit, RC1IE. 4. If 9-bit reception is desired, set bit, RX9. 5. Enable the reception by setting bit, CREN. 6. Flag bit, RC1IF, will be set when reception is complete and an interrupt will be generated if enable bit, RC1IE, was set. 7. Read the RCSTA1 register to get the 9th bit (if enabled) and determine if any error occurred during reception. 8. Read the 8-bit received data by reading the RCREG1 register. 9. If any error occurred, clear the error by clearing enable bit, CREN. 10. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. This mode would typically be used in RS-485 systems. To set up an Asynchronous Reception with Address Detect Enable: Initialize the SPBRGH1:SPBRG1 registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing the SYNC bit and setting the SPEN bit. 3. If interrupts are required, set the RCEN bit and select the desired priority level with the RC1IP bit. 4. Set the RX9 bit to enable 9-bit reception. 5. Set the ADDEN bit to enable address detect. 6. Enable reception by setting the CREN bit. 7. The RC1IF bit will be set when reception is complete. The interrupt will be Acknowledged if the RC1IE and GIE bits are set. 8. Read the RCSTA1 register to determine if any error occurred during reception, as well as read bit 9 of data (if applicable). 9. Read RCREG1 to determine if the device is being addressed. 10. If any error occurred, clear the CREN bit. 11. If the device has been addressed, clear the ADDEN bit to allow all received data into the receive buffer and interrupt the CPU. 1.
FIGURE 19-6:
EUSART RECEIVE BLOCK DIAGRAM
CREN x64 Baud Rate CLK OERR FERR
BRG16
SPBRGH1
SPBRG1
Baud Rate Generator
64 or 16 or 4
MSb Stop (8) 7
RSR Register 1 0
LSb Start
RX9 Pin Buffer and Control RX1 Data Recovery RX9D RCREG1 Register FIFO
SPEN 8 Interrupt RC1IF RC1IE Data Bus
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FIGURE 19-7:
RX1 (pin) Rcv Shift Reg Rcv Buffer Reg RCREG1 Read Rcv Buffer Reg RC1IF (Interrupt Flag) OERR bit CREN bit Note: This timing diagram shows three words appearing on the RX1 input. The RCREG1 (Receive Buffer register) is read after the third word causing the OERR (Overrun) bit to be set.
ASYNCHRONOUS RECEPTION
Start bit bit 0 bit 1 bit 7/8 Stop bit Start bit bit 0 bit 7/8 Stop bit Start bit bit 7/8 Stop bit
Word 1 RCREG1
Word 2 RCREG1
TABLE 19-6:
Name INTCON PIR1 PIE1 IPR1 RCSTA1 RCREG1 TXSTA1 BAUDCON1 SPBRGH1 SPBRG1
REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Bit 7 Bit 6 Bit 5 Bit 4 INT0IE TX1IF TX1IE TX1IP CREN SYNC TXCKP Bit 3 RBIE SSPIF SSPIE SSPIP ADDEN SENDB BRG16 Bit 2 TMR0IF -- -- -- FERR BRGH -- Bit 1 INT0IF TMR2IF TMR2IE TMR2IP OERR TRMT WUE Bit 0 RBIF TMR1IF TMR1IE TMR1IP RX9D TX9D ABDEN Reset Values on Page 49 52 52 52 51 51 51 53 51 51
GIE/GIEH PEIE/GIEL TMR0IE -- -- -- SPEN CSRC ABDOVF ADIF ADIE ADIP RX9 TX9 RCMT RC1IF RC1IE RC1IP SREN TXEN RXDTP
EUSART Receive Register
EUSART Baud Rate Generator Register High Byte EUSART Baud Rate Generator Register Low Byte
Legend: -- = unimplemented locations read as `0'. Shaded cells are not used for asynchronous reception.
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19.3.4 AUTO-WAKE-UP ON SYNC BREAK CHARACTER
During Sleep mode, all clocks to the EUSART are suspended. Because of this, the Baud Rate Generator is inactive and a proper byte reception cannot be performed. The auto-wake-up feature allows the controller to wake-up, due to activity on the RX1/DT1 line, while the EUSART is operating in Asynchronous mode. The auto-wake-up feature is enabled by setting the WUE bit (BAUDCON<1>). Once set, the typical receive sequence on RX1/DT1 is disabled and the EUSART remains in an Idle state, monitoring for a wake-up event independent of the CPU mode. A wake-up event consists of a high-to-low transition on the RX1/DT1 line. (This coincides with the start of a Sync Break or a Wake-up Signal character for the LIN/J2602 protocol.) Following a wake-up event, the module generates an RC1IF interrupt. The interrupt is generated synchronously to the Q clocks in normal operating modes (Figure 19-8) and asynchronously, if the device is in Sleep mode (Figure 19-9). The interrupt condition is cleared by reading the RCREG1 register. The WUE bit is automatically cleared once a low-to-high transition is observed on the RX1 line following the wake-up event. At this point, the EUSART module is in Idle mode and returns to normal operation. This signals to the user that the Sync Break event is over. End-of-Character (EOC and cause data or framing errors. Therefore, to work properly, the initial character in the transmission must be all `0's. This can be 00h (8 bits) for standard RS-232 devices, or 000h (12 bits) for LIN/J2602 bus. Oscillator start-up time must also be considered, especially in applications using oscillators with longer start-up intervals (i.e., XT or HS mode). The Sync Break (or Wake-up Signal) character must be of sufficient length and be followed by a sufficient interval to allow enough time for the selected oscillator to start and provide proper initialization of the EUSART.
19.3.4.2
Special Considerations Using the WUE Bit
The timing of WUE and RC1IF events may cause some confusion when it comes to determining the validity of received data. As noted, setting the WUE bit places the EUSART in an Idle mode. The wake-up event causes a receive interrupt by setting the RC1IF bit. The WUE bit is cleared after this when a rising edge is seen on RX1/DT1. The interrupt condition is then cleared by reading the RCREG1 register. Ordinarily, the data in RCREG1 will be dummy data and should be discarded. The fact that the WUE bit has been cleared (or is still set) and the RC1IF flag is set should not be used as an indicator of the integrity of the data in RCREG1. Users should consider implementing a parallel method in firmware to verify received data integrity. To assure that no actual data is lost, check the RCMT bit to verify that a receive operation is not in process. If a receive operation is not occurring, the WUE bit may then be set just prior to entering the Sleep mode.
19.3.4.1
Special Considerations Using Auto-Wake-up
Since auto-wake-up functions by sensing rising edge transitions on RX1/DT1, information with any state changes before the Stop bit may signal a false
FIGURE 19-8:
OSC1 WUE bit(1) RX1/DT1 Line RC1IF
AUTO-WAKE-UP BIT (WUE) TIMINGS DURING NORMAL OPERATION
Bit set by user
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Auto-Cleared
Cleared due to user read of RCREG1
Note 1: The EUSART remains in Idle while the WUE bit is set.
FIGURE 19-9:
OSC1 WUE bit(2) RX1/DT1 Line RC1IF
AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Bit set by user
Auto-Cleared
Note 1 Sleep Ends Cleared due to user read of RCREG1
SLEEP Command Executed Note
1: If the wake-up event requires long oscillator warm-up time, the auto-clear of the WUE bit can occur while the stposc signal is still active. This sequence should not depend on the presence of Q clocks. 2: The EUSART remains in Idle while the WUE bit is set.
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19.3.5 BREAK CHARACTER SEQUENCE
3. 4. 5. The Enhanced USART module has the capability of sending the special Break character sequences that are required by the LIN/J2602 bus standard. The Break character transmit consists of a Start bit, followed by twelve `0' bits and a Stop bit. The Frame Break character is sent whenever the SENDB and TXEN bits (TXSTA<3> and TXSTA<5>) are set while the Transmit Shift register is loaded with data. Note that the value of data written to TXREG1 will be ignored and all `0's will be transmitted. The SENDB bit is automatically reset by hardware after the corresponding Stop bit is sent. This allows the user to preload the transmit FIFO with the next transmit byte following the Break character (typically, the Sync character in the LIN/J2602 specification). Note that the data value written to the TXREG1 for the Break character is ignored. The write simply serves the purpose of initiating the proper sequence. The TRMT bit indicates when the transmit operation is active or Idle, just as it does during normal transmission. See Figure 19-10 for the timing of the Break character sequence. Break character. Load the TXREG1 with a dummy character to initiate transmission (the value is ignored). Write `55h' to TXREG1 to load the Sync character into the transmit FIFO buffer. After the Break has been sent, the SENDB bit is reset by hardware. The Sync character now transmits in the preconfigured mode.
When the TXREG1 becomes empty, as indicated by the TX1IF, the next data byte can be written to TXREG1.
19.3.6
RECEIVING A BREAK CHARACTER
The Enhanced USART module can receive a Break character in two ways. The first method forces configuration of the baud rate at a frequency of 9/13 the typical speed. This allows for the Stop bit transition to be at the correct sampling location (13 bits for Break versus Start bit and 8 data bits for typical data). The second method uses the auto-wake-up feature described in Section 19.3.4 "Auto-Wake-up On Sync Break Character". By enabling this feature, the EUSART will sample the next two transitions on RX1/DT1, cause an RC1IF interrupt and receive the next data byte followed by another interrupt. Note that following a Break character, the user will typically want to enable the Auto-Baud Rate Detect feature. For both methods, the user can set the ABD bit once the TX1IF interrupt is observed.
19.3.5.1
Break and Sync Transmit Sequence
The following sequence will send a message frame header made up of a Break, followed by an Auto-Baud Sync byte. This sequence is typical of a LIN/J2602 bus master. 1. 2. Configure the EUSART for the desired mode. Set the TXEN and SENDB bits to set up the
FIGURE 19-10:
Write to TXREG1 BRG Output (Shift Clock) TX1 (pin)
SEND BREAK CHARACTER SEQUENCE
Dummy Write
Start bit
bit 0
bit 1 Break
bit 11
Stop bit
TX1IF bit (Transmit Buffer Reg. Empty Flag) TRMT bit (Transmit Shift Reg. Empty Flag) SENDB sampled here SENDB (Transmit Shift Reg. Empty Flag) Auto-Cleared
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19.4 EUSART Synchronous Master Mode
Once the TXREG1 register transfers the data to the TSR register (occurs in one TCYCLE), the TXREG1 is empty and the TX1IF flag bit (PIR1<4>) is set. The interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TX1IE (PIE1<4>). TX1IF is set regardless of the state of enable bit, TX1IE; it cannot be cleared in software. It will reset only when new data is loaded into the TXREG1 register. While flag bit, TX1IF, indicates the status of the TXREG1 register, another bit, TRMT (TXSTA<1>), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. The TSR is not mapped in data memory so it is not available to the user. To set up a Synchronous Master Transmission: 1. Initialize the SPBRGH1:SPBRG1 registers for the appropriate baud rate. Set or clear the BRG16 bit, as required, to achieve the desired baud rate. Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. If interrupts are desired, set enable bit, TX1IE. If 9-bit transmission is desired, set bit, TX9. Enable the transmission by setting bit, TXEN. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Start transmission by loading data to the TXREG1 register. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set.
The Synchronous Master mode is entered by setting the CSRC bit (TXSTA<7>). In this mode, the data is transmitted in a half-duplex manner (i.e., transmission and reception do not occur at the same time). When transmitting data, the reception is inhibited and vice versa. Synchronous mode is entered by setting bit, SYNC (TXSTA<4>). In addition, enable bit, SPEN (RCSTA1<7>), is set in order to configure the TX1 and RX1 pins to CK1 (clock) and DT1 (data) lines, respectively. The Master mode indicates that the processor transmits the master clock on the CK1 line. Clock polarity is selected with the TXCKP bit (BAUDCON<4>). Setting TXCKP sets the Idle state on CK1 as high, while clearing the bit sets the Idle state as low. This option is provided to support Microwire devices with this module.
19.4.1
EUSART SYNCHRONOUS MASTER TRANSMISSION
2. 3. 4. 5. 6. 7. 8.
The EUSART transmitter block diagram is shown in Figure 19-3. The heart of the transmitter is the Transmit (Serial) Shift register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register, TXREG1. The TXREG1 register is loaded with data in software. The TSR register is not loaded until the last bit has been transmitted from the previous load. As soon as the last bit is transmitted, the TSR is loaded with new data from the TXREG1 (if available).
FIGURE 19-11:
SYNCHRONOUS TRANSMISSION
Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 bit 7 bit 0 bit 1 bit 7
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
RC7/RX1/DT1/SEG28 Pin RC6/TX1/CK1/SEG27 pin (TXCKP = 0) RC6/TX1/CK1/SEG27 pin (TXCKP = 1) Write to TXREG1 Reg TX1IF bit (Interrupt Flag) TRMT bit TXEN bit Note: `1'
bit 0
bit 1
bit 2
Word 1
Word 2
Write Word 1
Write Word 2
`1'
Sync Master mode, SPBRG1 = 0; continuous transmission of two 8-bit words.
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FIGURE 19-12: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)
bit 0 bit 1 bit 2 bit 6 bit 7 RC7/RX1/DT1/SEG28 Pin
RC6/TX1/CK1/SEG27 Pin Write to TXREG1 Reg
TX1IF bit
TRMT bit
TXEN bit
TABLE 19-7:
Name INTCON PIR1 PIE1 IPR1 RCSTA1 TXREG1 TXSTA1 SPBRGH1 SPBRG1 LATG
REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION
Bit 7 Bit 6 Bit 5 Bit 4 INT0IE TX1IF TX1IE TX1IP CREN SYNC TXCKP Bit 3 RBIE SSPIF SSPIE SSPIP ADDEN SENDB BRG16 Bit 2 TMR0IF -- -- -- FERR BRGH -- Bit 1 INT0IF TMR2IF TMR2IE TMR2IP OERR TRMT WUE Bit 0 RBIF TMR1IF TMR1IE TMR1IP RX9D TX9D ABDEN Reset Values on Page 49 52 52 52 51 51 51 53 53 51 LATG2 LATG1 LATG0 52
GIE/GIEH PEIE/GIEL TMR0IE -- -- -- SPEN CSRC ADIF ADIE ADIP RX9 TX9 RCMT RC1IF RC1IE RC1IP SREN TXEN RXDTP
EUSART Transmit Register
BAUDCON1 ABDOVF
EUSART Baud Rate Generator Register High Byte EUSART Baud Rate Generator Register Low Byte U2OD U1OD -- LATG4 LATG3
Legend: -- = unimplemented, read as `0'. Shaded cells are not used for synchronous master transmission.
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19.4.2 EUSART SYNCHRONOUS MASTER RECEPTION
Once Synchronous mode is selected, reception is enabled by setting either the Single Receive Enable bit, SREN (RCSTA1<5>), or the Continuous Receive Enable bit, CREN (RCSTA1<4>). Data is sampled on the RX1 pin on the falling edge of the clock. If enable bit, SREN, is set, only a single word is received. If enable bit, CREN, is set, the reception is continuous until CREN is cleared. If both bits are set, then CREN takes precedence. To set up a Synchronous Master Reception: 1. Initialize the SPBRGH1:SPBRG1 registers for the appropriate baud rate. Set or clear the BRG16 bit, as required, to achieve the desired baud rate. Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. 3. 4. 5. 6. Ensure bits, CREN and SREN, are clear. If interrupts are desired, set enable bit, RC1IE. If 9-bit reception is desired, set bit, RX9. If a single reception is required, set bit, SREN. For continuous reception, set bit, CREN. 7. Interrupt flag bit, RC1IF, will be set when reception is complete and an interrupt will be generated if the enable bit, RC1IE, was set. 8. Read the RCSTA1 register to get the 9th bit (if enabled) and determine if any error occurred during reception. 9. Read the 8-bit received data by reading the RCREG1 register. 10. If any error occurred, clear the error by clearing bit, CREN. 11. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set.
2.
FIGURE 19-13:
SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
RC7/RX1/DT1/ SEG28 pin RC6/TX1/CK1/SEG27 pin (TXCKP = 0) RC6/TX1/CK1/SEG27 pin (TXCKP = 1) Write to SREN bit SREN bit CREN bit `0' RC1IF bit (Interrupt) Read RCREG1 Note:
bit 0
bit 1
bit 2
bit 3
bit 4
bit 5
bit 6
bit 7
`0'
Timing diagram demonstrates Sync Master mode with bit, SREN = 1, and bit, BRGH = 0.
TABLE 19-8:
Name INTCON PIR1 PIE1 IPR1 RCSTA1 RCREG1 TXSTA1 SPBRGH1 SPBRG1
REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION
Bit 7 Bit 6 Bit 5 TMR0IE RC1IF RC1IE RC1IP SREN TXEN RXDTP Bit 4 INT0IE TX1IF TX1IE TX1IP CREN SYNC TXCKP Bit 3 RBIE SSPIF SSPIE SSPIP ADDEN SENDB BRG16 Bit 2 TMR0IF -- -- -- FERR BRGH -- Bit 1 INT0IF TMR2IF TMR2IE TMR2IP OERR TRMT WUE Bit 0 RBIF TMR1IF TMR1IE TMR1IP RX9D TX9D ABDEN Reset Values on Page 49 52 52 52 51 51 51 53 53 51
GIE/GIEH PEIE/GIEL -- -- -- SPEN CSRC ADIF ADIE ADIP RX9 TX9 RCMT
EUSART Receive Register
BAUDCON1 ABDOVF
EUSART Baud Rate Generator Register High Byte EUSART Baud Rate Generator Register Low Byte
Legend: -- = unimplemented, read as `0'. Shaded cells are not used for synchronous master reception.
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19.5 EUSART Synchronous Slave Mode
To set up a Synchronous Slave Transmission: 1. Enable the synchronous slave serial port by setting bits, SYNC and SPEN, and clearing bit, CSRC. Clear bits, CREN and SREN. If interrupts are desired, set enable bit, TX1IE. If 9-bit transmission is desired, set bit, TX9. Enable the transmission by setting enable bit, TXEN. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Start transmission by loading data to the TXREG1 register. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. Synchronous Slave mode is entered by clearing bit, CSRC (TXSTA<7>). This mode differs from the Synchronous Master mode in that the shift clock is supplied externally at the CK1 pin (instead of being supplied internally in Master mode). This allows the device to transfer or receive data while in any low-power mode.
2. 3. 4. 5. 6. 7. 8.
19.5.1
EUSART SYNCHRONOUS SLAVE TRANSMIT
The operation of the Synchronous Master and Slave modes are identical except in the case of Sleep mode. If two words are written to the TXREG1 and then the SLEEP instruction is executed, the following will occur: a) b) c) d) The first word will immediately transfer to the TSR register and transmit. The second word will remain in the TXREG1 register. Flag bit, TX1IF, will not be set. When the first word has been shifted out of TSR, the TXREG1 register will transfer the second word to the TSR and flag bit, TX1IF, will now be set. If enable bit, TX1IE, is set, the interrupt will wake the chip from Sleep. If the global interrupt is enabled, the program will branch to the interrupt vector.
e)
TABLE 19-9:
Name INTCON PIR1 PIE1 IPR1 RCSTA1 TXREG1 TXSTA1 SPBRGH1 SPBRG1 LATG
REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION
Bit 7 Bit 6 Bit 5 TMR0IE RC1IF RC1IE RC1IP SREN TXEN RXDTP Bit 4 INT0IE TX1IF TX1IE TX1IP CREN SYNC TXCKP Bit 3 RBIE SSPIF SSPIE SSPIP ADDEN SENDB BRG16 Bit 2 TMR0IF -- -- -- FERR BRGH -- Bit 1 INT0IF TMR2IF TMR2IE TMR2IP OERR TRMT WUE Bit 0 RBIF TMR1IF TMR1IE TMR1IP RX9D TX9D ABDEN Reset Values on Page 49 52 52 52 51 51 51 53 53 51 LATG2 LATG1 LATG0 52
GIE/GIEH PEIE/GIEL -- -- -- SPEN CSRC ADIF ADIE ADIP RX9 TX9 RCMT
EUSART Transmit Register
BAUDCON1 ABDOVF
EUSART Baud Rate Generator Register High Byte EUSART Baud Rate Generator Register Low Byte U2OD U1OD -- LATG4 LATG3
Legend: -- = unimplemented, read as `0'. Shaded cells are not used for synchronous slave transmission.
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19.5.2 EUSART SYNCHRONOUS SLAVE RECEPTION
To set up a Synchronous Slave Reception: 1. Enable the synchronous master serial port by setting bits, SYNC and SPEN, and clearing bit, CSRC. If interrupts are desired, set enable bit, RC1IE. If 9-bit reception is desired, set bit, RX9. To enable reception, set enable bit, CREN. Flag bit, RC1IF, will be set when reception is complete. An interrupt will be generated if enable bit, RC1IE, was set. Read the RCSTA1 register to get the 9th bit (if enabled) and determine if any error occurred during reception. Read the 8-bit received data by reading the RCREG1 register. If any error occurred, clear the error by clearing bit, CREN. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. The operation of the Synchronous Master and Slave modes is identical except in the case of Sleep or any Idle mode, and bit, SREN, which is a "don't care" in Slave mode. If receive is enabled by setting the CREN bit prior to entering Sleep or any Idle mode, then a word may be received while in this low-power mode. Once the word is received, the RSR register will transfer the data to the RCREG1 register; if the RC1IE enable bit is set, the interrupt generated will wake the chip from the low-power mode. If the global interrupt is enabled, the program will branch to the interrupt vector.
2. 3. 4. 5.
6.
7. 8. 9.
TABLE 19-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION
Name INTCON PIR1 PIE1 IPR1 RCSTA1 RCREG1 TXSTA1 SPBRGH1 SPBRG1 Bit 7 Bit 6 Bit 5 Bit 4 INT0IE TX1IF TX1IE TX1IP CREN SYNC TXCKP Bit 3 RBIE SSPIF SSPIE SSPIP ADDEN SENDB BRG16 Bit 2 TMR0IF -- -- -- FERR BRGH -- Bit 1 INT0IF TMR2IF TMR2IE TMR2IP OERR TRMT WUE Bit 0 RBIF TMR1IF TMR1IE TMR1IP RX9D TX9D ABDEN Reset Values on Page 49 52 52 52 51 51 51 53 53 51
GIE/GIEH PEIE/GIEL TMR0IE -- -- -- SPEN CSRC ADIF ADIE ADIP RX9 TX9 RCMT RC1IF RC1IE RC1IP SREN TXEN RXDTP
EUSART Receive Register
BAUDCON1 ABDOVF
EUSART Baud Rate Generator Register High Byte EUSART Baud Rate Generator Register Low Byte
Legend: -- = unimplemented, read as `0'. Shaded cells are not used for synchronous slave reception.
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20.0 ADDRESSABLE UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER TRANSMITTER (AUSART)
Note: The AUSART control will automatically reconfigure the pin from input to output as needed.
The Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART) module is very similar in function to the Enhanced USART module, discussed in the previous chapter. It is provided as an additional channel for serial communication with external devices, for those situations that do not require auto-baud detection or LIN/J2602 bus support. The AUSART can be configured in the following modes: * Asynchronous (full-duplex) * Synchronous - Master (half-duplex) * Synchronous - Slave (half-duplex) The pins of the AUSART module are multiplexed with the functions of PORTG (RG1/TX2/CK2 and RG2/RX2/DT2/VLCAP1, respectively). In order to configure these pins as an AUSART: * PEN bit (RCSTA2<7>) must be set (= 1) * TXEN bit (TXSTA2<5>) must also be set (= 1) to configure TX2/CK2 to transmit * TRISG<2> bit must be set (= 1) * TRISG<1> bit must be cleared (= 0) for Asynchronous and Synchronous Master modes * TRISG<1> bit must be set (= 1) for Synchronous Slave mode
The driver for the TX2 output pin can also be optionally configured as an open-drain output. This feature allows the voltage level on the pin to be pulled to a higher level through an external pull-up resistor and allows the output to communicate with external circuits without the need for additional level shifters. The open-drain output option is controlled by the U2OD bit (LATG<7>). Setting the bit configures the pin for open-drain operation.
20.1
Control Registers
The operation of the Addressable USART module is controlled through two registers: TXSTA2 and RXSTA2. These are detailed in Register 20-1 and Register 20-2, respectively.
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REGISTER 20-1:
R/W-0 CSRC bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
TXSTA2: AUSART TRANSMIT STATUS AND CONTROL REGISTER
R/W-0 TXEN(1) R/W-0 SYNC U-0 -- R/W-0 BRGH R-1 TRMT R/W-0 TX9D bit 0 TX9
R/W-0
CSRC: Clock Source Select bit Asynchronous mode: Don't care. Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) TX9: 9-Bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission TXEN: Transmit Enable bit(1) 1 = Transmit enabled 0 = Transmit disabled SYNC: AUSART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode Unimplemented: Read as `0' BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode. TRMT: Transmit Shift Register Status bit 1 = TSR empty 0 = TSR full TX9D: 9th bit of Transmit Data Can be address/data bit or a parity bit. SREN/CREN overrides TXEN in Sync mode.
bit 6
bit 5
bit 4
bit 3 bit 2
bit 1
bit 0
Note 1:
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REGISTER 20-2:
R/W-0 SPEN bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
RCSTA2: AUSART RECEIVE STATUS AND CONTROL REGISTER
R/W-0 SREN R/W-0 CREN R/W-0 ADDEN R-0 FERR R-0 OERR R-x RX9D bit 0 RX9
R/W-0
SPEN: Serial Port Enable bit 1 = Serial port enabled (configures RX2/DT2 and TX2/CK2 pins as serial port pins; TXEN must also be set to configure TX2/CK2 to transmit) 0 = Serial port disabled (held in Reset) RX9: 9-Bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception SREN: Single Receive Enable bit Asynchronous mode: Don't care. Synchronous mode - Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode - Slave: Don't care. CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables receiver 0 = Disables receiver Synchronous mode: 1 = Enables continuous receive until enable bit, CREN, is cleared (CREN overrides SREN) 0 = Disables continuous receive ADDEN: Address Detect Enable bit Asynchronous mode 9-bit (RX9 = 1): 1 = Enables address detection, enables interrupt and loads the receive buffer when RSR<8> is set 0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit Asynchronous mode 9-bit (RX9 = 0): Don't care. FERR: Framing Error bit 1 = Framing error (can be cleared by reading RCREG2 register and receiving next valid byte) 0 = No framing error OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit CREN) 0 = No overrun error RX9D: 9th bit of Received Data This can be an address/data bit or a parity bit and must be calculated by user firmware.
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
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20.2 AUSART Baud Rate Generator (BRG)
Writing a new value to the SPBRG2 register causes the BRG timer to be reset (or cleared). This ensures the BRG does not wait for a timer overflow before outputting the new baud rate.
The BRG is a dedicated, 8-bit generator that supports both the Asynchronous and Synchronous modes of the AUSART. The SPBRG2 register controls the period of a free-running timer. In Asynchronous mode, the BRGH (TXSTA<2>) bit also controls the baud rate. In Synchronous mode, BRGH is ignored. Table 20-1 shows the formula for computation of the baud rate for different AUSART modes, which only apply in Master mode (internally generated clock). Given the desired baud rate and FOSC, the nearest integer value for the SPBRG2 register can be calculated using the formulas in Table 20-1. From this, the error in baud rate can be determined. An example calculation is shown in Example 20-1. Typical baud rates and error values for the various Asynchronous modes are shown in Table 20-2. It may be advantageous to use the high baud rate (BRGH = 1) to reduce the baud rate error, or achieve a slow baud rate for a fast oscillator frequency.
20.2.1
OPERATION IN POWER-MANAGED MODES
The device clock is used to generate the desired baud rate. When one of the power-managed modes is entered, the new clock source may be operating at a different frequency. This may require an adjustment to the value in the SPBRG2 register.
20.2.2
SAMPLING
The data on the RX2 pin is sampled three times by a majority detect circuit to determine if a high or a low level is present on the RX2 pin.
TABLE 20-1:
SYNC 0 0 1
BAUD RATE FORMULAS
BRGH 0 1 x BRG/AUSART Mode Asynchronous Asynchronous Synchronous Baud Rate Formula FOSC/[64 (n + 1)] FOSC/[16 (n + 1)] FOSC/[4 (n + 1)]
Configuration Bits
Legend: x = Don't care, n = Value of SPBRG2 register
EXAMPLE 20-1:
CALCULATING BAUD RATE ERROR
For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, BRGH = 0: Desired Baud Rate = FOSC/(64 ([SPBRG2] + 1)) Solving for SPBRG2: X = ((FOSC/Desired Baud Rate)/64) - 1 = ((16000000/9600)/64) - 1 = [25.042] = 25 Calculated Baud Rate=16000000/(64 (25 + 1)) = 9615 Error = (Calculated Baud Rate - Desired Baud Rate)/Desired Baud Rate = (9615 - 9600)/9600 = 0.16%
TABLE 20-2:
Name TXSTA2 RCSTA2 SPBRG2
REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR
Bit 7 CSRC SPEN Bit 6 TX9 RX9 Bit 5 TXEN SREN Bit 4 SYNC CREN Bit 3 -- ADDEN Bit 2 BRGH FERR Bit 1 TRMT OERR Bit 0 TX9D RX9D Reset Values on Page 54 54 54
AUSART Baud Rate Generator Register
Legend: Shaded cells are not used by the BRG.
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TABLE 20-3: BAUD RATES FOR ASYNCHRONOUS MODES
BRGH = 0 FOSC = 40.000 MHz BAUD RATE (K) 0.3 1.2 2.4 9.6 19.2 57.6 115.2 Actual Rate (K) -- -- 2.441 9.615 19.531 56.818 125.000 % Error -- -- 1.73 0.16 1.73 -1.36 8.51 SPBRG value
(decimal)
FOSC = 20.000 MHz Actual Rate (K) -- 1.221 2.404 9.766 19.531 62.500 104.167 % Error -- 1.73 0.16 1.73 1.73 8.51 -9.58 BRGH = 0 SPBRG value
(decimal)
FOSC = 10.000 MHz Actual Rate (K) -- 1.202 2.404 9.766 19.531 52.083 78.125 % Error -- 0.16 0.16 1.73 1.73 -9.58 -32.18 SPBRG value
(decimal)
FOSC = 8.000 MHz Actual Rate (K) -- 1.201 2.403 9.615 -- -- -- % Error -- -0.16 -0.16 -0.16 -- -- -- SPBRG value
(decimal)
-- -- 255 64 31 10 4
-- 255 129 31 15 4 2
-- 129 64 15 7 2 1
-- 103 51 12 -- -- --
FOSC = 4.000 MHz BAUD RATE (K) 0.3 1.2 2.4 9.6 19.2 57.6 115.2 Actual Rate (K) 0.300 1.202 2.404 8.929 20.833 62.500 62.500 % Error 0.16 0.16 0.16 -6.99 8.51 8.51 -45.75 SPBRG value
(decimal)
FOSC = 2.000 MHz Actual Rate (K) 0.300 1.201 2.403 -- -- -- -- % Error -0.16 -0.16 -0.16 -- -- -- -- SPBRG value
(decimal)
FOSC = 1.000 MHz Actual Rate (K) 0.300 1.201 -- -- -- -- -- % Error -0.16 -0.16 -- -- -- -- -- SPBRG value
(decimal)
207 51 25 6 2 0 0
103 25 12 -- -- -- --
51 12 -- -- -- -- --
BRGH = 1 BAUD RATE (K) FOSC = 40.000 MHz Actual Rate (K) -- -- -- 9.766 19.231 58.140 113.636 % Error -- -- -- 1.73 0.16 0.94 -1.36 SPBRG value
(decimal)
FOSC = 20.000 MHz Actual Rate (K) -- -- -- 9.615 19.231 56.818 113.636 % Error -- -- -- 0.16 0.16 -1.36 -1.36 BRGH = 1 SPBRG value
(decimal)
FOSC = 10.000 MHz Actual Rate (K) -- -- 2.441 9.615 19.531 56.818 125.000 % Error -- -- 1.73 0.16 1.73 -1.36 8.51 SPBRG value
(decimal)
FOSC = 8.000 MHz Actual Rate (K) -- -- 2.403 9.615 19.230 55.555 -- % Error -- -- -0.16 -0.16 -0.16 3.55 -- SPBRG value
(decimal)
0.3 1.2 2.4 9.6 19.2 57.6 115.2
-- -- -- 255 129 42 21
-- -- -- 129 64 21 10
-- -- 255 64 31 10 4
-- -- 207 51 25 8 --
BAUD RATE (K)
FOSC = 4.000 MHz Actual Rate (K) -- 1.202 2.404 9.615 19.231 62.500 125.000 % Error -- 0.16 0.16 0.16 0.16 8.51 8.51 SPBRG value
(decimal)
FOSC = 2.000 MHz Actual Rate (K) -- 1.201 2.403 9.615 -- -- -- % Error -- -0.16 -0.16 -0.16 -- -- -- SPBRG value
(decimal)
FOSC = 1.000 MHz Actual Rate (K) 0.300 1.201 2.403 -- -- -- -- % Error -0.16 -0.16 -0.16 -- -- -- -- SPBRG value
(decimal)
0.3 1.2 2.4 9.6 19.2 57.6 115.2
-- 207 103 25 12 3 1
-- 103 51 12 -- -- --
207 51 25 -- -- -- --
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20.3 AUSART Asynchronous Mode
The Asynchronous mode of operation is selected by clearing the SYNC bit (TXSTA2<4>). In this mode, the AUSART uses standard Non-Return-to-Zero (NRZ) format (one Start bit, eight or nine data bits and one Stop bit). The most common data format is 8 bits. An on-chip, dedicated, 8-bit Baud Rate Generator can be used to derive standard baud rate frequencies from the oscillator. The AUSART transmits and receives the LSb first. The AUSART's transmitter and receiver are functionally independent but use the same data format and baud rate. The Baud Rate Generator produces a clock, either x16 or x64 of the bit shift rate, depending on the BRGH bit (TXSTA2<2>). Parity is not supported by the hardware but can be implemented in software and stored as the 9th data bit. When operating in Asynchronous mode, the AUSART module consists of the following important elements: * * * * Baud Rate Generator Sampling Circuit Asynchronous Transmitter Asynchronous Receiver Once the TXREG2 register transfers the data to the TSR register (occurs in one TCY), the TXREG2 register is empty and the TX2IF flag bit (PIR3<4>) is set. This interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TX2IE (PIE3<4>). TX2IF will be set regardless of the state of TX2IE; it cannot be cleared in software. TX2IF is also not cleared immediately upon loading TXREG2, but becomes valid in the second instruction cycle following the load instruction. Polling TX2IF immediately following a load of TXREG2 will return invalid results. While TX2IF indicates the status of the TXREG2 register, another bit, TRMT (TXSTA2<1>), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR register is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. Note 1: The TSR register is not mapped in data memory so it is not available to the user. 2: Flag bit, TX2IF, is set when enable bit, TXEN, is set. To set up an Asynchronous Transmission: 1. Initialize the SPBRG2 register for the appropriate baud rate. Set or clear the BRGH bit, as required, to achieve the desired baud rate. Enable the asynchronous serial port by clearing bit, SYNC, and setting bit, SPEN. If interrupts are desired, set enable bit, TX2IE. If 9-bit transmission is desired, set transmit bit, TX9. Can be used as address/data bit. Enable the transmission by setting bit, TXEN, which will also set bit, TX2IF. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Load data to the TXREG2 register (starts transmission). If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set.
20.3.1
AUSART ASYNCHRONOUS TRANSMITTER
2. 3. 4. 5. 6. 7. 8.
The AUSART transmitter block diagram is shown in Figure 20-1. The heart of the transmitter is the Transmit (Serial) Shift register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register, TXREG2. The TXREG2 register is loaded with data in software. The TSR register is not loaded until the Stop bit has been transmitted from the previous load. As soon as the Stop bit is transmitted, the TSR is loaded with new data from the TXREG2 register (if available).
FIGURE 20-1:
AUSART TRANSMIT BLOCK DIAGRAM
Data Bus TX2IF TXREG2 Register 8 MSb (8) Interrupt TXEN Baud Rate CLK TRMT TX9 TX9D SPEN TSR Register LSb 0 Pin Buffer and Control TX2 Pin
TX2IE
SPBRG2 Baud Rate Generator
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FIGURE 20-2:
Write to TXREG2 BRG Output (Shift Clock) TX2 (pin) TX2IF bit (Transmit Buffer Reg. Empty Flag)
ASYNCHRONOUS TRANSMISSION
Word 1
Start bit 1 TCY
bit 0
bit 1 Word 1
bit 7/8
Stop bit
TRMT bit (Transmit Shift Reg. Empty Flag)
Word 1 Transmit Shift Reg
FIGURE 20-3:
Write to TXREG2
ASYNCHRONOUS TRANSMISSION (BACK TO BACK)
Word 1 Word 2
BRG Output (Shift Clock) TX2 (pin) TX2IF bit (Interrupt Reg. Flag) 1 TCY 1 TCY Word 1 Transmit Shift Reg. Word 2 Transmit Shift Reg. Start bit bit 0 bit 1 Word 1 bit 7/8 Stop bit Start bit Word 2 bit 0
TRMT bit (Transmit Shift Reg. Empty Flag) Note:
This timing diagram shows two consecutive transmissions.
TABLE 20-4:
Name INTCON PIR3 PIE3 IPR3 RCSTA2 TXREG2 TXSTA2 SPBRG2 LATG
REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
Bit 7 Bit 6 Bit 5 TMR0IE RC2IF RC2IE RC2IP SREN TXEN -- Bit 4 INT0IE TX2IF TX2IE TX2IP CREN SYNC LATG4 Bit 3 RBIE CTMUIF CTMUIE CTMUIP ADDEN -- LATG3 Bit 2 TMR0IF CCP2IF CCP2IE CCP2IP FERR BRGH LATG2 Bit 1 INT0IF CCP1IF CCP1IE CCP1IP OERR TRMT LATG1 Bit 0 RBIF RTCCIF RTCCIE RTCCIP RX9D TX9D LATG0 Reset Values on Page 49 52 52 52 54 54 54 54 52
GIE/GIEH PEIE/GIEL -- -- -- SPEN CSRC U2OD LCDIF LCDIE LCDIP RX9 TX9 U1OD
AUSART Transmit Register AUSART Baud Rate Generator Register
Legend: -- = unimplemented locations read as `0'. Shaded cells are not used for asynchronous transmission.
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20.3.2 AUSART ASYNCHRONOUS RECEIVER 20.3.3 SETTING UP 9-BIT MODE WITH ADDRESS DETECT
The receiver block diagram is shown in Figure 20-4. The data is received on the RX2 pin and drives the data recovery block. The data recovery block is actually a high-speed shifter operating at x16 times the baud rate, whereas the main receive serial shifter operates at the bit rate or at FOSC. This mode would typically be used in RS-232 systems. To set up an Asynchronous Reception: 1. Initialize the SPBRG2 register for the appropriate baud rate. Set or clear the BRGH bit, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing bit, SYNC, and setting bit, SPEN. 3. If interrupts are desired, set enable bit, RC2IE. 4. If 9-bit reception is desired, set bit, RX9. 5. Enable the reception by setting bit, CREN. 6. Flag bit, RC2IF, will be set when reception is complete and an interrupt will be generated if enable bit, RC2IE, was set. 7. Read the RCSTA2 register to get the 9th bit (if enabled) and determine if any error occurred during reception. 8. Read the 8-bit received data by reading the RCREG2 register. 9. If any error occurred, clear the error by clearing enable bit, CREN. 10. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. This mode would typically be used in RS-485 systems. To set up an Asynchronous Reception with Address Detect Enable: 1. Initialize the SPBRG2 register for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing the SYNC bit and setting the SPEN bit. 3. If interrupts are required, set the RCEN bit and select the desired priority level with the RC2IP bit. 4. Set the RX9 bit to enable 9-bit reception. 5. Set the ADDEN bit to enable address detect. 6. Enable reception by setting the CREN bit. 7. The RC2IF bit will be set when reception is complete. The interrupt will be Acknowledged if the RC2IE and GIE bits are set. 8. Read the RCSTA2 register to determine if any error occurred during reception, as well as read bit 9 of data (if applicable). 9. Read RCREG2 to determine if the device is being addressed. 10. If any error occurred, clear the CREN bit. 11. If the device has been addressed, clear the ADDEN bit to allow all received data into the receive buffer and interrupt the CPU.
FIGURE 20-4:
AUSART RECEIVE BLOCK DIAGRAM
CREN x64 Baud Rate CLK SPBRG2 Baud Rate Generator 64 or 16 or 4 MSb Stop (8) 7 RSR Register 1 0 LSb Start OERR FERR
RX9 Pin Buffer and Control RX2 Pin Data Recovery RX9D RCREG2 Register FIFO
SPEN 8 Interrupt RC2IF RC2IE Data Bus
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FIGURE 20-5:
RX2 (pin) Rcv Shift Reg Rcv Buffer Reg Read Rcv Buffer Reg RCREG2 RC2IF (Interrupt Flag) OERR bit CREN Note: This timing diagram shows three words appearing on the RX2 input. The RCREG2 (Receive Buffer register) is read after the third word causing the OERR (Overrun) bit to be set.
ASYNCHRONOUS RECEPTION
Start bit bit 0 bit 1 bit 7/8 Stop bit Start bit bit 0 bit 7/8 Stop bit Start bit bit 7/8 Stop bit
Word 1 RCREG2
Word 2 RCREG2
TABLE 20-5:
Name INTCON PIR3 PIE3 IPR3 RCSTA2 RCREG2 TXSTA2 SPBRG2
REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Bit 7 Bit 6 Bit 5 Bit 4 INT0IE TX2IF TX2IE TX2IP CREN SYNC Bit 3 RBIE CTMUIF CTMUIE CTMUIP ADDEN -- Bit 2 TMR0IF CCP2IF CCP2IE CCP2IP FERR BRGH Bit 1 INT0IF CCP1IF CCP1IE CCP1IP OERR TRMT Bit 0 RBIF RTCCIF RTCCIE RTCCIP RX9D TX9D Reset Values on Page 49 52 52 52 54 54 54 54
GIE/GIEH PEIE/GIEL TMR0IE -- -- -- SPEN CSRC LCDIF LCDIE LCDIP RX9 TX9 RC2IF RC2IE RC2IP SREN TXEN
AUSART Receive Register AUSART Baud Rate Generator Register
Legend: -- = unimplemented locations read as `0'. Shaded cells are not used for asynchronous reception.
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20.4 AUSART Synchronous Master Mode
Once the TXREG2 register transfers the data to the TSR register (occurs in one TCYCLE), the TXREG2 is empty and the TX2IF flag bit (PIR3<4>) is set. The interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TX2IE (PIE3<4>). TX2IF is set regardless of the state of enable bit, TX2IE; it cannot be cleared in software. It will reset only when new data is loaded into the TXREG2 register. While flag bit, TX2IF, indicates the status of the TXREG2 register, another bit, TRMT (TXSTA2<1>), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. The TSR is not mapped in data memory so it is not available to the user. To set up a Synchronous Master Transmission: 1. 2. 3. 4. 5. 6. 7. 8. Initialize the SPBRG2 register for the appropriate baud rate. Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. If interrupts are desired, set enable bit, TX2IE. If 9-bit transmission is desired, set bit, TX9. Enable the transmission by setting bit, TXEN. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Start transmission by loading data to the TXREG2 register. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set.
The Synchronous Master mode is entered by setting the CSRC bit (TXSTA2<7>). In this mode, the data is transmitted in a half-duplex manner (i.e., transmission and reception do not occur at the same time). When transmitting data, the reception is inhibited and vice versa. Synchronous mode is entered by setting bit, SYNC (TXSTA2<4>). In addition, enable bit, SPEN (RCSTA2<7>), is set in order to configure the TX2 and RX2 pins to CK2 (clock) and DT2 (data) lines, respectively. The Master mode indicates that the processor transmits the master clock on the CK2 line.
20.4.1
AUSART SYNCHRONOUS MASTER TRANSMISSION
The AUSART transmitter block diagram is shown in Figure 20-1. The heart of the transmitter is the Transmit (Serial) Shift register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register: TXREG2. The TXREG2 register is loaded with data in software. The TSR register is not loaded until the last bit has been transmitted from the previous load. As soon as the last bit is transmitted, the TSR is loaded with new data from the TXREG2 (if available).
FIGURE 20-6:
SYNCHRONOUS TRANSMISSION
Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 bit 7 bit 0 bit 1 bit 7
Q1 Q2 Q3Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4
RX2/DT2 pin
bit 0
bit 1
bit 2
Word 1 TX2/CK2 pin Write to TXREG2 Reg TX2IF bit (Interrupt Flag) TRMT bit TXEN bit Note: `1'
Word 2
Write Word 1
Write Word 2
`1'
Sync Master mode, SPBRG2 = 0; continuous transmission of two 8-bit words.
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FIGURE 20-7: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)
bit 0 bit 1 bit 2 bit 6 bit 7 RX2/DT2 Pin
TX2/CK2 Pin Write to TXREG2 Reg
TX2IF bit
TRMT bit
TXEN bit
TABLE 20-6:
Name INTCON PIR3 PIE3 IPR3 RCSTA2 TXREG2 TXSTA2 SPBRG2 LATG
REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION
Bit 7 Bit 6 Bit 5 Bit 4 INT0IE TX2IF TX2IE TX2IP CREN SYNC LATG4 Bit 3 RBIE CTMUIF CTMUIE CTMUIP ADDEN -- LATG3 Bit 2 TMR0IF CCP2IF CCP2IE CCP2IP FERR BRGH LATG2 Bit 1 INT0IF CCP1IF CCP1IE CCP1IP OERR TRMT LATG1 Bit 0 RBIF RTCCIF RTCCIE RTCCIP RX9D TX9D LATG0 Reset Values on Page 49 52 52 52 54 54 54 54 52
GIE/GIEH PEIE/GIEL TMR0IE -- -- -- SPEN CSRC U2OD LCDIF LCDIE LCDIP RX9 TX9 U1OD RC2IF RC2IE RC2IP SREN TXEN --
AUSART Transmit Register AUSART Baud Rate Generator Register
Legend: -- = unimplemented, read as `0'. Shaded cells are not used for synchronous master transmission.
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20.4.2 AUSART SYNCHRONOUS MASTER RECEPTION
Once Synchronous mode is selected, reception is enabled by setting either the Single Receive Enable bit, SREN (RCSTA2<5>), or the Continuous Receive Enable bit, CREN (RCSTA2<4>). Data is sampled on the RX2 pin on the falling edge of the clock. If enable bit, SREN, is set, only a single word is received. If enable bit, CREN, is set, the reception is continuous until CREN is cleared. If both bits are set, then CREN takes precedence. To set up a Synchronous Master Reception: 1. 2. 3. Initialize the SPBRG2 register for the appropriate baud rate. Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. Ensure bits, CREN and SREN, are clear. If interrupts are desired, set enable bit, RC2IE. If 9-bit reception is desired, set bit, RX9. If a single reception is required, set bit, SREN. For continuous reception, set bit, CREN. 7. Interrupt flag bit, RC2IF, will be set when reception is complete and an interrupt will be generated if the enable bit, RC2IE, was set. 8. Read the RCSTA2 register to get the 9th bit (if enabled) and determine if any error occurred during reception. 9. Read the 8-bit received data by reading the RCREG2 register. 10. If any error occurred, clear the error by clearing bit, CREN. 11. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. 4. 5. 6.
FIGURE 20-8:
SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
RX2/DT2 pin TX2/CK2 pin Write to bit SREN SREN bit CREN bit `0' RC2IF bit (Interrupt) Read RCREG2 Note:
bit 0
bit 1
bit 2
bit 3
bit 4
bit 5
bit 6
bit 7
`0'
Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0.
TABLE 20-7:
Name INTCON PIR3 PIE3 IPR3 RCSTA2 RCREG2 TXSTA2 SPBRG2
REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION
Bit 7 Bit 6 Bit 5 TMR0IE RC2IF RC2IE RC2IP SREN TXEN Bit 4 INT0IE TX2IF TX2IE TX2IP CREN SYNC Bit 3 RBIE CTMUIF CTMUIE CTMUIP ADDEN -- Bit 2 TMR0IF CCP2IF CCP2IE CCP2IP FERR BRGH Bit 1 INT0IF CCP1IF CCP1IE CCP1IP OERR TRMT Bit 0 RBIF RTCCIF RTCCIE RTCCIP RX9D TX9D Reset Values on Page 49 52 52 52 54 54 54 54
GIE/GIEH PEIE/GIEL -- -- -- SPEN CSRC LCDIF LCDIE LCDIP RX9 TX9
AUSART Receive Register AUSART Baud Rate Generator Register
Legend: -- = unimplemented, read as `0'. Shaded cells are not used for synchronous master reception.
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20.5 AUSART Synchronous Slave Mode
To set up a Synchronous Slave Transmission: 1. Enable the synchronous slave serial port by setting bits, SYNC and SPEN, and clearing bit, CSRC. Clear bits, CREN and SREN. If interrupts are desired, set enable bit, TX2IE. If 9-bit transmission is desired, set bit, TX9. Enable the transmission by setting enable bit, TXEN. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Start transmission by loading data to the TXREG2 register. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. Synchronous Slave mode is entered by clearing bit, CSRC (TXSTA2<7>). This mode differs from the Synchronous Master mode in that the shift clock is supplied externally at the CK2 pin (instead of being supplied internally in Master mode). This allows the device to transfer or receive data while in any low-power mode.
2. 3. 4. 5. 6. 7. 8.
20.5.1
AUSART SYNCHRONOUS SLAVE TRANSMIT
The operation of the Synchronous Master and Slave modes are identical except in the case of the Sleep mode. If two words are written to the TXREG2 and then the SLEEP instruction is executed, the following will occur: a) b) c) d) The first word will immediately transfer to the TSR register and transmit. The second word will remain in the TXREG2 register. Flag bit, TX2IF, will not be set. When the first word has been shifted out of TSR, the TXREG2 register will transfer the second word to the TSR and flag bit, TX2IF, will now be set. If enable bit, TX2IE, is set, the interrupt will wake the chip from Sleep. If the global interrupt is enabled, the program will branch to the interrupt vector.
e)
TABLE 20-8:
Name INTCON PIR3 PIE3 IPR3 RCSTA2 TXREG2 TXSTA2 SPBRG2 LATG
REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION
Bit 7 Bit 6 Bit 5 TMR0IE RC2IF RC2IE RC2IP SREN TXEN -- Bit 4 INT0IE TX2IF TX2IE TX2IP CREN SYNC LATG4 Bit 3 RBIE CTMUIF CTMUIE CTMUIP ADDEN -- LATG3 Bit 2 TMR0IF CCP2IF CCP2IE CCP2IP FERR BRGH LATG2 Bit 1 INT0IF CCP1IF CCP1IE CCP1IP OERR TRMT LATG1 Bit 0 RBIF RTCCIF RTCCIE RTCCIP RX9D TX9D LATG0 Reset Values on Page 49 52 52 52 54 54 54 54 52
GIE/GIEH PEIE/GIEL -- -- -- SPEN CSRC U2OD LCDIF LCDIE LCDIP RX9 TX9 U1OD
AUSART Transmit Register AUSART Baud Rate Generator Register
Legend: -- = unimplemented, read as `0'. Shaded cells are not used for synchronous slave transmission.
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20.5.2 AUSART SYNCHRONOUS SLAVE RECEPTION
To set up a Synchronous Slave Reception: 1. Enable the synchronous master serial port by setting bits, SYNC and SPEN, and clearing bit, CSRC. If interrupts are desired, set enable bit, RC2IE. If 9-bit reception is desired, set bit, RX9. To enable reception, set enable bit, CREN. Flag bit, RC2IF, will be set when reception is complete. An interrupt will be generated if enable bit, RC2IE, was set. Read the RCSTA2 register to get the 9th bit (if enabled) and determine if any error occurred during reception. Read the 8-bit received data by reading the RCREG2 register. If any error occurred, clear the error by clearing bit, CREN. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. The operation of the Synchronous Master and Slave modes is identical except in the case of Sleep or any Idle mode, and bit SREN, which is a "don't care" in Slave mode. If receive is enabled by setting the CREN bit prior to entering Sleep, or any Idle mode, then a word may be received while in this low-power mode. Once the word is received, the RSR register will transfer the data to the RCREG2 register; if the RC2IE enable bit is set, the interrupt generated will wake the chip from low-power mode. If the global interrupt is enabled, the program will branch to the interrupt vector.
2. 3. 4. 5.
6.
7. 8. 9.
TABLE 20-9:
Name INTCON PIR3 PIE3 IPR3 RCSTA2 RCREG2 TXSTA2 SPBRG2
REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION
Bit 7 Bit 6 Bit 5 Bit 4 INT0IE TX2IF TX2IE TX2IP CREN SYNC Bit 3 RBIE CTMUIF CTMUIE CTMUIP ADDEN -- Bit 2 TMR0IF CCP2IF CCP2IE CCP2IP FERR BRGH Bit 1 INT0IF CCP1IF CCP1IE CCP1IP OERR TRMT Bit 0 RBIF RTCCIF RTCCIE RTCCIP RX9D TX9D Reset Values on Page 49 52 52 52 54 54 54 54
GIE/GIEH PEIE/GIEL TMR0IE -- -- -- SPEN CSRC LCDIF LCDIE LCDIP RX9 TX9 RC2IF RC2IE RC2IP SREN TXEN
AUSART Receive Register AUSART Baud Rate Generator Register
Legend: -- = unimplemented, read as `0'. Shaded cells are not used for synchronous slave reception.
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21.0 12-BIT ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE
The ADCON0 register, shown in Register 21-1, controls the operation of the A/D module. The ADCON1 register, shown in Register 21-2, configures the functions of the port pins. The ADCON2 register, shown in Register 21-3, configures the A/D clock source, programmed acquisition time and justification.
The Analog-to-Digital (A/D) Converter module has 12 inputs for all PIC18F87J72 family devices. This module allows conversion of an analog input signal to a corresponding 12-bit digital number. The module has these registers: * * * * * A/D Result High Register (ADRESH) A/D Result Low Register (ADRESL) A/D Control Register 0 (ADCON0) A/D Control Register 1 (ADCON1) A/D Control Register 2 (ADCON2)
REGISTER 21-1:
R/W-0 ADCAL bit 7 Legend: R = Readable bit -n = Value at POR bit 7
ADCON0: A/D CONTROL REGISTER 0
U-0 -- R/W-0 CHS3 R/W-0 CHS2 R/W-0 CHS1 R/W-0 CHS0 R/W-0 GO/DONE R/W-0 ADON bit 0
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
ADCAL: A/D Calibration bit 1 = Calibration is performed on the next A/D conversion 0 = Normal A/D Converter operation (no calibration is performed) Unimplemented: Read as `0' CHS<3:0>: Analog Channel Select bits 0000 = Channel 00 (AN0) 0001 = Channel 01 (AN1) 0010 = Channel 02 (AN2) 0011 = Channel 03 (AN3) 0100 = Channel 04 (AN4) 0101 = Channel 05 (AN5) 0110 = Channel 06 (AN6) 0111 = Channel 07 (AN7) 1000 = Channel 08 (AN8) 1001 = Channel 09 (AN9) 1010 = Channel 10 (AN10) 1011 = Channel 11 (AN11) 11xx = Unused GO/DONE: A/D Conversion Status bit When ADON = 1: 1 = A/D conversion is in progress 0 = A/D is Idle ADON: A/D On bit 1 = A/D Converter module is enabled 0 = A/D Converter module is disabled
bit 6 bit 5-2
bit 1
bit 0
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REGISTER 21-2:
R/W-0 TRIGSEL bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
ADCON1: A/D CONTROL REGISTER 1
U-0 -- R/W-0 VCFG1 R/W-0 VCFG0 R/W-0 PCFG3 R/W-0 PCFG2 R/W-0 PCFG1 R/W-0 PCFG0 bit 0
TRIGSEL: Special Trigger Select bit 1 = Selects the special trigger from the CTMU 0 = Selects the special trigger from the CCP2 Unimplemented: Read as `0' VCFG1: Voltage Reference Configuration bit (VREF- source) 1 = VREF- (AN2) 0 = AVSS VCFG0: Voltage Reference Configuration bit (VREF+ source) 1 = VREF+ (AN3) 0 = AVDD PCFG<3:0>: A/D Port Configuration Control bits: PCFG<3:0> AN11 AN10 AN9 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 A A A A D D D D D D D D D D D D A A A A A D D D D D D D D D D D A A A A A A D D D D D D D D D D AN8 A A A A A A A D D D D D D D D D AN7 A A A A A A A A D D D D D D D D AN6 A A A A A A A A A D D D D D D D AN5 A A A A A A A A A A D D D D D D AN4 A A A A A A A A A A A D D D D D AN3 A A A A A A A A A A A A D D D D AN2 A A A A A A A A A A A A A D D D AN1 A A A A A A A A A A A A A A D D AN0 A A A A A A A A A A A A A A A D
bit 6 bit 5
bit 4
bit 3-0
A = Analog input
D = Digital I/O
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REGISTER 21-3:
R/W-0 ADFM bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
ADCON2: A/D CONTROL REGISTER 2
U-0 -- R/W-0 ACQT2 R/W-0 ACQT1 R/W-0 ACQT0 R/W-0 ADCS2 R/W-0 ADCS1 R/W-0 ADCS0 bit 0
ADFM: A/D Result Format Select bit 1 = Right justified 0 = Left justified Unimplemented: Read as `0' ACQT<2:0>: A/D Acquisition Time Select bits 111 = 20 TAD 110 = 16 TAD 101 = 12 TAD 100 = 8 TAD 011 = 6 TAD 010 = 4 TAD 001 = 2 TAD 000 = 0 TAD(1) ADCS<2:0>: A/D Conversion Clock Select bits 111 = FRC (clock derived from A/D RC oscillator)(1) 110 = FOSC/64 101 = FOSC/16 100 = FOSC/4 011 = FRC (clock derived from A/D RC oscillator)(1) 010 = FOSC/32 001 = FOSC/8 000 = FOSC/2 If the A/D FRC clock source is selected, a delay of one TCY (instruction cycle) is added before the A/D clock starts. This allows the SLEEP instruction to be executed before starting a conversion.
bit 6 bit 5-3
bit 2-0
Note 1:
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The analog reference voltage is software selectable to either the device's positive and negative supply voltage (AVDD and AVSS) or the voltage level on the RA3/AN3/ VREF+ and RA2/AN2/VREF- pins. The A/D Converter has a unique feature of being able to operate while the device is in Sleep mode. To operate in Sleep, the A/D conversion clock must be derived from the A/D's internal RC oscillator. The output of the sample and hold is the input into the converter, which generates the result via successive approximation. Each port pin associated with the A/D Converter can be configured as an analog input or as a digital I/O. The ADRESH and ADRESL registers contain the result of the A/D conversion. When the A/D conversion is complete, the result is loaded into the ADRESH:ADRESL register pair, the GO/DONE bit (ADCON0<1>) is cleared and the A/D Interrupt Flag bit, ADIF, is set. A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off and any conversion in progress is aborted. The value in the ADRESH:ADRESL register pair is not modified for a Power-on Reset. These registers will contain unknown data after a Power-on Reset. The block diagram of the A/D module is shown in Figure 21-1.
FIGURE 21-1:
A/D BLOCK DIAGRAM(1,2)
CHS<3:0>
1011 1010 1001 1000 0111 0110 0101 0100 VAIN 12-Bit A/D Converter (Input Voltage) 0011 0010 VCFG<1:0> AVDD Reference Voltage VREF+ VREFAVSS Note 1: Channels, AN15 through AN12, are not available on PIC18F87J62 devices. 2: I/O pins have diode protection to VDD and VSS. 0001 0000
AN11 AN10 AN9 AN8 AN7 AN6 AN5 AN4 AN3 AN2 AN1 AN0
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After the A/D module has been configured as desired, the selected channel must be acquired before the conversion is started. The analog input channels must have their corresponding TRIS bits selected as inputs. To determine acquisition time, see Section 21.1 "A/D Acquisition Requirements". After this acquisition time has elapsed, the A/D conversion can be started. An acquisition time can be programmed to occur between setting the GO/DONE bit and the actual start of the conversion. The following steps should be followed to do an A/D conversion: 1. Configure the A/D module: * Configure analog pins, voltage reference and digital I/O (ADCON1) * Select A/D input channel (ADCON0) * Select A/D acquisition time (ADCON2) * Select A/D conversion clock (ADCON2) * Turn on A/D module (ADCON0) 6. 7. 2. Configure A/D interrupt (if desired): * Clear ADIF bit * Set ADIE bit * Set GIE bit Wait the required acquisition time (if required). Start conversion: * Set GO/DONE bit (ADCON0<1>) Wait for A/D conversion to complete, by either: * Polling for the GO/DONE bit to be cleared OR * Waiting for the A/D interrupt Read A/D Result registers (ADRESH:ADRESL); clear ADIF bit, if required. For next conversion, go to step 1 or step 2, as required. The A/D conversion time per bit is defined as TAD. A minimum wait of 2 TAD is required before the next acquisition starts.
3. 4. 5.
FIGURE 21-2:
ANALOG INPUT MODEL
VDD VT = 0.6V RIC 1k Sampling Switch SS RSS
RS
ANx
VAIN
CPIN 5 pF VT = 0.6V
ILEAKAGE 100 nA
CHOLD = 25 pF
VSS
Legend: CPIN = Input Capacitance VT = Threshold Voltage ILEAKAGE = Leakage Current at the pin due to various junctions RIC = Interconnect Resistance = Sampling Switch SS = Sample/Hold Capacitance (from DAC) CHOLD RSS = Sampling Switch Resistance
VDD
1 2 3 4 Sampling Switch (k)
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21.1 A/D Acquisition Requirements
For the A/D Converter to meet its specified accuracy, the Charge Holding Capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The analog input model is shown in Figure 21-2. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor, CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD). The source impedance affects the offset voltage at the analog input (due to pin leakage current). The maximum recommended impedance for analog sources is 2.5 k. After the analog input channel is selected (changed), the channel must be sampled for at least the minimum acquisition time before starting a conversion. Note: When the conversion is started, the holding capacitor is disconnected from the input pin. To calculate the minimum acquisition time, Equation 21-1 may be used. This equation assumes that 1/2 LSb error is used (1,024 steps for the A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified resolution. Equation 21-3 shows the calculation of the minimum required acquisition time, TACQ. This calculation is based on the following application system assumptions: CHOLD Rs Conversion Error VDD Temperature = = = = 25 pF 2.5 k 1/2 LSb 3V Rss = 2 k 85C (system max.)
EQUATION 21-1:
TACQ = =
ACQUISITION TIME
Amplifier Settling Time + Holding Capacitor Charging Time + Temperature Coefficient TAMP + TC + TCOFF
EQUATION 21-2:
VHOLD or TC = =
A/D MINIMUM CHARGING TIME
(VREF - (VREF/2048)) * (1 - e(-TC/CHOLD(RIC + RSS + RS))) -(CHOLD)(RIC + RSS + RS) ln(1/2048)
EQUATION 21-3:
TACQ TAMP TCOFF = = = 0.2 s
CALCULATING THE MINIMUM REQUIRED ACQUISITION TIME
TAMP + TC + TCOFF (Temp - 25C)(0.02 s/C) (85C - 25C)(0.02 s/C) 1.2 s -(CHOLD)(RIC + RSS + RS) ln(1/2048) s -(25 pF) (1 k + 2 k + 2.5 k) ln(0.0004883) s 1.05 s 0.2 s + 1 s + 1.2 s 2.4 s
Temperature coefficient is only required for temperatures > 25C. Below 25C, TCOFF = 0 ms. TC =
TACQ
=
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21.2 Selecting and Configuring Automatic Acquisition Time
TABLE 21-1: TAD vs. DEVICE OPERATING FREQUENCIES
Maximum Device Frequency 2.86 MHz 5.71 MHz 11.43 MHz 22.86 MHz 40.0 MHz 40.0 MHz 1.00 MHz(1) AD Clock Source (TAD) Operation 2 TOSC 4 TOSC 8 TOSC 16 TOSC 32 TOSC 64 TOSC RC(2) ADCS<2:0> 000 100 001 101 010 110 x11
The ADCON2 register allows the user to select an acquisition time that occurs each time the GO/DONE bit is set. When the GO/DONE bit is set, sampling is stopped and a conversion begins. The user is responsible for ensuring the required acquisition time has passed between selecting the desired input channel and setting the GO/DONE bit. This occurs when the ACQT<2:0> bits (ADCON2<5:3>) remain in their Reset state (`000') and is compatible with devices that do not offer programmable acquisition times. If desired, the ACQT bits can be set to select a programmable acquisition time for the A/D module. When the GO/DONE bit is set, the A/D module continues to sample the input for the selected acquisition time, then automatically begins a conversion. Since the acquisition time is programmed, there may be no need to wait for an acquisition time between selecting a channel and setting the GO/DONE bit. In either case, when the conversion is completed, the GO/DONE bit is cleared, the ADIF flag is set and the A/D begins sampling the currently selected channel again. If an acquisition time is programmed, there is nothing to indicate if the acquisition time has ended or if the conversion has begun.
Note 1: The RC source has a typical TAD time of 4 s. 2: For device frequencies above 1 MHz, the device must be in Sleep mode for the entire conversion or the A/D accuracy may be out of specification.
21.4
Configuring Analog Port Pins
The ADCON1, TRISA, TRISF and TRISH registers control the operation of the A/D port pins. The port pins needed as analog inputs must have their corresponding TRIS bits set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The A/D operation is independent of the state of the CHS<3:0> bits and the TRIS bits. Note 1: When reading the PORT register, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs will convert an analog input. Analog levels on a digitally configured input will be accurately converted. 2: Analog levels on any pin defined as a digital input may cause the digital input buffer to consume current out of the device's specification limits.
21.3
Selecting the A/D Conversion Clock
The A/D conversion time per bit is defined as TAD. The A/D conversion requires 11 TAD per 12-bit conversion. The source of the A/D conversion clock is software selectable. There are seven possible options for TAD: * * * * * * * 2 TOSC 4 TOSC 8 TOSC 16 TOSC 32 TOSC 64 TOSC Internal RC Oscillator
For correct A/D conversions, the A/D conversion clock (TAD) must be as short as possible but greater than the minimum TAD. Table 21-1 shows the resultant TAD times derived from the device operating frequencies and the A/D clock source selected.
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21.5 A/D Conversions 21.6 Use of the CCP2 Trigger
Figure 21-1 shows the operation of the A/D Converter after the GO/DONE bit has been set and the ACQT<2:0> bits are cleared. A conversion is started after the following instruction to allow entry into Sleep mode before the conversion begins. Figure 21-2 shows the operation of the A/D Converter after the GO/DONE bit has been set. The ACQT<2:0> bits are set to `010' and a 4 TAD acquisition time is selected before the conversion starts. Clearing the GO/DONE bit during a conversion will abort the current conversion. The A/D Result register pair will NOT be updated with the partially completed A/D conversion sample. This means the ADRESH:ADRESL registers will continue to contain the value of the last completed conversion (or the last value written to the ADRESH:ADRESL registers). After the A/D conversion is completed or aborted, a 2 TAD wait is required before the next acquisition can be started. After this wait, acquisition on the selected channel is automatically started. Note: The GO/DONE bit should NOT be set in the same instruction that turns on the A/D. An A/D conversion can be started by the "Special Event Trigger" of the CCP2 module. This requires that the CCP2M<3:0> bits (CCP2CON<3:0>) be programmed as `1011' and that the A/D module is enabled (ADON bit is set). When the trigger occurs, the GO/DONE bit will be set, starting the A/D acquisition and conversion, and the Timer1 (or Timer3) counter will be reset to zero. Timer1 (or Timer3) is reset to automatically repeat the A/D acquisition period with minimal software overhead (moving ADRESH:ADRESL to the desired location). The appropriate analog input channel must be selected and the minimum acquisition period is either timed by the user or an appropriate TACQ time is selected before the Special Event Trigger sets the GO/DONE bit (starts a conversion). If the A/D module is not enabled (ADON is cleared), the Special Event Trigger will be ignored by the A/D module, but will still reset the Timer1 (or Timer3) counter.
FIGURE 21-1:
A/D CONVERSION TAD CYCLES (ACQT<2:0> = 000, TACQ = 0)
b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 Discharge (typically 200 ns)
TCY - TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 TAD12 TAD13 TAD1
Conversion starts Holding capacitor is disconnected from analog input (typically 100 ns) Set GO/DONE bit
On the following cycle: ADRESH:ADRESL are loaded, GO/DONE bit is cleared, ADIF bit is set, holding capacitor is connected to analog input
FIGURE 21-2:
A/D CONVERSION TAD CYCLES (ACQT<2:0> = 010, TACQ = 4 TAD)
TAD Cycles 4 1 2 b11 3 b10 4 b9 5 b8 6 b7 7 b6 8 b5 9 b4 10 b3 11 b2 12 b1 13 b0 TAD1 Discharge (typically 200 ns)
TACQT Cycles 1 2 3
Automatic Acquisition Time
Conversion starts (Holding capacitor is disconnected)
Set GO/DONE bit (Holding capacitor continues acquiring input)
On the following cycle: ADRESH:ADRESL are loaded, GO/DONE bit is cleared, ADIF bit is set, holding capacitor is connected to analog input
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21.7 A/D Converter Calibration
The A/D Converter in the PIC18F87J72 family of devices includes a self-calibration feature which compensates for any offset generated within the module. The calibration process is automated and is initiated by setting the ADCAL bit (ADCON0<7>). The next time the GO/DONE bit is set, the module will perform a "dummy" conversion (which means it is reading none of the input channels) and store the resulting value internally to compensate for the offset. Thus, subsequent offsets will be compensated. The calibration process assumes that the device is in a relatively steady-state operating condition. If A/D calibration is used, it should be performed after each device Reset or if there are other major changes in operating conditions. If the A/D is expected to operate while the device is in a power-managed mode, the ACQT<2:0> and ADCS<2:0> bits in ADCON2 should be updated in accordance with the power-managed mode clock that will be used. After the power-managed mode is entered (either of the power-managed Run modes), an A/D acquisition or conversion may be started. Once an acquisition or conversion is started, the device should continue to be clocked by the same power-managed mode clock source until the conversion has been completed. If desired, the device may be placed into the corresponding power-managed Idle mode during the conversion. If the power-managed mode clock frequency is less than 1 MHz, the A/D RC clock source should be selected. Operation in Sleep mode requires the A/D RC clock to be selected. If bits, ACQT<2:0>, are set to `000' and a conversion is started, the conversion will be delayed one instruction cycle to allow execution of the SLEEP instruction and entry to Sleep mode. The IDLEN and SCSx bits in the OSCCON register must have already been cleared prior to starting the conversion.
21.8
Operation in Power-Managed Modes
The selection of the automatic acquisition time and A/D conversion clock is determined in part by the clock source and frequency while in a power-managed mode.
TABLE 21-2:
Name INTCON PIR1 PIE1 IPR1 PIR3 PIE3 IPR3 ADRESH ADRESL ADCON0 ADCON1 ADCON2 CCP2CON PORTA TRISA PORTF TRISF
SUMMARY OF A/D REGISTERS
Bit 7 Bit 6 Bit 5 TMR0IE RC1IF RC1IE RC1IP RC2IF RC2IE RC2IP Bit 4 INT0IE TX1IF TX1IE TX1IP TX2IF TX2IE TX2IP Bit 3 RBIE SSPIF SSPIE SSPIP CTMUIF CTMUIE CTMUIP Bit 2 TMR0IF -- -- -- CCP2IF CCP2IE CCP2IP Bit 1 INT0IF TMR2IF TMR2IE TMR2IP CCP1IF CCP1IE CCP1IP Bit 0 RBIF TMR1IF TMR1IE TMR1IP RTCCIF RTCCIE RTCCIP Reset Values on Page 49 52 52 52 52 52 52 51 51 CHS2 VCFG0 ACQT1 DC2B0 RA4 TRISA4 RF4 TRISF4 CHS1 PCFG3 ACQT0 CCP2M3 RA3 TRISA3 RF3 TRISF3 CHS0 PCFG2 ADCS2 CCP2M2 RA2 TRISA2 RF2 TRISF2 GO/DONE PCFG1 ADCS1 CCP2M1 RA1 TRISA1 RF1 TRISF1 ADON PCFG0 ADCS0 CCP2M0 RA0 TRISA0 -- -- 51 51 51 53 52 52 52 52
GIE/GIEH PEIE/GIEL -- -- -- -- -- -- ADIF ADIE ADIP LCDIF LCDIE LCDIP
A/D Result Register High Byte A/D Result Register Low Byte ADCAL TRIGSEL ADFM -- RA7(1) TRISA7(1) RF7 TRISF5 -- -- -- -- RA6(1) TRISA6(1) RF6 TRISF4 CHS3 VCFG1 ACQT2 DC2B1 RA5 TRISA5 RF5 TRISF5
Legend: -- = unimplemented, read as `0'. Shaded cells are not used for A/D conversion. Note 1: RA<7:6> and their associated latch and direction bits are configured as port pins only when the internal oscillator is selected as the default clock source (FOSC2 Configuration bit = 0); otherwise, they are disabled and these bits read as `0'.
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NOTES:
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22.0 DUAL-CHANNEL, 24-BIT ANALOG FRONT END (AFE)
AFE data and control functions are accessed through a dedicated register map. The map contains 24-bit wide data words for each ADC (readable as 8-bit registers), as well as five writable control registers to program amplifier gain, oversampling, phase, resolution, dithering, shutdown, Reset and communication features. Communication is largely simplified with various continuous read modes that can be accessed through the serial interface and with a separate data ready pin that can directly be connected to a microcontroller's IRQ input. Because of the complexity of and comprehensive options available on the AFE, a detailed explanation of all of its functional elements is not provided in this chapter. These are described in Appendix B: "Dual-Channel, 24-Bit AFE Reference". This chapter explains the important points of configuring and using the AFE in a PIC18F8XJ72 based application. Direct links to relevant information in the AFE reference are provided throughout the chapter for the reader's convenience.
The dual-channel, 24-bit Analog Front End (AFE) is an integrated, high-performance analog subsystem that has been tailored for energy metering and power measurement applications. The AFE contains two synchronous sampling Delta-Sigma Analog-to-Digital Converters ( ADC), two PGAs, a phase delay compensation block, an internal voltage reference and a dedicated, high-speed 20 MHz SPI compatible serial interface. A functional block diagram of the AFE is shown in Figure 22-1. The A/D Converters contain a proprietary dithering algorithm for reduced Idle tones and improved THD. Each converter is preceded by a PGA, allowing for weak signal amplification and true differential voltage inputs to the converters. This allows the AFE to interface with a large variety of voltage and current sensors including shunts, current transformers, Rogowski coils and Hall effect sensors.
FIGURE 22-1:
REFIN+/OUT+
DUAL-CHANNEL ANALOG FRONT END FUNCTIONAL DIAGRAM
SAVDD Voltage VREFEXT Reference + VREF VREF-/VREF+ ANALOG DIGITAL SINC3 + PGA D-S Modulator F SVDD AMCLK DMCLK/DRCLK Clock Generation MCLK CLKIA
REFIN -
DMCLK
OSR<1:0> PRE<1:0>
CH0+ CH0-
DATA_CH0<23:0> DR SDOA ARESET SDIA SCKA CSA
Phase Shifter
PHASE <7:0> Digital SPI Interface
CH1+ CH1-
+ PGA D-S Modulator SINC3
DATA_CH1<23:0>
DUAL-DS ADC POR SVDD Monitoring SDN<1:0>, RESET<1:0>, GAIN<7:0> POR SAVSS SVSS
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22.1 Functional Overview
22.1.4 SINC3 FILTER
While it is convenient to think of the dual-channel AFE as a high-precision ADC, there are actually many more components involved. The main components are described below. The dual-channel AFE reference provides more in-depth information on each. Both ADCs include a decimation filter that is a third-order sinc (or notch) filter. This filter processes the multi-bit stream into either 16-bit or 24-bit words, depending on the configuration chosen. The settling time of the filter is three DMCLK periods. The resolution achievable at the output of the sinc filter (the output of the ADC) is dependent on the oversampling ratio selected.
22.1.1
DELTA-SIGMA ADC ARCHITECTURE
Each Delta-Sigma ADC is an oversampling converter that incorporates a built-in modulator which is digitizing the quantity of charge integrated by the modulator loop. The quantizer is the block that is performing the analog-to-digital conversion. The quantizer is typically 1-bit, or a simple comparator, which helps to maintain the linearity performance of the ADC (the DAC structure is, in this case, inherently linear). Multi-bit quantizers help to lower the quantization error (the error fed back in the loop can be very large with 1-bit quantizers) without changing the order of the modulator or the OSR which leads to better SNR figures. However, typically, the linearity of such architectures is more difficult to achieve since the DAC is no more simple to realize and its linearity limits the THD of such ADCs. The 5-level quantizer is a Flash ADC composed of 4 comparators arranged with equally spaced thresholds and a thermometer coding. The AFE also includes proprietary 5-level DAC architecture that is inherently linear for improved THD figures. The resulting channel data is either a 16-bit or 24-bit word, presented in 23-bit or 15-bit plus sign, two's complement format and is MSb (left) justified.
22.1.4.1
Internal Voltage Reference
The AFE contains an internal voltage reference source specially designed to minimize drift over temperature. This internal VREF supplies reference voltage to both channels. The typical value of this voltage reference is 2.37V 2%. The internal reference has a very low typical temperature coefficient of 12 ppm/C, allowing the output codes to have minimal variation with respect to temperature since they are proportional to (1/VREF). The output pin for the internal voltage reference is REFIN+/OUT. Optionally, the AFE can be configured to use an external voltage reference supplied on the REFIN+ and REFIN- pins.
22.1.5
PHASE DELAY BLOCK
The AFE incorporates a phase delay generator which ensures that the two ADCs are converting the inputs with a fixed delay between them. The two ADCs are synchronously sampling but the averaging of modulator outputs is delayed, so that the SINC filter outputs (thus, the ADC outputs) show a fixed phase delay, configured by the PHASE register.
22.1.2
ANALOG INPUTS (CHn+/-)
22.1.6
INTERNAL AFE CLOCK
The analog inputs can be connected directly to current and voltage transducers. Each input pin is protected by specialized ESD structures that are certified to pass 7 kV HBM and 400V MM contact charge. These structures allow bipolar 6V continuous voltage with respect to SAVSS, to be present at their inputs without the risk of permanent damage.
The AFE uses an external clock signal to operate its internal digital logic. The AFE includes a clock generation chain of back-to-back dividers to produce a range of sampling frequencies.
22.1.7
SERIAL INTERFACE
22.1.3
PROGRAMMABLE GAIN AMPLIFIERS (PGA)
The AFE uses an SPI-compatible slave serial interface. Its operation is discussed in Section 22.3 "Serial Interface".
The two Programmable Gain Amplifiers (PGAs) reside at the front-end of each Delta-Sigma ADC. They have two functions: translate the common-mode of the input from SAVss to an internal level between SAVSS and SAVDD, and amplify the input differential signal. The translation of the common-mode does not change the differential signal, but recenters the common-mode so that the input signal can be properly amplified. The PGA block can be used to amplify very low signals, but the differential input range of the Delta-Sigma modulator must not be exceeded.
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22.2 AFE Register Map
The dual-channel AFE uses its own internal registers for data and control. This memory is not mapped to the microcontroller's SFR space, but is accessed through the AFE's serial interface. The memory space is divided into eight registers: * Two 24-bit registers, one for the data of each ADC * Five 8-bit control registers * One reserved 8-bit register address Although the data registers are 24 bits wide, they may be directly addressed as three different 8-bit registers. The complete memory map is listed in Table 22-1.
.
All registers are fully described in Section B.6 "Internal Registers" of the AFE reference. Registers may be read singly in a single read operation; continuously, as part of a group of registers; or continuously, by type (i.e., data registers vs. control registers). The type of read operation is handled through the AFE's serial interface by selecting the type of read operation. The grouping of registers is shown in Table 22-2. A complete description of the different read operations and how to implement them is described in Section B.5.3 "Reading from the Device" of the AFE reference.
TABLE 22-1:
Address 00h 03h 06h 07h 08h 09h 0Ah 0Bh
AFE REGISTER MAP
Name DATA_CH0 DATA_CH1 Reserved PHASE GAIN STATUS/COM CONFIG1 CONFIG2 Bits 24 24 8 8 8 8 8 8 R/W R R -- Description Channel 0 ADC Data <23:0>, MSB First Channel 1 ADC Data <23:0>, MSB First Reserved; ignore reads, do not write
R/W Phase Delay Configuration Register R/W Gain Configuration Register R/W Status/Communication Register R/W Configuration Register 1 R/W Configuration Register 2
TABLE 22-2:
Function
REGISTER MAP GROUPING FOR CONTINUOUS READ MODES
Address 00h READ<1:0> "01" Group Type Group Loop Entire Register Map "10" "11"
DATA_CH0
01h 02h 03h
DATA_CH1 PHASE GAIN STATUS/COM CONFIG1 CONFIG2
04h 05h 07h 08h 09h 0Ah 0Bh
Group Type Group
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22.3
22.3.1
Serial Interface
OVERVIEW
22.3.3
READING FROM THE DEVICE
All communication with the dual-channel AFE is handled through its serial interface; this includes the exchange of data with the PIC18F8XJ72 device itself. This arrangement allows the AFE to direct data with other microcontrollers on an SPI bus in complex applications, and work cooperatively with other SPI enabled analog devices. The serial interface is an SPI-compatible slave interface, compatible with SPI modes, 0,0 and 1,1. Data is clocked out of the AFE on the falling edge of SCKA and, clocked into the device on the rising edge of SCKA. In these modes, SCKA can Idle either high or low. A complete discussion of the serial interface is provided in Section B.5 "Serial Interface Description" of the AFE Reference.
The first data byte read is the one defined by the address given in the control byte. After this first byte is transmitted, if the CSA pin is held low, the communication continues and the address of the next transmitted byte is determined by the configuration of the interface, set by the read bits in the STATUS/COM register.
22.3.4
WRITING TO THE DEVICE
22.3.2
CONTROL BYTE
The first data byte written is the one defined by the address given in the control byte. The write communication automatically increments the address for subsequent bytes. The address of the next transmitted byte within the same communication (CSA stays low) is the next address defined on the register map. At the end of the register map, the address loops to the beginning of the register map. Writing a non-writable register has no effect. The SDOA pin remains in a high-impedance state during a write communication.
The first byte transmitted to the AFE is always a control byte. This byte is composed of three fields (Figure 22-2): * Two address bits (A<6:5>, the MSbs) * Five register address bits (A<4:0>) * One Read/Write bit (R/W, the LSbs) The AFE interface is device-addressable (through A<6:5>), so that multiple devices can be present on the same SPI bus with no data bus contention. This functionality allows external SPI Master devices on the bus, such as another microcontroller, to read and share data. It also enables three-phase power metering systems containing two additional analog front end devices, controlled by a single SPI bus (single CS, SCK, SDI and SDO pins). The SPI device address bits of the PIC18F87J72 interface are always `00'; they cannot be changed.
22.3.5
CONTINUOUS COMMUNICATION AND LOOPING ON ADDRESS SETS
If the user wishes to read back one or both of the ADC channels continuously, the internal address counter of the AFE can be set to loop on specific register sets. This method also makes it possible to continuously read specific register groups, one of the register types or all of the registers. In each case, one control byte on SDIA starts the communication. The part stays within the same loop until CSA returns high. Continuous communication is described in more detail in Section B.5.7 "Continuous Communication, Looping On Address Sets" of the AFE Reference.
22.3.6
DATA READY PIN (DR)
FIGURE 22-2:
A6 A5 A4
CONTROL BYTE
A3 A2 A1 A0 R/W Read Write Bit
Device Address Bits
Register Address Bits
In addition to the standard SPI interface pins (SDIA, SDOA, SCKA and CSA), the AFE provides an additional Data Ready (DR) signal. This signifies to an external device when conversion data is available. The DR signal, available on the pin of the same name, is an active-low pulse at the end of a channel conversion, with a period that is equal to the DRCLK clock period and with a width equal to one DMCLK period. The DR pin can be configured to operate in different modes that are defined by the availability of conversion data on the ADC channels. The various Data Ready modes and configuration options for the DR pin are described in Section B.5.9 "Data Ready Pin (DR)" of the AFE Reference.
A read on undefined addresses gives an output of all zeros on the first and all subsequent transmitted bytes. Writing to an undefined address has no effect and does not increment the address counter either.
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22.4 AFE Connections
The dual-channel AFE has multiple data and power connections that are independent of the digital side of the microcontroller. These connections are required to use the AFE, and are in addition to the connection and layout connections provided in Section 2.0 "Guidelines for Getting Started with PIC18FJ Microcontrollers". All of the connections required for proper operation of the AFE are shown in Figure 22-3. which requires a voltage of 4.5V to 5.5V (5V 10%). Independent ground returns are provided through the SVss and SAVss pins, respectively. As with the microcontroller's VDD/VSS and AVDD/AVSS pins, bypass capacitors are required on the AFE power and return pin pairs. Requirements for these capacitors are identical to those for the VDD/VSS and AVDD/AVSS pins. It is recommended that designs using PIC18F87J72 family devices incorporate a separate ground return path for analog circuits. SAVss, as well as other AFE analog pins (e.g., REFIN-) that require grounding, should be tied to this analog return. SVSS can be tied to the digital ground, along with VSS and AVSS. The analog and digital grounds may be tied to a single point at the power source.
22.4.1
VOLTAGE AND GROUND CONNECTIONS
The AFE has independent voltage supply requirements that differ from the rest of the microcontroller. Digital circuits are supplied through the SVDD pin, which requires a voltage of 2.7V to 5.5V. Typically, SVDD can be tied to 3.3V, the same as the VDD and AVDD pins. Analog circuits are separately supplied through the SAVDD pin,
FIGURE 22-3:
REQUIRED CONNECTIONS FOR AFE OPERATION
ARESET
GPIO(1)
GPIO(1) SDOA SCKA CSA INT0 SDO SDI SCK CCP1(2) CLKIA REFINDR
CH0CH0+
Differential Analog Inputs
CH1CH1+ SAVDD
PIC18F8XJ72
SVDD (3.3V) C1 C2 C3 SAVDD (5V) C4
Analog GND Key (all values are recommendations): C1 and C2: 0.1 F, 20V ceramic C3 and C4: 100 nF, 20V ceramic. Bold lines show SPI connections. Note 1: 2: Any available I/O pins may be used to control ARESET and CSA. The software examples discussed in this chapter use RD0 and RD7, respectively. The software examples discussed in this chapter use CCP1 to generate the AFE clock source. Other clock sources may be used, as required.
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REFIN+/OUT
SAVSS
SVDD
SVSS
SDIA
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22.4.2 SERIAL INTERFACE CONNECTIONS
The AFE uses its own dedicated Serial Peripheral Interface (SPI) to both send output data from its A/D Converters, and send and receive control information. The interface allows the AFE to operate directly with other microcontrollers and analog peripherals that use SPI on a common serial bus. To use the interface, the following connections are required between the AFE and the MSSP module: * from SDO (RC5) to SDIA * from SDI (RC4) to SDOA * from SCK (RC3) to SCKA In addition, the AFE requires a chip select signal on the CSA pin (active-low) to function properly. The chip select signal can be supplied by any available I/O pin. The REFIN+/OUT and REFIN- pins are used to supply an external voltage reference to the AFE; the REFIN+/OUT pin can also be configured to provide voltage generated by the AFE's internal voltage reference. If the internal voltage reference is enabled, bypass capacitors to analog ground are recommended for the REFIN+/OUT pin. The REFIN- pin should be directly connected to analog ground (as shown in Figure 22-3).
22.5
Using the AFE
To configure the AFE and read A/D conversion data, follow this sequence: 1. Initialize the MSSP module: a) Configure for SPI Master mode, in either SPI mode 0,0 (CKP = 0, CKE = 1) or mode 1,1 (CKP = 1, CKE = 0). b) Configure TRISC for SCK and SDO as outputs, and SDI as input. Reset the AFE by pulling ARESET low. Pull CSA high. Disable the chip select signals of all the devices connected to the same SPI bus. Pull CSA low, then write the register address with command (read or write selection) to the AFE through the SPI. As long as CSA is enabled, the address will increment automatically after each SPI transfer is completed. After sending the address and command, the registers of the AFE can be written or read. Disable CSA after read or write to a set of AFE registers. Note: The first byte sent to the AFE upon initialization must always be a control byte. See Appendix B.5 "Serial Interface Description" for more information.
22.4.3
OTHER INTERFACE CONNECTIONS
In addition to the SPI connections, the AFE requires three other digital signals for proper control: * the Data Ready (DR) output, asserted low to signal that a conversion has been completed and is ready to be transferred; * a module Reset (ARESET), asserted low to independently force the AFE into a POR event; and * a clock for the AFE's digital circuits, supplied on the CLKIA pin. To use the Data Ready, tie the DR pin to an external interrupt pin, such as INT0. Asserting DR will cause an interrupt, the ISR for which can be used to read the AFE's data through the SPI. Note that whatever interrupt trigger is used, it must be properly configured to trigger when the pin is asserted low. For the Reset input, use an available I/O pin to drive ARESET low when needed. For the AFE clock signal, any suitable clock signal in the proper frequency range (1 MHz to 5 MHz) can be used. One convenient and low pin count method is to use a CCP module in PWM mode to generate an appropriate clock, then connect the module's output pin to CLKIA.
2. 3. 4. 5.
6.
When the DR signal is asserted, signalling that an A/D conversion is complete, use an interrupt routine to read the data from one or both channels. The overall method is similar to that for reading other AFE registers over the SPI, described in step 5.
22.4.4
ANALOG INPUTS
The analog signals to be converted to digital values are connected to the pins of CH0 and/or CH1. Each channel has inverting and non-inverting inputs (CHn- and CHn+, respectively), and is fully differential. Limits and absolute maximums for the inputs are described in Section 29.0 "Electrical Characteristics".
Note that SPI operations to read or write the AFE's registers can be performed even without providing CLKIA to the AFE. The CLKIA signal is required to perform A/D conversions and make the Data Ready (DR) signal available after conversions are done.
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Example 22-1 provides a general outline for implementing a driver routine for the AFE. Example 22-2 through Example 22-5 show the details for each step. The example shown here assumes the following loopback connections: * * * * * * * RC4 (SDI) to SDOA RC5 (SDO) to SDIA RC3 (SCK) to SCKA RD0 to ARESET RD7 to CSA RC2 (CCP1) to CLKIA RB0 (INT0) to DR Aside from the SPI, which is determined by the microcontroller's single MSSP module, the other connections may change based on the particular application's requirements. For example, the AFE clock on CLKIA is generated from the PWM of CCP1 in this demonstration; other clock sources may be available. Users should modify the individual code segments accordingly.
EXAMPLE 22-1:
OVERALL STRUCTURE FOR USING THE AFE
/////////////////////////////////////////////////////////////////////////////////////////////// // Outline of a typical driver routine for the dual-channel AFE. /////////////////////////////////////////////////////////////////////////////////////////////// #include "p18F87J72.h" void main(void) { /////////////////////////////////////////////////////////////////////////////////// // STEP 1:Initialize MSSP (Example 22-2) //////////////////////////////////////////////////////////////////////////////////// ///////////////////////////////////////////////////////////////////////////////////// // STEP 2: Issue Reset to AFE (Example 22-2) ///////////////////////////////////////////////////////////////////////////////////// //////////////////////////////////////////////////////////////////////////////////// // STEPS 3: Disable all Chip Selects on all SPI devices (Example 22-2) //////////////////////////////////////////////////////////////////////////////////// //////////////////////////////////////////////////////////////////////////////////////////// // STEP 4: Write to AFE registers; read back (optionally) to confirm settings (Example 22-4) //////////////////////////////////////////////////////////////////////////////////////////// ///////////////////////////////////////////////////////////////////////////////////////////// // STEP 5: Configure CCP1 to serve as AFE clock source (Example 22-3) ///////////////////////////////////////////////////////////////////////////////////////////// ///////////////////////////////////////////////////////////////////////////////////////////// ///STEP 6: Configure Interrupt INT0 for use with DR pin (Example 22-3) ///////////////////////////////////////////////////////////////////////////////////////////// while(1); } ///////////////////////////////////////////////////////////////////////////////////////////// //STEP 7: ISR for reading AFE data (Example 22-5) ////////////////////////////////////////////////////////////////////////////////////////////
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EXAMPLE 22-2: INITIALIZING THE MSSP MODULE
/////////////////////////////////////////////////////////////////////////////////// // STEP 1: Initialize the MSSP in SPI Master mode to access the AFE // Connections: SCK--SCKA, SDI--SDOA, SDO--SDIA //////////////////////////////////////////////////////////////////////////////////// SSPCON1bits.CKP = 1; SSPCON1bits.CKE = 0; SSPCON1bits.CKP = 0; SSPCON1bits.CKE = 1; SSPCON1bits.SSPEN = 1; TRISCbits.TRISC3 = 0; TRISCbits.TRISC4 = 1; TRISCbits.TRISC5 = 0; // // // // // // // // SPI mode 1,1: idle state for SCK is high, data transmitted on transition from idle to active state If SPI mode 0,0 is used instead, SCK idle state is low, data trasmitted on transition from active to idle state Enable SPI define SCK pin as output define SDI pin as input define SDO pin as output
// //
/////////////////////////////////////////////////////////////////////////////// // STEP 2: Issue Reset to AFE. ARESET pin is connected to RD0 in this example ///////////////////////////////////////////////////////////////////////////////////// LATDbits.LATD0 = 0; TRISDbits.TRISD0=0; LATDbits.LATD0 = 1;
// Put the Delta Sigma ADC module in reset // Release the Delta Sigma ADC module from reset
//////////////////////////////////////////////////////////////////////////////////// // STEP 3: // Disable all chip selects for all devices connected to SPI, including chip select // for the AFE. CSA is connected to RD7 in this example //////////////////////////////////////////////////////////////////////////////////// TRISDbits.TRISD7=0; LATDbits.LATD7=1;
EXAMPLE 22-3:
AFE CLOCK SOURCE AND INTERRUPT CONFIGURATION
/////////////////////////////////////////////////////////////////////////////////////////////// // STEP 5: Set up Clock to AFE. // Connections: In this example CLKIA is connected to CCP1. /////////////////////////////////////////////////////////////////////////////////////////////// CCP1CON |= 0b00001100; // ccpxm3:ccpxm0 11xx=pwm mode CCPR1L=0x01; // 50% Duty Cycle Clock TRISCbits.TRISC2 = 0; // Make RC2 Output; RC2 is connected to CLKIA of AFE T2CONbits.TMR2ON = 0; // STOP TIMER2 registers to POR state PR2 = 0x01; // Set period T2CONbits.TMR2ON = 1; // Turn on PWM1 /////////////////////////////////////////////////////////////////////////////////////////////// // STEP 6: Interrupt Configuration // DR output of AFE can be used as interrupt. It can be connected to any external interrupt, // like INT0. It can be declared as low or high priority interrupt. // This example configures INT0 (connected to DR)as a high-priority interrupt. /////////////////////////////////////////////////////////////////////////////////////////////// RCONbits.IPEN=1; INTCON2bits.RBPU=0; INTCON2bits.INTEDG0=0; INTCONbits.GIEH = 1; INTCONbits.INT0IE = 1; //Priority Interrupt //Enable INT0 pull-up; required //Falling edge select; DR is active low pulse //Enable high pririty interrupts //Enable INT0 interrupt
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EXAMPLE 22-4: WRITING AND READING AFE REGISTERS THROUGH THE MSSP
/////////////////////////////////////////////////////////////////////////////////////////////// // STEP 4: Write to AFE registers // Initialize the AFE by writing to PHASE, GAIN, STATUS, CONFIG1 and CONFIG2 registers. // Below is an example. The registers can be programmed with values as required // by the application. /////////////////////////////////////////////////////////////////////////////////////////////// LATDbits.LATD7=0; if (SSPSTATbits.BF==1) Dummy_Read=SSPBUF; SSPBUF = 0x0E; while(!SSPSTATbits.BF); Dummy_Read=SSPBUF; SSPBUF =0x00; while(!SSPSTATbits.BF); Dummy_Read=SSPBUF; SSPBUF =0x04; while(!SSPSTATbits.BF); Dummy_Read=SSPBUF; SSPBUF = 0xA0; while(!SSPSTATbits.BF); Dummy_Read=SSPBUF; SSPBUF = 0x10; while(!SSPSTATbits.BF); Dummy_Read=SSPBUF; SSPBUF = 0x01; while(!SSPSTATbits.BF); Dummy_Read=SSPBUF; LATDbits.LATD7=1; //Chipselect enable for Delta Sigma ADC
//Address and Write command for Gain Register // A6-A5--->00;A4-A0---->0x07;R/W---0 for write //Dummy read to clear Buffer Full Status bit //PHASE Register: No Delay
//Address automatically incremented GAIN Register //CH1 gain 16, CH0 gain 1, No Boost
//Address automatically incremented STATUS Register //Default values
//Address automatically incrementedData for CONFIG1 Register //No Dither, Other values are default
//Address automatically incremented Data for CONFIG2 Register //CLKEXT bit should be always programmed to 1
//Disable chip select after read/write of each set of registers
/////////////////////////////////////////////////////////////////////////////////////////////// // Read from AFE registers to verify; this step is optional and does not affect AFE Operation. // As an example, only GAIN, STATUS, CONFIG1 and CONFIG2 are read. /////////////////////////////////////////////////////////////////////////////////////////////// LATDbits.LATD7=0; SSPBUF = 0x11; while(!SSPSTATbits.BF); Dummy_Read=SSPBUF; SSPBUF =0x00; while(!SSPSTATbits.BF); D_S_ADC_data1=SSPBUF; SSPBUF =0x00; while(!SSPSTATbits.BF); D_S_ADC_data2=SSPBUF; SSPBUF =0x00; while(!SSPSTATbits.BF); D_S_ADC_data3=SSPBUF; SSPBUF = 0x00; while(!SSPSTATbits.BF); D_S_ADC_data4=SSPBUF; LATDbits.LATD7=1; //Chip select enable for AFE //Address and Read command for Gain Register // A6-A5--->00;A4-A0---->0x08;R/W---1 for read //Dummy read to clear Buffer Full Status bit
//Data from GAIN Register
//Data from STATUS Register, Address automatically incremented
//Data from CONFIG1 Register, Address automatically incremented
//Data from CONFIG2 Register, Address automatically incremented //Disable chip select after read/write of each set of registers
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EXAMPLE 22-5: READING DATA FROM AFE DURING INTERRUPT
///////////////////////////////////////////////////////////////////////////////////////////// // STEP 7: Reading AFE results in Interrupt Routine. // ADC is configured in 16-bit result mode, thus 16-bit result of each Channel can be read. // In this example DR is connected to INT0; after each convesion, DR issues interrupt to INT0. // INT0 is configured as high priority interrupt //////////////////////////////////////////////////////////////////////////////////////////// #pragma interrupt High_isr_routine void High_isr_routine(void) { char D_S_ADC_data1=0,D_S_ADC_data2=0,D_S_ADC_data3=0,D_S_ADC_data4=0,Dummy_Read=0; if((INTCONbits.INT0IF)&&(INTCONbits.INT0IE)) { // Disable all Chip selects of other devices connected to SPI LATDbits.LATD7=0; //Chip select enable for Delta Sigma ADC SSP1BUF = 0x01; //Address and Read command for Channel0 result MSB register while(!SSPSTATbits.BF); Dummy_Read=SSPBUF; //Dummy read to clear Buffer Full Status bit SSPBUF =0x00; while(!SSPSTATbits.BF); D_S_ADC_data1=SSPBUF; //Data from Channel0 MSB SSPBUF = 0x00; while(!SSPSTATbits.BF); D_S_ADC_data2=SSPBUF; //Data from Channel0 LSB, Address automatically incremented SSPBUF = 0x00; while(!SSPSTATbits.BF); D_S_ADC_data3=SSPBUF; //Data from Channel1 MSB, Address automatically incremented SSPBUF = 0x00; while(!SSPSTATbits.BF); D_S_ADC_data4=SSPBUF; //Data from Channel1 LSB, Address automatically incremented LATDbits.LATD7=1; //Disable chip select after read/write of registers INTCONbits.INT0IF=0; } } #pragma code High_isr=0x08 void High_ISR(void) { _asm goto High_isr_routine _endasm } //Clear INT0IF for next interrupt
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23.0 COMPARATOR MODULE
The analog comparator module contains two comparators that can be configured in a variety of ways. The inputs can be selected from the analog inputs multiplexed with pins, RF1 through RF6, as well as the on-chip voltage reference (see Section 24.0 "Comparator Voltage Reference Module"). The digital outputs (normal or inverted) are available at the pin level and can also be read through the control register. The CMCON register (Register 23-1) selects the comparator input and output configuration. Block diagrams of the various comparator configurations are shown in Figure 23-1.
REGISTER 23-1:
R-0 C2OUT bit 7 Legend: R = Readable bit -n = Value at POR bit 7
CMCON: COMPARATOR MODULE CONTROL REGISTER
R-0 R/W-0 C2INV R/W-0 C1INV R/W-0 CIS R/W-1 CM2 R/W-1 CM1 R/W-1 CM0 bit 0
C1OUT
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
C2OUT: Comparator 2 Output bit When C2INV = 0: 1 = C2 VIN+ > C2 VIN0 = C2 VIN+ < C2 VINWhen C2INV = 1: 1 = C2 VIN+ < C2 VIN0 = C2 VIN+ > C2 VINC1OUT: Comparator 1 Output bit When C1INV = 0: 1 = C1 VIN+ > C1 VIN0 = C1 VIN+ < C1 VINWhen C1INV = 1: 1 = C1 VIN+ < C1 VIN0 = C1 VIN+ > C1 VINC2INV: Comparator 2 Output Inversion bit 1 = C2 output is inverted 0 = C2 output is not inverted C1INV: Comparator 1 Output Inversion bit 1 = C1 output is inverted 0 = C1 output is not inverted CIS: Comparator Input Switch bit When CM<2:0> = 110: 1 = C1 VIN- connects to RF5/AN10/CVREF/SEG23/C1INB C2 VIN- connects to RF3/AN8/SEG21/C2INB 0 = C1 VIN- connects to RF6/AN11/SEG24/C1INA C2 VIN- connects to RF4/AN9/SEG22/C2INA CM<2:0>: Comparator Mode bits Figure 23-1 shows the Comparator modes and the CM<2:0> bit settings.
bit 6
bit 5
bit 4
bit 3
bit 2-0
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23.1 Comparator Configuration
There are eight modes of operation for the comparators, shown in Figure 23-1. The CM<2:0> bits of the CMCON register are used to select these modes. The TRISF register controls the data direction of the comparator pins for each mode. If the Comparator mode is changed, the comparator output level may not be valid for the specified mode change delay shown in Section 29.0 "Electrical Characteristics". Note: Comparator interrupts should be disabled during a Comparator mode change; otherwise, a false interrupt may occur.
FIGURE 23-1:
COMPARATOR I/O OPERATING MODES
Comparators Off (POR Default Value) CM<2:0> = 111 C1INA C1 Off (Read as `0') C1INB
D D VINVIN+
Comparator Outputs Disabled CM<2:0> = 000 C1INA C1INB
A A VINVIN+
C1
Off (Read as `0')
C2INA A C2INB A
VINVIN+
C2INA C2 Off (Read as `0') C2INB
D D
VINVIN+
C2
Off (Read as `0')
Two Independent Comparators CM<2:0> = 010 C1INA C1INB
A A VINVIN+
Two Independent Comparators with Outputs CM<2:0> = 011 C1INA A
VINVIN+
C1
C1OUT
C1INB A
C1
C1OUT
RF2/AN7/C1OUT*/SEG20 C2INA C2INB
A A VINVIN+
C2
C2OUT
C2INA C2INB
A A
VINVIN+
C2
C2OUT
RF1/AN6/C2OUT*/SEG19 Two Common Reference Comparators CM<2:0> = 100 C1INA A C1INB
A VINVIN+
Two Common Reference Comparators with Outputs CM<2:0> = 101 C1INA A
VINVIN+
C1
C1OUT
C1INB
A
C1
C1OUT
C2INA
A
VINVIN+
RF2/AN7/C1OUT*/ SEG20 C2 C2OUT C2INA A C2INB D
VINVIN+
C2INB D
C2
C2OUT
RF1/AN6/C2OUT*/SEG19 One Independent Comparator with Output CM<2:0> = 001 C1INA A C1INB
A VINVIN+
Four Inputs Multiplexed to Two Comparators CM<2:0> = 110 C1INA A
CIS = 0 CIS = 1 VINVIN+
C1
C1OUT
C1INB A C2INA A C2INB A
C1
C1OUT
RF2/AN7/C1OUT*/SEG20 C2INA
D VINVIN+
CIS = 0 CIS = 1
VINVIN+
C2
C2OUT
C2INB D
C2
Off (Read as `0')
CVREF
From VREF module
A = Analog Input, port reads zeros always D = Digital Input CIS (CMCON<3>) is the Comparator Input Switch * Setting the TRISF<2:1> bits will disable the comparator outputs by configuring the pins as inputs.
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23.2 Comparator Operation
23.3.2 INTERNAL REFERENCE SIGNAL
A single comparator is shown in Figure 23-2, along with the relationship between the analog input levels and the digital output. When the analog input at VIN+ is less than the analog input VIN-, the output of the comparator is a digital low level. When the analog input at VIN+ is greater than the analog input VIN-, the output of the comparator is a digital high level. The shaded areas of the output of the comparator in Figure 23-2 represent the uncertainty due to input offsets and response time. The comparator module also allows the selection of an internally generated voltage reference from the comparator voltage reference module. This module is described in more detail in Section 24.0 "Comparator Voltage Reference Module". The internal reference is only available in the mode where four inputs are multiplexed to two comparators (CM<2:0> = 110). In this mode, the internal voltage reference is applied to the VIN+ pin of both comparators.
23.3
Comparator Reference
23.4
Comparator Response Time
Depending on the comparator operating mode, either an external or internal voltage reference may be used. The analog signal present at VIN- is compared to the signal at VIN+ and the digital output of the comparator is adjusted accordingly (Figure 23-2).
FIGURE 23-2:
SINGLE COMPARATOR
Response time is the minimum time, after selecting a new reference voltage or input source, before the comparator output has a valid level. If the internal reference is changed, the maximum delay of the internal voltage reference must be considered when using the comparator outputs. Otherwise, the maximum delay of the comparators should be used (see Section 29.0 "Electrical Characteristics").
VIN+ VIN-
+ -
23.5
Output
Comparator Outputs
VINVIN+
The comparator outputs are read through the CMCON register. These bits are read-only. The comparator outputs may also be directly output to the RF1 and RF2 I/O pins. When enabled, multiplexers in the output path of the RF1 and RF2 pins will switch and the output of each pin will be the unsynchronized output of the comparator. The uncertainty of each of the comparators is related to the input offset voltage and the response time given in the specifications. Figure 23-3 shows the comparator output block diagram. The TRISF bits will still function as an output enable/ disable for the RF1 and RF2 pins while in this mode. The polarity of the comparator outputs can be changed using the C2INV and C1INV bits (CMCON<5:4>).
Output
23.3.1
EXTERNAL REFERENCE SIGNAL
When external voltage references are used, the comparator module can be configured to have the comparators operate from the same or different reference sources. However, threshold detector applications may require the same reference. The reference signal must be between VSS and VDD and can be applied to either pin of the comparator(s).
Note 1: When reading the PORT register, all pins configured as analog inputs will read as `0'. Pins configured as digital inputs will convert an analog input according to the Schmitt Trigger input specification. 2: Analog levels on any pin defined as a digital input may cause the input buffer to consume more current than is specified.
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FIGURE 23-3: COMPARATOR OUTPUT BLOCK DIAGRAM
MULTIPLEX
Port Pins
+
To RF1 or RF2 Pin D CxINV EN Q Bus Data
Read CMCON
-
D EN Reset
Q CL From Other Comparator
Set CMIF bit
23.6
Comparator Interrupts
23.7
The comparator interrupt flag is set whenever there is a change in the output value of either comparator. Software will need to maintain information about the status of the output bits, as read from CMCON<7:6>, to determine the actual change that occurred. The CMIF bit (PIR2<6>) is the Comparator Interrupt Flag. The CMIF bit must be reset by clearing it. Since it is also possible to write a `1' to this register, a simulated interrupt may be initiated. Both the CMIE bit (PIE2<6>) and the PEIE bit (INTCON<6>) must be set to enable the interrupt. In addition, the GIE bit (INTCON<7>) must also be set. If any of these bits are clear, the interrupt is not enabled, though the CMIF bit will still be set if an interrupt condition occurs. Note: If a change in the CMCON register (C1OUT or C2OUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF (PIR2<6>) interrupt flag may not get set.
Comparator Operation During Sleep
When a comparator is active and the device is placed in Sleep mode, the comparator remains active and the interrupt is functional, if enabled. This interrupt will wake-up the device from Sleep mode, when enabled. Each operational comparator will consume additional current, as shown in the comparator specifications. To minimize power consumption while in Sleep mode, turn off the comparators (CM<2:0> = 111) before entering Sleep. If the device wakes up from Sleep, the contents of the CMCON register are not affected.
23.8
Effects of a Reset
The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) b) Any read or write of CMCON will end the mismatch condition. Clear flag bit, CMIF.
A device Reset forces the CMCON register to its Reset state, causing the comparator modules to be turned off (CM<2:0> = 111). However, the input pins (RF3 through RF6) are configured as analog inputs by default on device Reset. The I/O configuration for these pins is determined by the setting of the PCFG<3:0> bits (ADCON1<3:0>). Therefore, device current is minimized when analog inputs are present at Reset time.
A mismatch condition will continue to set flag bit, CMIF. Reading CMCON will end the mismatch condition and allow flag bit, CMIF, to be cleared.
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23.9 Analog Input Connection Considerations
range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up condition may occur. A maximum source impedance of 10 k is recommended for the analog sources. Any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current.
A simplified circuit for an analog input is shown in Figure 23-4. Since the analog pins are connected to a digital output, they have reverse biased diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this
FIGURE 23-4:
COMPARATOR ANALOG INPUT MODEL
VDD RS < 10k AIN VT = 0.6V RIC Comparator Input CPIN 5 pF VT = 0.6V ILEAKAGE 100 nA
VA
VSS Legend: CPIN VT ILEAKAGE RIC RS VA = = = = = = Input Capacitance Threshold Voltage Leakage Current at the pin due to various junctions Interconnect Resistance Source Impedance Analog Voltage
TABLE 23-1:
Name INTCON PIR2 PIE2 IPR2 CMCON CVRCON PORTF LATF TRISF
REGISTERS ASSOCIATED WITH COMPARATOR MODULE
Bit 7 Bit 6 Bit 5 TMR0IE -- -- -- C2INV CVRR RF5 LATF5 TRISF5 Bit 4 INT0IE -- -- -- C1INV CVRSS RF4 LATF4 TRISF4 Bit 3 RBIE BCLIF BCLIE BCLIP CIS CVR3 RF3 LATF3 TRISF3 Bit 2 TMR0IF LVDIF LVDIE LVDIP CM2 CVR2 RF2 LATF2 TRISF2 Bit 1 INT0IF TMR3IF TMR3IE TMR3IP CM1 CVR1 RF1 LATF1 TRISF1 Bit 0 RBIF -- -- -- CM0 CVR0 -- -- -- Reset Values on page 49 52 52 52 51 51 52 52 52
GIE/GIEH PEIE/GIEL OSCFIF OSCFIE OSCFIP C2OUT CVREN RF7 LATF7 TRISF7 CMIF CMIE CMIP C1OUT CVROE RF6 LATF6 TRISF6
Legend: -- = unimplemented, read as `0'. Shaded cells are unused by the comparator module.
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NOTES:
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24.0 COMPARATOR VOLTAGE REFERENCE MODULE
The range to be used is selected by the CVRR bit (CVRCON<5>). The primary difference between the ranges is the size of the steps selected by the CVREF Selection bits (CVR<3:0>), with one range offering finer resolution. The equations used to calculate the output of the comparator voltage reference are as follows: If CVRR = 1: CVREF = ((CVR<3:0>)/24) x (CVRSRC) If CVRR = 0: CVREF = (CVRSRC/4) + ((CVR<3:0>)/32) x (CVRSRC) The comparator reference supply voltage can come from either VDD and VSS, or the external VREF+ and VREF- that are multiplexed with RA2 and RA3. The voltage source is selected by the CVRSS bit (CVRCON<4>). The settling time of the comparator voltage reference must be considered when changing the CVREF output (see Table 29-3 in Section 29.0 "Electrical Characteristics").
The comparator voltage reference is a 16-tap resistor ladder network that provides a selectable reference voltage. Although its primary purpose is to provide a reference for the analog comparators, it may also be used independently of them. A block diagram of the module is shown in Figure 24-1. The resistor ladder is segmented to provide two ranges of CVREF values and has a power-down function to conserve power when the reference is not being used. The module's supply reference can be provided from either device VDD/VSS or an external voltage reference.
24.1
Configuring the Comparator Voltage Reference
The comparator voltage reference module is controlled through the CVRCON register (Register 24-1). The comparator voltage reference provides two ranges of output voltage, each with 16 distinct levels.
REGISTER 24-1:
R/W-0 CVREN bit 7 Legend: R = Readable bit -n = Value at POR bit 7
CVRCON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER
R/W-0 CVRR R/W-0 CVRSS R/W-0 CVR3 R/W-0 CVR2 R/W-0 CVR1 R/W-0 CVR0 bit 0
R/W-0 CVROE(1)
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
CVREN: Comparator Voltage Reference Enable bit 1 = CVREF circuit powered on 0 = CVREF circuit powered down CVROE: Comparator VREF Output Enable bit(1) 1 = CVREF voltage level is also output on the RF5/AN10/CVREF/SEG23/C1INB pin 0 = CVREF voltage is disconnected from the RF5/AN10/CVREF/SEG23/C1INB pin CVRR: Comparator VREF Range Selection bit 1 = 0 to 0.667 CVRSRC, with CVRSRC/24 step size (low range) 0 = 0.25 CVRSRC to 0.75 CVRSRC, with CVRSRC/32 step size (high range) CVRSS: Comparator VREF Source Selection bit 1 = Comparator reference source, CVRSRC = (VREF+) - (VREF-) 0 = Comparator reference source, CVRSRC = VDD - VSS CVR<3:0>: Comparator VREF Value Selection bits (0 (CVR<3:0>) 15) When CVRR = 1: CVREF = ((CVR<3:0>)/24) (CVRSRC) When CVRR = 0: CVREF = (CVRSRC/4) + ((CVR<3:0>)/32) (CVRSRC) CVROE overrides the TRISF<5> bit setting.
bit 6
bit 5
bit 4
bit 3-0
Note 1:
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FIGURE 24-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
VREF+ VDD CVRSS = 1
CVRSS = 0
8R R R R
CVR<3:0>
CVREN
16 Steps
16-to-1 MUX
R
CVREF
R R R CVRR VREFCVRSS = 1
8R
CVRSS = 0
24.2
Voltage Reference Accuracy/Error
24.4
Effects of a Reset
The full range of voltage reference cannot be realized due to the construction of the module. The transistors on the top and bottom of the resistor ladder network (Figure 24-1) keep CVREF from approaching the reference source rails. The voltage reference is derived from the reference source; therefore, the CVREF output changes with fluctuations in that source. The tested absolute accuracy of the voltage reference can be found in Section 29.0 "Electrical Characteristics".
A device Reset disables the voltage reference by clearing bit, CVREN (CVRCON<7>). This Reset also disconnects the reference from the RA2 pin by clearing bit, CVROE (CVRCON<6>) and selects the high-voltage range by clearing bit, CVRR (CVRCON<5>). The CVR value select bits are also cleared.
24.5
Connection Considerations
24.3
Operation During Sleep
When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the CVRCON register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled.
The voltage reference module operates independently of the comparator module. The output of the reference generator may be connected to the RF5 pin if the CVROE bit is set. Enabling the voltage reference output onto RA2 when it is configured as a digital input will increase current consumption. Connecting RF5 as a digital output with CVRSS enabled will also increase current consumption. The RF5 pin can be used as a simple D/A output with limited drive capability. Due to the limited current drive capability, a buffer must be used on the voltage reference output for external connections to VREF. Figure 24-2 shows an example buffering technique.
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FIGURE 24-2: COMPARATOR VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE
PIC18F87J72
CVREF Module R(1) Voltage Reference Output Impedance RF5
+ -
CVREF Output
Note 1:
R is dependent upon the Comparator Voltage Reference bits, CVRCON<5> and CVRCON<3:0>.
TABLE 24-1:
Name CVRCON CMCON TRISF
REGISTERS ASSOCIATED WITH COMPARATOR VOLTAGE REFERENCE
Bit 7 CVREN C2OUT TRISF7 Bit 6 CVROE C1OUT TRISF6 Bit 5 CVRR C2INV TRISF5 Bit 4 CVRSS C1INV TRISF4 Bit 3 CVR3 CIS TRISF3 Bit 2 CVR2 CM2 TRISF2 Bit 1 CVR1 CM1 TRISF1 Bit 0 CVR0 CM0 -- Reset Values on page 51 51 52
Legend: -- = unimplemented, read as `0'. Shaded cells are not used with the comparator voltage reference.
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NOTES:
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25.0 CHARGE TIME MEASUREMENT UNIT (CTMU)
Control of edge sequence Control of response to edges Time measurement resolution of 1 nanosecond High-precision time measurement Time delay of external or internal signal asynchronous to system clock * Accurate current source suitable for capacitive measurement The CTMU works in conjunction with the A/D Converter to provide up to 13 channels for time or charge measurement, depending on the specific device and the number of A/D channels available. When configured for time delay, the CTMU is connected to one of the analog comparators. The level-sensitive input edge sources can be selected from four sources: two external inputs or CCP1/CCP2 Special Event Triggers. Figure 25-1 provides a block diagram of the CTMU. * * * * *
The Charge Time Measurement Unit (CTMU) is a flexible analog module that provides accurate differential time measurement between pulse sources, as well as asynchronous pulse generation. By working with other on-chip analog modules, the CTMU can be used to precisely measure time, measure capacitance, measure relative changes in capacitance or generate output pulses with a specific time delay. The CTMU is ideal for interfacing with capacitive-based sensors. The module includes the following key features: * Up to 13 channels available for capacitive or time measurement input * On-chip precision current source * Four-edge input trigger sources * Polarity control for each edge source
FIGURE 25-1:
CTMU BLOCK DIAGRAM
CTMUCON
EDGEN EDGSEQEN EDG1SELx EDG1POL EDG2SELx EDG2POL
CTMUICON
ITRIM<5:0> IRNG<1:0> EDG1STAT EDG2STAT TGEN IDISSEN CTTRIG
Current Source
CTEDG1 CTEDG2
Edge Control Logic
Current Control
CTMU Control Logic
A/D Trigger
CCP2 CCP1 A/D Converter Comparator 2 Input
Pulse Generator
CTPLS
Comparator 2 Output
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25.1 CTMU Operation
The CTMU works by using a fixed current source to charge a circuit. The type of circuit depends on the type of measurement being made. In the case of charge measurement, the current is fixed, and the amount of time the current is applied to the circuit is fixed. The amount of voltage read by the A/D is then a measurement of the capacitance of the circuit. In the case of time measurement, the current, as well as the capacitance of the circuit, is fixed. In this case, the voltage read by the A/D is then representative of the amount of time elapsed from the time the current source starts and stops charging the circuit. If the CTMU is being used as a time delay, both capacitance and current source are fixed, as well as the voltage supplied to the comparator circuit. The delay of a signal is determined by the amount of time it takes the voltage to charge to the comparator threshold voltage. Current trim is provided by the ITRIM<5:0> bits (CTMUICON<7:2>). These six bits allow trimming of the current source in steps of approximately 2% per step. Note that half of the range adjusts the current source positively and the other half reduces the current source. A value of `000000' is the neutral position (no change). A value of `100000' is the maximum negative adjustment (approximately -62%) and `011111' is the maximum positive adjustment (approximately +62%).
25.1.3
EDGE SELECTION AND CONTROL
25.1.1
THEORY OF OPERATION
CTMU measurements are controlled by edge events occurring on the module's two input channels. Each channel, referred to as Edge 1 and Edge 2, can be configured to receive input pulses from one of the edge input pins (CTEDG1 and CTEDG2) or CCPx Special Event Triggers. The input channels are level-sensitive, responding to the instantaneous level on the channel rather than a transition between levels. The inputs are selected using the EDG1SEL and EDG2SEL bit pairs (CTMUCONL<3:2, 6:5>). In addition to source, each channel can be configured for event polarity using the EDGE2POL and EDGE1POL bits (CTMUCONL<7,4>). The input channels can also be filtered for an edge event sequence (Edge 1 occurring before Edge 2) by setting the EDGSEQEN bit (CTMUCONH<2>).
The operation of the CTMU is based on the equation for charge: dV C = I -----dT More simply, the amount of charge measured in coulombs in a circuit is defined as current in amperes (I) multiplied by the amount of time in seconds that the current flows (t). Charge is also defined as the capacitance in farads (C) multiplied by the voltage of the circuit (V). It follows that: I t = C V. The CTMU module provides a constant, known current source. The A/D Converter is used to measure (V) in the equation, leaving two unknowns: capacitance (C) and time (t). The above equation can be used to calculate capacitance or time, by either the relationship using the known fixed capacitance of the circuit: t = C V I or by: C = I t V using a fixed time that the current source is applied to the circuit.
25.1.4
EDGE STATUS
The CTMUCON register also contains two status bits, EDG2STAT and EDG1STAT (CTMUCONL<1:0>). Their primary function is to show if an edge response has occurred on the corresponding channel. The CTMU automatically sets a particular bit when an edge response is detected on its channel. The level-sensitive nature of the input channels also means that the status bits become set immediately if the channel's configuration is changed and is the same as the channel's current state. The module uses the edge status bits to control the current source output to external analog modules (such as the A/D Converter). Current is only supplied to external modules when only one (but not both) of the status bits is set, and shuts current off when both bits are either set or cleared. This allows the CTMU to measure current only during the interval between edges. After both status bits are set, it is necessary to clear them before another measurement is taken. Both bits should be cleared simultaneously, if possible, to avoid re-enabling the CTMU current source. In addition to being set by the CTMU hardware, the edge status bits can also be set by software. This is also the user's application to manually enable or disable the current source. Setting either one (but not both) of the bits enables the current source. Setting or clearing both bits at once disables the source.
25.1.2
CURRENT SOURCE
At the heart of the CTMU is a precision current source, designed to provide a constant reference for measurements. The level of current is user-selectable across three ranges or a total of two orders of magnitude, with the ability to trim the output in 2% increments (nominal). The current range is selected by the IRNG<1:0> bits (CTMUICON<1:0>), with a value of `00' representing the lowest range.
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25.1.5 INTERRUPTS
The CTMU sets its interrupt flag (PIR3<2>) whenever the current source is enabled, then disabled. An interrupt is generated only if the corresponding interrupt enable bit (PIE3<2>) is also set. If edge sequencing is not enabled (i.e., Edge 1 must occur before Edge 2), it is necessary to monitor the edge status bits and determine which edge occurred last and caused the interrupt. Depending on the type of measurement or pulse generation being performed, one or more additional modules may also need to be initialized and configured with the CTMU module: * Edge Source Generation: In addition to the external edge input pins, CCPx Special Event Triggers can be used as edge sources for the CTMU. * Capacitance or Time Measurement: The CTMU module uses the A/D Converter to measure the voltage across a capacitor that is connected to one of the analog input channels. * Pulse Generation: When generating system clock independent output pulses, the CTMU module uses Comparator 2 and the associated comparator voltage reference.
25.2
CTMU Module Initialization
The following sequence is a general guideline used to initialize the CTMU module: 1. Select the current source range using the IRNG bits (CTMUICON<1:0>). 2. Adjust the current source trim using the ITRIM bits (CTMUICON<7:2>). 3. Configure the edge input sources for Edge 1 and Edge 2 by setting the EDG1SEL and EDG2SEL bits (CTMUCONL<3:2 and 6:5>). 4. Configure the input polarities for the edge inputs using the EDG1POL and EDG2POL bits (CTMUCONL<4,7>). The default configuration is for negative edge polarity (high-to-low transitions). 5. Enable edge sequencing using the EDGSEQEN bit (CTMUCONH<2>). By default, edge sequencing is disabled. 6. Select the operating mode (Measurement or Time Delay) with the TGEN bit. The default mode is Time/Capacitance Measurement. 7. Configure the module to automatically trigger an A/D conversion when the second edge event has occurred using the CTTRIG bit (CTMUCONH<0>). The conversion trigger is disabled by default. 8. Discharge the connected circuit by setting the IDISSEN bit (CTMUCONH<1>); after waiting a sufficient time for the circuit to discharge, clear IDISSEN. 9. Disable the module by clearing the CTMUEN bit (CTMUCONH<7>). 10. Clear the Edge Status bits, EDG2STAT and EDG1STAT (CTMUCONL<1:0>). 11. Enable both edge inputs by setting the EDGEN bit (CTMUCONH<3>). 12. Enable the module by setting the CTMUEN bit.
25.3
Calibrating the CTMU Module
The CTMU requires calibration for precise measurements of capacitance and time, as well as for accurate time delay. If the application only requires measurement of a relative change in capacitance or time, calibration is usually not necessary. An example of this type of application would include a capacitive touch switch, in which the touch circuit has a baseline capacitance, and the added capacitance of the human body changes the overall capacitance of a circuit. If actual capacitance or time measurement is required, two hardware calibrations must take place: the current source needs calibration to set it to a precise current, and the circuit being measured needs calibration to measure and/or nullify all other capacitance other than that to be measured.
25.3.1
CURRENT SOURCE CALIBRATION
The current source onboard the CTMU module has a range of 60% nominal for each of three current ranges. Therefore, for precise measurements, it is possible to measure and adjust this current source by placing a high-precision resistor, RCAL, onto an unused analog channel. An example circuit is shown in Figure 25-2. The current source measurement is performed using the following steps: 1. 2. 3. 4. 5. 6. Initialize the A/D Converter. Initialize the CTMU. Enable the current source by setting EDG1STAT (CTMUCONL<0>). Issue settling time delay. Perform A/D conversion. Calculate the current source current using I = V/ RCAL, where RCAL is a high-precision resistance and V is measured by performing an A/D conversion.
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The CTMU current source may be trimmed with the trim bits in CTMUICON using an iterative process to get an exact desired current. Alternatively, the nominal value without adjustment may be used; it may be stored by the software for use in all subsequent capacitive or time measurements. To calculate the value for RCAL, the nominal current must be chosen, and then the resistance can be calculated. For example, if the A/D Converter reference voltage is 3.3V, use 70% of full scale or 2.31V as the desired approximate voltage to be read by the A/D Converter. If the range of the CTMU current source is selected to be 0.55 A, the resistor value needed is calculated as RCAL = 2.31V/0.55 A, for a value of 4.2 M. Similarly, if the current source is chosen to be 5.5 A, RCAL would be 420,000, and 42,000 if the current source is set to 55 A. A value of 70% of full-scale voltage is chosen to make sure that the A/D Converter was in a range that is well above the noise floor. Keep in mind that if an exact current is chosen to incorporate the trimming bits from CTMUICON, the resistor value of RCAL may need to be adjusted accordingly. RCAL may be also adjusted to allow for available resistor values. RCAL should be of the highest precision available, keeping in mind the amount of precision needed for the circuit that the CTMU will be used to measure. A recommended minimum would be 0.1% tolerance. The following examples show one typical method for performing a CTMU current calibration. Example 25-1 demonstrates how to initialize the A/D Converter and the CTMU. This routine is typical for applications using both modules. Example 25-2 demonstrates one method for the actual calibration routine. Note that this method manually triggers the A/D Converter, which is done to demonstrate the entire stepwise process. It is also possible to automatically trigger the conversion by setting the CTMU's CTTRIG bit (CTMUCONH<0>).
FIGURE 25-2:
CTMU CURRENT SOURCE CALIBRATION CIRCUIT
PIC18F87J72 Current Source CTMU
A/D Trigger A/D Converter ANx RCAL
A/D MUX
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EXAMPLE 25-1: SETUP FOR CTMU CALIBRATION ROUTINES
#include "p18cxxx.h" /**************************************************************************/ /*Setup CTMU *****************************************************************/ /**************************************************************************/ void setup(void) { //CTMUCON - CTMU Control register CTMUCONH = 0x00; //make sure CTMU is disabled CTMUCONL = 0X90; //CTMU continues to run when emulator is stopped,CTMU continues //to run in idle mode,Time Generation mode disabled, Edges are blocked //No edge sequence order, Analog current source not grounded, trigger //output disabled, Edge2 polarity = positive level, Edge2 source = //source 0, Edge1 polarity = positive level, Edge1 source = source 0, // Set Edge status bits to zero
//CTMUICON - CTMU Current Control Register CTMUICON = 0x01; //0.55uA, Nominal - No Adjustment /**************************************************************************/ //Setup AD converter; /**************************************************************************/ TRISA=0x04; //set channel 2 as an input
// Configured AN2 as an analog channel // ANCON0 ANCON0 = 0XFB; // ANCON1 ANCON1 = 0X1F; // ADCON1 ADCON1bits.ADFM=1; ADCON1bits.ADCAL=0; ADCON1bits.ACQT=1; ADCON1bits.ADCS=2;
// // // //
Resulst format 1= Right justified Normal A/D conversion operation Acquition time 7 = 20TAD 2 = 4TAD 1=2TAD Clock conversion bits 6= FOSC/64 2=FOSC/32
ANCON1bits.VBGEN=1; // ADCON0 ADCON0bits.VCFG0 =0; ADCON0bits.VCFG1 =0; ADCON0bits.CHS=2; ADCON0bits.ADON=1; }
// Turn on the Bandgap needed for Rev A0 parts
// Vref+ = AVdd // Vref- = AVss // Select ADC channel // Turn on ADC
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EXAMPLE 25-2: CURRENT CALIBRATION ROUTINE
//@ 8MHz = 125uS. //R value is 4200000 (4.2M) //scaled so that result is in //1/100th of uA //for unsigned conversion 10 sig bits //Vdd connected to A/D Vr+ #include "p18cxxx.h" #define COUNT 500 #define DELAY for(i=0;i#define ADSCALE 1023 #define ADREF 3.3 int main(void) { int i; int j = 0; //index for loop unsigned int Vread = 0; double VTot = 0; float Vavg=0, Vcal=0, CTMUISrc = 0;
//float values stored for calcs
//assume CTMU and A/D have been setup correctly //see Example 25-1 for CTMU & A/D setup setup(); CTMUCONHbits.CTMUEN = 1; for(j=0;j<10;j++) { CTMUCONHbits.IDISSEN = 1; DELAY; CTMUCONHbits.IDISSEN = 0; CTMUCONLbits.EDG1STAT = 1; DELAY; CTMUCONLbits.EDG1STAT = 0; PIR1bits.ADIF = 0; ADCON0bits.GO=1; while(!PIR1bits.ADIF); Vread = ADRES; PIR1bits.ADIF = 0; VTot += Vread; } Vavg = (float)(VTot/10.000); Vcal = (float)(Vavg/ADSCALE*ADREF); CTMUISrc = Vcal/RCAL; } //Average of 10 readings //CTMUISrc is in 1/100ths of uA //Enable the CTMU
//drain charge on the circuit //wait 125us //end drain of circuit //Begin charging the circuit //using CTMU current source //wait for 125us //Stop charging circuit //make sure A/D Int not set //and begin A/D conv. //Wait for A/D convert complete //Get the value from the A/D //Clear A/D Interrupt Flag //Add the reading to the total
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25.3.2 CAPACITANCE CALIBRATION
There is a small amount of capacitance from the internal A/D Converter sample capacitor as well as stray capacitance from the circuit board traces and pads that affect the precision of capacitance measurements. A measurement of the stray capacitance can be taken by making sure the desired capacitance to be measured has been removed. The measurement is then performed using the following steps: 1. 2. 3. 4. 5. 6. Initialize the A/D Converter and the CTMU. Set EDG1STAT (= 1). Wait for a fixed delay of time, t. Clear EDG1STAT. Perform an A/D conversion. Calculate the stray and A/D sample capacitances: C OFFSET = C STRAY + C AD = I t V An iterative process may need to be used to adjust the time, t, that the circuit is charged to obtain a reasonable voltage reading from the A/D Converter. The value of t may be determined by setting COFFSET to a theoretical value, then solving for t. For example, if CSTRAY is theoretically calculated to be 11 pF, and V is expected to be 70% of VDD, or 2.31V, then t would be: (4 pF + 11 pF) * 2.31V/0.55 A or 63 s. See Example 25-3 for a typical routine for CTMU capacitance calibration.
where I is known from the current source measurement step, t is a fixed delay and V is measured by performing an A/D conversion. This measured value is then stored and used for calculations of time measurement, or subtracted for capacitance measurement. For calibration, it is expected that the capacitance of CSTRAY + CAD is approximately known. CAD is approximately 4 pF.
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EXAMPLE 25-3: CAPACITANCE CALIBRATION ROUTINE
#include "p18cxxx.h" #define #define #define #define #define #define COUNT 25 ETIME COUNT*2.5 DELAY for(i=0;iint main(void) { int i; int j = 0; //index for loop unsigned int Vread = 0; float CTMUISrc, CTMUCap, Vavg, VTot, Vcal; //assume CTMU and A/D have been setup correctly //see Example 25-1 for CTMU & A/D setup setup(); CTMUCONHbits.CTMUEN = 1; for(j=0;j<10;j++) { CTMUCONHbits.IDISSEN = 1; DELAY; CTMUCONHbits.IDISSEN = 0; CTMUCONLbits.EDG1STAT = 1; DELAY; CTMUCONLbits.EDG1STAT = 0; PIR1bits.ADIF = 0; ADCON0bits.GO=1; while(!PIR1bits.ADIF); //Enable the CTMU
//drain charge on the circuit //wait 125us //end drain of circuit //Begin charging the circuit //using CTMU current source //wait for 125us //Stop charging circuit //make sure A/D Int not set //and begin A/D conv. //Wait for A/D convert complete
Vread = ADRES; PIR1bits.ADIF = 0; VTot += Vread; }
//Get the value from the A/D //Clear A/D Interrupt Flag //Add the reading to the total
Vavg = (float)(VTot/10.000); //Average of 10 readings Vcal = (float)(Vavg/ADSCALE*ADREF); CTMUISrc = Vcal/RCAL; //CTMUISrc is in 1/100ths of uA CTMUCap = (CTMUISrc*ETIME/Vcal)/100; }
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25.4 Measuring Capacitance with the CTMU
25.4.2 RELATIVE CHARGE MEASUREMENT
An application may not require precise capacitance measurements. For example, when detecting a valid press of a capacitance-based switch, detecting a relative change of capacitance is of interest. In this type of application, when the switch is open (or not touched), the total capacitance is the capacitance of the combination of the board traces, the A/D Converter, etc. A larger voltage will be measured by the A/D Converter. When the switch is closed (or is touched), the total capacitance is larger due to the addition of the capacitance of the human body to the above listed capacitances and a smaller voltage will be measured by the A/D Converter. Detecting capacitance changes is easily accomplished with the CTMU using these steps: 1. 2. 3. 4. 5. Initialize the A/D Converter and the CTMU. Set EDG1STAT. Wait for a fixed delay. Clear EDG1STAT. Perform an A/D conversion.
There are two separate methods of measuring capacitance with the CTMU. The first is the absolute method, in which the actual capacitance value is desired. The second is the relative method, in which the actual capacitance is not needed, rather an indication of a change in capacitance is required.
25.4.1
ABSOLUTE CAPACITANCE MEASUREMENT
For absolute capacitance measurements, both the current and capacitance calibration steps found in Section 25.3 "Calibrating the CTMU Module" should be followed. Capacitance measurements are then performed using the following steps: 1. 2. 3. 4. 5. 6. 7. Initialize the A/D Converter. Initialize the CTMU. Set EDG1STAT. Wait for a fixed delay, T. Clear EDG1STAT. Perform an A/D conversion. Calculate the total capacitance, CTOTAL = (I * T)/V, where I is known from the current source measurement step (Section 25.3.1 "Current Source Calibration"), T is a fixed delay and V is measured by performing an A/D conversion. Subtract the stray and A/D capacitance (COFFSET from Section 25.3.2 "Capacitance Calibration") from CTOTAL to determine the measured capacitance.
The voltage measured by performing the A/D conversion is an indication of the relative capacitance. Note that in this case, no calibration of the current source or circuit capacitance measurement is needed. See Example 25-4 for a sample software routine for a capacitive touch switch.
8.
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EXAMPLE 25-4: ROUTINE FOR CAPACITIVE TOUCH SWITCH
#include "p18cxxx.h" #define #define #define #define COUNT 500 DELAY for(i=0;i#define HYST 65 #define PRESSED 1 #define UNPRESSED 0 int main(void) { unsigned int Vread; unsigned int switchState; int i;
//storage for reading
//assume CTMU and A/D have been setup correctly //see Example 25-1 for CTMU & A/D setup setup(); CTMUCONHbits.CTMUEN = 1; CTMUCONHbits.IDISSEN = 1; DELAY; CTMUCONHbits.IDISSEN = 0; CTMUCONLbits.EDG1STAT = 1; DELAY; CTMUCONLbits.EDG1STAT = 0; PIR1bits.ADIF = 0; ADCON0bits.GO=1; while(!PIR1bits.ADIF); Vread = ADRES; if(Vread < OPENSW - TRIP) { switchState = PRESSED; } else if(Vread > OPENSW - TRIP + HYST) { switchState = UNPRESSED; } } //Enable the CTMU //drain charge on the circuit //wait 125us //end drain of circuit //Begin charging the circuit //using CTMU current source //wait for 125us //Stop charging circuit //make sure A/D Int not set //and begin A/D conv. //Wait for A/D convert complete //Get the value from the A/D
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25.5 Measuring Time with the CTMU Module
It is assumed that the time measured is small enough that the capacitance COFFSET provides a valid voltage to the A/D Converter. For the smallest time measurement, always set the A/D Channel Select register (AD1CHS) to an unused A/D channel; the corresponding pin for which is not connected to any circuit board trace. This minimizes added stray capacitance, keeping the total circuit capacitance close to that of the A/D Converter itself (25 pF). To measure longer time intervals, an external capacitor may be connected to an A/D channel, and this channel selected when making a time measurement.
Time can be precisely measured after the ratio (C/I) is measured from the current and capacitance calibration step by following these steps: 1. 2. 3. 4. 5. Initialize the A/D Converter and the CTMU. Set EDG1STAT. Set EDG2STAT. Perform an A/D conversion. Calculate the time between edges as T = (C/I) * V, where I is calculated in the current calibration step (Section 25.3.1 "Current Source Calibration"), C is calculated in the capacitance calibration step (Section 25.3.2 "Capacitance Calibration") and V is measured by performing the A/D conversion.
FIGURE 25-3:
TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR TIME MEASUREMENT
PIC18F87J72 CTMU CTEDG1 CTEDG2 EDG1 EDG2 Output Pulse A/D Converter CAD RPR Current Source
ANX
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25.6 Creating a Delay with the CTMU Module
An example use of this feature is for interfacing with variable capacitive-based sensors, such as a humidity sensor. As the humidity varies, the pulse-width output on CTPLS will vary. The CTPLS output pin can be connected to an input capture pin and the varying pulse width is measured to determine the humidity in the application. Follow these steps to use this feature: 1. 2. 3. 4. 5. Initialize Comparator 2. Initialize the comparator voltage reference. Initialize the CTMU and enable time delay generation by setting the TGEN bit. Set EDG1STAT. When CPULSE charges to the value of the voltage reference trip point, an output pulse is generated on CTPLS.
A unique feature on board the CTMU module is its ability to generate system clock independent output pulses based on an external capacitor value. This is accomplished using the internal comparator voltage reference module, Comparator 2 input pin and an external capacitor. The pulse is output onto the CTPLS pin. To enable this mode, set the TGEN bit. See Figure 25-4 for an example circuit. CPULSE is chosen by the user to determine the output pulse width on CTPLS. The pulse width is calculated by T = (CPULSE/I)*V, where I is known from the current source measurement step (Section 25.3.1 "Current Source Calibration") and V is the internal reference voltage (CVREF).
FIGURE 25-4:
TYPICAL CONNECTIONS AND INTERNAL CONFIGURATION FOR PULSE DELAY GENERATION
PIC18F87J72 CTEDG1 EDG1 CTMU CTPLS
Current Source Comparator C2INB C2
CDELAY
CVREF
25.7
25.7.1
Operation During Sleep/Idle Modes
SLEEP MODE AND DEEP SLEEP MODES
25.8
Effects of a Reset on CTMU
When the device enters any Sleep mode, the CTMU module current source is always disabled. If the CTMU is performing an operation that depends on the current source when Sleep mode is invoked, the operation may not terminate correctly. Capacitance and time measurements may return erroneous values.
Upon Reset, all registers of the CTMU are cleared. This leaves the CTMU module disabled, its current source is turned off and all configuration options return to their default settings. The module needs to be re-initialized following any Reset. If the CTMU is in the process of taking a measurement at the time of Reset, the measurement will be lost. A partial charge may exist on the circuit that was being measured, and should be properly discharged before the CTMU makes subsequent attempts to make a measurement. The circuit is discharged by setting and then clearing the IDISSEN bit (CTMUCONH<1>) while the A/D Converter is connected to the appropriate channel.
25.7.2
IDLE MODE
The behavior of the CTMU in Idle mode is determined by the CTMUSIDL bit (CTMUCONH<5>). If CTMUSIDL is cleared, the module will continue to operate in Idle mode. If CTMUSIDL is set, the module's current source is disabled when the device enters Idle mode. If the module is performing an operation when Idle mode is invoked, in this case, the results will be similar to those with Sleep mode.
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25.9 Registers
There are three control registers for the CTMU: * CTMUCONH * CTMUCONL * CTMUICON The CTMUCONH and CTMUCONL registers (Register 25-1 and Register 25-2) contain control bits for configuring the CTMU module edge source selection, edge source polarity selection, edge sequencing, A/D trigger, analog circuit capacitor discharge and enables. The CTMUICON register (Register 25-3) has bits for selecting the current source range and current source trim.
REGISTER 25-1:
R/W-0 CTMUEN bit 7 Legend: R = Readable bit -n = Value at POR bit 7
CTMUCONH: CTMU CONTROL HIGH REGISTER
U-0 -- R/W-0 CTMUSIDL R/W-0 TGEN R/W-0 EDGEN R/W-0 EDGSEQEN R/W-0 IDISSEN R/W-0 CTTRIG bit 0
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
CTMUEN: CTMU Enable bit 1 = Module is enabled 0 = Module is disabled Unimplemented: Read as `0' CTMUSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode TGEN: Time Generation Enable bit 1 = Enables edge delay generation 0 = Disables edge delay generation EDGEN: Edge Enable bit 1 = Edges are not blocked 0 = Edges are blocked EDGSEQEN: Edge Sequence Enable bit 1 = Edge 1 event must occur before Edge 2 event can occur 0 = No edge sequence is needed IDISSEN: Analog Current Source Control bit 1 = Analog current source output is grounded 0 = Analog current source output is not grounded CTTRIG: Trigger Control bit 1 = Trigger output is enabled 0 = Trigger output is disabled
bit 6 bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
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REGISTER 25-2:
R/W-0 EDG2POL bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
CTMUCONL: CTMU CONTROL LOW REGISTER
R/W-0 EDG2SEL0 R/W-0 EDG1POL R/W-0 EDG1SEL1 R/W-0 EDG1SEL0 R/W-0 EDG2STAT R/W-0 EDG1STAT bit 0
R/W-0 EDG2SEL1
EDG2POL: Edge 2 Polarity Select bit 1 = Edge 2 is programmed for a positive edge response 0 = Edge 2 is programmed for a negative edge response EDG2SEL<1:0>: Edge 2 Source Select bits 11 = CTEDG1 pin 10 = CTEDG2 pin 01 = CCP1 Special Event Trigger 00 = CCP2 Special Event Trigger EDG1POL: Edge 1 Polarity Select bit 1 = Edge 1 is programmed for a positive edge response 0 = Edge 1 is programmed for a negative edge response EDG1SEL<1:0>: Edge 1 Source Select bits 11 = CTEDG1 pin 10 = CTEDG2 pin 01 = CCP1 Special Event Trigger 00 = CCP2 Special Event Trigger EDG2STAT: Edge 2 Status bit 1 = Edge 2 event has occurred 0 = Edge 2 event has not occurred EDG1STAT: Edge 1 Status bit 1 = Edge 1 event has occurred 0 = Edge 1 event has not occurred
bit 6-5
bit 4
bit 3-2
bit 1
bit 0
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REGISTER 25-3:
R/W-0 ITRIM5 bit 7 Legend: R = Readable bit -n = Value at POR bit 7-2 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
CTMUICON: CTMU CURRENT CONTROL REGISTER
R/W-0 ITRIM3 R/W-0 ITRIM2 R/W-0 ITRIM1 R/W-0 ITRIM0 R/W-0 IRNG1 R/W-0 IRNG0 bit 0
R/W-0 ITRIM4
ITRIM<5:0>: Current Source Trim bits 011111 = Maximum positive change from nominal current 011110 . . . 000001 = Minimum positive change from nominal current 000000 = Nominal current output specified by IRNG<1:0> 111111 = Minimum negative change from nominal current . . . 100010 100001 = Maximum negative change from nominal current IRNG<1:0>: Current Source Range Select bits 11 = 100 x Base current 10 = 10 x Base current 01 = Base current level (0.55 A nominal) 00 = Current source disabled
bit 1-0
TABLE 25-1:
Name CTMUCONH CTMUCONL CTMUICON Legend:
REGISTERS ASSOCIATED WITH CTMU MODULE
Bit 7 Bit 6 -- EDG2SEL1 ITRIM4 Bit 5 CTMUSIDL EDG2SEL0 ITRIM3 Bit 4 TGEN EDG1POL ITRIM2 Bit 3 EDGEN EDG1SEL1 ITRIM1 Bit 2 EDGSEQEN ITRIM0 Bit 1 IDISSEN IRNG1 Bit 0 CTTRIG IRNG0 Reset Values on page: -- -- --
CTMUEN EDG2POL ITRIM5
EDG1SEL0 EDG2STAT EDG1STAT
-- = unimplemented, read as `0'. Shaded cells are not used during CCP operation.
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NOTES:
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26.0 SPECIAL FEATURES OF THE CPU
26.1.1 CONSIDERATIONS FOR CONFIGURING PIC18F87J72 FAMILY DEVICES
PIC18F87J72 family devices include several features intended to maximize reliability and minimize cost through elimination of external components. These are: * Oscillator Selection * Resets: - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Reset (BOR) * Interrupts * Watchdog Timer (WDT) * Fail-Safe Clock Monitor * Two-Speed Start-up * Code Protection * In-Circuit Serial Programming The oscillator can be configured for the application depending on frequency, power, accuracy and cost. All of the options are discussed in detail in Section 3.0 "Oscillator Configurations". A complete discussion of device Resets and interrupts is available in previous sections of this data sheet. In addition to their Power-up and Oscillator Start-up Timers provided for Resets, the PIC18F87J72 family of devices has a configurable Watchdog Timer which is controlled in software. The inclusion of an internal RC oscillator also provides the additional benefits of a Fail-Safe Clock Monitor (FSCM) and Two-Speed Start-up. FSCM provides for background monitoring of the peripheral clock and automatic switchover in the event of its failure. Two-Speed Start-up enables code to be executed almost immediately on start-up, while the primary clock source completes its start-up delays. All of these features are enabled and configured by setting the appropriate Configuration register bits.
Devices of the PIC18F87J72 family do not use persistent memory registers to store configuration information. The configuration bytes are implemented as volatile memory which means that configuration data must be programmed each time the device is powered up. Configuration data is stored in the three words at the top of the on-chip program memory space, known as the Flash Configuration Words. It is stored in program memory in the same order shown in Table 26-2, with CONFIG1L at the lowest address and CONFIG3H at the highest. The data is automatically loaded in the proper Configuration registers during device power-up. When creating applications for these devices, users should always specifically allocate the location of the Flash Configuration Word for configuration data. This is to make certain that program code is not stored in this address when the code is compiled. The volatile memory cells used for the Configuration bits always reset to `1' on Power-on Resets. For all other types of Reset events, the previously programmed values are maintained and used without reloading from program memory. The four Most Significant bits of CONFIG1H, CONFIG2H and CONFIG3H in program memory should also be `1111'. This makes these Configuration Words appear to be NOP instructions in the remote event that their locations are ever executed by accident. Since Configuration bits are not implemented in the corresponding locations, writing `1's to these locations has no effect on device operation. To prevent inadvertent configuration changes during code execution, all programmable Configuration bits are write-once. After a bit is initially programmed during a power cycle, it cannot be written to again. Changing a device configuration requires that power to the device be cycled.
26.1
Configuration Bits
TABLE 26-1:
The Configuration bits can be programmed (read as `0'), or left unprogrammed (read as `1'), to select various device configurations. These bits are mapped starting at program memory location, 300000h. A complete list is shown in Table 26-2. A detailed explanation of the various bit functions is provided in Register 26-1 through Register 26-6.
MAPPING OF THE FLASH CONFIGURATION WORDS TO THE CONFIGURATION REGISTERS
Code Space Address XXXF8h XXXF9h XXXFAh XXXFBh XXXFCh XXXFDh Configuration Register Address 300000h 300001h 300002h 300003h 300004h 300005h
Configuration Byte CONFIG1L CONFIG1H CONFIG2L CONFIG2H CONFIG3L CONFIG3H
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TABLE 26-2:
File Name 300000h 300001h 300002h 300003h 300004h 300005h CONFIG1L CONFIG1H CONFIG2L CONFIG2H CONFIG3L CONFIG3H
CONFIGURATION BITS AND DEVICE IDs
Bit 7 DEBUG --
(2)
Bit 6 XINST --
(2)
Bit 5 STVREN --
(2)
Bit 4 -- --
(2)
Bit 3 -- --
(3)
Bit 2 -- CP0 FOSC2 -- -- REV2 DEV5
Bit 1 -- -- FOSC1 RTCOSC -- REV1 DEV4
Bit 0 WDTEN -- FOSC0 -- CCP2MX REV0 DEV3
Default/ Unprogrammed Value(1) 111- ---1 ---- 01-11-1 1111 ---- 1111 ---- --1---- ---1 01xx xxxx(4) 0101 0000(4)
IESO --(2) --(2) --(2) DEV2 DEV10
FCMEN --(2) --(2) --(2) DEV1 DEV9
-- --(2) --(2) --(2) DEV0 DEV8
LPT1OSC --(2) --(2) --(2) REV4 DEV7
T1DIG -- -- REV3 DEV6
WDTPS3 WDTPS2 WDTPS1 WDTPS0
3FFFFEh DEVID1 3FFFFFh DEVID2 Legend: Note 1: 2: 3: 4:
x = unknown, - = unimplemented. Shaded cells are unimplemented, read as `0'. Values reflect the unprogrammed state as received from the factory and following Power-on Resets. In all other Reset states, the configuration bytes maintain their previously programmed states. The value of these bits in program memory should always be `1'. This ensures that the location is executed as a NOP if it is accidentally executed. This bit should always be maintained as `0'. These registers are read-only and cannot be programmed by the user. See Register 26-7 for device-specific values for DEVID1.
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REGISTER 26-1:
R/WO-1 DEBUG bit 7 Legend: R = Readable bit WO = Write-Once bit U = Unimplemented bit, read as `0' `1' = Bit is set `0' = Bit is cleared -n = Value when device is unprogrammed bit 7
CONFIG1L: CONFIGURATION REGISTER 1 LOW (BYTE ADDRESS 300000h)
R/WO-1 STVREN U-0 -- U-0 -- U-0 -- U-0 -- R/WO-1 WDTEN bit 0
R/WO-1 XINST
DEBUG: Background Debugger Enable bit 1 = Background debugger is disabled; RB6 and RB7 are configured as general purpose I/O pins 0 = Background debugger is enabled; RB6 and RB7 are dedicated to In-Circuit Debug XINST: Extended Instruction Set Enable bit 1 = Instruction set extension and Indexed Addressing mode are enabled 0 = Instruction set extension and Indexed Addressing mode are disabled (Legacy mode) STVREN: Stack Overflow/Underflow Reset Enable bit 1 = Reset on stack overflow/underflow is enabled 0 = Reset on stack overflow/underflow is disabled Unimplemented: Read as `0' WDTEN: Watchdog Timer Enable bit 1 = WDT is enabled 0 = WDT is disabled (control is placed on SWDTEN bit)
bit 6
bit 5
bit 4-1 bit 0
REGISTER 26-2:
U-0 --(1) bit 7 Legend: R = Readable bit
CONFIG1H: CONFIGURATION REGISTER 1 HIGH (BYTE ADDRESS 300001h)
U-0 --(1) U-0 --(1) U-0 --(1) U-0 --(2) R/WO-1 CP0 U-0 -- U-0 -- bit 0
WO = Write-Once bit
U = Unimplemented bit, read as `0' `1' = Bit is set `0' = Bit is cleared
-n = Value when device is unprogrammed bit 7-3 bit 2 Unimplemented: Read as `0' CP0: Code Protection bit 1 = Program memory is not code-protected 0 = Program memory is code-protected Unimplemented: Read as `0'
bit 1-0 Note 1: 2:
The value of these bits in program memory should always be `1'. This ensures that the location is executed as a NOP if it is accidentally executed. This bit should always be maintained as `0'.
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REGISTER 26-3:
R/WO-1 IESO bit 7 Legend: R = Readable bit WO = Write-Once bit -n = Value when device is unprogrammed bit 7 U = Unimplemented bit, read as `0' `1' = Bit is set `0' = Bit is cleared
CONFIG2L: CONFIGURATION REGISTER 2 LOW (BYTE ADDRESS 300002h)
U-0 -- R/WO-1 LPT1OSC R/WO-1 T1DIG R/WO-1 FOSC2 R/WO-1 FOSC1 R/WO-1 FOSC0 bit 0
R/WO-1 FCMEN
IESO: Two-Speed Start-up (Internal/External Oscillator Switchover) Control bit 1 = Two-Speed Start-up is enabled 0 = Two-Speed Start-up is disabled FCMEN: Fail-Safe Clock Monitor Enable bit 1 = Fail-Safe Clock Monitor is enabled 0 = Fail-Safe Clock Monitor is disabled Unimplemented: Read as `0' LPT1OSC: T1OSC/SOSC Power Selection Configuration bit 1 = High-power T1OSC/SOSC circuit is selected 0 = Low-power T1OSC/SOSC circuit is selected T1DIG: T1CKI for Digital Input Clock Enable bit 1 = T1CKI is available as a digital input without enabling T1OSCEN 0 = T1CKI is not available as a digital input without enabling T1OSCEN FOSC<2:0>: Oscillator Selection bits 111 = ECPLL OSC1/OSC2 as primary; ECPLL oscillator with PLL is enabled; CLKO on RA6 110 = EC OSC1/OSC2 as primary; external clock with FOSC/4 output 101 = HSPLL OSC1/OSC2 as primary; high-speed crystal/resonator with software PLL control 100 = HS OSC1/OSC2 as primary; high-speed crystal/resonator 011 = INTPLL1 internal oscillator block with software PLL control; FOSC/4 output 010 = INTIO1 internal oscillator block with FOSC/4 output on RA6 and I/O on RA7 001 = INTPLL2 internal oscillator block with software PLL control and I/O on RA6 and RA7 000 = INTIO2 internal oscillator block with I/O on RA6 and RA7
bit 6
bit 5 bit 4
bit 3
bit 2-0
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REGISTER 26-4:
U-0 -- bit 7 Legend: R = Readable bit
(1)
CONFIG2H: CONFIGURATION REGISTER 2 HIGH (BYTE ADDRESS 300003h)
U-0 --
(1)
U-0 --
(1)
U-0 --
(1)
R/WO-1 WDTPS3
R/WO-1 WDTPS2
R/WO-1 WDTPS1
R/WO-1 WDTPS0 bit 0
WO = Write-Once bit
U = Unimplemented bit, read as `0' `1' = Bit is set `0' = Bit is cleared
-n = Value when device is unprogrammed bit 7-4 bit 3-0
Unimplemented: Read as `0' WDTPS<3:0>: Watchdog Timer Postscale Select bits 1111 = 1:32,768 1110 = 1:16,384 1101 = 1:8,192 1100 = 1:4,096 1011 = 1:2,048 1010 = 1:1,024 1001 = 1:512 1000 = 1:256 0111 = 1:128 0110 = 1:64 0101 = 1:32 0100 = 1:16 0011 = 1:8 0010 = 1:4 0001 = 1:2 0000 = 1:1 The value of these bits in program memory should always be `1'. This ensures that the location is executed as a NOP if it is accidentally executed.
Note 1:
REGISTER 26-5:
U-0 --(1) bit 7 Legend: R = Readable bit
CONFIG3L: CONFIGURATION REGISTER 3 LOW (BYTE ADDRESS 300004h)
U-0 --(1) U-0 --(1) U-0 --(1) U-0 -- U-0 -- R/WO-1 RTCOSC U-0 -- bit 0
WO = Write-Once bit
U = Unimplemented bit, read as `0' `1' = Bit is set `0' = Bit is cleared
-n = Value when device is unprogrammed bit 7-2 bit 1
bit 0 Note 1:
Unimplemented: Read as `0' RTCOSC: RTCC Reference Clock Select bit 1 = RTCC uses T1OSC/T1CKI as the reference clock 0 = RTCC uses INTRC as the reference clock Unimplemented: Read as `0' The value of these bits in program memory should always be `1'. This ensures that the location is executed as a NOP if it is accidentally executed.
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REGISTER 26-6:
U-0 -- bit 7 Legend: R = Readable bit WO = Write-Once bit U = Unimplemented bit, read as `0' `1' = Bit is set `0' = Bit is cleared -n = Value when device is unprogrammed bit 7-1 bit 0 Unimplemented: Read as `0' CCP2MX: CCP2 MUX bit 1 = CCP2 is multiplexed with RC1 0 = CCP2 is multiplexed with RE7 The value of these bits in program memory should always be `1'. This ensures that the location is executed as a NOP if it is accidentally executed.
(1)
CONFIG3H: CONFIGURATION REGISTER 3 HIGH (BYTE ADDRESS 300005h)
U-0 --
(1)
U-0 --
(1)
U-0 --
(1)
U-0 --
U-0 --
U-0 --
R/WO-1 CCP2MX bit 0
Note 1:
REGISTER 26-7:
R DEV2 bit 7 Legend: R = Read-only bit bit 7-5
DEVID1: DEVICE ID REGISTER 1
R R DEV0 R REV4 R REV3 R REV2 R REV1 R REV0 bit 0
DEV1
DEV<2:0>: Device ID bits 011 = PIC18F87J72 010 = PIC18F86J72 REV<4:0>: Revision ID bits These bits are used to indicate the device revision.
bit 4-0
REGISTER 26-8:
R DEV10(1) bit 7 Legend: R = Read-only bit bit 7-0
DEVID2: DEVICE ID REGISTER 2
R R DEV8(1) R DEV7(1) R DEV6(1) R DEV5(1) R DEV4(1) R DEV3(1) bit 0
DEV9(1)
DEV<10:3>: Device ID bits(1) These bits are used with the DEV<2:0> bits in the Device ID Register 1 to identify the part number. 0101 0000 = PIC18F87J72 family devices The values for DEV<10:3> may be shared with other device families. The specific device is always identified by using the entire DEV<10:0> bit sequence.
Note 1:
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26.2 Watchdog Timer (WDT)
For PIC18F87J72 family devices, the WDT is driven by the INTRC oscillator. When the WDT is enabled, the clock source is also enabled. The nominal WDT period is 4 ms and has the same stability as the INTRC oscillator. The 4 ms period of the WDT is multiplied by a 16-bit postscaler. Any output of the WDT postscaler is selected by a multiplexer, controlled by the WDTPS bits in Configuration Register 2H. Available periods range from 4 ms to 131.072 seconds (2.18 minutes). The WDT and postscaler are cleared whenever a SLEEP or CLRWDT instruction is executed, or a clock failure (primary or Timer1 oscillator) has occurred. Note 1: The CLRWDT and SLEEP instructions clear the WDT and postscaler counts when executed. 2: When a CLRWDT instruction is executed, the postscaler count will be cleared.
26.2.1
CONTROL REGISTER
The WDTCON register (Register 26-9) is a readable and writable register. The SWDTEN bit enables or disables WDT operation. This allows software to override the WDTEN Configuration bit and enable the WDT only if it has been disabled by the Configuration bit.
FIGURE 26-1:
SWDTEN
WDT BLOCK DIAGRAM
Enable WDT INTRC Control Wake-up from Power-Managed Modes Programmable Postscaler 1:1 to 1:32,768 4 Reset WDT Reset
WDT Counter INTRC Oscillator CLRWDT All Device Resets WDTPS<3:0> Sleep 128
WDT
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REGISTER 26-9:
R/W-0 REGSLP(1) bit 7 Legend: R = Readable bit -n = Value at POR bit 7 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
WDTCON: WATCHDOG TIMER CONTROL REGISTER
U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 SWDTEN(2) bit 0
REGSLP: Voltage Regulator Low-Power Operation Enable bit(1) 1 = On-chip regulator enters low-power operation when device enters Sleep mode 0 = On-chip regulator continues to operate normally in Sleep mode Unimplemented: Read as `0' SWDTEN: Software Controlled Watchdog Timer Enable bit(2) 1 = Watchdog Timer is on 0 = Watchdog Timer is off The REGSLP bit is automatically cleared when a Low-Voltage Detect condition occurs. This bit has no effect if the Configuration bit, WDTEN, is enabled.
bit 6-1 bit 0
Note 1: 2:
TABLE 26-3:
Name RCON WDTCON
SUMMARY OF WATCHDOG TIMER REGISTERS
Bit 7 IPEN REGSLP Bit 6 -- -- Bit 5 CM -- Bit 4 RI -- Bit 3 TO -- Bit 2 PD -- Bit 1 POR -- Bit 0 BOR SWDTEN Reset Values on page 50 50
Legend: -- = unimplemented, read as `0'. Shaded cells are not used by the Watchdog Timer.
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26.3 On-Chip Voltage Regulator
FIGURE 26-2:
All of the PIC18F87J72 family devices power their core digital logic at a nominal 2.5V. For designs that are required to operate at a higher typical voltage, such as 3.3V, all devices in the PIC18F87J72 family incorporate an on-chip regulator that allows the device to run its core logic from VDD. The regulator is controlled by the ENVREG pin. Tying VDD to the pin enables the regulator, which in turn, provides power to the core from the other VDD pins. When the regulator is enabled, a low-ESR filter capacitor must be connected to the VDDCORE/VCAP pin (Figure 26-2). This helps to maintain the stability of the regulator. The recommended value for the filter capacitor is provided in Section 29.3 "DC Characteristics: PIC18F87J72 Family (Industrial)". If ENVREG is tied to VSS, the regulator is disabled. In this case, separate power for the core logic, at a nominal 2.5V, must be supplied to the device on the VDDCORE/VCAP pin to run the I/O pins at higher voltage levels, typically 3.3V. Alternatively, the VDDCORE/VCAP and VDD pins can be tied together to operate at a lower nominal voltage. Refer to Figure 26-2 for possible configurations.
CONNECTIONS FOR THE ON-CHIP REGULATOR
Regulator Enabled (ENVREG tied to VDD): 3.3V PIC18F87J72 VDD ENVREG VDDCORE/VCAP CF VSS
Regulator Disabled (ENVREG tied to ground): 2.5V(1) 3.3V(1) PIC18F87J72 VDD ENVREG VDDCORE/VCAP VSS
26.3.1
VOLTAGE REGULATION AND LOW-VOLTAGE DETECTION
When it is enabled, the on-chip regulator provides a constant voltage of 2.5V nominal to the digital core logic. The regulator can provide this level from a VDD of about 2.5V, all the way up to the device's VDDMAX. It does not have the capability to boost VDD levels below 2.5V. In order to prevent "brown-out" conditions, when the voltage drops too low for the regulator, the regulator enters Tracking mode. In Tracking mode, the regulator output follows VDD, with a typical voltage drop of 100 mV. The on-chip regulator includes a simple Low-Voltage Detect (LVD) circuit. If VDD drops too low to maintain approximately 2.45V on VDDCORE, the circuit sets the Low-Voltage Detect Interrupt Flag, LVDIF (PIR2<2>), and clears the REGSLP (WDTCON<7>) bit if it was set. This can be used to generate an interrupt and puts the application into a low-power operational mode or triggers an orderly shutdown. Low-Voltage Detection is only available when the regulator is enabled.
Regulator Disabled (VDD tied to VDDCORE): 2.5V(1) PIC18F87J72 VDD ENVREG VDDCORE/VCAP VSS
Note 1:
These are typical operating voltages. For the full operating ranges of VDD and VDDCORE, refer to Section 29.1 "DC Characteristics: Supply Voltage PIC18F87J72 Family (Industrial)".
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26.3.2 ON-CHIP REGULATOR AND BOR
When the on-chip regulator is enabled, PIC18F87J72 family devices also have a simple Brown-out Reset capability. If the voltage supplied to the regulator falls to a level that is inadequate to maintain a regulated output for full-speed operation, the regulator Reset circuitry will generate a Brown-out Reset. This event is captured by the BOR flag bit (RCON<0>). The operation of the BOR is described in more detail in Section 5.4 "Brown-out Reset (BOR)" and Section 5.4.1 "Detecting BOR". The REGSLP bit is automatically cleared by hardware when a Low-Voltage Detect condition occurs. The REGSLP bit can be set again in software, which would continue to keep the voltage regulator in Low-Power mode. This, however, is not recommended if any write operations to the Flash will be performed.
26.4
Two-Speed Start-up
26.3.3
POWER-UP REQUIREMENTS
The on-chip regulator is designed to meet the power-up requirements for the device. If the application does not use the regulator, then strict power-up conditions must be adhered to. While powering up, VDDCORE must never exceed VDD by 0.3 volts.
The Two-Speed Start-up feature helps to minimize the latency period, from oscillator start-up to code execution, by allowing the microcontroller to use the INTRC oscillator as a clock source until the primary clock source is available. It is enabled by setting the IESO Configuration bit. Two-Speed Start-up should be enabled only if the primary oscillator mode is HS or HSPLL (Crystal-Based) modes. Since the EC and ECPLL modes do not require an OST start-up delay, Two-Speed Start-up should be disabled. When enabled, Resets and wake-ups from Sleep mode cause the device to configure itself to run from the internal oscillator block as the clock source, following the time-out of the Power-up Timer after a Power-on Reset is enabled. This allows almost immediate code execution while the primary oscillator starts and the OST is running. Once the OST times out, the device automatically switches to PRI_RUN mode. In all other power-managed modes, Two-Speed Start-up is not used. The device will be clocked by the currently selected clock source until the primary clock source becomes available. The setting of the IESO bit is ignored.
26.3.4
OPERATION IN SLEEP MODE
When enabled, the on-chip regulator always consumes a small incremental amount of current over IDD. This includes when the device is in Sleep mode, even though the core digital logic does not require power. To provide additional savings in applications where power resources are critical, the regulator can be configured to automatically disable itself whenever the device goes into Sleep mode. This feature is controlled by the REGSLP bit (WDTCON<7>). Setting this bit disables the regulator in Sleep mode and reduces its current consumption to a minimum. Substantial Sleep mode power savings can be obtained by setting the REGSLP bit, but device wake-up time will increase in order to ensure the regulator has enough time to stabilize.
FIGURE 26-3:
TIMING TRANSITION FOR TWO-SPEED START-UP (INTRC TO HSPLL)
Q1 INTRC OSC1 TOST(1) TPLL(1) 1 2 n-1 n Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3
PLL Clock Output CPU Clock Peripheral Clock Program Counter PC PC + 2 OSTS bit Set
Clock Transition
PC + 4
PC + 6
Wake from Interrupt Event Note 1:
TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
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26.4.1 SPECIAL CONSIDERATIONS FOR USING TWO-SPEED START-UP
While using the INTRC oscillator in Two-Speed Start-up, the device still obeys the normal command sequences for entering power-managed modes, including serial SLEEP instructions (refer to Section 4.1.4 "Multiple Sleep Commands"). In practice, this means that user code can change the SCS<1:0> bit settings or issue SLEEP instructions before the OST times out. This would allow an application to briefly wake-up, perform routine "housekeeping" tasks and return to Sleep before the device starts to operate from the primary oscillator. User code can also check if the primary clock source is currently providing the device clocking by checking the status of the OSTS bit (OSCCON<3>). If the bit is set, the primary oscillator is providing the clock. Otherwise, the internal oscillator block is providing the clock during wake-up from Reset or Sleep mode. Clock failure is tested for on the falling edge of the sample clock. If a sample clock falling edge occurs while CM is still set, a clock failure has been detected (Figure 26-5). This causes the following: * the FSCM generates an oscillator fail interrupt by setting bit, OSCFIF (PIR2<7>); * the device clock source is switched to the internal oscillator block (OSCCON is not updated to show the current clock source - this is the fail-safe condition); and * the WDT is reset. During switchover, the postscaler frequency from the internal oscillator block may not be sufficiently stable for timing-sensitive applications. In these cases, it may be desirable to select another clock configuration and enter an alternate power-managed mode. This can be done to attempt a partial recovery or execute a controlled shutdown. See Section 4.1.4 "Multiple Sleep Commands" and Section 26.4.1 "Special Considerations for Using Two-Speed Start-up" for more details. The FSCM will detect failures of the primary or secondary clock sources only. If the internal oscillator block fails, no failure would be detected, nor would any action be possible.
26.5
Fail-Safe Clock Monitor
The Fail-Safe Clock Monitor (FSCM) allows the microcontroller to continue operation in the event of an external oscillator failure by automatically switching the device clock to the internal oscillator block. The FSCM function is enabled by setting the FCMEN Configuration bit. When FSCM is enabled, the INTRC oscillator runs at all times to monitor clocks to peripherals and provides a backup clock in the event of a clock failure. Clock monitoring (shown in Figure 26-4) is accomplished by creating a sample clock signal, which is the INTRC output divided by 64. This allows ample time between FSCM sample clocks for a peripheral clock edge to occur. The peripheral device clock and the sample clock are presented as inputs to the Clock Monitor (CM) latch. The CM is set on the falling edge of the device clock source but cleared on the rising edge of the sample clock.
26.5.1
FSCM AND THE WATCHDOG TIMER
Both the FSCM and the WDT are clocked by the INTRC oscillator. Since the WDT operates with a separate divider and counter, disabling the WDT has no effect on the operation of the INTRC oscillator when the FSCM is enabled. As already noted, the clock source is switched to the INTRC clock when a clock failure is detected. This may mean a substantial change in the speed of code execution. If the WDT is enabled with a small prescale value, a decrease in clock speed allows a WDT time-out to occur and a subsequent device Reset. For this reason, Fail-Safe Clock Monitor events also reset the WDT and postscaler, allowing it to start timing from when execution speed was changed and decreasing the likelihood of an erroneous time-out. If the interrupt is disabled, subsequent interrupts while in Idle mode will cause the CPU to begin executing instructions while being clocked by the INTRC source.
FIGURE 26-4:
FSCM BLOCK DIAGRAM
Clock Monitor Latch (CM) (edge-triggered)
Peripheral Clock
S
Q
INTRC Source (32 s)
/ 64 488 Hz (2.048 ms)
C
Q
Clock Failure Detected
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FIGURE 26-5:
Sample Clock Device Clock Output CM Output (Q) OSCFIF Failure Detected Oscillator Failure
FSCM TIMING DIAGRAM
CM Test Note:
CM Test
CM Test
The device clock is normally at a much higher frequency than the sample clock. The relative frequencies in this example have been chosen for clarity.
26.5.2
EXITING FAIL-SAFE OPERATION
26.5.4
POR OR WAKE-UP FROM SLEEP
The fail-safe condition is terminated by either a device Reset or by entering a power-managed mode. On Reset, the controller starts the primary clock source specified in Configuration Register 2H (with any required start-up delays that are required for the oscillator mode, such as OST or PLL timer). The INTRC oscillator provides the device clock until the primary clock source becomes ready (similar to a Two-Speed Start-up). The clock source is then switched to the primary clock (indicated by the OSTS bit in the OSCCON register becoming set). The Fail-Safe Clock Monitor then resumes monitoring the peripheral clock. The primary clock source may never become ready during start-up. In this case, operation is clocked by the INTOSC multiplexer. The OSCCON register will remain in its Reset state until a power-managed mode is entered.
The FSCM is designed to detect oscillator failure at any point after the device has exited Power-on Reset (POR) or low-power Sleep mode. When the primary device clock is either EC or INTRC mode, monitoring can begin immediately following these events. For HS or HSPLL modes, the situation is somewhat different. Since the oscillator may require a start-up time considerably longer than the FSCM sample clock time, a false clock failure may be detected. To prevent this, the internal oscillator block is automatically configured as the device clock and functions until the primary clock is stable (the OST and PLL timers have timed out). This is identical to Two-Speed Start-up mode. Once the primary clock is stable, the INTRC returns to its role as the FSCM source. Note: The same logic that prevents false oscillator failure interrupts on POR, or wake from Sleep, will also prevent the detection of the oscillator's failure to start at all following these events. This can be avoided by monitoring the OSTS bit and using a timing routine to determine if the oscillator is taking too long to start. Even so, no oscillator failure interrupt will be flagged.
26.5.3
FSCM INTERRUPTS IN POWER-MANAGED MODES
By entering a power-managed mode, the clock multiplexer selects the clock source selected by the OSCCON register. Fail-Safe Clock Monitoring of the power-managed clock source resumes in the power-managed mode. If an oscillator failure occurs during power-managed operation, the subsequent events depend on whether or not the oscillator failure interrupt is enabled. If enabled (OSCFIF = 1), code execution will be clocked by the INTRC multiplexer. An automatic transition back to the failed clock source will not occur.
As noted in Section 26.4.1 "Special Considerations for Using Two-Speed Start-up", it is also possible to select another clock configuration and enter an alternate power-managed mode while waiting for the primary clock to become stable. When the new power-managed mode is selected, the primary clock is disabled.
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26.6 Program Verification and Code Protection 26.7 In-Circuit Serial Programming
PIC18F87J72 family microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed.
For all devices in the PIC18F87J72 family of devices, the on-chip program memory space is treated as a single block. Code protection for this block is controlled by one Configuration bit, CP0. This bit inhibits external reads and writes to the program memory space. It has no direct effect in normal execution mode.
26.6.1
CONFIGURATION REGISTER PROTECTION
The Configuration registers are protected against untoward changes or reads in two ways. The primary protection is the write-once feature of the Configuration bits, which prevents reconfiguration once the bit has been programmed during a power cycle. To safeguard against unpredictable events, Configuration bit changes resulting from individual cell-level disruptions (such as ESD events) will cause a parity error and trigger a device Reset. The data for the Configuration registers is derived from the Flash Configuration Words in program memory. When the CP0 bit set, the source data for device configuration is also protected as a consequence.
26.8
In-Circuit Debugger
When the DEBUG Configuration bit is programmed to a `0', the In-Circuit Debugger functionality is enabled. This function allows simple debugging functions when used with MPLAB(R) IDE. When the microcontroller has this feature enabled, some resources are not available for general use. Table 26-4 shows which resources are required by the background debugger.
TABLE 26-4:
I/O Pins: Stack:
DEBUGGER RESOURCES
RB6, RB7 2 levels 512 bytes 10 bytes
Program Memory: Data Memory:
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NOTES:
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27.0 INSTRUCTION SET SUMMARY
The PIC18F87J72 family of devices incorporates the standard set of 75 PIC18 core instructions, as well as an extended set of 8 new instructions for the optimization of code that is recursive or that utilizes a software stack. The extended set is discussed later in this section. The literal instructions may use some of the following operands: * A literal value to be loaded into a file register (specified by `k') * The desired FSR register to load the literal value into (specified by `f') * No operand required (specified by `--') The control instructions may use some of the following operands: * A program memory address (specified by `n') * The mode of the CALL or RETURN instructions (specified by `s') * The mode of the table read and table write instructions (specified by `m') * No operand required (specified by `--') All instructions are a single word, except for four double-word instructions. These instructions were made double-word to contain the required information in 32 bits. In the second word, the 4 MSbs are `1's. If this second word is executed as an instruction (by itself), it will execute as a NOP. All single-word instructions are executed in a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles with the additional instruction cycle(s) executed as a NOP. The double-word instructions execute in two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 s. If a conditional test is true, or the program counter is changed as a result of an instruction, the instruction execution time is 2 s. Two-word branch instructions (if true) would take 3 s. Figure 27-1 shows the general formats that the instructions can have. All examples use the convention `nnh' to represent a hexadecimal number. The Instruction Set Summary, shown in Table 27-2, lists the standard instructions recognized by the Microchip MPASMTM Assembler. Section 27.1.1 "Standard Instruction Set" provides a description of each instruction.
27.1
Standard Instruction Set
The standard PIC18 MCU instruction set adds many enhancements to the previous PIC(R) MCU instruction sets, while maintaining an easy migration from these PIC MCU instruction sets. Most instructions are a single program memory word (16 bits), but there are four instructions that require two program memory locations. Each single-word instruction is a 16-bit word divided into an opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into four basic categories: * * * * Byte-oriented operations Bit-oriented operations Literal operations Control operations
The PIC18 instruction set summary in Table 27-2 lists byte-oriented, bit-oriented, literal and control operations. Table 27-1 shows the opcode field descriptions. Most byte-oriented instructions have three operands: 1. 2. 3. The file register (specified by `f') The destination of the result (specified by `d') The accessed memory (specified by `a')
The file register designator, `f', specifies which file register is to be used by the instruction. The destination designator, `d', specifies where the result of the operation is to be placed. If `d' is zero, the result is placed in the WREG register. If `d' is one, the result is placed in the file register specified in the instruction. All bit-oriented instructions have three operands: 1. 2. 3. The file register (specified by `f') The bit in the file register (specified by `b') The accessed memory (specified by `a')
The bit field designator, `b', selects the number of the bit affected by the operation, while the file register designator, `f', represents the number of the file in which the bit is located.
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TABLE 27-1:
Field a
OPCODE FIELD DESCRIPTIONS
Description RAM access bit: a = 0: RAM location in Access RAM (BSR register is ignored) a = 1: RAM bank is specified by BSR register Bit address within an 8-bit file register (0 to 7). Bank Select Register. Used to select the current RAM bank. ALU Status bits: Carry, Digit Carry, Zero, Overflow, Negative. Destination select bit: d = 0: store result in WREG d = 1: store result in file register f Destination: either the WREG register or the specified register file location. 8-bit register file address (00h to FFh), or 2-bit FSR designator (0h to 3h). 12-bit register file address (000h to FFFh). This is the source address. 12-bit register file address (000h to FFFh). This is the destination address. Global Interrupt Enable bit. Literal field, constant data or label (may be either an 8-bit, 12-bit or a 20-bit value). Label name. The mode of the TBLPTR register for the table read and table write instructions. Only used with table read and table write instructions: No Change to register (such as TBLPTR with table reads and writes) Post-Increment register (such as TBLPTR with table reads and writes) Post-Decrement register (such as TBLPTR with table reads and writes) Pre-Increment register (such as TBLPTR with table reads and writes) The relative address (2's complement number) for relative branch instructions or the direct address for Call/Branch and Return instructions. Program Counter. Program Counter Low Byte. Program Counter High Byte. Program Counter High Byte Latch. Program Counter Upper Byte Latch. Power-Down bit. Product of Multiply High Byte. Product of Multiply Low Byte. Fast Call/Return mode select bit: s = 0: do not update into/from shadow registers s = 1: certain registers loaded into/from shadow registers (Fast mode) 21-bit Table Pointer (points to a Program Memory location). 8-bit Table Latch. Time-out bit. Top-of-Stack. Unused or Unchanged. Watchdog Timer. Working register (accumulator). Don't care (`0' or `1'). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. 7-bit offset value for Indirect Addressing of register files (source). 7-bit offset value for Indirect Addressing of register files (destination).
bbb BSR C, DC, Z, OV, N d
dest f fs fd GIE k label mm * *+ *+* n PC PCL PCH PCLATH PCLATU PD PRODH PRODL s
TBLPTR TABLAT TO TOS u WDT WREG x zs zd { } [text] (text)
Optional argument. Indicates an Indexed Address. The contents of text.
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TABLE 27-1:
Field [expr] <> italics Assigned to. Register bit field. In the set of. User-defined term (font is Courier New).
OPCODE FIELD DESCRIPTIONS (CONTINUED)
Description Specifies bit n of the register indicated by the pointer expr.
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FIGURE 27-1: GENERAL FORMAT FOR INSTRUCTIONS
Byte-oriented file register operations 15 OPCODE 10 d 9 87 a f (FILE #) 0 ADDWF MYREG, W, B Example Instruction
d = 0 for result destination to be WREG register d = 1 for result destination to be file register (f) a = 0 to force Access Bank a = 1 for BSR to select bank f = 8-bit file register address Byte to Byte move operations (2-word) 15 15 1111 12 11 f (Source FILE #) 0 f (Destination FILE #) 12 11 0 MOVFF MYREG1, MYREG2 OPCODE
f = 12-bit file register address Bit-oriented file register operations 15 12 11 98 7 f (FILE #) 0 BSF MYREG, bit, B OPCODE b (BIT #) a
b = 3-bit position of bit in file register (f) a = 0 to force Access Bank a = 1 for BSR to select bank f = 8-bit file register address Literal operations 15 OPCODE k = 8-bit immediate value Control operations CALL, GOTO and Branch operations 15 OPCODE 15 1111 12 11 n<19:8> (literal) 87 n<7:0> (literal) 0 0 GOTO Label 8 7 k (literal) 0 MOVLW 7Fh
n = 20-bit immediate value 15 OPCODE 15 1111 S = Fast bit 15 OPCODE 15 OPCODE 87 n<7:0> (literal) 11 10 n<10:0> (literal) 0 BC MYFUNC 0 BRA MYFUNC 12 11 n<19:8> (literal) 87 S n<7:0> (literal) 0 0 CALL MYFUNC
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TABLE 27-2:
Mnemonic, Operands
PIC18F87J72 FAMILY INSTRUCTION SET
Description Cycles 16-Bit Instruction Word MSb 0010 0010 0001 0110 0001 0110 0110 0110 0000 0010 0100 0010 0011 0100 0001 0101 1100 1111 0110 0000 0110 0011 0100 0011 0100 0110 0101 01da 00da 01da 101a 11da 001a 010a 000a 01da 11da 11da 10da 11da 10da 00da 00da ffff ffff 111a 001a 110a 01da 01da 00da 00da 100a 01da ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff LSb ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff Status Affected Notes
BYTE-ORIENTED OPERATIONS ADDWF ADDWFC ANDWF CLRF COMF CPFSEQ CPFSGT CPFSLT DECF DECFSZ DCFSNZ INCF INCFSZ INFSNZ IORWF MOVF MOVFF MOVWF MULWF NEGF RLCF RLNCF RRCF RRNCF SETF SUBFWB SUBWF SUBWFB SWAPF TSTFSZ XORWF Note 1: f, d, a f, d, a f, d, a f, a f, d, a f, a f, a f, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a fs, fd f, a f, a f, a f, d, a f, d, a f, d, a f, d, a f, a f, d, a f, d, a f, d, a f, d, a f, a f, d, a Add WREG and f Add WREG and Carry bit to f AND WREG with f Clear f Complement f Compare f with WREG, Skip = Compare f with WREG, Skip > Compare f with WREG, Skip < Decrement f Decrement f, Skip if 0 Decrement f, Skip if Not 0 Increment f Increment f, Skip if 0 Increment f, Skip if Not 0 Inclusive OR WREG with f Move f Move fs (source) to 1st word fd (destination) 2nd word Move WREG to f Multiply WREG with f Negate f Rotate Left f through Carry Rotate Left f (No Carry) Rotate Right f through Carry Rotate Right f (No Carry) Set f Subtract f from WREG with Borrow Subtract WREG from f Subtract WREG from f with Borrow Swap Nibbles in f Test f, Skip if 0 Exclusive OR WREG with f 1 1 1 1 1 1 (2 or 3) 1 (2 or 3) 1 (2 or 3) 1 1 (2 or 3) 1 (2 or 3) 1 1 (2 or 3) 1 (2 or 3) 1 1 2 1 1 1 1 1 1 1 1 1 1 1 C, DC, Z, OV, N C, DC, Z, OV, N Z, N Z Z, N None None None C, DC, Z, OV, N None None C, DC, Z, OV, N None None Z, N Z, N None 1, 2 1, 2 1,2 2 1, 2 4 4 1, 2 1, 2, 3, 4 1, 2, 3, 4 1, 2 1, 2, 3, 4 4 1, 2 1, 2 1
None None 1, 2 C, DC, Z, OV, N C, Z, N 1, 2 Z, N C, Z, N Z, N None 1, 2 C, DC, Z, OV, N
0101 11da 0101 10da
ffff C, DC, Z, OV, N 1, 2 ffff C, DC, Z, OV, N ffff None ffff None ffff Z, N 4 1, 2
1 0011 10da 1 (2 or 3) 0110 011a 1 0001 10da
2: 3: 4:
When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is `1' for a pin configured as input and is driven low by an external device, the data will be written back with a `0'. If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned. If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction.
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TABLE 27-2:
Mnemonic, Operands
PIC18F87J72 FAMILY INSTRUCTION SET (CONTINUED)
Description Cycles 16-Bit Instruction Word MSb 1001 1000 1011 1010 0111 1110 1110 1110 1110 1110 1110 1110 1101 1110 1110 1111 0000 0000 1110 1111 0000 1111 0000 0000 1101 0000 0000 bbba bbba bbba bbba bbba 0010 0110 0011 0111 0101 0001 0100 0nnn 0000 110s kkkk 0000 0000 1111 kkkk 0000 xxxx 0000 0000 1nnn 0000 0000 ffff ffff ffff ffff ffff nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn kkkk kkkk 0000 0000 kkkk kkkk 0000 xxxx 0000 0000 nnnn 1111 0001 kkkk 0001 0000 LSb ffff ffff ffff ffff ffff nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn kkkk kkkk 0100 0111 kkkk kkkk 0000 xxxx 0110 0101 nnnn 1111 000s Status Affected Notes
BIT-ORIENTED OPERATIONS BCF BSF BTFSC BTFSS BTG BC BN BNC BNN BNOV BNZ BOV BRA BZ CALL CLRWDT DAW GOTO NOP NOP POP PUSH RCALL RESET RETFIE RETLW RETURN SLEEP Note 1: f, b, a f, b, a f, b, a f, b, a f, b, a n n n n n n n n n n, s -- -- n -- -- -- -- n s k s -- Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set Bit Toggle f Branch if Carry Branch if Negative Branch if Not Carry Branch if Not Negative Branch if Not Overflow Branch if Not Zero Branch if Overflow Branch Unconditionally Branch if Zero Call Subroutine 1st word 2nd word Clear Watchdog Timer Decimal Adjust WREG Go to Address 1st word 2nd word No Operation No Operation Pop Top of Return Stack (TOS) Push Top of Return Stack (TOS) Relative Call Software Device Reset Return from Interrupt Enable Return with Literal in WREG Return from Subroutine Go into Standby mode 1 1 1 (2 or 3) 1 (2 or 3) 1 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 2 1 (2) 2 1 1 2 1 1 1 1 2 1 2 2 2 1 None None None None None None None None None None None None None None None TO, PD C None 1, 2 1, 2 3, 4 3, 4 1, 2
CONTROL OPERATIONS
0000 1100 0000 0000 0000 0000
None None None None None All GIE/GIEH, PEIE/GIEL kkkk None 001s None 0011 TO, PD
4
2: 3: 4:
When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is `1' for a pin configured as input and is driven low by an external device, the data will be written back with a `0'. If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned. If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction.
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TABLE 27-2:
Mnemonic, Operands LITERAL OPERATIONS ADDLW ANDLW IORLW LFSR MOVLB MOVLW MULLW RETLW SUBLW XORLW TBLRD* TBLRD*+ TBLRD*TBLRD+* TBLWT* TBLWT*+ TBLWT*TBLWT+* Note 1: k k k f, k k k k k k k Add Literal and WREG AND Literal with WREG Inclusive OR Literal with WREG Move literal (12-bit) 2nd word to FSR(f) 1st word Move Literal to BSR<3:0> Move Literal to WREG Multiply Literal with WREG Return with Literal in WREG Subtract WREG from Literal Exclusive OR Literal with WREG 1 1 1 2 1 1 1 2 1 1 0000 0000 0000 1110 1111 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 1111 1011 1001 1110 0000 0001 1110 1101 1100 1000 1010 0000 0000 0000 0000 0000 0000 0000 0000 kkkk kkkk kkkk 00ff kkkk 0000 kkkk kkkk kkkk kkkk kkkk 0000 0000 0000 0000 0000 0000 0000 0000 kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk 1000 1001 1010 1011 1100 1101 1110 1111 C, DC, Z, OV, N Z, N Z, N None None None None None C, DC, Z, OV, N Z, N None None None None None None None None
PIC18F87J72 FAMILY INSTRUCTION SET (CONTINUED)
Description Cycles 16-Bit Instruction Word MSb LSb Status Affected Notes
DATA MEMORY PROGRAM MEMORY OPERATIONS Table Read 2 Table Read with Post-Increment Table Read with Post-Decrement Table Read with Pre-Increment Table Write 2 Table Write with Post-Increment Table Write with Post-Decrement Table Write with Pre-Increment
2: 3: 4:
When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is `1' for a pin configured as input and is driven low by an external device, the data will be written back with a `0'. If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned. If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction.
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27.1.1
ADDLW Syntax: Operands: Operation: Status Affected: Encoding: Description:
STANDARD INSTRUCTION SET
ADD Literal to W ADDLW 0 k 255 (W) + k W N, OV, C, DC, Z 0000 1111 kkkk kkkk The contents of W are added to the 8-bit literal `k' and the result is placed in W. 1 1 Q1 Q2 Read literal `k' ADDLW Q3 Process Data 15h Q4 Write to W Operation: Status Affected: Encoding: Description: k ADDWF Syntax: Operands: ADD W to f ADDWF 0 f 255 d [0,1] a [0,1] (W) + (f) dest N, OV, C, DC, Z 0010 01da ffff ffff Add W to register `f'. If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' ADDWF 17h 0C2h 0D9h 0C2h Q3 Process Data REG, 0, 0 Q4 Write to destination 1 1 f {,d {,a}}
Words: Cycles: Q Cycle Activity: Decode
Example:
Before Instruction W = 10h After Instruction W= 25h
Example:
Before Instruction W = REG = After Instruction W = REG =
Note:
All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s).
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ADDWFC Syntax: Operands: ADD W and Carry bit to f ADDWFC 0 f 255 d [0,1] a [0,1] (W) + (f) + (C) dest N,OV, C, DC, Z 0010 00da ffff ffff Add W, the Carry flag and data memory location `f'. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed in data memory location `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' ADDWFC 1 02h 4Dh 0 02h 50h Q3 Process Data REG, 0, 1 Q4 Write to destination 1 1 f {,d {,a}} ANDLW Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read literal `k' ANDLW A3h 03h Q3 Process Data 05Fh Q4 Write to W AND Literal with W ANDLW 0 k 255 (W) .AND. k W N, Z 0000 1011 kkkk kkkk The contents of W are ANDed with the 8-bit literal `k'. The result is placed in W. 1 1 k
Operation: Status Affected: Encoding: Description:
Example:
Before Instruction W = After Instruction W =
Example:
Before Instruction Carry bit = REG = W = After Instruction Carry bit = REG = W =
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ANDWF Syntax: Operands: AND W with f ANDWF 0 f 255 d [0,1] a [0,1] (W) .AND. (f) dest N, Z 0001 01da ffff ffff The contents of W are ANDed with register `f'. If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' ANDWF 17h C2h 02h C2h Q3 Process Data REG, 0, 0 Q4 Write to destination 1 1 No operation If No Jump: Q1 Decode Q2 Read literal `n' HERE = = = = = Q3 Process Data BC 5 Q4 No operation Words: Cycles: Q Cycle Activity: If Jump: Q1 Decode Q2 Read literal `n' No operation Q3 Process Data No operation Q4 Write to PC No operation f {,d {,a}} BC Syntax: Operands: Operation: Status Affected: Encoding: Description: Branch if Carry BC n
-128 n 127 if Carry bit is `1', (PC) + 2 + 2n PC None 1110 0010 nnnn nnnn If the Carry bit is '1', then the program will branch. The 2's complement number `2n' is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. 1 1(2)
Operation: Status Affected: Encoding: Description:
Example:
Example:
Before Instruction W = REG = After Instruction W = REG =
Before Instruction PC After Instruction If Carry PC If Carry PC
address (HERE) 1; address (HERE + 12) 0; address (HERE + 2)
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BCF Syntax: Operands: Bit Clear f BCF f, b {,a} BN Syntax: Operands: Operation: Status Affected: Encoding: bbba ffff ffff Description: Branch if Negative BN n
0 f 255 0b7 a [0,1] 0 f None 1001 Bit `b' in register `f' is cleared. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details.
-128 n 127 if Negative bit is `1', (PC) + 2 + 2n PC None 1110 0110 nnnn nnnn If the Negative bit is `1', then the program will branch. The 2's complement number `2n' is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction.
Operation: Status Affected: Encoding: Description:
Words: Cycles: Q Cycle Activity: If Jump: Q1 Decode
1 1(2)
Words: Cycles: Q Cycle Activity: Q1 Decode
1 1 Q2 Read register `f' BCF Q3 Process Data FLAG_REG, Q4 Write register `f' 7, 0
Q2 Read literal `n' No operation Q2 Read literal `n' HERE = = = = =
Q3 Process Data No operation Q3 Process Data BN Jump
Q4 Write to PC No operation Q4 No operation
No operation If No Jump: Q1 Decode
Example:
Before Instruction FLAG_REG = C7h After Instruction FLAG_REG = 47h
Example:
Before Instruction PC After Instruction If Negative PC If Negative PC
address (HERE) 1; address (Jump) 0; address (HERE + 2)
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BNC Syntax: Operands: Operation: Status Affected: Encoding: Description: Branch if Not Carry BNC n BNN Syntax: Operands: Operation: Status Affected: 0011 nnnn nnnn Encoding: Description: Branch if Not Negative BNN n
-128 n 127 if Carry bit is `0', (PC) + 2 + 2n PC None 1110 If the Carry bit is `0', then the program will branch. The 2's complement number `2n' is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction.
-128 n 127 if Negative bit is `0', (PC) + 2 + 2n PC None 1110 0111 nnnn nnnn If the Negative bit is `0', then the program will branch. The 2's complement number `2n' is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction.
Words: Cycles: Q Cycle Activity: If Jump: Q1 Decode No operation If No Jump: Q1 Decode
1 1(2)
Words: Cycles: Q Cycle Activity: If Jump: Q2 Q3 Process Data No operation Q3 Process Data BNC Jump Q4 Write to PC No operation Q4 No operation Q1 Decode No operation If No Jump: Q2 Q1 Decode
1 1(2)
Q2 Read literal `n' No operation Q2 Read literal `n' HERE = = = = =
Q3 Process Data No operation Q3 Process Data BNN Jump
Q4 Write to PC No operation Q4 No operation
Read literal `n' No operation
Read literal `n' HERE = = = = =
Example:
Example:
Before Instruction PC After Instruction If Carry PC If Carry PC
address (HERE) 0; address (Jump) 1; address (HERE + 2)
Before Instruction PC After Instruction If Negative PC If Negative PC
address (HERE) 0; address (Jump) 1; address (HERE + 2)
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BNOV Syntax: Operands: Operation: Status Affected: Encoding: Description: Branch if Not Overflow BNOV n BNZ Syntax: Operands: Operation: Status Affected: 0101 nnnn nnnn Encoding: Description: Branch if Not Zero BNZ n
-128 n 127 if Overflow bit is `0', (PC) + 2 + 2n PC None 1110 If the Overflow bit is `0', then the program will branch. The 2's complement number `2n' is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction.
-128 n 127 if Zero bit is `0', (PC) + 2 + 2n PC None 1110 0001 nnnn nnnn If the Zero bit is `0', then the program will branch. The 2's complement number `2n' is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction.
Words: Cycles: Q Cycle Activity: If Jump: Q1 Decode No operation If No Jump: Q1 Decode
1 1(2)
Words: Cycles: Q Cycle Activity: If Jump: Q2 Q3 Process Data No operation Q3 Process Data BNOV Jump address (HERE) 0; address (Jump) 1; address (HERE + 2) Q4 Write to PC No operation Q4 No operation Q1 Decode No operation If No Jump: Q2 Q1 Decode
1 1(2)
Q2 Read literal `n' No operation Q2 Read literal `n' HERE = = = = =
Q3 Process Data No operation Q3 Process Data BNZ Jump
Q4 Write to PC No operation Q4 No operation
Read literal `n' No operation
Read literal `n' HERE = = = = =
Example:
Example:
Before Instruction PC After Instruction If Overflow PC If Overflow PC
Before Instruction PC After Instruction If Zero PC If Zero PC
address (HERE) 0; address (Jump) 1; address (HERE + 2)
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BRA Syntax: Operands: Operation: Status Affected: Encoding: Description: Unconditional Branch BRA n BSF Syntax: Operands: Bit Set f BSF f, b {,a}
-1024 n 1023 (PC) + 2 + 2n PC None 1101 0nnn nnnn nnnn Add the 2's complement number `2n' to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is a two-cycle instruction. 1 2 Q1 Q2 Read literal `n' No operation Q3 Process Data No operation Q4 Write to PC No operation
0 f 255 0b7 a [0,1] 1 f None 1000 bbba ffff ffff Bit `b' in register `f' is set. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details.
Operation: Status Affected: Encoding: Description:
Words: Cycles: Q Cycle Activity: Decode No operation
Words: Cycles: Q Cycle Activity: Q1 Decode
1 1 Q2 Read register `f' BSF = = Q3 Process Data Q4 Write register `f'
Example:
HERE = =
BRA
Jump
Before Instruction PC After Instruction PC
address (HERE) address (Jump)
Example:
FLAG_REG, 7, 1 0Ah 8Ah
Before Instruction FLAG_REG After Instruction FLAG_REG
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BTFSC Syntax: Operands: Bit Test File, Skip if Clear BTFSC f, b {,a} 0 f 255 0b7 a [0,1] skip if (f) = 0 None 1011 bbba ffff ffff If bit `b' in register `f' is `0', then the next instruction is skipped. If bit `b' is `0', then the next instruction fetched during the current instruction execution is discarded and a NOP is executed instead, making this a two-cycle instruction. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: 1 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q2 Read register `f' Q2 No operation Q2 No operation No operation HERE FALSE TRUE = = = = = Q3 Process Data Q3 No operation Q3 No operation No operation BTFSC : : Q4 No operation If skip: Q1 No operation Q1 No operation No operation Example: Q4 No operation Q4 No operation No operation Q1 No operation Q1 No operation No operation Example: Q2 No operation Q2 No operation No operation HERE FALSE TRUE = = = = = Q3 No operation Q3 No operation No operation BTFSS : : Q4 No operation Q4 No operation No operation Q1 Decode Q2 Read register `f' Q3 Process Data Q4 No operation Words: Cycles: BTFSS Syntax: Operands: Bit Test File, Skip if Set BTFSS f, b {,a} 0 f 255 0b<7 a [0,1] skip if (f) = 1 None 1010 bbba ffff ffff If bit `b' in register `f' is `1', then the next instruction is skipped. If bit `b' is `1', then the next instruction fetched during the current instruction execution is discarded and a NOP is executed instead, making this a two-cycle instruction. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. 1 1(2) Note: 3 cycles if skip and followed by a 2-word instruction.
Operation: Status Affected: Encoding: Description:
Operation: Status Affected: Encoding: Description:
Q Cycle Activity: Q1 Decode If skip:
If skip and followed by 2-word instruction:
If skip and followed by 2-word instruction:
FLAG, 1, 0
FLAG, 1, 0
Before Instruction PC After Instruction If FLAG<1> PC If FLAG<1> PC
address (HERE) 0; address (TRUE) 1; address (FALSE)
Before Instruction PC After Instruction If FLAG<1> PC If FLAG<1> PC
address (HERE) 0; address (FALSE) 1; address (TRUE)
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BTG Syntax: Operands: Bit Toggle f BTG f, b {,a} 0 f 255 0b<7 a [0,1] (f) f None 0111 bbba ffff ffff Bit `b' in data memory location `f' is inverted. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' BTG Q3 Process Data PORTC, 4, 0 Example: Q4 Write register `f' 1 1 BOV Syntax: Operands: Operation: Status Affected: Encoding: Description: Branch if Overflow BOV n
-128 n 127 if Overflow bit is `1', (PC) + 2 + 2n PC None 1110 0100 nnnn nnnn If the Overflow bit is `1', then the program will branch. The 2's complement number `2n' is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction.
Operation: Status Affected: Encoding: Description:
Words: Cycles: Q Cycle Activity: If Jump: Q1 Decode No operation If No Jump: Q1 Decode
1 1(2)
Q2 Read literal `n' No operation Q2 Read literal `n' HERE = = = = =
Q3 Process Data No operation Q3 Process Data BOV Jump
Q4 Write to PC No operation Q4 No operation
Example:
Before Instruction: PORTC = 0111 0101 [75h] After Instruction: PORTC = 0110 0101 [65h]
Before Instruction PC After Instruction If Overflow PC If Overflow PC
address (HERE) 1; address (Jump) 0; address (HERE + 2)
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BZ Syntax: Operands: Operation: Status Affected: Encoding: Description: Branch if Zero BZ n CALL Syntax: Operands: Operation: nnnn nnnn Subroutine Call CALL k {,s} 0 k 1048575 s [0,1] (PC) + 4 TOS, k PC<20:1>; if s = 1 (W) WS, (STATUS) STATUSS, (BSR) BSRS None 1110 1111 110s k19kkk k7kkk kkkk kkkk0 kkkk8
-128 n 127 if Zero bit is `1', (PC) + 2 + 2n PC None 1110 0000 If the Zero bit is `1', then the program will branch. The 2's complement number `2n' is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction.
Status Affected: Encoding: 1st word (k<7:0>) 2nd word(k<19:8>) Description:
Words: Cycles: Q Cycle Activity: If Jump: Q1 Decode No operation If No Jump: Q1 Decode
1 1(2)
Q2 Read literal `n' No operation Q2 Read literal `n' HERE = = = = =
Q3 Process Data No operation Q3 Process Data BZ Jump
Q4 Write to PC No operation Q4 No operation Words: Cycles: Q Cycle Activity: Q1 Decode
Subroutine call of entire 2-Mbyte memory range. First, return address (PC+ 4) is pushed onto the return stack. If `s' = 1, the W, STATUS and BSR registers are also pushed into their respective shadow registers, WS, STATUSS and BSRS. If `s' = 0, no update occurs. Then, the 20-bit value `k' is loaded into PC<20:1>. CALL is a two-cycle instruction. 2 2 Q2 Read literal `k'<7:0>, No operation HERE Q3 Push PC to stack No operation CALL Q4 Read literal 'k'<19:8>, Write to PC No operation
Example:
Before Instruction PC After Instruction If Zero PC If Zero PC
No operation Example:
address (HERE) 1; address (Jump) 0; address (HERE + 2) THERE,1
Before Instruction PC = After Instruction PC = TOS = WS = BSRS = STATUSS =
address (HERE) address (THERE) address (HERE + 4) W BSR STATUS
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CLRF Syntax: Operands: Operation: Status Affected: Encoding: Description: Clear f CLRF f {,a} CLRWDT Syntax: Operands: Operation: Clear Watchdog Timer CLRWDT None 000h WDT, 000h WDT postscaler, 1 TO, 1 PD TO, PD 0000 0000 0000 0100 CLRWDT instruction resets the Watchdog Timer. It also resets the postscaler of the WDT. Status bits, TO and PD, are set. 1 1 Q1 Decode Q2 No operation CLRWDT = = = = = ? 00h 0 1 1 Q3 Process Data Q4 No operation
0 f 255 a [0,1] 000h f, 1Z Z 0110 101a ffff ffff
Status Affected: Encoding: Description:
Clears the contents of the specified register. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details.
Words: Cycles: Q Cycle Activity:
Words: Cycles: Q Cycle Activity: Q1 Decode
1 1 Q2 Read register `f' CLRF = = 5Ah 00h Q3 Process Data FLAG_REG,1 Q4 Write register `f' Example: Before Instruction WDT Counter After Instruction WDT Counter WDT Postscaler TO PD
Example:
Before Instruction FLAG_REG After Instruction FLAG_REG
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COMF Syntax: Operands: Complement f COMF f {,d {,a}} CPFSEQ Syntax: Operands: Operation: Compare f with W, Skip if f = W CPFSEQ 0 f 255 a [0,1] (f) - (W), skip if (f) = (W) (unsigned comparison) None 0110 001a ffff ffff Compares the contents of data memory location `f' to the contents of W by performing an unsigned subtraction. If `f' = W, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: 1 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q2 Read register `f' Q3 Process Data Q4 No operation Q4 No operation Q4 No operation No operation f {,a}
0 f 255 d [0,1] a [0,1] f dest N, Z 0001 11da ffff ffff The contents of register `f' are complemented. If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details.
Operation: Status Affected: Encoding: Description:
Status Affected: Encoding: Description:
Words: Cycles: Q Cycle Activity: Q1 Decode
1 1 Q2 Read register `f' COMF 13h 13h ECh Q3 Process Data REG, 0, 0 Q4 Write to destination
Example:
Before Instruction REG = After Instruction REG = W =
Q Cycle Activity: Q1 Decode If skip:
Q1 Q2 Q3 No No No operation operation operation If skip and followed by 2-word instruction: Q1 Q2 Q3 No No No operation operation operation No No No operation operation operation Example: HERE NEQUAL EQUAL = = = = = =
CPFSEQ REG, 0 : : HERE ? ? W; Address (EQUAL) W; Address (NEQUAL)
Before Instruction PC Address W REG After Instruction If REG PC If REG PC
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CPFSGT Syntax: Operands: Operation: Compare f with W, Skip if f > W CPFSGT 0 f 255 a [0,1] (f) -W), skip if (f) > (W) (unsigned comparison) None 0110 010a ffff ffff Compares the contents of data memory location `f' to the contents of the W by performing an unsigned subtraction. If the contents of `f' are greater than the contents of WREG, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: 1 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q3 Process Data Q4 No operation Q4 No operation Q4 No operation No operation If skip: Q1 No operation Q1 No operation No operation Example: Q2 No operation Q2 No operation No operation HERE NLESS LESS = = < = = Q3 No operation Q3 No operation No operation Q4 No operation Q4 No operation No operation Words: Cycles: f {,a} CPFSLT Syntax: Operands: Operation: Compare f with W, Skip if f < W CPFSLT 0 f 255 a [0,1] (f) -W), skip if (f) < (W) (unsigned comparison) None 0110 000a ffff ffff Compares the contents of data memory location `f' to the contents of W by performing an unsigned subtraction. If the contents of `f' are less than the contents of W, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. 1 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q1 Decode Q2 Read register `f' Q3 Process Data Q4 No operation f {,a}
Status Affected: Encoding: Description:
Status Affected: Encoding: Description:
Q Cycle Activity:
Q Cycle Activity: Q1 Decode If skip:
Q2 Read register `f'
If skip and followed by 2-word instruction:
Q1 Q2 Q3 No No No operation operation operation If skip and followed by 2-word instruction: Q1 Q2 Q3 No No No operation operation operation No No No operation operation operation Example: HERE NGREATER GREATER = = = =
CPFSLT REG, 1 : : Address (HERE) ? W; Address (LESS) W; Address (NLESS)
CPFSGT REG, 0 : :
Before Instruction PC W After Instruction If REG PC If REG PC
Address (HERE) ? W; Address (GREATER) W; Address (NGREATER)
Before Instruction PC W After Instruction If REG PC If REG PC
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DAW Syntax: Operands: Operation: Decimal Adjust W Register DAW None If [W<3:0> > 9] or [DC = 1], then (W<3:0>) + 6 W<3:0>; else (W<3:0>) W<3:0> If [W<7:4> > 9] or [C = 1], then (W<7:4>) + 6 W<7:4>; C =1; else (W<7:4>) W<7:4> Status Affected: Encoding: Description: C 0000 0000 0000 0111 DAW adjusts the eight-bit value in W, resulting from the earlier addition of two variables (each in packed BCD format) and produces a correct packed BCD result. 1 1 Q1 Decode Q2 Read register W DAW A5h 0 0 05h 1 0 Example: Q3 Process Data Q4 Write W Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' DECF 01h 0 00h 1 Q3 Process Data CNT, 1, 0 Q4 Write to destination DECF Syntax: Operands: Decrement f DECF f {,d {,a}} 0 f 255 d [0,1] a [0,1] (f) - 1 dest C, DC, N, OV, Z 0000 01da ffff ffff Decrement register `f'. If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. 1 1
Operation: Status Affected: Encoding: Description:
Words: Cycles: Q Cycle Activity:
Example 1:
Before Instruction W = C = DC = After Instruction W = C = DC = Example 2: Before Instruction W = C = DC = After Instruction W = C = DC =
Before Instruction CNT = Z = After Instruction CNT = Z =
CEh 0 0 34h 1 0
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DECFSZ Syntax: Operands: Decrement f, Skip if 0 DECFSZ f {,d {,a}} 0 f 255 d [0,1] a [0,1] (f) - 1 dest, skip if result = 0 None 0010 11da ffff ffff The contents of register `f' are decremented. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed back in register `f'. If the result is `0', the next instruction which is already fetched is discarded and a NOP is executed instead, making it a two-cycle instruction. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: 1 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q1 Decode If skip: Q1 No operation Q1 No operation No operation Example: Q2 No operation Q2 No operation No operation HERE CONTINUE Before Instruction PC = After Instruction CNT = If CNT = PC = If CNT PC = Address (HERE) CNT - 1 0; Address (CONTINUE) 0; Address (HERE + 2) Q3 No operation Q3 No operation No operation DECFSZ GOTO Q4 No operation Q4 No operation No operation CNT, 1, 1 LOOP If skip: Q1 No operation Q1 No operation No operation Example: Q2 No operation Q2 No operation No operation HERE ZERO NZERO = = = = = Q3 No operation Q3 No operation No operation DCFSNZ : : ? TEMP - 1, 0; Address (ZERO) 0; Address (NZERO) Q4 No operation Q4 No operation No operation Q2 Read register `f' Q3 Process Data Q4 Write to destination Words: Cycles: DCFSNZ Syntax: Operands: Decrement f, Skip if Not 0 DCFSNZ 0 f 255 d [0,1] a [0,1] (f) - 1 dest, skip if result 0 None 0100 11da ffff ffff The contents of register `f' are decremented. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed back in register `f'. If the result is not `0', the next instruction which is already fetched is discarded and a NOP is executed instead, making it a two-cycle instruction. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. 1 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q3 Process Data Q4 Write to destination f {,d {,a}}
Operation: Status Affected: Encoding: Description:
Operation: Status Affected: Encoding: Description:
Q Cycle Activity: Q Cycle Activity: Q1 Decode Q2
Read register `f'
If skip and followed by 2-word instruction:
If skip and followed by 2-word instruction:
TEMP, 1, 0
Before Instruction TEMP After Instruction TEMP If TEMP PC If TEMP PC
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GOTO Syntax: Operands: Operation: Status Affected: Encoding: 1st word (k<7:0>) 2nd word(k<19:8>) Description: Unconditional Branch GOTO k 0 k 1048575 k PC<20:1> None 1110 1111 1111 k19kkk k7kkk kkkk kkkk0 kkkk8 Operation: Status Affected: Encoding: Description: INCF Syntax: Operands: Increment f INCF f {,d {,a}}
0 f 255 d [0,1] a [0,1] (f) + 1 dest C, DC, N, OV, Z 0010 10da ffff ffff The contents of register `f' are incremented. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed back in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details.
GOTO allows an unconditional branch anywhere within entire 2-Mbyte memory range. The 20-bit value `k' is loaded into PC<20:1>. GOTO is always a two-cycle instruction. 2 2
Words: Cycles: Q Cycle Activity: Q1 Decode
Q2 Read literal `k'<7:0>, No operation
Q3 No operation No operation
Q4 Read literal `k'<19:8>, Write to PC No operation Words: Cycles: Q Cycle Activity: Q1 Decode
No operation Example:
1 1 Q2 Read register `f' INCF FFh 0 ? ? 00h 1 1 1 Q3 Process Data CNT, 1, 0 Q4 Write to destination
GOTO THERE
After Instruction PC = Address (THERE)
Example:
Before Instruction CNT = Z = C = DC = After Instruction CNT = Z = C = DC =
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INCFSZ Syntax: Operands: Increment f, Skip if 0 INCFSZ 0 f 255 d [0,1] a [0,1] (f) + 1 dest, skip if result = 0 None 0011 11da ffff ffff The contents of register `f' are incremented. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed back in register `f'. If the result is `0', the next instruction which is already fetched is discarded and a NOP is executed instead, making it a two-cycle instruction. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: 1 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q2 Read register `f' Q2 No operation Q2 No operation No operation HERE NZERO ZERO Q3 Process Data Q3 No operation Q3 No operation No operation INCFSZ : : Q4 Write to destination If skip: Q1 No operation Q1 No operation No operation Example: Q4 No operation Q4 No operation No operation CNT, 1, 0 Q1 No operation Q1 No operation No operation Example: Q2 No operation Q2 No operation No operation HERE ZERO NZERO Q3 No operation Q3 No operation No operation INFSNZ Q4 No operation Q4 No operation No operation Q1 Decode Q2 Read register `f' Q3 Process Data Q4 Write to destination Words: Cycles: f {,d {,a}} INFSNZ Syntax: Operands: Increment f, Skip if Not 0 INFSNZ 0 f 255 d [0,1] a [0,1] (f) + 1 dest, skip if result 0 None 0100 10da ffff ffff The contents of register `f' are incremented. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed back in register `f'. If the result is not `0', the next instruction which is already fetched is discarded and a NOP is executed instead, making it a two-cycle instruction. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. 1 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. f {,d {,a}}
Operation: Status Affected: Encoding: Description:
Operation: Status Affected: Encoding: Description:
Q Cycle Activity: Q1 Decode If skip:
If skip and followed by 2-word instruction:
If skip and followed by 2-word instruction:
REG, 1, 0
Before Instruction PC = After Instruction CNT = If CNT = PC = If CNT PC =
Address (HERE) CNT + 1 0; Address (ZERO) 0; Address (NZERO)
Before Instruction PC = After Instruction REG = If REG PC = If REG = PC =
Address (HERE) REG + 1 0; Address (NZERO) 0; Address (ZERO)
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IORLW Syntax: Operands: Operation: Status Affected: Encoding: Description: Inclusive OR Literal with W IORLW k 0 k 255 (W) .OR. k W N, Z 0000 1001 kkkk kkkk The contents of W are ORed with the eight-bit literal `k'. The result is placed in W. 1 1 Q1 Decode Q2 Read literal `k' IORLW 9Ah BFh Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' IORWF 13h 91h 13h 93h Q3 Process Data RESULT, 0, 1 Q4 Write to destination Q3 Process Data 35h Q4 Write to W Operation: Status Affected: Encoding: Description: IORWF Syntax: Operands: Inclusive OR W with f IORWF f {,d {,a}}
0 f 255 d [0,1] a [0,1] (W) .OR. (f) dest N, Z 0001 00da ffff ffff Inclusive OR W with register `f'. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed back in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. 1 1
Words: Cycles: Q Cycle Activity:
Example:
Before Instruction W = After Instruction W =
Example:
Before Instruction RESULT = W = After Instruction RESULT = W =
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LFSR Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read literal `k' MSB Q3 Process Data Q4 Write literal `k' MSB to FSRfH Write literal `k' to FSRfL Load FSR LFSR f, k 0f2 0 k 4095 k FSRf None 1110 1111 1110 0000 00ff k7kkk k11kkk kkkk Operation: Status Affected: Encoding: Description: MOVF Syntax: Operands: Move f MOVF f {,d {,a}}
0 f 255 d [0,1] a [0,1] f dest N, Z 0101 00da ffff ffff The contents of register `f' are moved to a destination dependent upon the status of `d'. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed back in register `f'. Location `f' can be anywhere in the 256-byte bank. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details.
The 12-bit literal `k' is loaded into the file select register pointed to by `f'. 2 2
Decode
Read literal `k' LSB
Process Data
Example: After Instruction FSR2H FSR2L
LFSR 2, 3ABh = = 03h ABh Words: Cycles: Q Cycle Activity: Q1 Decode
1 1 Q2 Read register `f' MOVF = = = = Q3 Process Data REG, 0, 0 22h FFh 22h 22h Q4 Write W
Example:
Before Instruction REG W After Instruction REG W
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MOVFF Syntax: Operands: Operation: Status Affected: Encoding: 1st word (source) 2nd word (destin.) Description: Move f to f MOVFF fs,fd 0 fs 4095 0 fd 4095 (fs) fd None 1100 1111 ffff ffff ffff ffff ffffs ffffd MOVLB Syntax: Operands: Operation: Status Affected: Encoding: Description: Move Literal to Low Nibble in BSR MOVLW k 0 k 255 k BSR None 0000 0001 kkkk kkkk The eight-bit literal `k' is loaded into the Bank Select Register (BSR). The value of BSR<7:4> always remains `0' regardless of the value of k7:k4. 1 1 Q1 Decode Q2 Read literal `k' MOVLB 02h 05h Q3 Process Data 5 Q4 Write literal `k' to BSR
The contents of source register `fs' are moved to destination register `fd'. Location of source `fs' can be anywhere in the 4096-byte data space (000h to FFFh) and location of destination `fd' can also be anywhere from 000h to FFFh. Either source or destination can be W (a useful special situation). MOVFF is particularly useful for transferring a data memory location to a peripheral register (such as the transmit buffer or an I/O port). The MOVFF instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register
Words: Cycles: Q Cycle Activity:
Example:
Before Instruction BSR Register = After Instruction BSR Register =
Words: Cycles: Q Cycle Activity: Q1 Decode
2 2 Q2 Read register `f' (src) No operation No dummy read Q3 Process Data No operation Q4 No operation Write register `f' (dest)
Decode
Example:
MOVFF = = = =
REG1, REG2 33h 11h 33h 33h
Before Instruction REG1 REG2 After Instruction REG1 REG2
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MOVLW Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read literal `k' MOVLW 5Ah Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' MOVWF 4Fh FFh 4Fh 4Fh Q3 Process Data REG, 0 Q4 Write register `f' Q3 Process Data 5Ah Q4 Write to W 1 1 Move Literal to W MOVLW k 0 k 255 kW None 0000 1110 kkkk kkkk The eight-bit literal `k' is loaded into W. Operation: Status Affected: Encoding: Description: MOVWF Syntax: Operands: Move W to f MOVWF 0 f 255 a [0,1] (W) f None 0110 111a ffff ffff Move data from W to register `f'. Location `f' can be anywhere in the 256-byte bank. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. 1 1 f {,a}
Example: After Instruction W =
Example:
Before Instruction W = REG = After Instruction W = REG =
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MULLW Syntax: Operands: Operation: Status Affected: Encoding: Description: Multiply Literal with W MULLW k MULWF Syntax: Operands: Operation: 1101 kkkk kkkk Status Affected: Encoding: Description: Multiply W with f MULWF 0 f 255 a [0,1] (W) x (f) PRODH:PRODL None 0000 001a ffff ffff An unsigned multiplication is carried out between the contents of W and the register file location `f'. The 16-bit result is stored in the PRODH:PRODL register pair. PRODH contains the high byte. Both W and `f' are unchanged. None of the Status flags are affected. Note that neither Overflow nor Carry is possible in this operation. A Zero result is possible but not detected. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. Q2 Read literal `k' Q3 Process Data Q4 Write registers PRODH: PRODL If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' Q3 Process Data Q4 Write registers PRODH: PRODL 1 1 f {,a}
0 k 255 (W) x k PRODH:PRODL None 0000 An unsigned multiplication is carried out between the contents of W and the 8-bit literal `k'. The 16-bit result is placed in the PRODH:PRODL register pair. PRODH contains the high byte. W is unchanged. None of the Status flags are affected. Note that neither Overflow nor Carry is possible in this operation. A Zero result is possible but not detected.
Words: Cycles: Q Cycle Activity: Q1 Decode
1 1
Example: Before Instruction W PRODH PRODL After Instruction W PRODH PRODL
MULLW = = = = = =
0C4h E2h ? ? E2h ADh 08h
Example: Before Instruction W REG PRODH PRODL After Instruction W REG PRODH PRODL
MULWF = = = = = = = =
REG, 1 C4h B5h ? ? C4h B5h 8Ah 94h
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NEGF Syntax: Operands: Operation: Status Affected: Encoding: Description: Negate f NEGF f {,a} NOP Syntax: Operands: Operation: Status Affected: Encoding: ffff ffff Description: Words: Cycles: Q Cycle Activity: Q1 Decode Q2 No operation Q3 No operation Q4 No operation 1 1 110a No Operation NOP None No operation None 0000 1111 0000 xxxx 0000 xxxx 0000 xxxx
0 f 255 a [0,1] (f) + 1 f N, OV, C, DC, Z 0110 Location `f' is negated using two's complement. The result is placed in the data memory location `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details.
No operation.
Example: None.
Words: Cycles: Q Cycle Activity: Q1 Decode
1 1 Q2 Read register `f' NEGF Q3 Process Data REG, 1 Q4 Write register `f'
Example:
Before Instruction REG = After Instruction REG =
0011 1010 [3Ah] 1100 0110 [C6h]
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POP Syntax: Operands: Operation: Status Affected: Encoding: Description: Pop Top of Return Stack POP None (TOS) bit bucket None 0000 0000 0000 0110 The TOS value is pulled off the return stack and is discarded. The TOS value then becomes the previous value that was pushed onto the return stack. This instruction is provided to enable the user to properly manage the return stack to incorporate a software stack. 1 1 Q1 Decode Q2 No operation POP GOTO Q3 POP TOS value Q4 No operation Example: NEW = = = = 0031A2h 014332h 014332h NEW PUSH Syntax: Operands: Operation: Status Affected: Encoding: Description: Push Top of Return Stack PUSH None (PC + 2) TOS None 0000 0000 0000 0101 The PC + 2 is pushed onto the top of the return stack. The previous TOS value is pushed down on the stack. This instruction allows implementing a software stack by modifying TOS and then pushing it onto the return stack. 1 1 Q1 Decode Q2 PUSH PC + 2 onto return stack PUSH = = = = = 345Ah 0124h 0126h 0126h 345Ah Q3 No operation Q4 No operation
Words: Cycles: Q Cycle Activity:
Words: Cycles: Q Cycle Activity:
Example:
Before Instruction TOS Stack (1 level down) After Instruction TOS PC
Before Instruction TOS PC After Instruction PC TOS Stack (1 level down)
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RCALL Syntax: Operands: Operation: Status Affected: Encoding: Description: Relative Call RCALL n RESET Syntax: Operands: Operation: Status Affected: 1nnn nnnn nnnn Encoding: Description: Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Start reset RESET Reset Value Reset Value Q3 No operation Q4 No operation Reset RESET None Reset all registers and flags that are affected by a MCLR Reset. All 0000 0000 1111 1111 This instruction provides a way to execute a MCLR Reset in software. 1 1
-1024 n 1023 (PC) + 2 TOS, (PC) + 2 + 2n PC None 1101 Subroutine call with a jump up to 1K from the current location. First, return address (PC + 2) is pushed onto the stack. Then, add the 2's complement number `2n' to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is a two-cycle instruction. 1 2 Q1 Q2 Read literal `n' PUSH PC to stack Q3 Process Data Q4 Write to PC
Words: Cycles: Q Cycle Activity: Decode
Example: After Instruction Registers = Flags* =
No operation Example:
No operation HERE
No operation RCALL Jump
No operation
Before Instruction PC = Address (HERE) After Instruction PC = Address (Jump) TOS = Address (HERE + 2)
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RETFIE Syntax: Operands: Operation: Return from Interrupt RETFIE {s} s [0,1] (TOS) PC, 1 GIE/GIEH or PEIE/GIEL; if s = 1, (WS) W, (STATUSS) STATUS, (BSRS) BSR, PCLATU, PCLATH are unchanged GIE/GIEH, PEIE/GIEL. 0000 0000 0001 000s Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read literal `k' No operation Q3 Process Data No operation Q4 POP PC from stack, write to W No operation Return from interrupt. Stack is popped and Top-of-Stack (TOS) is loaded into the PC. Interrupts are enabled by setting either the high or low-priority global interrupt enable bit. If `s' = 1, the contents of the shadow registers WS, STATUSS and BSRS are loaded into their corresponding registers W, STATUS and BSR. If `s' = 0, no update of these registers occurs. 1 2 Example: Q2 No operation Q3 No operation Q4 POP PC from stack Set GIEH or GIEL No operation Example: No operation RETFIE 1 = = = = = TOS WS BSRS STATUSS 1 No operation No operation CALL TABLE ; ; ; ; : TABLE ADDWF PCL ; RETLW k0 ; RETLW k1 ; : : RETLW kn ; Before Instruction W = After Instruction W = W contains table offset value W now has table value Q1 Decode RETLW Syntax: Operands: Operation: Return Literal to W RETLW k 0 k 255 k W, (TOS) PC, PCLATU, PCLATH are unchanged None 0000 1100 kkkk kkkk W is loaded with the eight-bit literal `k'. The program counter is loaded from the top of the stack (the return address). The high address latch (PCLATH) remains unchanged. 1 2
Status Affected: Encoding: Description:
Status Affected: Encoding: Description:
Words: Cycles: Q Cycle Activity:
No operation
W = offset Begin table
After Interrupt PC W BSR STATUS GIE/GIEH, PEIE/GIEL
End of table
07h value of kn
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RETURN Syntax: Operands: Operation: Return from Subroutine RETURN {s} s [0,1] (TOS) PC; if s = 1, (WS) W, (STATUSS) STATUS, (BSRS) BSR, PCLATU, PCLATH are unchanged None 0000 0000 0001 001s Return from subroutine. The stack is popped and the top of the stack (TOS) is loaded into the program counter. If `s'= 1, the contents of the shadow registers WS, STATUSS and BSRS are loaded into their corresponding registers W, STATUS and BSR. If `s' = 0, no update of these registers occurs. 1 2 Q1 Decode No operation Q2 No operation No operation Q3 Process Data No operation Q4 POP PC from stack No operation Words: Cycles: Q Cycle Activity: Example: RETURN Q1 Decode Q2 Read register `f' RLCF Q3 Process Data Q4 Write to destination After Instruction: PC = TOS RLCF Syntax: Operands: Rotate Left f through Carry RLCF f {,d {,a}}
0 f 255 d [0,1] a [0,1] (f) dest, (f<7>) C, (C) dest<0> C, N, Z 0011 01da ffff ffff The contents of register `f' are rotated one bit to the left through the Carry flag. If `d' is `0', the result is placed in W. If `d' is `1', the result is stored back in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. C 1 1 register f
Operation:
Status Affected: Encoding: Description:
Status Affected: Encoding: Description:
Words: Cycles: Q Cycle Activity:
Example: Before Instruction REG = C = After Instruction REG = W = C =
REG, 0, 0
1110 0110 0 1110 0110 1100 1100 1
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RLNCF Syntax: Operands: Rotate Left f (No Carry) RLNCF 0 f 255 d [0,1] a [0,1] (f) dest, (f<7>) dest<0> N, Z 0100 01da ffff ffff Status Affected: Encoding: Description: The contents of register `f' are rotated one bit to the left. If `d' is `0', the result is placed in W. If `d' is `1', the result is stored back in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. register f Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' RLNCF Q3 Process Data Q4 Write to destination 1 1 Words: Cycles: Q Cycle Activity: Q1 Decode Example: Before Instruction REG = After Instruction REG = REG, 1, 0 Example: Q2 Read register `f' RRCF Q3 Process Data REG, 0, 0 Q4 Write to destination 1 1 f {,d {,a}} RRCF Syntax: Operands: Rotate Right f through Carry RRCF f {,d {,a}}
0 f 255 d [0,1] a [0,1] (f) dest, (f<0>) C, (C) dest<7> C, N, Z 0011 00da ffff ffff The contents of register `f' are rotated one bit to the right through the Carry flag. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed back in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. C register f
Operation: Status Affected: Encoding: Description:
Operation:
1010 1011 0101 0111
Before Instruction REG = C = After Instruction REG = W = C =
1110 0110 0 1110 0110 0111 0011 0
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RRNCF Syntax: Operands: Rotate Right f (No Carry) RRNCF f {,d {,a}} SETF Syntax: Operands: Operation: Status Affected: Encoding: ffff Description: Set f SETF f {,a}
0 f 255 d [0,1] a [0,1] (f) dest, (f<0>) dest<7> N, Z 0100 00da ffff The contents of register `f' are rotated one bit to the right. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed back in register `f'. If `a' is `0', the Access Bank will be selected, overriding the BSR value. If `a' is `1', then the bank will be selected as per the BSR value. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. register f
0 f 255 a [0,1] FFh f None 0110 100a ffff ffff The contents of the specified register are set to FFh. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details.
Operation: Status Affected: Encoding: Description:
Words: Cycles: Q Cycle Activity: Q1 Decode
1 1 Q2 Read register `f' SETF = = 5Ah FFh Q3 Process Data REG,1 Q4 Write register `f'
Words: Cycles: Q Cycle Activity: Q1 Decode
1 1 Q2 Read register `f' RRNCF Q3 Process Data REG, 1, 0 Q4 Write to destination Example: Before Instruction REG After Instruction REG
Example 1:
Before Instruction REG = After Instruction REG = Example 2:
1101 0111 1110 1011 REG, 0, 0
RRNCF
Before Instruction W = REG = After Instruction W = REG =
? 1101 0111 1110 1011 1101 0111
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SLEEP Syntax: Operands: Operation: Enter Sleep Mode SLEEP None 00h WDT, 0 WDT postscaler, 1 TO, 0 PD TO, PD 0000 0000 0000 0011 The Power-Down status bit (PD) is cleared. The Time-out status bit (TO) is set. The Watchdog Timer and its postscaler are cleared. The processor is put into Sleep mode with the oscillator stopped. Words: Cycles: Q Cycle Activity: Q1 Decode Q2 No operation SLEEP Q3 Process Data Q4 Go to Sleep Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' Q3 Process Data Q4 Write to destination 1 1 SUBFWB Syntax: Operands: Subtract f from W with Borrow SUBFWB 0 f 255 d [0,1] a [0,1] (W) - (f) - (C) dest N, OV, C, DC, Z 0101 01da ffff ffff Subtract register `f' and Carry flag (borrow) from W (2's complement method). If `d' is `0', the result is stored in W. If `d' is `1', the result is stored in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. 1 1 f {,d {,a}}
Operation: Status Affected: Encoding: Description:
Status Affected: Encoding: Description:
Example: Before Instruction TO = ? ? PD =
After Instruction 1 TO = 0 PD = If WDT causes wake-up, this bit is cleared.
Example 1: SUBFWB REG, 1, 0 Before Instruction REG = 3 W = 2 C = 1 After Instruction REG = FF W = 2 C = 0 Z = 0 N = 1 ; result is negative SUBFWB REG, 0, 0 Example 2: Before Instruction REG = 2 W = 5 C = 1 After Instruction REG = 2 W = 3 C = 1 Z = 0 N = 0 ; result is positive SUBFWB REG, 1, 0 Example 3: Before Instruction REG = 1 W = 2 C = 0 After Instruction REG = 0 W = 2 C = 1 Z = 1 ; result is zero N = 0
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SUBLW Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Q Cycle Activity: Q1 Decode Example 1: Before Instruction W = C = After Instruction W = C = Z = N = Example 2: Before Instruction W = C = After Instruction W = C = Z = N = Example 3: Before Instruction W = C = After Instruction W = C = Z = N = Q2 Read literal `k' SUBLW 01h ? 01h 1 0 0 SUBLW 02h ? 00h 1 1 0 SUBLW 03h ? FFh 0 0 1 ; (2's complement) ; result is negative ; result is zero ; result is positive Words: 02h Cycles: Q Cycle Activity: Q1 Decode Example 1: Before Instruction REG = W = C = After Instruction REG = W = C = Z = N = Example 2: Before Instruction REG = W = C = After Instruction REG = W = C = Z = N = Example 3: Before Instruction REG = W = C = After Instruction REG = W = C = Z = N = Q2 Read register `f' SUBWF 3 2 ? 1 2 1 0 0 SUBWF 2 2 ? 2 0 1 1 0 SUBWF 1 2 ? FFh ;(2's complement) 2 0 ; result is negative 0 1 Q3 Process Data REG, 1, 0 Q4 Write to destination Q3 Process Data 02h Q4 Write to W Subtract W from Literal SUBLW k 0 k 255 k - (W) W N, OV, C, DC, Z 0000 1000 kkkk kkkk W is subtracted from the eight-bit literal `k'. The result is placed in W. 1 1 Operation: Status Affected: Encoding: Description: SUBWF Syntax: Operands: Subtract W from f SUBWF 0 f 255 d [0,1] a [0,1] (f) - (W) dest N, OV, C, DC, Z 0101 11da ffff ffff Subtract W from register `f' (2's complement method). If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. 1 1 f {,d {,a}}
02h
; result is positive
REG, 0, 0
; result is zero
REG, 1, 0
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SUBWFB Syntax: Operands: Subtract W from f with Borrow SUBWFB 0 f 255 d [0,1] a [0,1] (f) - (W) - (C) dest N, OV, C, DC, Z 0101 10da ffff ffff Status Affected: Encoding: Description: Subtract W and the Carry flag (borrow) from register `f' (2's complement method). If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: Q Cycle Activity: Q1 Decode Example 1: Before Instruction REG = W = C = After Instruction REG = W = C = Z = N = Example 2: Before Instruction REG = W = C = After Instruction REG = W = C = Z = N = Example 3: Before Instruction REG = W = C = After Instruction REG = W C Z N = = = = 1 1 Q2 Read register `f' SUBWFB 19h 0Dh 1 0Ch 0Dh 1 0 0 Q3 Process Data REG, 1, 0 (0001 1001) (0000 1101) (0000 1011) (0000 1101) ; result is positive Example: Q4 Write to destination Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' SWAPF 53h 35h Q3 Process Data REG, 1, 0 Q4 Write to destination f {,d {,a}} SWAPF Syntax: Operands: Swap f SWAPF f {,d {,a}} 0 f 255 d [0,1] a [0,1] (f<3:0>) dest<7:4>, (f<7:4>) dest<3:0> None 0011 10da ffff ffff The upper and lower nibbles of register `f' are exchanged. If `d' is `0', the result is placed in W. If `d' is `1', the result is placed in register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. 1 1
Operation: Status Affected: Encoding: Description:
Operation:
Before Instruction REG = After Instruction REG =
SUBWFB REG, 0, 0 1Bh 1Ah 0 1Bh 00h 1 1 0 SUBWFB 03h 0Eh 1 F5h 0Eh 0 0 1 (0001 1011) (0001 1010) (0001 1011) ; result is zero REG, 1, 0 (0000 0011) (0000 1101) (1111 0100) ; [2's comp] (0000 1101) ; result is negative
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TBLRD Syntax: Operands: Operation: Table Read TBLRD ( *; *+; *-; +*) None if TBLRD *, (Prog Mem (TBLPTR)) TABLAT; TBLPTR - No Change if TBLRD *+, (Prog Mem (TBLPTR)) TABLAT; (TBLPTR) + 1 TBLPTR if TBLRD *-, (Prog Mem (TBLPTR)) TABLAT; (TBLPTR) - 1 TBLPTR if TBLRD +*, (TBLPTR) + 1 TBLPTR; (Prog Mem (TBLPTR)) TABLAT 0000 0000 0000 10nn nn=0 * =1 *+ =2 *=3 +* TBLRD Example 1: Table Read (Continued) TBLRD *+ ; = = = = = +* ; = = = = = = AAh 01A357h 12h 34h 34h 01A358h 55h 00A356h 34h 34h 00A357h
Before Instruction TABLAT TBLPTR MEMORY(00A356h) After Instruction TABLAT TBLPTR Example 2: TBLRD Before Instruction TABLAT TBLPTR MEMORY(01A357h) MEMORY(01A358h) After Instruction TABLAT TBLPTR
Status Affected: None Encoding:
Description:
This instruction is used to read the contents of Program Memory (P.M.). To address the program memory, a pointer called Table Pointer (TBLPTR) is used. The TBLPTR (a 21-bit pointer) points to each byte in the program memory. TBLPTR has a 2-Mbyte address range. TBLPTR<0> = 0:Least Significant Byte of Program Memory Word TBLPTR<0> = 1:Most Significant Byte of Program Memory Word The TBLRD instruction can modify the value of TBLPTR as follows: * no change * post-increment * post-decrement * pre-increment
Words: Cycles: Q Cycle Activity: Q1 Decode No operation
1 2 Q2 No operation No operation (Read Program Memory) Q3 No operation No operation Q4 No operation No operation (Write TABLAT)
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TBLWT Syntax: Operands: Operation: Table Write TBLWT ( *; *+; *-; +*) None if TBLWT*, (TABLAT) Holding Register; TBLPTR - No Change if TBLWT*+, (TABLAT) Holding Register; (TBLPTR) + 1 TBLPTR if TBLWT*-, (TABLAT) Holding Register; (TBLPTR) - 1 TBLPTR if TBLWT+*, (TBLPTR) + 1 TBLPTR; (TABLAT) Holding Register None 0000 0000 0000 11nn nn=0 * =1 *+ =2 *=3 +* TBLWT Example 1: Table Write (Continued) TBLWT *+;
Before Instruction TABLAT = 55h TBLPTR = 00A356h HOLDING REGISTER (00A356h) = FFh After Instructions (table write completion) TABLAT = 55h TBLPTR = 00A357h HOLDING REGISTER (00A356h) = 55h Example 2: TBLWT +*; Before Instruction TABLAT = 34h TBLPTR = 01389Ah HOLDING REGISTER (01389Ah) = FFh HOLDING REGISTER (01389Bh) = FFh After Instruction (table write completion) TABLAT = 34h TBLPTR = 01389Bh HOLDING REGISTER (01389Ah) = FFh HOLDING REGISTER (01389Bh) = 34h
Status Affected: Encoding:
Description:
This instruction uses the 3 LSBs of TBLPTR to determine which of the 8 holding registers the TABLAT is written to. The holding registers are used to program the contents of Program Memory (P.M.). (Refer to Section 6.0 "Memory Organization" for additional details on programming Flash memory.) The TBLPTR (a 21-bit pointer) points to each byte in the program memory. TBLPTR has a 2-Mbyte address range. The LSb of the TBLPTR selects which byte of the program memory location to access. TBLPTR[0] = 0:Least Significant Byte of Program Memory Word TBLPTR[0] = 1:Most Significant Byte of Program Memory Word The TBLWT instruction can modify the value of TBLPTR as follows: * * * * no change post-increment post-decrement pre-increment
Words: Cycles: Q Cycle Activity:
1 2 Q1 Decode Q2 Q3 Q4
No No No operation operation operation
No No No No operation operation operation operation (Write to (Read Holding TABLAT) Register)
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TSTFSZ Syntax: Operands: Operation: Status Affected: Encoding: Description: Test f, Skip if 0 TSTFSZ f {,a} 0 f 255 a [0,1] skip if f = 0 None 0110 011a ffff ffff If `f' = 0, the next instruction fetched during the current instruction execution is discarded and a NOP is executed, making this a two-cycle instruction. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: 1 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q1 Decode If skip: Q1 No operation Q1 No operation No operation Example: Q2 No operation Q2 No operation No operation HERE NZERO ZERO = = = = Q3 No operation Q3 No operation No operation TSTFSZ : : Q4 No operation Q4 No operation No operation Q2 Read register `f' Q3 Process Data Q4 No operation XORLW Syntax: Operands: Operation: Status Affected: Encoding: Description: Exclusive OR Literal with W XORLW k 0 k 255 (W) .XOR. k W N, Z 0000 1010 kkkk kkkk The contents of W are XORed with the 8-bit literal `k'. The result is placed in W. 1 1 Q1 Decode Q2 Read literal `k' XORLW B5h 1Ah Q3 Process Data 0AFh Q4 Write to W
Words: Cycles: Q Cycle Activity:
Example: Before Instruction W = After Instruction W =
Q Cycle Activity:
If skip and followed by 2-word instruction:
CNT, 1
Before Instruction PC After Instruction If CNT PC If CNT PC
Address (HERE) 00h, Address (ZERO) 00h, Address (NZERO)
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XORWF Syntax: Operands: Exclusive OR W with f XORWF 0 f 255 d [0,1] a [0,1] (W) .XOR. (f) dest N, Z 0001 10da ffff ffff Exclusive OR the contents of W with register `f'. If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in the register `f'. If `a' is `0', the Access Bank is selected. If `a' is `1', the BSR is used to select the GPR bank. If `a' is `0' and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 27.2.3 "Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode" for details. Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' XORWF AFh B5h 1Ah B5h Q3 Process Data REG, 1, 0 Q4 Write to destination 1 1 f {,d {,a}}
Operation: Status Affected: Encoding: Description:
Example:
Before Instruction REG = W = After Instruction REG = W =
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27.2 Extended Instruction Set
In addition to the standard 75 instructions of the PIC18 instruction set, the PIC18F87J72 family of devices also provides an optional extension to the core CPU functionality. The added features include eight additional instructions that augment Indirect and Indexed Addressing operations and the implementation of Indexed Literal Offset Addressing for many of the standard PIC18 instructions. The additional features of the extended instruction set are enabled by default on unprogrammed devices. Users must properly set or clear the XINST Configuration bit during programming to enable or disable these features. The instructions in the extended set can all be classified as literal operations, which either manipulate the File Select Registers, or use them for Indexed Addressing. Two of the instructions, ADDFSR and SUBFSR, each have an additional special instantiation for using FSR2. These versions (ADDULNK and SUBULNK) allow for automatic return after execution. The extended instructions are specifically implemented to optimize re-entrant program code (that is, code that is recursive or that uses a software stack) written in high-level languages, particularly C. Among other things, they allow users working in high-level languages to perform certain operations on data structures more efficiently. These include: * Dynamic allocation and deallocation of software stack space when entering and leaving subroutines * Function Pointer invocation * Software Stack Pointer manipulation * Manipulation of variables located in a software stack A summary of the instructions in the extended instruction set is provided in Table 27-3. Detailed descriptions are provided in Section 27.2.2 "Extended Instruction Set". The opcode field descriptions in Table 27-1 (page 334) apply to both the standard and extended PIC18 instruction sets. Note: The instruction set extension and the Indexed Literal Offset Addressing mode were designed for optimizing applications written in C; the user may likely never use these instructions directly in assembler. The syntax for these commands is provided as a reference for users who may be reviewing code that has been generated by a compiler.
27.2.1
EXTENDED INSTRUCTION SYNTAX
Most of the extended instructions use indexed arguments, using one of the File Select Registers and some offset to specify a source or destination register. When an argument for an instruction serves as part of Indexed Addressing, it is enclosed in square brackets ("[ ]"). This is done to indicate that the argument is used as an index or offset. The MPASMTM Assembler will flag an error if it determines that an index or offset value is not bracketed. When the extended instruction set is enabled, brackets are also used to indicate index arguments in byte-oriented and bit-oriented instructions. This is in addition to other changes in their syntax. For more details, see Section 27.2.3.1 "Extended Instruction Syntax with Standard PIC18 Commands". Note: In the past, square brackets have been used to denote optional arguments in the PIC18 and earlier instruction sets. In this text and going forward, optional arguments are denoted by braces ("{ }").
TABLE 27-3:
Mnemonic, Operands ADDFSR ADDULNK CALLW MOVSF MOVSS PUSHL SUBFSR SUBULNK f, k k
EXTENSIONS TO THE PIC18 INSTRUCTION SET
Description Add Literal to FSR Add Literal to FSR2 and Return Call Subroutine using WREG Move zs (source) to 1st word fd (destination) 2nd word Move zs (source) to 1st word zd (destination) 2nd word Store Literal at FSR2, Decrement FSR2 Subtract Literal from FSR Subtract Literal from FSR2 and return Cycles 1 2 2 2 2 1 1 2 16-Bit Instruction Word MSb 1110 1110 0000 1110 1111 1110 1111 1110 1110 1110 1000 1000 0000 1011 ffff 1011 xxxx 1010 1001 1001 ffkk 11kk 0001 0zzz ffff 1zzz xzzz kkkk ffkk 11kk LSb kkkk kkkk 0100 zzzz ffff zzzz zzzz kkkk kkkk kkkk Status Affected None None None None None None None None
zs, fd zs, zd k f, k k
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27.2.2
ADDFSR Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read literal `k' Q3 Process Data Q4 Write to FSR
EXTENDED INSTRUCTION SET
Add Literal to FSR ADDFSR f, k 0 k 63 f [ 0, 1, 2 ] FSR(f) + k FSR(f) None 1110 1000 ffkk kkkk The 6-bit literal `k' is added to the contents of the FSR specified by `f'. 1 1 Status Affected: Encoding: Description: ADDULNK Syntax: Operands: Operation: Add Literal to FSR2 and Return ADDULNK k 0 k 63 FSR2 + k FSR2, (TOS) PC None 1110 1000 11kk kkkk The 6-bit literal `k' is added to the contents of FSR2. A RETURN is then executed by loading the PC with the TOS. The instruction takes two cycles to execute; a NOP is performed during the second cycle. This may be thought of as a special case of the ADDFSR instruction, where f = 3 (binary `11'); it operates only on FSR2. Words: Cycles: Q Cycle Activity: 0422h Q1 Decode No Operation Q2 Read literal `k' No Operation Q3 Process Data No Operation Q4 Write to FSR No Operation 1 2
Example:
ADDFSR 2, 23h 03FFh
Before Instruction FSR2 = After Instruction FSR2 =
Example:
ADDULNK 23h 03FFh 0100h 0422h (TOS)
Before Instruction FSR2 = PC = After Instruction FSR2 = PC =
Note:
All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s).
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CALLW Syntax: Operands: Operation: Subroutine Call Using WREG CALLW None (PC + 2) TOS, (W) PCL, (PCLATH) PCH, (PCLATU) PCU None 0000 0000 0001 0100 First, the return address (PC + 2) is pushed onto the return stack. Next, the contents of W are written to PCL; the existing value is discarded. Then, the contents of PCLATH and PCLATU are latched into PCH and PCU, respectively. The second cycle is executed as a NOP instruction while the new next instruction is fetched. Unlike CALL, there is no option to update W, STATUS or BSR. Words: Cycles: Q Cycle Activity: Q1 Decode No operation Q2 Read WREG No operation Q3 Push PC to stack No operation Q4 No operation No operation Words: Cycles: Q Cycle Activity: Q1 Example: HERE CALLW Decode Decode address (HERE) 10h 00h 06h 001006h address (HERE + 2) 10h 00h 06h Example: Q2 Q3 Q4 Read source reg Write register `f' (dest) Determine Determine source addr source addr No operation No dummy read No operation 1 2 MOVSF Syntax: Operands: Operation: Status Affected: Encoding: 1st word (source) 2nd word (destin.) Description: Move Indexed to f MOVSF [zs], fd 0 zs 127 0 fd 4095 ((FSR2) + zs) fd None 1110 1111 1011 ffff 0zzz ffff zzzzs ffffd
Status Affected: Encoding: Description
The contents of the source register are moved to destination register `fd'. The actual address of the source register is determined by adding the 7-bit literal offset `zs', in the first word, to the value of FSR2. The address of the destination register is specified by the 12-bit literal `fd' in the second word. Both addresses can be anywhere in the 4096-byte data space (000h to FFFh). The MOVSF instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. If the resultant source address points to an Indirect Addressing register, the value returned will be 00h. 2 2
Before Instruction PC = PCLATH = PCLATU = W = After Instruction PC = TOS = PCLATH = PCLATU = W =
MOVSF = = = = = =
[05h], REG2 80h 33h 11h 80h 33h 33h
Before Instruction FSR2 Contents of 85h REG2 After Instruction FSR2 Contents of 85h REG2
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MOVSS Syntax: Operands: Operation: Status Affected: Encoding: 1st word (source) 2nd word (dest.) Description Move Indexed to Indexed MOVSS [zs], [zd] 0 zs 127 0 zd 127 ((FSR2) + zs) ((FSR2) + zd) None 1110 1111 1011 xxxx 1zzz xzzz zzzzs zzzzd PUSHL Syntax: Operands: Operation: Status Affected: Encoding: Description: Store Literal at FSR2, Decrement FSR2 PUSHL k 0k 255 k (FSR2), FSR2 - 1 FSR2 None 1111 1010 kkkk kkkk The 8-bit literal `k' is written to the data memory address specified by FSR2. FSR2 is decremented by 1 after the operation. This instruction allows users to push values onto a software stack. Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read `k' Q3 Process data Q4 Write to destination 1 1
The contents of the source register are moved to the destination register. The addresses of the source and destination registers are determined by adding the 7-bit literal offsets, `zs' or `zd', respectively, to the value of FSR2. Both registers can be located anywhere in the 4096-byte data memory space (000h to FFFh). The MOVSS instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. If the resultant source address points to an Indirect Addressing register, the value returned will be 00h. If the resultant destination address points to an Indirect Addressing register, the instruction will execute as a NOP.
Example:
PUSHL 08h = = = = 01ECh 00h 01EBh 08h
Before Instruction FSR2H:FSR2L Memory (01ECh) After Instruction FSR2H:FSR2L Memory (01ECh)
Words: Cycles: Q Cycle Activity: Q1 Decode Decode
2 2 Q2 Q3 Q4 Read source reg Write to dest reg
Determine Determine source addr source addr Determine dest addr Determine dest addr
Example:
MOVSS [05h], [06h] = = = = = = 80h 33h 11h 80h 33h 33h
Before Instruction FSR2 Contents of 85h Contents of 86h After Instruction FSR2 Contents of 85h Contents of 86h
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SUBFSR Syntax: Operands: Operation: Status Affected: Encoding: Description: Subtract Literal from FSR SUBFSR f, k 0 k 63 f [ 0, 1, 2 ] FSRf - k FSRf None 1110 1001 ffkk kkkk The 6-bit literal `k' is subtracted from the contents of the FSR specified by `f'. 1 1 Q1 Decode Q2 Read register `f' Q3 Process Data Q4 Write to destination Words: Example: Before Instruction FSR2 = After Instruction FSR2 = SUBFSR 2, 23h 03FFh 03DCh Cycles: Q Cycle Activity: Q1 Decode No Operation Q2 Read register `f' No Operation Q3 Process Data No Operation Q4 Write to destination No Operation Status Affected: Encoding: Description: SUBULNK Syntax: Operands: Operation: Subtract Literal from FSR2 and Return SUBULNK k 0 k 63 FSR2 - k FSR2, (TOS) PC None 1110 1001 11kk kkkk The 6-bit literal `k' is subtracted from the contents of the FSR2. A RETURN is then executed by loading the PC with the TOS. The instruction takes two cycles to execute; a NOP is performed during the second cycle. This may be thought of as a special case of the SUBFSR instruction, where f = 3 (binary `11'); it operates only on FSR2. 1 2
Words: Cycles: Q Cycle Activity:
Example: Before Instruction FSR2 = PC = After Instruction FSR2 = PC =
SUBULNK 23h 03FFh 0100h 03DCh (TOS)
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27.2.3 BYTE-ORIENTED AND BIT-ORIENTED INSTRUCTIONS IN INDEXED LITERAL OFFSET MODE
Enabling the PIC18 instruction set extension may cause legacy applications to behave erratically or fail entirely.
27.2.3.1
Extended Instruction Syntax with Standard PIC18 Commands
Note:
In addition to eight new commands in the extended set, enabling the extended instruction set also enables Indexed Literal Offset Addressing (Section 6.6.1 "Indexed Addressing with Literal Offset"). This has a significant impact on the way that many commands of the standard PIC18 instruction set are interpreted. When the extended set is disabled, addresses embedded in opcodes are treated as literal memory locations: either as a location in the Access Bank (a = 0) or in a GPR bank designated by the BSR (a = 1). When the extended instruction set is enabled and a = 0, however, a file register argument of 5Fh or less is interpreted as an offset from the pointer value in FSR2 and not as a literal address. For practical purposes, this means that all instructions that use the Access RAM bit as an argument - that is, all byte-oriented and bit-oriented instructions, or almost half of the core PIC18 instructions - may behave differently when the extended instruction set is enabled. When the content of FSR2 is 00h, the boundaries of the Access RAM are essentially remapped to their original values. This may be useful in creating backward-compatible code. If this technique is used, it may be necessary to save the value of FSR2 and restore it when moving back and forth between C and assembly routines in order to preserve the Stack Pointer. Users must also keep in mind the syntax requirements of the extended instruction set (see Section 27.2.3.1 "Extended Instruction Syntax with Standard PIC18 Commands"). Although the Indexed Literal Offset mode can be very useful for dynamic stack and pointer manipulation, it can also be very annoying if a simple arithmetic operation is carried out on the wrong register. Users who are accustomed to the PIC18 programming must keep in mind that, when the extended instruction set is enabled, register addresses of 5Fh or less are used for Indexed Literal Offset Addressing. Representative examples of typical byte-oriented and bit-oriented instructions in the Indexed Literal Offset mode are provided on the following page to show how execution is affected. The operand conditions shown in the examples are applicable to all instructions of these types.
When the extended instruction set is enabled, the file register argument `f' in the standard byte-oriented and bit-oriented commands is replaced with the literal offset value `k'. As already noted, this occurs only when `f' is less than or equal to 5Fh. When an offset value is used, it must be indicated by square brackets ("[ ]"). As with the extended instructions, the use of brackets indicates to the compiler that the value is to be interpreted as an index or an offset. Omitting the brackets, or using a value greater than 5Fh within the brackets, will generate an error in the MPASMTM Assembler. If the index argument is properly bracketed for Indexed Literal Offset Addressing, the Access RAM argument is never specified; it will automatically be assumed to be `0'. This is in contrast to standard operation (extended instruction set disabled), when `a' is set on the basis of the target address. Declaring the Access RAM bit in this mode will also generate an error in the MPASM Assembler. The destination argument `d' functions as before. In the latest versions of the MPASM Assembler, language support for the extended instruction set must be explicitly invoked. This is done with either the command line option, /y, or the PE directive in the source listing.
27.2.4
CONSIDERATIONS WHEN ENABLING THE EXTENDED INSTRUCTION SET
It is important to note that the extensions to the instruction set may not be beneficial to all users. In particular, users who are not writing code that uses a software stack may not benefit from using the extensions to the instruction set. Additionally, the Indexed Literal Offset Addressing mode may create issues with legacy applications written to the PIC18 assembler. This is because instructions in the legacy code may attempt to address registers in the Access Bank below 5Fh. Since these addresses are interpreted as literal offsets to FSR2 when the instruction set extension is enabled, the application may read or write to the wrong data addresses. When porting an application to the PIC18F87J72 family, it is very important to consider the type of code. A large, re-entrant application that is written in C and would benefit from efficient compilation will do well when using the instruction set extensions. Legacy applications that heavily use the Access Bank will most likely not benefit from using the extended instruction set.
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ADDWF Syntax: Operands: Operation: Status Affected: Encoding: Description: ADD W to Indexed (Indexed Literal Offset mode) ADDWF 0 k 95 d [0,1] (W) + ((FSR2) + k) dest N, OV, C, DC, Z 0010 01d0 kkkk kkkk The contents of W are added to the contents of the register indicated by FSR2, offset by the value `k'. If `d' is `0', the result is stored in W. If `d' is `1', the result is stored back in register `f'. Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read `k' Q3 Process Data [OFST] ,0 = = = = = = 17h 2Ch 0A00h 20h 37h 20h SETF Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read `k' Q3 Process Data [OFST] 2Ch 0A00h 00h FFh Q4 Write register Set Indexed (Indexed Literal Offset mode) SETF [k] 0 k 95 FFh ((FSR2) + k) None 0110 1000 kkkk kkkk The contents of the register indicated by FSR2, offset by `k', are set to FFh. 1 1 Q4 Write to destination Example: BSF = = = = [FLAG_OFST], 7 0Ah 0A00h 55h D5h Before Instruction FLAG_OFST FSR2 Contents of 0A0Ah After Instruction Contents of 0A0Ah 1 1 [k] {,d} BSF Syntax: Operands: Operation: Status Affected: Encoding: Description: Words: Cycles: Q Cycle Activity: Q1 Decode Q2 Read register `f' Q3 Process Data Q4 Write to destination Bit Set Indexed (Indexed Literal Offset mode) BSF [k], b 0 f 95 0b7 1 ((FSR2) + k) None 1000 bbb0 kkkk kkkk Bit `b' of the register indicated by FSR2, offset by the value `k', is set. 1 1
Example:
ADDWF
Before Instruction W OFST FSR2 Contents of 0A2Ch After Instruction W Contents of 0A2Ch
Example:
SETF = = = =
Before Instruction OFST FSR2 Contents of 0A2Ch After Instruction Contents of 0A2Ch
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27.2.5 SPECIAL CONSIDERATIONS WITH MICROCHIP MPLAB(R) IDE TOOLS
The latest versions of Microchip's software tools have been designed to fully support the extended instruction set for the PIC18F87J72 family. This includes the MPLAB C18 C Compiler, MPASM assembly language and MPLAB Integrated Development Environment (IDE). When selecting a target device for software development, MPLAB IDE will automatically set default Configuration bits for that device. The default setting for the XINST Configuration bit is `1', enabling the extended instruction set and Indexed Literal Offset Addressing. For proper execution of applications developed to take advantage of the extended instruction set, XINST must be set during programming. To develop software for the extended instruction set, the user must enable support for the instructions and the Indexed Addressing mode in their language tool(s). Depending on the environment being used, this may be done in several ways: * A menu option or dialog box within the environment that allows the user to configure the language tool and its settings for the project * A command line option * A directive in the source code These options vary between different compilers, assemblers and development environments. Users are encouraged to review the documentation accompanying their development systems for the appropriate information.
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NOTES:
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28.0 DEVELOPMENT SUPPORT
28.1
The PIC(R) microcontrollers and dsPIC(R) digital signal controllers are supported with a full range of software and hardware development tools: * Integrated Development Environment - MPLAB(R) IDE Software * Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families * Simulators - MPLAB SIM Software Simulator * Emulators - MPLAB REAL ICETM In-Circuit Emulator * In-Circuit Debuggers - MPLAB ICD 3 - PICkitTM 3 Debug Express * Device Programmers - PICkitTM 2 Programmer - MPLAB PM3 Device Programmer * Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits
MPLAB Integrated Development Environment Software
The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows(R) operating system-based application that contains: * A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) * A full-featured editor with color-coded context * A multiple project manager * Customizable data windows with direct edit of contents * High-level source code debugging * Mouse over variable inspection * Drag and drop variables from source to watch windows * Extensive on-line help * Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: * Edit your source files (either C or assembly) * One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) * Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power.
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28.2 MPLAB C Compilers for Various Device Families 28.5 MPLINK Object Linker/ MPLIB Object Librarian
The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip's PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger.
The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: * Efficient linking of single libraries instead of many smaller files * Enhanced code maintainability by grouping related modules together * Flexible creation of libraries with easy module listing, replacement, deletion and extraction
28.3
HI-TECH C for Various Device Families
The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip's PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms.
28.6
MPLAB Assembler, Linker and Librarian for Various Device Families
28.4
MPASM Assembler
The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel(R) standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: * Integration into MPLAB IDE projects * User-defined macros to streamline assembly code * Conditional assembly for multi-purpose source files * Directives that allow complete control over the assembly process
MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: * * * * * * Support for the entire device instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility
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28.7 MPLAB SIM Software Simulator 28.9
The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC(R) DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool.
MPLAB ICD 3 In-Circuit Debugger System
MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC(R) Flash microcontrollers and dsPIC(R) DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers.
28.8
MPLAB REAL ICE In-Circuit Emulator System
28.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and programming of PIC(R) and dsPIC(R) Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer's PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial ProgrammingTM. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user's guide, lessons, tutorial, compiler and MPLAB IDE software.
MPLAB REAL ICE In-Circuit Emulator System is Microchip's next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC(R) Flash MCUs and dsPIC(R) Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables.
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28.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express
The PICkitTM 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip's Flash families of microcontrollers. The full featured Windows(R) programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip's powerful MPLAB Integrated Development Environment (IDE) the PICkitTM 2 enables in-circuit debugging on most PIC(R) microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user's guide, lessons, tutorial, compiler and MPLAB IDE software.
28.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits
A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEMTM and dsPICDEMTM demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ(R) security ICs, CAN, IrDA(R), PowerSmart battery management, SEEVAL(R) evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits.
28.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSPTM cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications.
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29.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings()
Ambient temperature under bias.............................................................................................................-40C to +100C Storage temperature .............................................................................................................................. -65C to +150C Voltage on any digital only I/O pin or MCLR with respect to VSS (except VDD) ........................................... -0.3V to 5.6V Voltage on any combined digital and analog pin with respect to VSS (except VDD and MCLR)...... -0.3V to (VDD + 0.3V) Voltage on VDDCORE with respect to VSS................................................................................................... -0.3V to 2.75V Voltage on VDD with respect to VSS ........................................................................................................... -0.3V to 3.6V Total power dissipation (Note 1) ...............................................................................................................................1.0W Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin ..............................................................................................................................250 mA Maximum output current sunk by PORTA<7:6> and any PORTB and PORTC I/O pins.........................................25 mA Maximum output current sunk by any PORTD, PORTE and PORTJ I/O pins ..........................................................8 mA Maximum output current sunk by PORTA<5:0> and any PORTF, PORTG and PORTH I/O pins ............................2 mA Maximum output current sourced by PORTA<7:6> and any PORTB and PORTC I/O pins ...................................25 mA Maximum output current sourced by any PORTD, PORTE and PORTJ I/O pins .....................................................8 mA Maximum output current sourced by PORTA<5:0> and any PORTF, PORTG and PORTH I/O pins .......................2 mA Maximum current sunk byall ports combined.......................................................................................................200 mA Voltage on AFE SVDD ................................................................................................................................................7.0V AFE digital inputs and outputs with respect to SAVSS ..................................................................-0.6V to (SVDD + 0.6V) AFE analog input with respect to SAVSS...................................................................................................... ....-6V to +6V AFE VREF input with respect to SAVSS .........................................................................................-0.6V to (SVDD + 0.6V) ESD on the AFE analog inputs (HBM(2),MM(3)) ............................................................................................ 7.0 kV, 400V ESD on all other AFE pins (HBM(2),MM(3)) ................................................................................................... 7.0 kV, 400V Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOL x IOL) 2: Human Body Model for ESD testing. 3: Machine Model for ESD testing.
NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
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FIGURE 29-1: VOLTAGE-FREQUENCY GRAPH, REGULATOR ENABLED (INDUSTRIAL)(1)
4.0V 3.6V 3.5V 3.0V 2.5V 2.0V 2.35V
PIC18F8XJ72
Voltage (VDD)
0
8 MHz
Frequency
48 MHz
Note 1:
When the on-chip regulator is enabled, its BOR circuit will automatically trigger a device Reset before VDD reaches a level at which full-speed operation is not possible.
FIGURE 29-2:
VOLTAGE-FREQUENCY GRAPH, REGULATOR DISABLED (INDUSTRIAL)(1,2)
3.00V 2.75V 2.7V
PIC18F8XJ72
Voltage (VDDCORE)
2.50V 2.25V 2.00V
2.35V
8 MHz
Frequency
48 MHz
Note 1:
When the on-chip voltage regulator is disabled, VDD and VDDCORE must be maintained so that VDDCORE VDD 3.6V.
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29.1 DC Characteristics: Supply Voltage PIC18F87J72 Family (Industrial)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Characteristic Supply Voltage Min VDDCORE 2.0 2.0 VDD - 0.3 1.5 -- Typ -- -- -- -- -- -- -- Max 3.6 3.6 2.70 VDD + 0.3 VSS + 0.3 -- 0.7 Units V V V V V V V See Section 5.3 "Power-on Reset (POR)" for details Conditions ENVREG tied to VSS ENVREG tied to VDD ENVREG tied to VSS
PIC18F87J72 Family (Industrial) Param Symbol No. D001 VDD
D001B VDDCORE External Supply for Microcontroller Core D001C AVDD D001D AVSS D002 D003 VDR VPOR Analog Supply Voltage RAM Data Retention Voltage(1) VDD Start Voltage to Ensure Internal Power-on Reset Signal VDD Rise Rate to Ensure Internal Power-on Reset Signal Brown-out Reset Voltage
Analog Ground Potential VSS - 0.3
D004
SVDD
0.05
--
--
V/ms See Section 5.3 "Power-on Reset (POR)" for details V
D005 Note 1:
VBOR
--
1.8
--
This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data.
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29.2 DC Characteristics: Power-Down and Supply Current PIC18F87J72 Family (Industrial)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Typ Max Units Conditions
PIC18F87J72 Family (Industrial) Param No. Device
Power-Down Current (IPD)(1) All devices 0.5 0.1 0.8 5.5 All devices 0.5 0.1 1 6.8 All devices 2.9 3.6 4.1 9.6 Note 1: 1.4 1.4 6 10.2 1.5 1.5 8 12.6 7 7 10 19 A A A A A A A A A A A A -40C +25C +60C +85C -40C +25C +60C +85C -40C +25C +60C +85C VDD = 3.3V(5) (Sleep mode) VDD = 2.5V(4) (Sleep mode) VDD = 2.0V(4) (Sleep mode)
2:
3: 4: 5:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. Standard, low-cost 32 kHz crystals have an operating temperature range of -10C to +70C. Extended temperature crystals are available at a much higher cost. Voltage regulator is disabled (ENVREG = 0, tied to VSS). Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
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29.2 DC Characteristics: Power-Down and Supply Current PIC18F87J72 Family (Industrial) (Continued)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Typ Max Units Conditions
PIC18F87J72 Family (Industrial) Param No. Device Supply Current (IDD)(2,3) All devices
5 5.5 10
14.2 14.2 19.0 16.5 16.5 22.4 84 84 108 0.82 0.82 0.95 0.98 0.98 1.10 0.96 0.96 1.18 1.45 1.45 1.58 1.72 1.72 1.85 2.87 2.87 2.96
A A A A A A A A A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
-40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C
VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 31 kHz (RC_RUN mode, internal oscillator source)
All devices
6.8 7.6 14
VDD = 2.5V, VDDCORE = 2.5V(4)
All devices
37 51 72
VDD = 3.3V(5)
All devices
0.43 0.47 0.52
VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 1 MHz (RC_RUN mode, internal oscillator source)
All devices
0.52 0.57 0.63
VDD = 2.5V, VDDCORE = 2.5V(4)
All devices
0.59 0.65 0.72
VDD = 3.3V(5)
All devices
0.88 1 1.1
VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 4 MHz (RC_RUN mode, internal oscillator source)
All devices
1.2 1.3 1.4
VDD = 2.5V, VDDCORE = 2.5V(4)
All devices
1.3 1.4 1.5
VDD = 3.3V(5)
Note 1:
2:
3: 4: 5:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. Standard, low-cost 32 kHz crystals have an operating temperature range of -10C to +70C. Extended temperature crystals are available at a much higher cost. Voltage regulator is disabled (ENVREG = 0, tied to VSS). Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
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29.2 DC Characteristics: Power-Down and Supply Current PIC18F87J72 Family (Industrial) (Continued)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Typ Max Units Conditions
PIC18F87J72 Family (Industrial) Param No. Device
Supply Current (IDD) Cont.(2,3) All devices 3 3.3 8.5 All devices 4 4.3 10.3 All devices 34 48 69 All devices 0.33 0.37 0.41 All devices 0.39 0.42 0.47 All devices 0.43 0.48 0.54 All devices 0.53 0.57 0.61 All devices 0.63 0.67 0.72 All devices 0.7 0.76 0.82 Note 1: 9.4 9.4 17.2 10.5 10.5 19.5 82 82 105 0.75 0.75 0.84 0.78 0.78 0.91 0.82 0.82 0.95 0.98 0.98 1.12 1.14 1.14 1.25 1.27 1.27 1.45 A A A A A A A A A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C VDD = 3.3V(5) VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 4 MHz (RC_IDLE mode, internal oscillator source) VDD = 3.3V(5) VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 1 MHz (RC_IDLE mode, internal oscillator source) VDD = 3.3V(5) VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 31 kHz (RC_IDLE mode, internal oscillator source)
VDD = 2.5V, VDDCORE = 2.5V(4)
VDD = 2.5V, VDDCORE = 2.5V(4)
VDD = 2.5V, VDDCORE = 2.5V(4)
2:
3: 4: 5:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. Standard, low-cost 32 kHz crystals have an operating temperature range of -10C to +70C. Extended temperature crystals are available at a much higher cost. Voltage regulator is disabled (ENVREG = 0, tied to VSS). Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
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29.2 DC Characteristics: Power-Down and Supply Current PIC18F87J72 Family (Industrial) (Continued)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Typ Max Units Conditions
PIC18F87J72 Family (Industrial) Param No. Device
Supply Current (IDD) Cont.(2,3) All devices 0.17 0.18 0.20 All devices 0.29 0.31 0.34 All devices 0.59 0.44 0.42 All devices 0.70 0.75 0.79 All devices 1.10 1.10 1.12 All devices 1.55 1.47 1.54 All devices 9.9 9.5 10.1 All devices 13.3 12.2 12.1 Note 1: 0.35 0.35 0.42 0.52 0.52 0.61 1.1 0.85 0.85 1.25 1.25 1.36 1.7 1.7 1.82 1.95 1.89 1.92 14.8 14.8 15.2 23.2 22.7 22.7 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C VDD = 3.3V(5) VDD = 2.5V, VDDCORE = 2.5V(4) VDD = 3.3V(5) VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 4 MHz (PRI_RUN mode, EC oscillator) VDD = 3.3V(5) VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 1 MHZ (PRI_RUN mode, EC oscillator)
VDD = 2.5V, VDDCORE = 2.5V(4)
VDD = 2.5V, VDDCORE = 2.5V(4)
FOSC = 48 MHZ (PRI_RUN mode, EC oscillator)
2:
3: 4: 5:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. Standard, low-cost 32 kHz crystals have an operating temperature range of -10C to +70C. Extended temperature crystals are available at a much higher cost. Voltage regulator is disabled (ENVREG = 0, tied to VSS). Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
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29.2 DC Characteristics: Power-Down and Supply Current PIC18F87J72 Family (Industrial) (Continued)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Typ Max Units Conditions
PIC18F87J72 Family (Industrial) Param No. Device
Supply Current (IDD) Cont.(2,3) All devices 4.5 4.4 4.5 All devices 5.7 5.5 5.3 All devices 10.8 10.8 9.9 All devices 13.4 12.3 11.2 Note 1: 5.2 5.2 5.2 6.7 6.3 6.3 13.5 13.5 13.0 24.1 20.2 19.5 mA mA mA mA mA mA mA mA mA mA mA mA -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C VDD = 3.3V(5) VDD = 2.5V, VDDCORE = 2.5V(4) VDD = 3.3V(5) VDD = 2.5V, VDDCORE = 2.5V(4)
FOSC = 4 MHZ, 16 MHz internal (PRI_RUN HSPLL mode)
FOSC = 10 MHZ, 40 MHz internal (PRI_RUN HSPLL mode)
2:
3: 4: 5:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. Standard, low-cost 32 kHz crystals have an operating temperature range of -10C to +70C. Extended temperature crystals are available at a much higher cost. Voltage regulator is disabled (ENVREG = 0, tied to VSS). Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
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29.2 DC Characteristics: Power-Down and Supply Current PIC18F87J72 Family (Industrial) (Continued)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Typ Max Units Conditions
PIC18F87J72 Family (Industrial) Param No. Device
Supply Current (IDD) Cont.(2,3) All devices 0.10 0.07 0.09 All devices 0.25 0.13 0.10 All devices 0.45 0.26 0.30 All devices 0.36 0.33 0.35 All devices 0.52 0.45 0.46 All devices 0.80 0.66 0.65 All devices 5.2 4.9 3.4 All devices 6.2 5.9 5.8 Note 1: 0.26 0.18 0.22 0.48 0.30 0.26 0.68 0.45 0.54 0.60 0.56 0.56 0.81 0.70 0.70 1.15 0.98 0.98 6.5 5.9 4.5 12.4 11.5 11.5 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C VDD = 3.3V(5) VDD = 2.5V, VDDCORE = 2.5V(4) VDD = 3.3V(5) VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 4 MHz (PRI_IDLE mode, EC oscillator) VDD = 3.3V(5) VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 1 MHz (PRI_IDLE mode, EC oscillator)
VDD = 2.5V, VDDCORE = 2.5V(4)
VDD = 2.5V, VDDCORE = 2.5V(4)
FOSC = 48 MHz (PRI_IDLE mode, EC oscillator)
2:
3: 4: 5:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. Standard, low-cost 32 kHz crystals have an operating temperature range of -10C to +70C. Extended temperature crystals are available at a much higher cost. Voltage regulator is disabled (ENVREG = 0, tied to VSS). Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
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29.2 DC Characteristics: Power-Down and Supply Current PIC18F87J72 Family (Industrial) (Continued)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Typ Max Units Conditions
PIC18F87J72 Family (Industrial) Param No. Device
Supply Current (IDD) Cont.(2,3) All devices 18 19 28 All devices 20 21 32 All devices 0.06 0.07 0.09 All devices 14 15 24 All devices 15 16 27 All devices 0.05 0.06 0.08 Note 1: 35 35 49 45 45 61 0.11 0.11 0.15 28 28 43 31 31 50 0.10 0.10 0.14 A A A A A A mA mA mA A A A A A A mA mA mA -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C -40C +25C +85C VDD = 3.3V(5) VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 32 kHz(3) (SEC_IDLE mode, Timer1 as clock) VDD = 3.3V(5) VDD = 2.0V, VDDCORE = 2.0V(4) FOSC = 32 kHz(3) (SEC_RUN mode, Timer1 as clock)
VDD = 2.5V, VDDCORE = 2.5V(4)
VDD = 2.5V, VDDCORE = 2.5V(4)
2:
3: 4: 5:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. Standard, low-cost 32 kHz crystals have an operating temperature range of -10C to +70C. Extended temperature crystals are available at a much higher cost. Voltage regulator is disabled (ENVREG = 0, tied to VSS). Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
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29.2 DC Characteristics: Power-Down and Supply Current PIC18F87J72 Family (Industrial) (Continued)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Typ Max Units Conditions
PIC18F87J72 Family (Industrial) Param No. D022 Device
Module Differential Currents (IWDT, IOSCB, IAD) Watchdog Timer 2.1 7.0 A 2.2 4.3 3.0 3.1 5.5 5.9 6.2 6.9 2(6,7) 2.7(6,7) 3.5(6,7) 16(7) 17(7) 24(7) 7.0 9.5 8.0 8.0 10.4 12.1 12.1 13.6 5 5 7 25 25 40 4.0 4.5 4.5 4.5 5.0 5.0 6.5 6.5 8.0 10.0 A A A A A A A A A A A A A A A A A A A A A A A A
-40C +25C +85C -40C +25C +85C -40C +25C +85C +25C +25C +25C +25C +25C +25C -10C +25C +85C -10C +25C +85C -10C +25C +85C -40C to +85C
VDD = 2.0V, VDDCORE = 2.0V(4) VDD = 2.5V, VDDCORE = 2.5V(4)
VDD = 3.3V VDD = 2.0V VDD = 2.5V VDD = 3.0V VDD = 2.0V VDD = 2.5V VDD = 3.0V VDD = 2.0V, VDDCORE = 2.0V(4) VDD = 2.5V, VDDCORE = 2.5V(4) Resistive Ladder CPEN = 0; CKSEL<1:0> = 00; CS<1:0> = 10; LP<3:0> = 0100 Charge Pump BIAS<2:0> = 111; CPEN = 1; CKSEL<1:0> = 11; CS<1:0> = 10 32 kHz on Timer1(3)
D024 (ILCD)
LCD Module
D025 (IOSCB)
RTCC + Timer1 Osc. with 32 kHz Crystal(6)
0.9 1.0 1.1 1.1 1.2 1.2 1.6 1.6 2.1 3.0
32 kHz on Timer1(3)
VDD = 3.3V VDD = 2.0V, VDDCORE = 2.0V(4)
32 kHz on Timer1(3)
D026 (IAD) Note 1:
A/D Converter
A/D on, not converting
2:
3: 4: 5:
3.0 10.0 A -40C to +85C VDD = 2.5V, The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. Standard, low-cost 32 kHz crystals have an operating temperature range of -10C to +70C. Extended temperature crystals are available at a much higher cost. Voltage regulator is disabled (ENVREG = 0, tied to VSS). Voltage regulator is enabled (ENVREG = 1, tied to VDD, REGSLP = 1).
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29.3 DC Characteristics: PIC18F87J72 Family (Industrial)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Characteristic Input Low Voltage All I/O Ports: D030 D030A D031 D031A D031B D032 D033 D033A D034 VIH D040 D040A D041 D041A D041B I/O Ports (5.5V tolerant): with TTL Buffer with Schmitt Trigger Buffer D042 D043 D043A D044 IIL D060 MCLR OSC1 OSC1 T13CKI Input Leakage Current(1) -- -- -- -- 80 200 200 1 1 400 nA nA A A A VSS VPIN VDD, Pin at high-impedance VSS VPIN 5.5V, Pin at high-impedance Vss VPIN VDD Vss VPIN VDD VDD = 3.3V, VPIN = VSS I/O Ports with Analog Functions Digital Only I/O Ports D061 D063 IPU D070 Note 1: IPURB MCLR OSC1 Weak Pull-up Current PORTB Weak Pull-up Current 0.25 VDD + 0.8V 2.0 0.8 VDD 0.8 VDD 0.7 VDD 0.8 VDD 1.6 5.5 5.5 5.5 VDD VDD VDD VDD V V V V V V V HS, HSPLL modes EC, ECPLL modes VDD < 3.3V 3.3V VDD 3.6V with Schmitt Trigger Buffer RC3 and RC4 only MCLR OSC1 OSC1 T13CKI Input High Voltage I/O Ports (not 5.5V tolerant): with TTL Buffer 0.25 VDD + 0.8V 2.0 0.8 VDD 0.7 VDD 2.1 VDD VDD VDD VDD VDD V V V I2C enabled SMBus V VDD < 3.3V 3.3V VDD 3.6V with Schmitt Trigger Buffer RC3 and RC4 only with TTL Buffer VSS -- VSS VSS VSS VSS VSS VSS VSS 0.15 VDD 0.8 0.2 VDD 0.3 VDD 0.8 0.2 VDD 0.3 VDD 0.2 VDD 0.3 V V V V V V V V V HS, HSPLL modes EC, ECPLL modes I2CTM enabled SMBus VDD < 3.3V 3.3V VDD 3.6V Min Max Units Conditions DC CHARACTERISTICS Param Symbol No. VIL
Negative current is defined as current sourced by the pin.
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29.3 DC Characteristics: PIC18F87J72 Family (Industrial) (Continued)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Characteristic Output Low Voltage I/O Ports: PORTA, PORTF, PORTG, PORTD, PORTE PORTB, PORTC D083 VOH D090 OSC2/CLKO (EC, ECPLL modes) Output High Voltage(1) I/O Ports: PORTA, PORTF, PORTG PORTD, PORTE PORTB, PORTC D092 OSC2/CLKO (INTOSC, EC, ECPLL modes) Capacitive Loading Specs on Output Pins D100(4) COSC2 OSC2 Pin -- 15 pF In HS mode when external clock is used to drive OSC1 To meet the AC Timing Specifications I2CTM Specification 2.4 2.4 2.4 2.4 -- -- -- -- V V V V V IOH = -2 mA, VDD = 3.3V, -40C to +85C IOH = -2 mA, VDD = 3.3V, -40C to +85C IOH = -2 mA, VDD = 3.3V, -40C to +85C IOH = -1 mA, VDD = 3.3V, -40C to +85C -- -- -- -- 0.4 0.4 0.4 0.4 V V V V IOL = 2 mA, VDD = 3.3V, -40C to +85C IOL = 3.4 mA, VDD = 3.3V, -40C to +85C IOL = 3.4 mA, VDD = 3.3V, -40C to +85C IOL = 1.6 mA, VDD = 3.3V, -40C to +85C Min Max Units Conditions DC CHARACTERISTICS Param Symbol No. VOL D080
D101 D102 Note 1:
CIO CB
All I/O Pins and OSC2 SCL, SDA
-- --
50 400
pF pF
Negative current is defined as current sourced by the pin.
29.4
DC Characteristics: CTMU Current Source Specifications
Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial Min -- -- -- Typ(1) 550 5.5 55 Max -- -- -- Units nA A A Conditions CTMUICON<1:0> = 01 CTMUICON<1:0> = 10 CTMUICON<1:0> = 11
DC CHARACTERISTICS Param Sym No. Characteristic
IOUT1 CTMU Current Source, Base Range IOUT2 CTMU Current Source, 10x Range IOUT3 CTMU Current Source, 100x Range Note 1:
Nominal value at center point of current trim range (CTMUICON<7:2> = 000000).
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TABLE 29-1: MEMORY PROGRAMMING REQUIREMENTS
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Characteristic Program Flash Memory D130 D131 EP VPR Cell Endurance VDD for Read Voltage for Self-Timed Erase or Write operations VDD VDDCORE Self-Timed Write Cycle Time Self-Timed Block Erased Cycle Time 10K VMIN -- -- -- 3.6 E/W -40C to +85C V VMIN = Minimum operating voltage Min Typ Max Units Conditions DC CHARACTERISTICS Param No. Sym
D132B VPEW
2.35 2.25 -- -- 20 -- --
-- -- 2.8 33 -- 3 --
3.6 2.7 -- -- -- 14 1
V V ms ms
ENVREG tied to VDD ENVREG tied to VSS
D133A TIW D133B TIE D134 D135 D140
TRETD Characteristic Retention IDDP TWE Supply Current during Programming Writes per Erase Cycle
Year Provided no other specifications are violated mA For each physical address
Data in "Typ" column is at 3.3V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
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TABLE 29-2:
Param No. D300 D301 D302 D303 D304 Note 1:
COMPARATOR SPECIFICATIONS
Operating Conditions: 3.0V VDD 3.6V, -40C TA +85C (unless otherwise stated) Sym VIOFF VICM CMRR TRESP TMC2OV Characteristics Input Offset Voltage Input Common-Mode Voltage Common-Mode Rejection Ratio Response Time(1) Comparator Mode Change to Output Valid* Min -- 0 55 -- -- Typ 5.0 -- -- 150 -- Max 25 AVDD - 1.5 -- 400 10 Units mV V dB ns s Comments
Response time measured with one comparator input at (AVDD - 1.5)/2, while the other input transitions from VSS to VDD.
TABLE 29-3:
Param No. D310 D311 D312 310 Note 1:
VOLTAGE REFERENCE SPECIFICATIONS
Operating Conditions: 3.0V VDD 3.6V, -40C TA +85C (unless otherwise stated) Sym VRES VRAA VRUR TSET Characteristics Resolution Absolute Accuracy Unit Resistor Value (R) Settling Time(1) Min VDD/24 -- -- -- Typ -- -- 2k -- Max VDD/32 1/2 -- 10 Units LSb LSb s Comments
Settling time measured while CVRR = 1 and CVR<3:0> transitions from `0000' to `1111'.
TABLE 29-4:
Param No.
INTERNAL VOLTAGE REGULATOR SPECIFICATIONS
Operating Conditions: -40C TA +85C (unless otherwise stated) Sym Characteristics Min -- 4.7 Typ 2.5 10 Max -- -- Units V F Capacitor must be low-ESR, a low series resistance (< 5) Comments
VRGOUT Regulator Output Voltage* CEFC External Filter Capacitor Value*
TABLE 29-5:
Param No.
INTERNAL LCD VOLTAGE REGULATOR SPECIFICATIONS
Operating Conditions: 2.0V VDD 3.6V, -40C TA +85C (unless otherwise stated) Sym CFLY VBIAS Characteristics Fly Back Capacitor VPK-PK between LCDBIAS0 & LCDBIAS3 Min 0.47 -- -- -- -- -- -- -- -- Typ 4.7 3.40 3.27 3.14 3.01 2.88 2.75 2.62 2.49 Max -- 3.6 -- -- -- -- -- -- -- Units F V V V V V V V V Comments Capacitor must be low-ESR BIAS<2:0> = 111 BIAS<2:0> = 110 BIAS<2:0> = 101 BIAS<2:0> = 100 BIAS<2:0> = 011 BIAS<2:0> = 010 BIAS<2:0> = 001 BIAS<2:0> = 000
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DS39979A-page 403
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29.5
29.5.1
AC (Timing) Characteristics
TIMING PARAMETER SYMBOLOGY
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKO cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (High-impedance) L Low I2C only AA output access BUF Bus free TCC:ST (I2C specifications only) CC HD Hold ST DAT DATA input hold STA Start condition 3. TCC:ST 4. Ts T (I2C specifications only) (I2C specifications only) Time
osc rd rw sc ss t0 t1 wr
OSC1 RD RD or WR SCK SS T0CKI T13CKI WR
P R V Z High Low
Period Rise Valid High-impedance High Low
SU STO
Setup Stop condition
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29.5.2 TIMING CONDITIONS
The temperature and voltages specified in Table 29-6 apply to all timing specifications unless otherwise noted. Figure 29-3 specifies the load conditions for the timing specifications.
TABLE 29-6:
TEMPERATURE AND VOLTAGE SPECIFICATIONS - AC
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Operating voltage VDD range as described in Section 29.1 and Section 29.3.
AC CHARACTERISTICS
FIGURE 29-3:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 VDD/2 RL Load Condition 2
Pin VSS
CL
Pin VSS
CL
RL = 464 CL = 50 pF CL = 15 pF for all pins except OSC2/CLKO/RA6 and including D and E outputs as ports for OSC2/CLKO/RA6
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29.5.3 TIMING DIAGRAMS AND SPECIFICATIONS EXTERNAL CLOCK TIMING
Q4 Q1 Q2 Q3 Q4 Q1
FIGURE 29-4:
OSC1
1 2 3 3 4 4
CLKO
TABLE 29-7:
Param. No. 1A
EXTERNAL CLOCK TIMING REQUIREMENTS
Characteristic External CLKI Frequency(1) Oscillator Frequency(1) Min DC DC 4 4 20.8 100 Oscillator Period(1) 40.0 100 83.3 10 -- Max 48 10 25 10 -- -- 250 250 -- -- 7.5 ns ns ns ns ns MHz Units MHz Conditions EC Oscillator mode ECPLL Oscillator mode HS Oscillator mode HSPLL Oscillator mode EC Oscillator mode ECPLL Oscillator mode HS Oscillator mode HSPLL Oscillator mode TCY = 4/FOSC, Industrial HS Oscillator mode HS Oscillator mode
Symbol FOSC
1
TOSC
External CLKI Period(1)
2 3 4 Note 1:
TCY TOSL, TOSH TOSR, TOSF
Instruction Cycle Time(1) External Clock in (OSC1) High or Low Time External Clock in (OSC1) Rise or Fall Time
Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations except PLL. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the "max." cycle time limit is "DC" (no clock) for all devices.
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TABLE 29-8:
Param No. F10 F11 F12 F13 Sym
PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.15V TO 3.6V)
Characteristic Min 4 16 -- -2 Typ -- -- -- -- Max 10 40 2 +2 Units Conditions
FOSC Oscillator Frequency Range FSYS On-Chip VCO System Frequency trc CLK PLL Start-up Time (Lock Time) CLKO Stability (Jitter)
MHz HS mode only MHz HS mode only ms %
Data in "Typ" column is at 3.3V, 25C, unless otherwise stated. These parameters are for design guidance only and are not tested.
TABLE 29-9:
INTERNAL RC ACCURACY (INTOSC AND INTRC SOURCES)
Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Min Typ Max Units Conditions
PIC18F87J72 Family (Industrial) Param No. Device
INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz, 31 kHz(1) All Devices -2 -5 -10 INTRC Accuracy @ Freq = 31 All Devices Note 1: kHz(1) -- 40.3 kHz -40C to +85C VDD = 2.0-3.3V 21.7 +/-1 -- +/-1 2 5 10 % % % +25C -10C to +85C -40C to +85C VDD = 2.7-3.3V VDD = 2.0-3.3V VDD = 2.0-3.3V
The accuracy specification of the 31 kHz clock is determined by which source is providing it at a given time. When INTSRC (OSCTUNE<7>) is `1', use the INTOSC accuracy specification. When INTSRC is `0', use the INTRC accuracy specification.
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FIGURE 29-5: CLKO AND I/O TIMING
Q4 OSC1 10 CLKO 13 14 I/O pin (Input) 17 I/O pin (Output) Old Value 20, 21 Note: Refer to Figure 29-3 for load conditions. 15 New Value 19 18 12 16 11 Q1 Q2 Q3
TABLE 29-10: CLKO AND I/O TIMING REQUIREMENTS
Param No. 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Symbol Characteristic Min -- -- -- -- -- 0.25 TCY + 25 0 -- 100 0 -- -- TCY TCY Typ 75 75 15 15 -- -- -- 50 -- -- -- -- -- -- Max 200 200 30 30 0.5 TCY + 20 -- -- 150 -- -- 6 5 -- -- Units Conditions ns ns ns ns ns ns ns ns ns ns ns ns ns ns (Note 1) (Note 1) (Note 1) (Note 1)
TOSH2CKL OSC1 to CLKO TOSH2CKH OSC1 to CLKO TCKR TCKF CLKO Rise Time CLKO Fall Time
TCKL2IOV CLKO to Port Out Valid TIOV2CKH Port In Valid before CLKO TCKH2IOI TOSH2IOI Port In Hold after CLKO OSC1 (Q2 cycle) to Port Input Invalid (I/O in hold time) TOSH2IOV OSC1 (Q1 cycle) to Port Out Valid
TIOV2OSH Port Input Valid to OSC1 (I/O in setup time) TIOR TIOF TINP TRBP Port Output Rise Time Port Output Fall Time INTx Pin High or Low Time RB<7:4> Change INTx High or Low Time
These parameters are asynchronous events not related to any internal clock edges. Note 1: Measurements are taken in EC mode, where CLKO output is 4 x TOSC.
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FIGURE 29-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING
VDD MCLR Internal POR PWRT Time-out Oscillator Time-out Internal Reset Watchdog Timer Reset 34 I/O pins Note: Refer to Figure 29-3 for load conditions. 33 32 30
31
34
TABLE 29-11: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET REQUIREMENTS
Param. Symbol No. 30 31 32 33 34 38 TMCL TWDT TOST TPWRT TIOZ TCSD Characteristic MCLR Pulse Width (low) Watchdog Timer Time-out Period (no postscaler) Oscillation Start-up Timer Period Power-up Timer Period I/O High-Impedance from MCLR Low or Watchdog Timer Reset CPU Start-up Time Min 2 TCY 3.4 1024 TOSC 45.8 -- -- Typ 10 TCY 4.0 -- 65.5 2 10 200 Max -- 4.6 1024 TOSC 85.2 -- -- ms s s s Voltage Regulator enabled and put to sleep ms TOSC = OSC1 period Units Conditions (Note 1)
39 Note 1:
TIOBST
Time for INTOSC to Stabilize
--
1
--
s
To ensure device Reset, MCLR must be low for at least 2 TCY or 400 s, whichever is lower.
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FIGURE 29-7: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
T0CKI
40 42 T1OSO/T13CKI
41
45 47 TMR0 or TMR1 Note: Refer to Figure 29-3 for load conditions.
46
48
TABLE 29-12: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param No. 40 41 42 Symbol TT0H TT0L TT0P Characteristic T0CKI High Pulse Width T0CKI Low Pulse Width T0CKI Period No prescaler With prescaler No prescaler With prescaler No prescaler With prescaler Min 0.5 TCY + 20 10 0.5 TCY + 20 10 TCY + 10 Greater of: 20 ns or (TCY + 40)/N 0.5 TCY + 20 10 30 0.5 TCY + 5 10 30 Greater of: 20 ns or (TCY + 40)/N 60 DC 2 TOSC Max -- -- -- -- -- -- Units ns ns ns ns ns ns N = prescale value (1, 2, 4,..., 256) Conditions
45
TT1H
T13CKI High Synchronous, no prescaler Time Synchronous, with prescaler Asynchronous T13CKI Low Synchronous, no prescaler Time Synchronous, with prescaler Asynchronous T13CKI Input Synchronous Period Asynchronous
-- -- -- -- -- -- --
ns ns ns ns ns ns ns N = prescale value (1, 2, 4, 8)
46
TT1L
47
TT1P
-- 50 7 TOSC
ns kHz --
FT1 48
T13CKI Oscillator Input Frequency Range
TCKE2TMRI Delay from External T13CKI Clock Edge to Timer Increment
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FIGURE 29-8: CAPTURE/COMPARE/PWM TIMINGS (CCP1, CCP2 MODULES)
CCPx (Capture Mode)
50 52
51
CCPx (Compare or PWM Mode) 53 Note: Refer to Figure 29-3 for load conditions. 54
TABLE 29-13: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP1, CCP2 MODULES)
Param Symbol No. 50 51 52 53 54 TCCL TCCH TCCP TCCR TCCF Characteristic CCPx Input Low No prescaler Time With prescaler CCPx Input High Time No prescaler With prescaler Min 0.5 TCY + 20 10 0.5 TCY + 20 10 3 TCY + 40 N -- -- Max -- -- -- -- -- 25 25 Units ns ns ns ns ns ns ns N = prescale value (1, 4 or 16) Conditions
CCPx Input Period CCPx Output Fall Time CCPx Output Fall Time
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FIGURE 29-9: EXAMPLE SPI MASTER MODE TIMING (CKE = 0)
SCK (CKP = 0) 78 SCK (CKP = 1) 79 MSb 75, 76 SDI 73 Note: Refer to Figure 29-3 for load conditions. MSb In 74 bit 6 - - - - 1 LSb In bit 6 - - - - - - 1 78 LSb 79
80 SDO
TABLE 29-14: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0)
Param No. 73 73A 74 75 76 78 79 80 Note 1: Symbol TDIV2SCH, TDIV2SCL TB2B TSCH2DIL, TSCL2DIL TDOR TDOF TSCR TSCF Characteristic Setup Time of SDI Data Input to SCK Edge Last Clock Edge of Byte 1 to the 1st Clock Edge of Byte 2 Hold Time of SDI Data Input to SCK Edge SDO Data Output Rise Time SDO Data Output Fall Time SCK Output Rise Time (Master mode) SCK Output Fall Time (Master mode) Min 20 1.5 TCY + 40 40 -- -- -- -- -- Max Units -- -- -- 25 25 25 25 50 ns ns ns ns ns ns ns ns Conditions
TSCH2DOV, SDO Data Output Valid after SCK Edge TSCL2DOV Requires the use of Parameter #73A.
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FIGURE 29-10: EXAMPLE SPI MASTER MODE TIMING (CKE = 1)
81 SCK (CKP = 0) 79
73 SCK (CKP = 1)
80 78 MSb 75, 76 bit 6 - - - - - - 1 LSb
SDO
SDI
MSb In 74
bit 6 - - - - 1
LSb In
Note:
Refer to Figure 29-3 for load conditions.
TABLE 29-15: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1)
Param. No. 73 73A 74 75 76 78 79 80 81 Note 1: 2: Symbol TDIV2SCH, TDIV2SCL TB2B TSCH2DIL, TSCL2DIL TDOR TDOF TSCR TSCF Characteristic Setup Time of SDI Data Input to SCK Edge Last Clock Edge of Byte 1 to the 1st Clock Edge of Byte 2 Hold Time of SDI Data Input to SCK Edge SDO Data Output Rise Time SDO Data Output Fall Time SCK Output Rise Time (Master mode) SCK Output Fall Time (Master mode) Min 20 1.5 TCY + 40 40 -- -- -- -- -- TCY Max Units -- -- -- 25 25 25 25 50 -- ns ns ns ns ns ns ns ns ns (Note 2) Conditions
TSCH2DOV, SDO Data Output Valid after SCK Edge TSCL2DOV TDOV2SCH, SDO Data Output Setup to SCK Edge TDOV2SCL Requires the use of Parameter #73A. Only if Parameter #71A and #72A are used.
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FIGURE 29-11:
SS 70 SCK (CKP = 0) 71 72 78 79 83
EXAMPLE SPI SLAVE MODE TIMING (CKE = 0)
SCK (CKP = 1) 80 SDO MSb 75, 76 SDI MSb In 74 73 Note: Refer to Figure 29-3 for load conditions. bit 6 - - - - 1 LSb In 79 bit 6 - - - - - - 1 78 LSb 77
TABLE 29-16: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING, CKE = 0)
Param No. 70 70A 71 71A 72 72A 73 73A 74 75 76 77 78 79 80 83 Note 1: 2: TSCL Symbol Characteristic Min 3 TCY 3 TCY Continuous Single Byte Continuous Single Byte 1.25 TCY + 30 40 1.25 TCY + 30 40 100 Max Units Conditions -- -- -- -- -- -- -- -- -- 25 25 50 25 25 50 -- ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns (Note 2) (Note 1) (Note 1)
TSSL2SCH, SS to SCK or SCK Input TSSL2SCL TSSL2WB SS to write to SSPBUF TSCH SCK Input High Time (Slave mode) SCK Input Low Time (Slave mode)
TDIV2SCH, Setup Time of SDI Data Input to SCK Edge TDIV2SCL TB2B TSCH2DIL, Hold Time of SDI Data Input to SCK Edge TSCL2DIL TDOR TDOF TSCR TSCF SDO Data Output Rise Time SDO Data Output Fall Time SCK Output Rise Time (Master mode) SCK Output Fall Time (Master mode)
Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 100 -- -- 10 -- -- -- 1.5 TCY + 40
TSSH2DOZ SS to SDO Output High-Impedance
TSCH2DOV, SDO Data Output Valid after SCK Edge TSCL2DOV TSCH2SSH, SS after SCK Edge TSCL2SSH Requires the use of Parameter #73A. Only if Parameter #71A and #72A are used.
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FIGURE 29-12:
SS 70 83 71 72
EXAMPLE SPI SLAVE MODE TIMING (CKE = 1)
82
SCK (CKP = 0)
SCK (CKP = 1) 80
SDO
MSb 75, 76
bit 6 - - - - - - 1
LSb 77
SDI
MSb In 74
bit 6 - - - - 1
LSb In
Note:
Refer to Figure 29-3 for load conditions.
TABLE 29-17: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1)
Param No. 70 70A 71 71A 72 72A 73A 74 75 76 77 78 79 80 82 83 TB2B TSCL Symbol Characteristic Min 3 TCY 3 TCY Continuous Single Byte Continuous Single Byte 1.25 TCY + 30 40 1.25 TCY + 30 40 100 -- -- 10 -- -- -- -- 1.5 TCY + 40 Max Units Conditions -- -- -- -- -- -- -- -- 25 25 50 25 25 50 50 -- ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns (Note 1) (Note 2) (Note 1)
TSSL2SCH, SS to SCK or SCK Input TSSL2SCL TSSL2WB TSCH SS to Write to SSPBUF SCK Input High Time (Slave mode) SCK Input Low Time (Slave mode)
Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40
TSCH2DIL, Hold Time of SDI Data Input to SCK Edge TSCL2DIL TDOR TDOF TSCR TSCF SDO Data Output Rise Time SDO Data Output Fall Time SCK Output Rise Time (Master mode) SCK Output Fall Time (Master mode)
TSSH2DOZ SS to SDO Output High-Impedance
TSCH2DOV, SDO Data Output Valid after SCK Edge TSCL2DOV TSSL2DOV SDO Data Output Valid after SS Edge TSCH2SSH, SS after SCK Edge TSCL2SSH Requires the use of Parameter #73A. Only if Parameter #71A and #72A are used.
Note 1: 2:
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FIGURE 29-13: I2CTM BUS START/STOP BITS TIMING
SCL 91 90 92 93
SDA
Start Condition Note: Refer to Figure 29-3 for load conditions.
Stop Condition
TABLE 29-18: I2CTM BUS START/STOP BITS REQUIREMENTS (SLAVE MODE)
Param. Symbol No. 90 91 92 93 TSU:STA THD:STA TSU:STO Characteristic Start Condition Setup Time Start Condition Hold Time Stop Condition Setup Time 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode Min 4700 600 4000 600 4700 600 4000 600 Max -- -- -- -- -- -- -- -- ns ns ns Units ns Conditions Only relevant for Repeated Start condition After this period, the first clock pulse is generated
THD:STO Stop Condition Hold Time
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FIGURE 29-14: I2CTM BUS DATA TIMING
103 100 101 90 91 106 107 92 102
SCL
SDA In
109 109
110
SDA Out Note: Refer to Figure 29-3 for load conditions.
TABLE 29-19: I2CTM BUS DATA REQUIREMENTS (SLAVE MODE)
Param. No. 100 Symbol THIGH Characteristic Clock High Time 100 kHz mode 400 kHz mode MSSP Module 101 TLOW Clock Low Time 100 kHz mode 400 kHz mode MSSP Module 102 TR SDA and SCL Rise Time 100 kHz mode 400 kHz mode 103 TF SDA and SCL Fall Time 100 kHz mode 400 kHz mode 90 91 106 107 92 109 110 D102 Note 1: 2: TSU:STA THD:STA THD:DAT TSU:DAT TSU:STO TAA TBUF CB Start Condition Setup Time 100 kHz mode 400 kHz mode Start Condition Hold Time Data Input Hold Time Data Input Setup Time 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode Stop Condition Setup Time 100 kHz mode 400 kHz mode Output Valid from Clock Bus Free Time Bus Capacitive Loading 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode Min 4.0 0.6 1.5 TCY 4.7 1.3 1.5 TCY -- 20 + 0.1 CB -- 20 + 0.1 CB 4.7 0.6 4.0 0.6 0 0 250 100 4.7 0.6 -- -- 4.7 1.3 -- Max -- -- -- -- -- -- 1000 300 300 300 -- -- -- -- -- 0.9 -- -- -- -- 3500 -- -- -- 400 ns ns ns ns s s s s ns s ns ns s s ns ns s s pF Time the bus must be free before a new transmission can start (Note 1) (Note 2) CB is specified to be from 10 to 400 pF Only relevant for Repeated Start condition After this period, the first clock pulse is generated CB is specified to be from 10 to 400 pF s s Units s s Conditions
As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. A Fast mode I2CTM bus device can be used in a Standard mode I2C bus system, but the requirement, TSU:DAT 250 ns, must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification), before the SCL line is released.
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FIGURE 29-15: MSSP I2CTM BUS START/STOP BITS TIMING WAVEFORMS
SCL 91 90 92 93
SDA
Start Condition Note: Refer to Figure 29-3 for load conditions.
Stop Condition
TABLE 29-20: MSSP I2CTM BUS START/STOP BITS REQUIREMENTS
Param. Symbol No. 90 TSU:STA Characteristic Start Condition Setup Time 100 kHz mode 400 kHz mode 1 MHz mode(1,2) 91 THD:STA Start Condition Hold Time TSU:STO Stop Condition Setup Time THD:STO Stop Condition Hold Time 100 kHz mode 400 kHz mode 1 MHz mode(1,2) 92 100 kHz mode 400 kHz mode 1 MHz mode(1,2) 93 100 kHz mode 400 kHz mode 1 MHz mode(1,2) Note 1: 2: Min 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) Max -- -- -- -- -- -- -- -- -- -- -- -- ns ns ns Units ns Conditions Only relevant for Repeated Start condition After this period, the first clock pulse is generated
Maximum pin capacitance = 10 pF for all I2CTM pins. FOSC must be at least 16 MHz for I2C bus operation at this speed.
FIGURE 29-16:
MSSP I2CTM BUS DATA TIMING
103 100 101 90 91 106 107 92 102
SCL
SDA In
109 109
110
SDA Out Note: Refer to Figure 29-3 for load conditions.
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TABLE 29-21: MSSP I2CTM BUS DATA REQUIREMENTS
Param. Symbol No. 100 THIGH Characteristic Clock High Time 100 kHz mode 400 kHz mode 1 MHz mode(1,2) 101 TLOW Clock Low Time 100 kHz mode 400 kHz mode 1 MHz mode 102 TR SDA and SCL Rise Time SDA and SCL Fall Time Start Condition Setup Time
(1,2)
Min 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) -- 20 + 0.1 CB -- -- 20 + 0.1 CB -- 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 0 0 -- 250 100 -- 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) 2(TOSC)(BRG + 1) -- -- -- 4.7 1.3 -- --
Max -- -- -- -- -- -- 1000 300 300 300 300 100 -- -- -- -- -- -- -- 0.9 -- -- -- -- -- -- -- 3500 1000 -- -- -- -- 400
Units s s s s s s ns ns ns ns ns ns s s s s s s ns s ns ns ns ns s s s ns ns ns s s s pF
Conditions
100 kHz mode 400 kHz mode 1 MHz mode(1,2) 100 kHz mode 400 kHz mode 1 MHz mode(1,2) 100 kHz mode 400 kHz mode 1 MHz mode(1,2) 100 kHz mode 400 kHz mode 1 MHz mode(1,2) 100 kHz mode 400 kHz mode 1 MHz mode(1,2) 100 kHz mode 400 kHz mode 1 MHz mode(1,2) 100 kHz mode 400 kHz mode 1 MHz mode(1,2) 100 kHz mode 400 kHz mode 1 MHz mode
(1,2)
CB is specified to be from 10 to 400 pF CB is specified to be from 10 to 400 pF Only relevant for Repeated Start condition After this period, the first clock pulse is generated
103
TF
90
TSU:STA
91
THD:STA Start Condition Hold Time THD:DAT Data Input Hold Time TSU:DAT Data Input Setup Time
106
107
(Note 3)
92
TSU:STO Stop Condition Setup Time TAA Output Valid from Clock Bus Free Time
109
110
TBUF
100 kHz mode 400 kHz mode 1 MHz mode(1,2)
Time the bus must be free before a new transmission can start
D102 Legend: Note 1: 2: 3:
CB
Bus Capacitive Loading
TBD = To Be Determined Maximum pin capacitance = 10 pF for all I2CTM pins. FOSC must be at least 16 MHz for I2C bus operation at this speed. A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but parameter #107 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, parameter #102 + parameter #107 = 1000 + 250 = 1250 ns (for 100 kHz mode), before the SCL line is released.
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FIGURE 29-17:
TXx/CKx pin RXx/DTx pin 120 Note: Refer to Figure 29-3 for load conditions. 122
EUSART/AUSART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
121
121
TABLE 29-22: EUSART/AUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS
Param No. 120 121 122 Symbol Characteristic Min Max Units Conditions
TCKH2DTV SYNC XMIT (MASTER and SLAVE) Clock High to Data Out Valid TCKRF TDTRF Clock Out Rise Time and Fall Time (Master mode) Data Out Rise Time and Fall Time
-- -- --
40 20 20
ns ns ns
FIGURE 29-18:
TXx/CKx Pin RXx/DTx Pin
EUSART/AUSART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
125
126 Note: Refer to Figure 29-3 for load conditions.
TABLE 29-23: EUSART/AUSART SYNCHRONOUS RECEIVE REQUIREMENTS
Param. No. 125 126 Symbol Characteristic Min Max Units Conditions
TDTV2CKL SYNC RCV (MASTER and SLAVE) Data Hold before CKx (DTx hold time) TCKL2DTL Data Hold after CKx (DTx hold time)
10 15
-- --
ns ns
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TABLE 29-24: A/D CONVERTER CHARACTERISTICS: PIC18F87J72 FAMILY (INDUSTRIAL)
Param No. A01 A03 A04 A06 A07 A10 A20 A21 A22 A25 A30 Sym NR EIL EDL EOFF EGN -- Characteristic Resolution Integral Linearity Error Differential Linearity Error Offset Error Gain Error Monotonicity 3 Min -- -- -- -- -- Typ -- <1 <1 <1 <1 Guaranteed(1) -- -- -- -- -- VDD - VSS VDD + 0.3V VDD - 3.0V VREFH 2.5 Max 12 2.0 1.5 5 3 Units bit Conditions VREF 3.0V
LSB VREF 3.0V LSB VREF 3.0V LSB VREF 3.0V LSB VREF 3.0V -- V V V V k VSS VAIN VREF For 12-bit resolution For 12-bit resolution For 12-bit resolution Note 2
VREF Reference Voltage Range (VREFH - VREFL) VREFL Reference Voltage Low VAIN ZAIN Analog Input Voltage Recommended Impedance of Analog Voltage Source VREF Input Current(2)
VREFH Reference Voltage High VSS + 3.0V VSS - 0.3V VREFL --
A50 Note 1: 2:
IREF
-- --
-- --
5 150
A A
During VAIN acquisition. During A/D conversion cycle.
The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. VREFH current is from the RA3/AN3/VREF+ pin or VDD, whichever is selected as the VREFH source. VREFL current is from the RA2/AN2/VREF- pin or VSS, whichever is selected as the VREFL source.
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FIGURE 29-19: A/D CONVERSION TIMING
BSF ADCON0, GO (Note 2) Q4 A/D CLK(1) 132 131 130
A/D DATA
11
10
9
...
...
3
2
1
0
ADRES ADIF GO
OLD_DATA
NEW_DATA TCY
DONE SAMPLING STOPPED
SAMPLE Note 1: 2:
If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input.
TABLE 29-25: A/D CONVERSION REQUIREMENTS
Param Symbol No. 130 131 132 135 137 Note 1: 2: 3: 4: TAD TCNV TACQ TSWC TDIS Characteristic A/D Clock Period Conversion Time (not including acquisition time)(2) Acquisition Time(3) Switching Time from Convert Sample Discharge Time Min 0.8 13 1.4 -- 0.2 Max 12.5(1) 14 -- (Note 4) -- s Units s TAD s Conditions TOSC based, VREF 3.0V
The time of the A/D clock period is dependent on the device frequency and the TAD clock divider. ADRES registers may be read on the following TCY cycle. The time for the holding capacitor to acquire the "New" input voltage when the voltage changes full scale after the conversion (VDD to VSS or VSS to VDD). The source impedance (RS) on the input channels is 50. On the following cycle of the device clock.
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TABLE 29-26: DUAL-CHANNEL AFE ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated: SAVDD = 4.5 to 5.5V, SVDD = 2.7 to 5.5V, -40C < TA <+85C, MCLK = 4 MHz, PRESCALE = 1, OSR = 64, GAIN = 1, Dithering Off, VIN = -0.5, dBFS = 353 mVRMS @ 50/60 Hz Parameters Internal Voltage Reference Internal Voltage Reference Tolerance Temperature Coefficient Output Impedance Voltage Reference Input Input Capacitance Differential Input Voltage Range (VREF+ - VREF-) Absolute Voltage on REFIN+ Pin Absolute Voltage on REFIN- Pin ADC Performance Resolution (no missing codes) Sampling Frequency Output Data Rate -- fS fD 24 125 0.4882 -- -- -- -- 1000 31.25 bits kHz ksps OSR = 256 fS = DMCLK = MCLK/ (4 x Prescale) fD = DRCLK = DMCLK/ OSR = MCLK/ (4 x Prescale x OSR) All analog input channels, measured to SAVss (Note 1) (Note 2) (Note 3) (Note 5) From -40C to +125C G=1 All gains -- VREF VREF+ VREF-- 2.2 1.9 -0.3 -- -- -- -- 10 2.6 2.9 0.3 pF V V V VREF = (VREF+ - VREF-), VREFEXT = 1 VREFEXT = 1 VREF TCREF ZOUTREF -2% -- -- 2.37 12 7 +2% -- -- V VREFEXT = 0 Symbol Min Typical Max Units Conditions
ppm/C VREFEXT = 0 k SAVDD = 5V, VREFEXT = 0
Analog Input Absolute Voltage on CH0+, CH0-, CH1+, CH1- Pins Analog Input Leakage Current Differential Input Voltage Range Offset Error (Note 4) Offset Error Drift Gain Error (Note 4) Gain Error Drift Note 1: 2: 3:
CHn+/-
-1
--
+1
V
AIN (CHn+ - CHn-) VOS -- GE --
-- -- -3 -- -- -2.5 --
1 -- -- 3 -0.4 -- 1
-- 500/GAIN +3 -- -- +2.5 --
nA mV mV V/C % %
ppm/C From -40C to +125C
4: 5: 6: 7:
8:
Outside of this range, the ADC accuracy is not specified. An extended input range of 6V can be applied continuously to the part with no risk of damage. For these operating currents, the following bit settings apply: SHUTDOWN<1:0> = 00, RESET<1:0> = 00, VREFEXT = 0, CLKEXT = 0. This specification implies that the ADC output is valid over this entire differential range and that there is no distortion or instability across this input range. Dynamic performance is specified at -0.5 dB below the maximum signal range, VIN = -0.5 dBFS @ 50/60 Hz = 353 mVRMS, mVREF = 2.4V. See Appendix B.3 "Terminology and Formulas" for definitions. Applies to all gains. Offset error is dependent on PGA gain setting. This parameter is established by characterization and is not 100% tested. For proper operation and to keep ADC accuracy, AMCLK should always be in the range of 1 to 5 MHz with BOOST bits off. With BOOST bits on, AMCLK should be in the range of 1 to 8.192 MHz. AMCLK = MCLK/PRESCALE. For these operating currents, the following Configuration bit settings apply: SHUTDOWN<1:0> = 11, VREFEXT = 1, CLKEXT = 1.
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TABLE 29-26: DUAL-CHANNEL AFE ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated: SAVDD = 4.5 to 5.5V, SVDD = 2.7 to 5.5V, -40C < TA <+85C, MCLK = 4 MHz, PRESCALE = 1, OSR = 64, GAIN = 1, Dithering Off, VIN = -0.5, dBFS = 353 mVRMS @ 50/60 Hz Parameters ADC Performance (continued) Integral Non-Linearity (Note 4) Input Impedance Signal-to-Noise and Distortion Ratio (Notes 4, 6) INL ZIN SINAD -- 350 -- -- Total Harmonic Distortion (Notes 4, 6) THD -- -- Signal-to-Noise Ratio (Notes 4, 6) SNR -- -- Spurious Free Dynamic Range (Note 4) SFDR -- -- Crosstalk (50/60 Hz) (Note 4) AC Power Supply Rejection DC Power Supply Rejection DC Common-Mode Rejection Ratio (Note 4) Note 1: 2: 3: CTALK AC PSRR DC PSRR CMRR -- -- -- -- 15 -- 90 78 -101 -82 91 81 103 83 -133 -77 -77 -72 -- -- -- -- -- -- -- -- -- -- -- -- -- -- ppm k dB dB dB dB dB dB dB dB dB dB dB dB GAIN = 1, DITHER = ON Proportional to 1/AMCLK OSR = 256, DITHER = ON OSR = 64, DITHER = OFF OSR = 256, DITHER = ON OSR = 64, DITHER = OFF OSR = 256, DITHER = ON OSR = 64, DITHER = OFF OSR = 256, DITHER = ON OSR = 64, DITHER = OFF OSR = 256, DITHER = ON SAVDD and SVDD = 5V + 1 VPP @ 50/60 Hz SAVDD and SVDD = 4.5 to 5.5V VCM varies from -1V to +1V Symbol Min Typical Max Units Conditions
4: 5: 6: 7:
8:
Outside of this range, the ADC accuracy is not specified. An extended input range of 6V can be applied continuously to the part with no risk of damage. For these operating currents, the following bit settings apply: SHUTDOWN<1:0> = 00, RESET<1:0> = 00, VREFEXT = 0, CLKEXT = 0. This specification implies that the ADC output is valid over this entire differential range and that there is no distortion or instability across this input range. Dynamic performance is specified at -0.5 dB below the maximum signal range, VIN = -0.5 dBFS @ 50/60 Hz = 353 mVRMS, mVREF = 2.4V. See Appendix B.3 "Terminology and Formulas" for definitions. Applies to all gains. Offset error is dependent on PGA gain setting. This parameter is established by characterization and is not 100% tested. For proper operation and to keep ADC accuracy, AMCLK should always be in the range of 1 to 5 MHz with BOOST bits off. With BOOST bits on, AMCLK should be in the range of 1 to 8.192 MHz. AMCLK = MCLK/PRESCALE. For these operating currents, the following Configuration bit settings apply: SHUTDOWN<1:0> = 11, VREFEXT = 1, CLKEXT = 1.
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TABLE 29-26: DUAL-CHANNEL AFE ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated: SAVDD = 4.5 to 5.5V, SVDD = 2.7 to 5.5V, -40C < TA <+85C, MCLK = 4 MHz, PRESCALE = 1, OSR = 64, GAIN = 1, Dithering Off, VIN = -0.5, dBFS = 353 mVRMS @ 50/60 Hz Parameters Oscillator Input Master Clock Frequency Range Power Specifications Operating Voltage, Analog Operating Voltage, Digital Operating Current, Analog (Note 2) Operating Current, Digital SAVDD SVDD AIDD DIDD 4.5 2.7 -- -- -- -- -- Shutdown Current, Analog Shutdown Current, Digital Note 1: 2: 3: IDDS,A IDDS,D -- -- -- 3.6 2 3.5 0.65 0.3 1.2 -- -- 5.5 5.5 2.8 5.6 0.9 0.4 1.6 1 1 mA mA mA mA A A V V BOOST<1:0> = 00 BOOST<1:0> = 11 SVDD = 5V, MCLK = 4 MHz SVDD = 2.7V, MCLK = 4 MHz SVDD = 5V, MCLK = 8.192 MHz SAVDD pin only (Note 8) SVDD pin only (Note 8) MCLK 1 -- 16.384 MHz (Note 7) Symbol Min Typical Max Units Conditions
4: 5: 6: 7:
8:
Outside of this range, the ADC accuracy is not specified. An extended input range of 6V can be applied continuously to the part with no risk of damage. For these operating currents, the following bit settings apply: SHUTDOWN<1:0> = 00, RESET<1:0> = 00, VREFEXT = 0, CLKEXT = 0. This specification implies that the ADC output is valid over this entire differential range and that there is no distortion or instability across this input range. Dynamic performance is specified at -0.5 dB below the maximum signal range, VIN = -0.5 dBFS @ 50/60 Hz = 353 mVRMS, mVREF = 2.4V. See Appendix B.3 "Terminology and Formulas" for definitions. Applies to all gains. Offset error is dependent on PGA gain setting. This parameter is established by characterization and is not 100% tested. For proper operation and to keep ADC accuracy, AMCLK should always be in the range of 1 to 5 MHz with BOOST bits off. With BOOST bits on, AMCLK should be in the range of 1 to 8.192 MHz. AMCLK = MCLK/PRESCALE. For these operating currents, the following Configuration bit settings apply: SHUTDOWN<1:0> = 11, VREFEXT = 1, CLKEXT = 1.
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TABLE 29-27: DUAL-CHANNEL AFE SERIAL PERIPHERAL INTERFACE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all parameters apply at SAVDD = 4.5 to 5.5V, DVDD = 2.7 to 5.5V, -40C < TA <+85C, CLOAD = 30 pF. Parameters Serial Clock Frequency CS Setup Time CS Hold Time CS Disable Time Data Setup Time Data Hold Time Serial Clock High Time Serial Clock Low Time Serial Clock Delay Time Serial Clock Enable Time Output Valid from SCK Low Output hold time Output disable time Reset Pulse Width (RESET) Sym fSCK tCSS tCSH tCSD tSU tHD tHI tLO tCLD tCLE tDO tHO tDIS tMCLR Min -- -- 25 50 50 100 50 5 10 10 20 25 50 25 50 50 50 -- 0 -- -- 100 Typ -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 20 10 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 50 -- 25 50 -- Units Conditions MHz 4.5 SVDD 5.5 MHz 2.7 SVDD 5.5 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns s V V mV V V V V A A pF IOL = +2.5 mA, SVDD = 5.0V IOL = +1.25 mA, SVDD = 5.0V IOH = -2.5 mA, SVDD = 5.0V IOH = -1.25 mA, SVDD = 5.0V CSA = SVDD, VIN = SVSS or SVDD CSA = SVDD, VOUT = SVSS or SVDD TA = 25C, SCKA = 1.0 MHz, SVDD = 5.0V (Note 1) 4.5 SVDD 5.5 2.7 SVDD 5.5 4.5 SVDD 5.5 2.7 SVDD 5.5 -- 4.5 SVDD 5.5 2.7 SVDD 5.5 4.5 SVDD 5.5 2.7SVDD 5.5 4.5SVDD 5.5 2.7 SVDD 5.5 4.5 DVDD 5.5 2.7 DVDD 5.5
2.7 SVDD 5.5 (Note 1) 4.5 SVDD 5.5 2.7 SVDD 5.5 (Note 1) 2.7 SVDD 5.5 2.7 SVDD 5.5 2.7 SVDD 5.5
Data Transfer Time to DR (Data Ready) tDODR Data Ready Pulse Low Time tDRP Schmitt Trigger High-Level Input VIH1 Voltage Schmitt Trigger Low-Level Input Voltage VIL1 Hysteresis of Schmitt Trigger Inputs VHYS (all digital inputs) Low-Level Output Voltage, SDOA Pin VOL Low-Level Output Voltage, DR Pin High-Level Output Voltage, SDOA Pin High-Level Output Voltage, DR Pin Input Leakage Current Output Leakage Current Internal Capacitance (all inputs and outputs) Note 1: VOL VOH VOH ILI ILO CINT
-- -- 50 -- 1/DMCLK -- 0.7 SVDD -- SVDD + 1 -0.3 300 -- -- SVDD - 0.5 SVDD - 0.5 -- -- -- -- -- -- -- -- -- -- -- 0.2 SVDD -- 0.4 0.4 -- -- 1 1 7
This parameter is periodically sampled and is not 100% tested.
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FIGURE 29-20:
CS fSCK tHI SCK tDO SDO MSB Out Don't Care tHO tDIS LSB Out tLO tCSH Mode 1,1 Mode 0,0
SERIAL OUTPUT TIMING DIAGRAM
SDI
FIGURE 29-21:
SERIAL INPUT TIMING DIAGRAM
tCSD
CS
tCSS
fSCK tHI tLO
tCLE tCSH tCLD
Mode 1,1 SCK Mode 0,0
tSU tHD
SDI
MSB In
HI-Z
LSB In
SDO
FIGURE 29-22:
DATA READY PULSE TIMING DIAGRAM
1/DRCLK
DR
tDODR tDRP
SCK
SDO
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FIGURE 29-23: SPECIFIC TIMING DIAGRAMS
Timing Waveform for tDO CS
tDO
Timing Waveform for tDIS
VIH 90%
SCK
SDO
SDO
tDIS 10%
HI-Z
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30.0
30.1
PACKAGING INFORMATION
Package Marking Information
80-Lead TQFP
Example
XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN
PIC18F86J72 -I/PT e3 1002017
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
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30.2 Package Details
The following sections give the technical details of the packages.
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NOTES:
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APPENDIX A: REVISION HISTORY
Revision A (June 2010)
Original data sheet for the PIC18F87J72 family devices.
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APPENDIX B: DUAL-CHANNEL, 24-BIT AFE REFERENCE
The 5-level quantizer is a Flash ADC composed of 4 comparators, arranged with equally spaced thresholds and a thermometer coding. The AFE also includes proprietary, 5-level DAC architecture that is inherently linear for improved THD figures.
B.1
B.1.1
Introduction
DESCRIPTION
B.1.3
FEATURES
The dual-channel Analog Front End (AFE) contains two synchronous sampling Delta-Sigma Analog-to-Digital Converters (ADC), two PGAs, phase delay compensation block, internal voltage reference, modulator output block and high-speed 20 MHz SPI compatible serial interface. The converters contain a proprietary dithering algorithm for reduced Idle tones and improved THD. The internal register map contains 24-bit wide ADC data words, as well as six writable control registers to program gain, oversampling ratio, phase, resolution, dithering, shutdown, Reset and communication features. The communication is largely simplified with various continuous read modes that can be accessed by the DMA of an external device, and with a separate Data Ready (DR) pin that can directly be connected to an IRQ input of an external microcontroller. The AFE is capable of interfacing to a large variety of voltage and current sensors, including shunts, current transformers, Rogowski coils and Hall effect sensors.
* Two synchronous sampling 16/24-bit resolution Delta-Sigma A/D Converters with proprietary multi-bit architecture * 91 dB SINAD, -104 dBc THD (up to 35th harmonic), 109 dB SFDR for each channel * Programmable data rate of up to 64 ksps * Ultra Low-Power Shutdown mode with <2 A * -133 dB crosstalk between the two channels * Low drift internal voltage reference: 12 ppm/C * Differential voltage reference input pins * High gain PGA on each channel (up to 32V/V) * Phase delay compensation between the two channels with 1 s time resolution * Separate modulator outputs for each channel * High-speed addressable 20 MHz SPI interface with Mode 0,0 and 1,1 compatibility * Independent analog and digital power supplies 4.5V-5.5V SAVDD, 2.7V-5.5V SVDD * Low-power consumption (14 mW typical at 5V)
B.1.2
DELTA-SIGMA ADC ARCHITECTURE
B.1.4
* * * *
APPLICATIONS
The AFE incorporates two Delta-Sigma ADCs with a multi-bit architecture. A Delta-Sigma ADC is an oversampling converter that incorporates a built-in modulator which is digitizing the quantity of charge integrated by the modulator loop. The quantizer is the block that is performing the analog-to-digital conversion. The quantizer is typically 1-bit or a simple comparator which helps to maintain the linearity performance of the ADC (the DAC structure is in this case inherently linear). Multi-bit quantizers help to lower the quantization error (the error fed back in the loop can be very large with 1-bit quantizers) without changing the order of the modulator or the OSR which leads to better SNR figures. However, typically, the linearity of such architectures is more difficult to achieve since the DAC is no more simple to realize and its linearity limits the THD of such ADCs.
Energy Metering and Power Measurement Automotive Portable Instrumentation Medical and Power Monitoring
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FIGURE B-1:
REFIN+/OUT+
DUAL-CHANNEL AFE FUNCTIONAL BLOCK DIAGRAM
SAVDD Voltage VREFEXT Reference + VREF VREF- VREF+ Analog Digital SINC3 + PGA D-S Modulator F SVDD AMCLK DMCLK/DRCLK Clock Generation OSR<1:0> PRE<1:0> MCLK CLKIA
REFIN-
DMCLK
CH0+ CH0-
DATA_CH0<23:0> DR SDOA ARESET SDIA SCKA CSA
Phase Shifter
PHASE<7:0> Digital SPI Interface
CH1+ CH1-
+ PGA D-S Modulator SINC3
DATA_CH1<23:0>
DUAL-DS ADC POR AVDD Monitoring SDN<1:0>, RESET<1:0>, GAIN<7:0> POR SAVSS SVSS
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B.2
B.2.1
Pin Description
AFE RESET (ARESET)
B.2.6
NON-INVERTING REFERENCE INPUT, INTERNAL REFERENCE OUTPUT (REFIN+/OUT)
This pin is active-low and places the AFE in a Reset state when active. When ARESET = 0, all registers are reset to their default value, no communication can take place and no clock is distributed to internal circuitry. This state is equivalent to a POR state. Since the default state of the ADCs is on, the analog power consumption when ARESET = 0 is equivalent to when ARESET = 1. Only the digital power consumption is largely reduced because this current consumption is essentially dynamic and is reduced drastically when there is no clock running. All the analog biases are enabled during a Reset, so that the part is fully operational just after a ARESET rising edge. This input is Schmitt triggered.
This pin is the non-inverting side of the differential voltage reference input for both ADCs or the internal voltage reference output. When VREFEXT = 1, and an external voltage reference source can be used, the internal voltage reference is disabled. When using an external differential voltage reference, it should be connected to its VREF+ pin. When using an external single-ended reference, it should be connected to this pin. When VREFEXT = 0, the internal voltage reference is enabled and connected to this pin through a switch. This voltage reference has minimal drive capability, and thus, needs proper buffering and bypass capacitances (10 F tantalum in parallel with 0.1 F ceramic) if used as a voltage source. For optimal performance, bypass capacitances should be connected between this pin and AGND at all times, even when the internal voltage reference is used. However, these capacitors are not mandatory to ensure proper operation.
B.2.2
DIGITAL VDD (SVDD)
SVDD is the power supply pin for the AFE's digital circuitry. This pin requires appropriate bypass capacitors and should be maintained between 2.7V and 5.5V for specified operation.
B.2.7
INVERTING REFERENCE INPUT (REFIN-)
B.2.3
ANALOG VDD (SAVDD)
AVDD is the power supply pin for the AFE's analog circuitry. This pin requires appropriate bypass capacitors and should be maintained to 5V 10% for specified operation.
B.2.4
ADC DIFFERENTIAL ANALOG INPUTS (CHn+/CHn-)
This pin is the inverting side of the differential voltage reference input for both ADCs. When using an external differential voltage reference, it should be connected to its VREF- pin. When using an external, single-ended voltage reference, or when VREFEXT = 0 (default) and using the internal voltage reference, this pin should be directly connected to SAVss.
CH0-/CH0+ and CH1-/CH1+ are the two fully differential, analog voltage inputs for the Delta-Sigma ADCs. The linear and specified region of the channels are dependent on the PGA gain. This region corresponds to a differential voltage range of 500 mV/GAIN with VREF = 2.4V. The maximum absolute voltage, with respect to SAVSS, for each CHn+/- input pin is 1V with no distortion and 6V with no breaking after continuous voltage.
B.2.8
DIGITAL GROUND CONNECTION (SVSS)
B.2.5
ANALOG GROUND (SAVSS)
SVss is the ground connection to internal digital circuitry (SINC filters, oscillator, serial interface). To ensure accuracy and noise cancellation, SVss must be connected to the same ground as SAVss, preferably with a star connection. If a digital ground plane is available, it is recommended that this pin be tied to this plane of the Printed Circuit Board (PCB). This plane should also reference all other digital circuitry in the system.
SAVss is the ground connection to internal analog circuitry (ADCs, PGA, voltage reference, POR). To ensure accuracy and noise cancellation, this pin must be connected to the same ground as SVSS, preferably with a star connection. If an analog ground plane is available, it is recommended that this pin be tied to this plane of the PCB. This plane should also reference all other analog circuitry in the system.
B.2.9
DATA READY (DR)
The Data Ready pin indicates if a new conversion result is ready to be read. The default state of this pin is high when DR_HIZN = 1 and is high impedance when DR_HIZN = 0 (default). After each conversion is finished, a low pulse will take place on the Data Ready pin to indicate the conversion result is ready as an interrupt. This pulse is synchronous with the master clock and has a defined and constant width.
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The Data Ready pin is independent of the SPI interface and acts like an interrupt output. The pin state is not latched and the pulse width (and period) are both determined by the MCLK frequency, oversampling rate and internal clock prescale settings. The DR pulse width is equal to one DMCLK period and the frequency of the pulses is equal to DRCLK (see Figure 29-22 in Section 29.0 "Electrical Characteristics" of the data sheet). Note: This pin should not be left floating when the DR_HIZN bit is low; a 10 k pull-up resistor connected to DVDD is recommended.
B.2.12
SERIAL DATA CLOCK (SCKA)
This is the serial clock pin for SPI communication. Data is clocked into the device on the rising edge of SCK. Data is clocked out of the device on the falling edge of SCK. The AFE interface is compatible with both SPI 0,0 and 1,1 modes. SPI modes can only be changed during a Reset. The maximum clock speed specified is 20 MHz when SVDD > 4.5V and 10 MHz otherwise. This input is Schmitt triggered.
B.2.10
MASTER CLOCK INPUT (CLKIA)
B.2.13
SERIAL DATA OUTPUT (SDOA)
CLKIA provides the master clock for the device. The typical clock frequency specified is 4 MHz. However, the clock frequency can be 1 MHz to 5 MHz without disturbing ADC accuracy. With the current boost circuit enabled, the master clock can be used up to 8.192 MHz without disturbing ADC accuracy. Appropriate load capacitance should be connected to these pins for proper operation.
This is the SPI data output pin. Data is clocked out of the device on the falling edge of SCK. This pin stays high impedance during the first command byte. It also stays high impedance during the whole communication for write commands and when the CSA pin is high or when the ARESET pin is low. This pin is active only when a read command is processed. Each read is processed by a packet of 8 bits.
B.2.11
CHIP SELECT (CSA)
This pin is the SPI chip select that enables the serial communication. When this pin is high, no communication can take place. A chip select falling edge initiates the serial communication and a chip select rising edge terminates the communication. No communication can take place even when CSA is low and when ARESET is low. This input is Schmitt triggered.
B.2.14
SERIAL DATA INPUT (SDIA)
This is the SPI data input pin. Data is clocked into the device on the rising edge of SCK. When CS is low, this pin is used to communicate with series of 8-bit commands. The interface is half-duplex (inputs and outputs do not happen at the same time). Each communication starts with a chip select falling edge, followed by an 8-bit command word entered through the SDI pin. Each command is either a read or a write command. Toggling SDI during a read command has no effect. This input is Schmitt triggered.
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B.3 Terminology and Formulas
TABLE B-1:
This section defines the terms and formulas used throughout this data sheet. The following terms are defined: * * * * * * * * * * * * * * * * * * * * * MCLK - Master Clock AMCLK - Analog Master Clock DMCLK - Digital Master Clock DRCLK - Data Rate Clock OSR - Oversampling Ratio Offset Error Gain Error Integral Non-Linearity Error Signal-To-Noise Ratio (SNR) Signal-To-Noise Ratio And Distortion (SINAD) Total Harmonic Distortion (THD) Spurious-Free Dynamic Range (SFDR) Idle Tones Dithering Crosstalk PSRR CMRR ADC Reset Mode Hard Reset Mode (ARESET = 0) ADC Shutdown Mode Full Shutdown Mode
OVERSAMPLING RATIO SETTINGS
Analog Master Clock Prescale AMCLK = MCLK/1 (default) AMCLK = MCLK/2 AMCLK = MCLK/4 AMCLK = MCLK/8
PRESCALE (CONFIG1<15:14>) 0 0 1 1 0 1 0 1
B.3.3
DMCLK - DIGITAL MASTER CLOCK
This is the clock frequency that is present on the digital portion of the device, after prescaling and division by 4. This is also the sampling frequency, that is the rate at which the modulator outputs are refreshed. Each period of this clock corresponds to one sample and one modulator output.
EQUATION B-2:
AMCLK MCLK DMCLK = -------------------- = --------------------------------------4 4 PRESCALE
B.3.4
DRCLK - DATA RATE CLOCK
This is the output data rate (i.e., the rate at which the ADCs output new data). Each new data is signaled by a data ready pulse on the DR pin. This data rate is depending on the OSR and the prescaler with the following formula:
B.3.1
MCLK - MASTER CLOCK
This is the fastest clock present in the device. This is the frequency of the clock input at the CLKIA.
EQUATION B-3:
AMCLK DMCLK MCLK DRCLK = --------------------- = --------------------- = ---------------------------------------------------------4 OSR OSR 4 OSR PRESCALE
B.3.2
AMCLK - ANALOG MASTER CLOCK
This is the clock frequency that is present on the analog portion of the device, after prescaling has occurred via the CONFIG1 PRESCALE<1:0> register bits. The analog portion includes the PGAs and the two sigma-delta modulators.
Since this is the output data rate, and since the decimation filter is a SINC (or notch) filter, there is a notch in the filter transfer function at each integer multiple of this rate. Table B-2 describes the various combinations of OSR and PRESCALE and their associated AMCLK, DMCLK and DRCLK rates.
EQUATION B-1:
MCLK AMCLK = -----------------------------PRESCALE
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TABLE B-2:
PRE<1:0> 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 Note: 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0
DEVICE DATA RATES IN FUNCTION OF MCLK, OSR AND PRESCALE
OSR<1:0> 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 OSR 256 128 64 32 256 128 64 32 256 128 64 32 256 128 64 32 AMCLK MCLK/8 MCLK/8 MCLK/8 MCLK/8 MCLK/4 MCLK/4 MCLK/4 MCLK/4 MCLK/2 MCLK/2 MCLK/2 MCLK/2 MCLK MCLK MCLK MCLK DMCLK MCLK/32 MCLK/32 MCLK/32 MCLK/32 MCLK/16 MCLK/16 MCLK/16 MCLK/16 MCLK/8 MCLK/8 MCLK/8 MCLK/8 MCLK/4 MCLK/4 MCLK/4 MCLK/4 DRCLK MCLK/8192 MCLK/4096 MCLK/2048 MCLK/1024 MCLK/4096 MCLK/2048 MCLK/1024 MCLK/512 MCLK/2048 MCLK/1024 MCLK/512 MCLK/256 MCLK/1024 MCLK/512 MCLK/256 MCLK/128 DRCLK (ksps) 0.4882 0.976 1.95 3.9 0.976 1.95 3.9 7.8125 1.95 3.9 7.8125 15.625 3.9 7.8125 15.625 31.25 SINAD (dB) 91.4 86.6 78.7 68.2 91.4 86.6 78.7 68.2 91.4 86.6 78.7 68.2 91.4 86.6 78.7 68.2 ENOB (bits) 14.89 14.10 12.78 11.04 14.89 14.10 12.78 11.04 14.89 14.10 12.78 11.04 14.89 14.10 12.78 11.04
For OSR = 32 and 64, DITHER = 0. For OSR = 128 and 256, DITHER = 1.
B.3.5
OSR - OVERSAMPLING RATIO
B.3.7
GAIN ERROR
The ratio of the sampling frequency to the output data rate, OSR = DMCLK/DRCLK. The default OSR is 64, or with MCLK = 4 MHz, PRESCALE = 1, AMCLK = 4 MHz, fS = 1 MHz, fD = 15.625 ksps. The following bits in the CONFIG1 register are used to change the oversampling ratio (OSR).
TABLE B-3:
CONFIG OSR<1:0> 0 0 1 1 0 1 0 1
OVERSAMPLING RATIO SETTINGS
OVERSAMPLING RATIO (OSR) 32 64 (default) 128 256
This is the error induced by the ADC on the slope of the transfer function. It is the deviation expressed in percent compared to the ideal transfer function defined by Equation B-15. The specification incorporates both PGA and ADC gain error contributions, but not the VREF contribution (it is measured with an external VREF).This error varies with PGA and OSR settings. The gain error of the dual-channel AFE has a low temperature coefficient.
B.3.8
INTEGRAL NON-LINEARITY ERROR
Integral nonlinearity error is the maximum deviation of an ADC transition point from the corresponding point of an ideal transfer function, with the offset and gain errors removed, or with the endpoints equal to zero. It is the maximum remaining error after calibration of offset and gain errors for a DC input signal.
B.3.6
OFFSET ERROR
B.3.9
SIGNAL-TO-NOISE RATIO (SNR)
This is the error induced by the ADC when the inputs are shorted together (VIN = 0V). The specification incorporates both PGA and ADC offset contributions. This error varies with PGA and OSR settings. The offset is different on each channel and varies from chip to chip. This offset error can easily be calibrated out by a MCU with a subtraction. The offset is specified in mV. The offset on the dual-channel AFE has a low temperature coefficient.
For the AFE, the signal-to-noise ratio is a ratio of the output fundamental signal power to the noise power (not including the harmonics of the signal), when the input is a sine wave at a predetermined frequency. It is measured in dB. Usually, only the maximum signal to noise ratio is specified. The SNR figure depends mainly on the OSR and DITHER settings of the device.
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EQUATION B-4: SIGNAL-TO-NOISE RATIO B.3.12
SignalPower SNR dB = 10 log --------------------------------- NoisePower
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
B.3.10
SIGNAL-TO-NOISE RATIO AND DISTORTION (SINAD)
The most important figure of merit for the analog performance of the ADCs is the Signal-to-Noise and Distortion (SINAD) specification. Signal-to-noise and distortion ratio is similar to signal-to-noise ratio, with the exception that you must include the harmonics power in the noise power calculation. The SINAD specification depends mainly on the OSR and DITHER settings.
The ratio between the output power of the fundamental and the highest spur in the frequency spectrum. The spur frequency is not necessarily a harmonic of the fundamental even though it is usually the case. This figure represents the dynamic range of the ADC when a full-scale signal is used at the input. This specification depends mainly on the DITHER setting.
EQUATION B-9:
FundamentalPower SFDR dB = 10 log ---------------------------------------------------- HighestSpurPower-
B.3.13
IDLE TONES
EQUATION B-5:
SINAD EQUATION
SignalPower SINAD dB = 10 log ------------------------------------------------------------------- Noise + HarmonicsPower The calculated combination of SNR and THD per the following formula also yields SINAD:
EQUATION B-6:
SINAD, THD AND SNR RELATIONSHIP
SNR ---------- 10
SINAD dB = 10 log 10
+ 10
- THD --------------- 10
A Delta-Sigma Converter is an integrating converter. It also has a finite quantization step (LSB) which can be detected by its quantizer. A DC input voltage that is below the quantization step should only provide an all zeros result, since the input is not large enough to be detected. As an integrating device, any Delta-Sigma will show, in this case, Idle tones. This means that the output will have spurs in the frequency content that are depending on the ratio between quantization step voltage and the input voltage. These spurs are the result of the integrated subquantization step inputs that will eventually cross the quantization steps after a long enough integration. This will induce an AC frequency at the output of the ADC and can be shown in the ADC output spectrum. These Idle tones are residues that are inherent to the quantization process and the fact that the converter is integrating at all times without being reset. They are residues of the finite resolution of the conversion process. They are very difficult to attenuate and they are heavily signal dependent. They can degrade both SFDR and THD of the converter, even for DC inputs. They can be localized in the baseband of the converter, and thus, difficult to filter from the actual input signal. For power metering applications, Idle tones can be very disturbing because energy can be detected even at the 50 or 60 Hz frequency, depending on the DC offset of the ADCs, while no power is really present at the inputs. The only practical way to suppress or attenuate Idle tones phenomenon is to apply dithering to the ADC. The Idle tones amplitudes are a function of the order of the modulator, the OSR and the number of levels in the quantizer of the modulator. A higher order, a higher OSR or a higher number of levels for the quantizer will attenuate the Idle tones amplitude.
B.3.11
TOTAL HARMONIC DISTORTION (THD)
The total harmonic distortion is the ratio of the output harmonics power to the fundamental signal power for a sine wave input and is defined by the following equation.
EQUATION B-7:
HarmonicsPower THD dB = 10 log ---------------------------------------------------- FundamentalPower The THD calculation includes the first 35 harmonics for the AFE's specifications. The THD is usually only measured with respect to the first 10 harmonics. This specification depends mainly on the DITHER setting. THD is sometimes expressed in percentage. For converting the THD to a percentage, here is the formula:
EQUATION B-8:
THD % = 100 10
THD dB -----------------------20
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B.3.14 DITHERING
Step 1
* CH0+ = CH0- = SAVSS * CH1+ = CH1- = SAVSS
In order to suppress or attenuate the Idle tones present in any Delta-Sigma ADCs, dithering can be applied to the ADC. Dithering is the process of adding an error to the ADC feedback loop in order to "decorrelate" the outputs and "break" the Idle tones behavior. Usually a random or pseudo-random generator adds an analog or digital error to the feedback loop of the Delta-Sigma ADC in order to ensure that no tonal behavior can happen at its outputs. This error is filtered by the feedback loop and typically has a zero average value so that the converter static transfer function is not disturbed by the dithering process. However, the dithering process slightly increases the noise floor (it adds noise to the part) while reducing its tonal behavior, and thus, improving SFDR and THD. The dithering process scrambles the Idle tones into baseband white noise and ensures that dynamic specs (SNR, SINAD, THD, SFDR) are less signal dependent. The AFE incorporates a proprietary dithering algorithm on both ADCs in order to remove Idle tones and improve THD, which is crucial for power metering applications.
Step 2
* CH0+ = CH0- = SAVSS * CH1+ - CH1- = 1VP-P @ 50/60 Hz (full-scale sine wave) The crosstalk is then calculated with the following formula:
EQUATION B-10:
CTalk dB = 10 log -------------------------------- CH1Power
CH0Power
B.3.16
PSRR
This is the ratio between a change in the power supply voltage and the ADC output codes. It measures the influence of the power supply voltage on the ADC outputs. The PSRR specification can be DC (the power supply is taking multiple DC values) or AC (the power supply is a sine wave at a certain frequency with a certain common-mode). In AC, the amplitude of the sine wave is representing the change in the power supply. It is defined as:
B.3.15
CROSSTALK
The crosstalk is defined as the perturbation caused by one ADC channel on the other ADC channel. It is a measurement of the isolation between the two ADCs present in the chip. This measurement is a two-step procedure: 1. 2. Measure one ADC input with no perturbation on the other ADC (ADC inputs shorted). Measure the same ADC input with a perturbation sine wave signal on the other ADC at a certain predefined frequency.
EQUATION B-11:
VOUT PSRR dB = 20 log --------------------- SAVDD
The crosstalk is then the ratio between the output power of the ADC when the perturbation is present and when it is not divided by the power of the perturbation signal. A lower crosstalk value implies more independence and isolation between the two channels. The measurement of this signal is performed under the following conditions: * * * * GAIN = 1 PRESCALE = 1 OSR = 256 MCLK = 4 MHz
Where VOUT is the equivalent input voltage that the output code translates to with the ADC transfer function. For the AFE, SAVDD ranges from 4.5V to 5.5V, and for AC PSRR, a 50/60 Hz sine wave is chosen, centered around 5V, with a maximum 500 mV amplitude. The PSRR specification is measured with SAVDD = SVDD.
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B.3.17 CMRR
This is the ratio between a change in the common-mode input voltage and the ADC output codes. It measures the influence of the common-mode input voltage on the ADC outputs. The CMRR specification can be DC (the common-mode input voltage is taking multiple DC values) or AC (the common-mode input voltage is a sine wave at a certain frequency with a certain common-mode). In AC, the amplitude of the sine wave is representing the change in the power supply. It is defined as: If both ADCs are in Soft Reset or Shutdown modes, the clock is no longer distributed to the digital core for low-power operation. Once any of the ADC is back to normal operation, the clock is automatically distributed again.
B.3.19
HARD RESET MODE (ARESET = 0)
This mode is only available during a POR or when the ARESET pin is pulled low. The ARESET pin low state places the device in a Hard Reset mode. In this mode, all internal registers are reset to their default state. The DC biases for the analog blocks are still active (i.e., the AFE is ready to convert). However, this pin clears all conversion data in the ADCs. The comparator outputs of both ADCs are forced to their Reset state (`0011'). The SINC filters are all reset as well as their double output buffers. See serial timing for minimum pulse low time in Section 29.0 "Electrical Characteristics" of the data sheet. During a Hard Reset, no communication with the part is possible. The digital interface is maintained in a Reset state.
EQUATION B-12:
VOUT CMRR dB = 20 log ----------------- VCM
When VCM = (CHn+ + CHn-)/2, the common-mode input voltage, and VOUT is the equivalent input voltage that is what the output code translates to with the ADC transfer function. For the AFE, VCM varies from -1V to +1V, and for the AC specification, a 50/60 Hz sine wave is chosen centered around 0V with a 500 mV amplitude.
B.3.20
ADC SHUTDOWN MODE
B.3.18
ADC RESET MODE
ADC Reset mode (also called Soft Reset mode) can only be entered through setting the RESET<1:0> bits high in the Configuration register. This mode is defined as the condition where the converters are active but their output is forced to `0'. The registers are not affected in this Reset mode and retain their values. The ADCs can immediately output meaningful codes after leaving Reset mode (and after the sinc filter settling time of 3/DRCLK). This mode is both entered and exited through the setting of the bits in the Configuration register. Each converter can be placed in Soft Reset mode independently. The Configuration registers are not modified by the Soft Reset mode. A data ready pulse will not be generated by any ADC while in Reset mode. When an ADC exits ADC Reset mode, any phase delay present before Reset was entered will still be present. If one ADC was not in Reset, the ADC leaving Reset mode will automatically resynchronize the phase delay, relative to the other ADC channel, per the Phase Delay register block and give DR pulses accordingly. If an ADC is placed in Reset mode while the other is converting, it is not shutting down the internal clock. When going back out of Reset, it will be resynchronized automatically with the clock that did not stop during Reset.
ADC Shutdown mode is defined as a state where the converters and their biases are off, consuming only leakage current. After this is removed, start-up delay time (SINC filter settling time will occur before outputting meaningful codes). The start-up delay is needed to power up all DC biases in the channel that were in shutdown. This delay is the same than tPOR and any DR pulse coming within this delay should be discarded. Each converter can be placed in Shutdown mode independently. The CONFIG registers are not modified by the Shutdown mode. This mode is only available through programming of the SHUTDOWN<1:0> bits in the CONFIG2 register. The output data is flushed to all zeros while in ADC shutdown. No data ready pulses are generated by any ADC while in ADC Shutdown mode.
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When an ADC exits ADC Shutdown mode, any phase delay present before shutdown was entered will still be present. If one ADC was not in shutdown, the ADC leaving Shutdown mode will resynchronize automatically the phase delay relative to the other ADC channel per the Phase Delay register block and give DR pulses accordingly. If an ADC is placed in Shutdown mode while the other is converting, it is not shutting down the internal clock. When going back out of shutdown, it will be resynchronized automatically with the clock that did not stop during Reset. If both ADCs are in ADC Reset or ADC Shutdown modes, the clock is no more distributed to the digital core for low-power operation. Once any of the ADC is back to normal operation, the clock is automatically distributed again.
B.4
B.4.1
Device Overview
ANALOG INPUTS (CHn+/-)
The analog inputs of the dual-channel AFE can be connected directly to current and voltage transducers (such as shunts, current transformers or Rogowski coils). Each input pin is protected by specialized ESD structures that are certified to pass 7 kV HBM and 400V MM contact charge. These structures allow bipolar 6V continuous voltage, with respect to SAVSS, to be present at their inputs without the risk of permanent damage. Both channels have fully differential voltage inputs for better noise performance. The absolute voltage at each pin relative to SAVSS should be maintained in the 1V range during operation in order to ensure the specified ADC accuracy. The common-mode signals should be adapted to respect both the previous conditions and the differential input voltage range. For best performance, the common-mode signals should be maintained to SAVSS.
B.3.21
FULL SHUTDOWN MODE
The lowest power consumption can be achieved when SHUTDOWN<1:0> = 11, VREFEXT = CLKEXT = 1. This mode is called "Full Shutdown mode" and no analog circuitry is enabled. In this mode, the POR SVDD monitoring circuit is also disabled. When the clock is Idle (CLKIA = 0 or 1 continuously), no clock is propagated throughout the chip. Both ADCs are in shutdown, the internal voltage reference is disabled and the internal oscillator is disabled. The only circuit that remains active is the SPI interface, but this circuit does not induce any static power consumption. If SCK is Idle, the only current consumption comes from the leakage currents induced by the transistors and is less than 1 A on each power supply. This mode can be used to power down the chip completely and avoid power consumption when there is no data to convert at the analog inputs. Any SCK or MCLK edge coming, while on this mode, will induce dynamic power consumption. Once any of the SHUTDOWN, CLKEXT and VREFEXT bits returns to `0', the POR SVDD monitoring block is back to operation and SVDD monitoring can take place.
B.4.2
PROGRAMMABLE GAIN AMPLIFIERS (PGA)
The two Programmable Gain Amplifiers (PGAs) reside at the front end of each Delta-Sigma ADC. They have two functions: translate the common-mode of the input from SAVSS to an internal level between SAVSS and SAVDD, and amplify the input differential signal. The translation of the common-mode does not change the differential signal, but re-centers the common-mode so that the input signal can be properly amplified. The PGA block can be used to amplify very low signals, but the differential input range of the Delta-Sigma modulator must not be exceeded. The PGA is controlled by the PGA_CHn<2:0> bits in the GAIN register. Table B-4 represents the gain settings for the PGA:
TABLE B-4:
PGA CONFIGURATION SETTING
Gain (V/V) 1 2 4 8 16 32 (dB) 0 6 12 18 24 30 VIN Range (V) 0.5 0.25 0.125 0.0625 0.03125 0.015625
PGA Gain (PGA_CHn<2:0>) 0 0 0 0 1 1 0 0 1 1 0 0 0 1 0 1 0 1
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B.4.3 B.4.3.1 DELTA-SIGMA MODULATOR Architecture B.4.3.2 Modulator Input Range and Saturation Point
For a specified voltage reference value of 2.4V, the modulators' specified differential input range is 500 mV. The input range is proportional to VREF and scales according to the VREF voltage. This range ensures the stability of the modulator over amplitude and frequency. Outside of this range, the modulator is still functional, however, its stability is no longer ensured, and therefore, it is not recommended to exceed this limit. The saturation point for the modulator is VREF/3 since the transfer function of the ADC includes a gain of 3 by default (independent from the PGA setting). See Section B.4.5 "ADC Output Coding".
Both of the ADCs in the AFE are identical and they include a second-order modulator with a multi-bit DAC architecture (see Figure B-2). The quantizer is a Flash ADC composed of 4 comparators with equally spaced thresholds and a thermometer output coding. The proprietary 5-level architecture ensures minimum quantization noise at the outputs of the modulators without disturbing linearity or inducing additional distortion. The sampling frequency is DMCLK (typically 1 MHz with MCLK = 4 MHz) so the modulator outputs are refreshed at a DMCLK rate. Both modulators also include a dithering algorithm that can be enabled through the DITHER<1:0> bits in the Configuration register. This dithering process improves THD and SFDR (for high OSR settings) while increasing slightly the noise floor of the ADCs. For power metering applications and applications that are distortion-sensitive, it is recommended to keep DITHER enabled for both ADCs. In the case of power metering applications, THD and SFDR are critical specifications to optimize SNR (noise floor). This is not really problematic due to the large averaging factor at the output of the ADCs; therefore, even for low OSR settings, the dithering algorithm will show a positive impact on the performance of the application. Figure B-2 represents a simplified block diagram of the Delta-Sigma ADC present on the AFE.
B.4.3.3
Boost Mode
The Delta-Sigma modulators also include an independent Boost mode for each channel. If the corresponding BOOST<1:0> bit is enabled, the power consumption of the modulator is multiplied by 2 and its bandwidth is increased to be able to sustain AMCLK clock frequencies, up to 8.192 MHz, while keeping the ADC accuracy. When disabled, the power consumption is back to normal and the AMCLK clock frequencies can only reach up to 5 MHz without affecting ADC accuracy.
B.4.4
SINC3 FILTER
FIGURE B-2:
SIMPLIFIED DELTA-SIGMA ADC BLOCK DIAGRAM
Loop Filter Differential Voltage Input
Second Order Integrator
Quantizer Output Bitstream
5-Level Flash ADC
Both of the ADCs include a decimation filter that is a third-order sinc (or notch) filter. This filter processes the multi-bit bitstream into 16 or 24-bit words (depending on the WIDTH Configuration bit). The settling time of the filter is 3 DMCLK periods. It is recommended to discard unsettled data to avoid data corruption, which can be done easily by setting the DR_LTY bit high in the STATUS/COM register. The resolution achievable at the output of the sinc filter (the output of the ADC) is dependant on the OSR and is summarized with the following table:
TABLE B-5:
OSR<1:0>
ADC RESOLUTION vs. OSR
OSR 32 64 128 256 ADC Resolution (bits) No Missing Codes 17 20 23 24
DAC
0 0 1 1
0 1 0 1
Delta-Sigma Modulator
For 24-Bit Output mode (WIDTH = 1), the output of the sinc filter is padded with least significant zeros for any resolution less than 24 bits. For 16-Bit Output modes, the output of the sinc filter is rounded to the closest 16-bit number in order to conserve only 16-bit words and to minimize truncation error.
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The gain of the transfer function of this filter is 1 at each multiple of DMCLK (typically 1 MHz), so a proper anti-aliasing filter must be placed at the inputs to attenuate the frequency content around DMCLK and keep the desired accuracy over the baseband of the converter. This anti-aliasing filter can be a simple first-order RC network with a sufficiently low time constant to generate high rejection at DMCLK frequency. Figure B-3 shows the sinc filter frequency response:
FIGURE B-3:
SINC FILTER RESPONSE WITH MCLK = 4 MHZ, OSR = 64, PRESCALE = 1
20 0 Magnitude (dB) -20 -40 -60 -80 -100 -120
1 10 100 1000 10000 100000 1000000
EQUATION B-13:
SINC FILTER TRANSFER FUNCTION H(z)
- OSR 3
1-z H z = -------------------------------- -1 OSR 1 - z where 2fj z = exp --------------------- DMCLK
Input Frequency (Hz)
The Normal-Mode Rejection Ratio (NMRR) or gain of the transfer function is given by the following equation:
B.4.5
ADC OUTPUT CODING
EQUATION B-14:
MAGNITUDE OF FREQUENCY RESPONSE H(f)
3
The second-order modulator, SINC3 filter, PGA, VREF and analog input structure all work together to produce the device transfer function for the analog to digital conversion (see Equation B-15). The channel data is either a 16-bit or 24-bit word, presented in 23-bit or 15-bit plus sign, two's complement format and is MSB (left) justified. The ADC data is two or three bytes wide depending on the WIDTH bit of the associated channel. The 16-bit mode includes a round to the closest 16-bit word (instead of truncation) in order to improve the accuracy of the ADC data. In case of positive saturation (CHn+ - CHn- > VREF/3), the output is locked to 7FFFFF for 24-bit mode (7FFF for 16-bit mode). In case of negative saturation (CHn+ - CHn- VREF/3), the output code is locked to 800000 for 24-bit mode (8000 for 16-bit mode). Equation B-15 is only true for DC inputs. For AC inputs, this transfer function needs to be multiplied by the transfer function of the SINC3 filter (see Equation B-13 and Equation B-14).
f sin c --------------------- DMCLK NMRR f = --------------------------------------------f sin c -------------------- DRCLK f sin c --- f S NMRR f = ---------------------------f sin c ---- f D sin x sin c x = -------------x
3
or,
where
EQUATION B-15:
CH n+ - CH n- DATA_CHn = ------------------------------------- 8,388,608 G 3 V REF+ - VREF- CH n+ - CH n- DATA_CHn = ------------------------------------- 32, 768 G 3 V REF+ - V REF--
(For 24-bit Mode Or WIDTH = 1)
(For 16-bit Mode Or WIDTH = 0)
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B.4.5.1 ADC Resolution as a Function of OSR
The ADC resolution is a function of the OSR (Section B.4.4 "SINC3 Filter"). The resolution is the same for both channels. No matter what the resolution is, the ADC output data is always presented in 24-bit words, with added zeros at the end, if the OSR is not large enough to produce 24-bit resolution (left justification).
TABLE B-6:
0111 0111 0000 1111 1000 1000 1 1 0 1 0 0 1 1 0 1 0 0
OSR = 256 OUTPUT CODE EXAMPLES
ADC Output Code (MSB First) 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 0 0 1 1 0 Hexadecimal 0x7FFFFF 0x7FFFFE 0x000000 0xFFFFFF 0x800001 0x800000 Decimal + 8,388,607 + 8,388,606 0 -1 - 8,388,607 - 8,388,608
TABLE B-7:
OSR = 128 OUTPUT CODE EXAMPLES
ADC Output Code (MSB First) Hexadecimal 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 1 0 1 0 0 1 0 0 1 1 0 0 0 0 0 0 0 0x7FFFFE 0x7FFFFC 0x000000 0xFFFFFE 0x800002 0x800000 Decimal 23-Bit Resolution + 4,194,303 + 4,194,302 0 -1 - 4,194,303 - 4,194,304
0 0 0 1 1 1
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 0 0 1 0 0
1 1 0 1 0 0
TABLE B-8:
OSR = 64 OUTPUT CODE EXAMPLES
ADC Output Code (MSB First) Hexadecimal 1 1 0 1 0 0 1 1 0 1 0 0 1 0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0x7FFFF0 0x7FFFE0 0x000000 0xFFFFF0 0x800010 0x800000 Decimal 20-Bit resolution + 524, 287 + 524, 286 0 -1 - 524,287 - 524, 288
0 0 0 1 1 1
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
TABLE B-9:
OSR = 32 OUTPUT CODE EXAMPLES
ADC Output Code (MSB First) Hexadecimal 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0x7FFF80 0x7FFF00 0x000000 0xFFFF80 0x800080 0x800000 Decimal 17-Bit resolution + 65, 535 + 65, 534 0 -1 - 65,535 - 65, 536
0 0 0 1 1 1
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 1 0 1 0 0
1 0 0 1 1 0
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B.4.6 B.4.6.1 VOLTAGE REFERENCE Internal Voltage Reference B.4.7 POWER-ON RESET
The AFE contains its own internal POR circuit that monitors analog supply voltage AVDD during operation. The typical threshold for a power-up event detection is 4.2V, 5%. The POR circuit has a built-in hysteresis for improved transient spikes immunity that has a typical value of 200 mV. Proper decoupling capacitors (0.1 F ceramic and 10 F tantalum) should be mounted as close as possible to the AVDD pin, providing additional transient immunity. Figure B-4 illustrates the different conditions at power-up and a power-down event in the typical conditions. All internal DC biases are not settled until at least 50 s after system POR. Any DR pulses during this time after system Reset should be ignored. After POR, DR pulses are present at the pin with all the default conditions in the Configuration registers. The analog and digital power supplies are independent. Since AVDD is the only power supply that is monitored, it is highly recommended to power up DVDD first as a power-up sequence. If AVDD is powered up first, it is highly recommended to keep the RESET pin low during the whole power-up sequence.
The AFE contains an internal voltage reference source specially designed to minimize drift over temperature. In order to enable the internal voltage reference, the VREFEXT bit in the Configuration register must be set to `0' (Default mode). This internal VREF supplies reference voltage to both channels. The typical value of this voltage reference is 2.37V 2%. The internal reference has a very low typical temperature coefficient of 12 ppm/C, allowing the output codes to have minimal variation with respect to temperature since they are proportional to (1/VREF). The noise of the internal voltage reference is low enough not to significantly degrade the SNR of the ADC if compared to a precision external low-noise voltage reference. The output pin for the internal voltage reference is REFIN+/OUT. When the internal voltage reference is enabled, the REFIN- pin should always be connected to SAVSS. For optimal ADC accuracy, appropriate bypass capacitors should be placed between REFIN+/OUT and SAVSS. Decoupling at the sampling frequency, around 1 MHz is important, for any noise around this frequency will be aliased back into the conversion data. 0.1 F ceramic and 10 F tantalum capacitors are recommended. These bypass capacitors are not mandatory for correct ADC operation, but removing these capacitors may degrade accuracy of the ADC. The bypass capacitors also help for applications where the voltage reference output is connected to other circuits. In this case, additional buffering may be needed as the output drive capability of this output is low.
FIGURE B-4:
POWER-ON RESET OPERATION
AVDD 5V 4.2V 4V
50 s tPOR
B.4.6.2
Differential External Voltage Inputs
0V
When the VREFEXT bit is high, the two reference pins (REFIN+/OUT, REFIN-) become a differential voltage reference input. The voltage at the REFIN+/OUT is noted VREF+ and the voltage at the REFIN- pin is noted VREF-. The differential voltage input value is given by the following equation: VREF = VREF+ - VREFThe specified VREF range is from 2.2V to 2.6V. The REFIN- pin voltage (VREF-) should be limited to 0.3V. Typically, for single-ended reference applications, the REFIN- pin should be directly connected to SAVSS.
Device Mode
Reset
Proper Operation
Time
Reset
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B.4.8 ARESET EFFECT ON DELTA-SIGMA MODULATOR/SINC FILTER B.4.9.1 Phase Delay Limits
When the ARESET pin is low, both ADCs will be in Reset and output code, 0x0000h. The RESET pin performs a Hard Reset (DC biases still on, part ready to convert) and clears all charges contained in the Sigma-Delta modulators. The comparator output is `0011' for each ADC. The sinc filters are all reset, as well as their double output buffers. This pin is independent of the serial interface. It brings the CONFIG registers to the default state. When RESET is low, any write with the SPI interface will be disabled and will have no effect. The output pins (SDOA, DR) are high impedance and no clock is propagated through the chip. The phase delay can only go from -OSR/2 to +OSR/2 - 1. This sets the fine phase resolution. The PHASE register is coded with 2's complement. If larger delays between the two channels are needed, they can be implemented by the microcontroller. A FIFO can save incoming data from the leading channel for a number N of DRCLK clocks. In this case, DRCLK would represent the coarse timing resolution, and DMCLK the fine timing resolution. The total delay will then be equal to: Delay = N/DRCLK + PHASE/DMCLK The Phase Delay register can be programmed once with the OSR = 256 setting, and will adjust to the OSR automatically afterwards, without the need to change the value of the PHASE register. * OSR = 256: the delay can go from -128 to +127. PHASE<7> is the sign bit. PHASE<6> is the MSB and PHASE<0> is the LSB. * OSR = 128: the delay can go from -64 to +63. PHASE<6> is the sign bit. PHASE<5> is the MSB and PHASE<0> is the LSB. * OSR = 64: the delay can go from -32 to +31. PHASE<5> is the sign bit. PHASE<4> is the MSB and PHASE<0> is the LSB. * OSR = 32: the delay can go from -16 to +15. PHASE<4> is the sign bit. PHASE<3> is the MSB and PHASE<0> is the LSB.
B.4.9
PHASE DELAY BLOCK
The AFE incorporates a phase delay generator which ensures that the two ADCs are converting the inputs with a fixed delay between them. The two ADCs are synchronously sampling, but the averaging of modulator outputs is delayed so that the sinc filter outputs (thus, the ADC outputs) show a fixed phase delay, as determined by the PHASE register setting. The PHASE register (PHASE<7:0>) is a 7-bit + sign, MSB first, two's complement register, that indicates how much phase delay there is to be between Channel 0 and Channel 1. The reference channel for the delay is Channel 1 (typically the voltage channel for power metering applications). When PHASE<7:0> bits are positive, Channel 0 is lagging versus Channel 1. When PHASE<7:0> are negative, Channel 0 is leading versus Channel 1. The amount of delay between two ADC conversions is given by the following formula:
TABLE B-10:
PHASE VALUES WITH MCLK = 4 MHZ, OSR = 256
Hex 0x7F 0x7E 0x01 0x00 0xFF 0x81 0x80 Delay (CH0 relative to CH1) +127 s +126 s +1 s 0 s -1 s -127 s -128 s
PHASE Register Value Binary
EQUATION B-16:
Phase Register Code Delay = ------------------------------------------------DMCLK The timing resolution of the phase delay is 1/DMCLK or 1 s in the default configuration with MCLK = 4 MHz. The data ready signals are affected by the phase delay settings. Typically, the time difference between the data ready pulses of Channel 0 and Channel 1 is equal to the phase delay setting. Note: A detailed explanation of the Data Ready pin (DR) with phase delay is present in Section B.5.9.1 "Data Ready Latches And Data Ready Modes (DRMODE<1:0>)".
01111111 01111110 00000001 00000000 11111111 10000001 10000000
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B.4.10 INTERNAL AFE CLOCK
The AFE uses an external clock signal to operate its internal digital logic. An internal clock generation chain (Figure B-5) is used to produce a range of DRCLK sampling frequencies. For keeping specified ADC accuracy, AMCLK should be kept between 1 and 5 MHz with BOOST off, or 1 and 8.192 MHz with BOOST on. Larger MCLK frequencies can be used provided the prescaler clock settings allow the AMCLK to respect these ranges.
FIGURE B-5:
AFE INTERNAL CLOCK DETAIL
PRESCALE<1:0> fS ADC Sampling Rate DMCLK Clock Divider OSR<1:0> fD ADC Output Data Rate 1/OSR DRCLK
Digital Buffer CLKIA 1/ Prescale 1/4 AMCLK Clock Divider
MCLK
Clock Divider
B.5
B.5.1
Serial Interface Description
OVERVIEW
The AFE is accessed for control and data output exclusively through its dedicated Serial Peripheral Interface (SPI). The interface is compatible with SPI Modes 0,0 and 1,1. Data is clocked out of the AFE on the falling edge of SCK, and data is clocked in on the rising edge of SCK. In these modes, SCK can Idle either high or low. Each SPI communication starts with a CS falling edge and stops with the CS rising edge. Each SPI communication is independent. When CS is high, SDO is in high-impedance, transitions on SCK and SDI have no effect. Additional controls pins (ARESET and DR) are also provided on separate pins for advanced communication. The AFE's SPI interface has a simple command structure. The first byte transmitted is always the control byte and is followed by data bytes that are 8-bit wide. Both ADCs are continuously converting data by default and can be reset or shut down through a CONFIG2 register setting. Since each ADC data is either 16 or 24 bits (depending on the WIDTH bits), the internal registers can be grouped together with various configurations (through the READ bits) in order to allow easy data retrieval within only one communication. For device reads, the internal address counter can be automatically incremented in order to loop through groups of data within the register map. SDOA will then output the data located at the ADDRESS (A<4:0>) defined in the control byte and then ADDRESS + 1 depending on the READ<1:0> bits, which select the groups of registers. These groups are defined in Section B.6.1 "ADC Channel Data Output Registers" (Register Map).
The Data Ready pin (DR) can be used as an interrupt for a microcontroller and outputs pulses when new ADC channel data is available. The ARESET pin acts like a Hard Reset and can reset the AFE to its default power-up configuration, independent of the microcontroller.
B.5.2
CONTROL BYTE
The control byte of the AFE contains two device address bits (A<6:5>), 5 register address bits (A<4:0>) and a read/write bit (R/W). The first byte transmitted to the AFE is always the control byte. The AFE interface is device-addressable (through A<6:5>) so that multiple devices can be present on the same SPI bus with no data bus contention. This functionality enables three-phase power metering systems containing an AFE and two other external AFE-type chips, controlled by a single SPI bus (single CS, SCK, SDI and SDO pins). The default device address bits are `00'.
FIGURE B-6:
A6
CONTROL BYTE
A5
A4
A3
A2
A1
A0
R/W Read Write Bit
Device Address Bits
Register Address Bits
A read on undefined addresses will give an all zeros output on the first and all subsequent transmitted bytes. A write on an undefined address will have no effect and will not increment the address counter either. The register map is defined in Section B.6.1 "ADC Channel Data Output Registers".
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B.5.3 READING FROM THE DEVICE
The first data byte read is the one defined by the address given in the control byte. After this first byte is transmitted, if the CS pin is maintained low, the communication continues and the address of the next transmitted byte is determined by the status of the READ bits in the STATUS/COM register. Multiple looping configurations can be defined through the READ<1:0> bits for the address increment (see Section B.5.6 "SPI Mode 0,0 - Clock Idle Low, Read/Write Examples"). The address of the next transmitted byte within the same communication (CSA stays low) is the next address defined on the register map. At the end of the register map, the address loops to the beginning of the register map. Writing a non-writable register has no effect. The SDOA pin stays in a high-impedance state during a write communication.
B.5.5
SPI MODE 1,1 - CLOCK IDLE HIGH, READ/WRITE EXAMPLES
B.5.4
WRITING TO THE DEVICE
The first data byte written is the one defined by the address given in the control byte. The write communication automatically increments the address for subsequent bytes.
In this SPI mode, the clock Idles high. For the AFE, this means that there will be a falling edge before there is a rising edge. Note: Changing from an SPI Mode 1,1 to an SPI Mode 0,0 is possible, but needs a Reset pulse in-between to ensure correct communication.
FIGURE B-7:
CS
DEVICE READ (SPI MODE 1,1 - CLOCK IDLES HIGH)
Data Transitions on the Falling Edge AFE Latches Bits on the Rising Edge
SCK
SDI
A6 A5 A4 A3 A2 A1 A0 R/W
SDO
HI-Z
HI-Z
D7 D6 D5 D4 D3 D2 D1
D0
D7 D6 D5 D4 D3 D2 D1
D0
HI-Z
(ADDRESS) DATA
(ADDRESS + 1) DATA
FIGURE B-8:
CS
DEVICE WRITE (SPI MODE 1,1 - CLOCK IDLES HIGH)
Data Transitions on the Falling Edge AFE Latches Bits on the Rising Edge
SCK
SDI SDO
HI-Z
A6 A5 A4 A3 A2 A1
A0
R/W
D7 D6 D5 D4 D3 D2 D1
D0
D7 D6 D5 D4 D3 D2
D1
D0
(ADDRESS) DATA
HI-Z
(ADDRESS + 1) DATA
HI-Z
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B.5.6 SPI MODE 0,0 - CLOCK IDLE LOW, READ/WRITE EXAMPLES
In this SPI mode, the clock Idles low. For the AFE, this means that there will be a rising edge before there is a falling edge.
FIGURE B-9:
CS
DEVICE READ (SPI MODE 0,0 - CLOCK IDLES LOW)
Data Transitions on the Falling Edge AFE Latches Bits on the Rising Edge
SCK
SDI
A6 A5 A4 A3 A2 A1 A0 R/W
SDO
HI-Z
HI-Z
D7
D6 D5 D4 D3 D2 D1
D0
D7
D6 D5 D4 D3 D2 D1 D0
D7 OF (ADDRESS + 2) DATA
HI-Z
(ADDRESS) DATA
(ADDRESS + 1) DATA
FIGURE B-10: DEVICE WRITE (SPI MODE 0,0 - CLOCK IDLES LOW)
CS
Data Transitions on the Falling Edge Bits on the Rising Edge
AFE Latches
SCK
SDI SDO
HI-Z
A6 A5 A4 A3 A2 A1
A0 R/W
D7
D6 D5 D4 D3 D2 D1 D0
D7
D6 D5 D4 D3 D2
D1 D0
D7 OF (ADDRESS + 2) DATA
(ADDRESS) DATA
HI-Z
(ADDRESS + 1) DATA
HI-Z
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B.5.7 CONTINUOUS COMMUNICATION, LOOPING ON ADDRESS SETS
If the user wishes to read back either of the ADC channels continuously, or both channels continuously, the internal address counter can be set to loop on specific register sets. In this case, there is only one control byte on SDI to start the communication. The part stays within the same loop until CS returns high. This internal address counter allows the following functionality: * Read one ADC channel data continuously * Read both ADC channel data continuously (both ADC data can be independent or linked with DRMODE settings) * Read continuously the entire register map * Read continuously each separate register * Read continuously all Configuration registers * Write all Configuration registers in one communication (see Figure B-11) The STATUS/COM register contains the loop settings for the internal address counter (READ<1:0>). The internal address counter can either stay constant (READ<1:0> = 00) and read continuously the same byte, or it can auto-increment and loop through the register groups defined below (READ<1:0> = 01), register types (READ<1:0> = 10) or the entire register map (READ<1:0> = 11). Each channel is configured independently as either a 16-bit or 24-bit data word depending on the setting of the corresponding WIDTH bit in the CONFIG1 register. For continuous reading, in the case of WIDTH = 0 (16-bit), the lower byte of the ADC data is not accessed and the part jumps automatically to the following address (the user does not have to clock out the lower byte since it becomes undefined for WIDTH = 0). The following figure represents a typical, continuous read communication with the default settings (DRMODE<1:0> = 00, READ<1:0> = 10) for both width settings. This configuration is typically used for power metering applications.
FIGURE B-11: TYPICAL CONTINUOUS READ COMMUNICATION
CS
SCK
SDI
CH0 ADC ADDR/R
SDO
CH0 ADC CH0 ADC CH0 ADC CH1 ADC CH1 ADC CH1 ADC Upper byte Middle byte Lower byte Upper byte Middle byte Lower byte
CH0 ADC CH0 ADC CH0 ADC CH1 ADC CH1 ADC CH1 ADC Upper byte Middle byte Lower byte Upper byte Middle byte Lower byte
DR
These bytes are not present when WIDTH=0 (16-bit mode)
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B.5.7.1 Continuous Write
The following register sets are defined as types: Both ADCs are powered up with their default configurations and begin to output DR pulses immediately (RESET<1:0> and SHUTDOWN<1:0> bits are all `0' by default). The default output codes for both ADCs are all zeros. The default modulator output for both ADCs is `0011' (corresponding to a theoretical zero voltage at the inputs). The default phase is zero between the two channels. It is recommended to enter into ADC Reset mode for both ADCs just after power-up because the desired register configuration may not be the default one, and in this case, the ADC would output undesired data. Within the ADC Reset mode (RESET<1:0> = 11), the user can configure the whole part with a single communication. The write commands increment the address automatically so that the user can start writing the PHASE register, and finish with the CONFIG2 register, in only one communication (see Figure B-11). The RESET<1:0> bits are in the CONFIG2 register to allow exiting of the Soft Reset mode, and have the whole part configured and ready to run in only one command. The following register sets are defined as groups:
TABLE B-12:
TYPE ADC DATA (Both Channels)
REGISTER TYPES
ADDRESSES 0x00-x05 0x07-0x0B
CONFIGURATION
B.5.8
SITUATIONS THAT RESET ADC DATA
Immediately after the following actions, the ADCs are temporarily reset in order to provide proper operation: 1. 2. 3. 4. 5. Change in the PHASE register. Change in the OSR setting. Change in the PRESCALE setting. Overwrite of the same PHASE register value. Change in the CLKEXT bit in the CONFIG2 register, modifying the internal oscillator state.
TABLE B-11:
GROUP ADC DATA CH0 ADC DATA CH1 PHASE, GAIN
REGISTER GROUPS
ADDRESSES 0x00-0x02 0x03-0x05 0x07-0x08 0x09-0x0B
After these temporary Resets, the ADCs go back to the normal operation with no need for an additional command. These are also the settings where the DR position is affected. The PHASE register can be used to serially soft reset the ADCs without using the RESET bits in the Configuration register if the same value is written in the PHASE register.
CONFIG, STATUS
FIGURE B-12: RECOMMENDED CONFIGURATION SEQUENCE AT POWER UP
AVDD CS
SCK SDI 00011000 11XXXXX1 CONFIG2 00001110 PHASE ADDR/W xxxxxxxx PHASE xxxxxxxx GAIN xxxxxxxx STATUS/COM xxxxxxxx CONFIG1 xxxxxxxx CONFIG2
CONFIG2 ADDR/W
Optional Reset of Both ADCs
One Command for Writing Complete Configuration
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B.5.9 DATA READY PIN (DR) B.5.9.2
To signify when channel data is ready for transmission, the data ready signal is available on the Data Ready pin (DR) through an active-low pulse at the end of a channel conversion. The Data Ready pin outputs an active-low pulse with a period that is equal to the DRCLK clock period and with a width equal to one DMCLK period. When not active-low, this pin can either be in high impedance (when DR_HIZN = 0) or in a defined logic high state (when DR_HIZN = 1). This is controlled through the Configuration registers. This allows multiple devices to share the same Data Ready pin (with a pull-up resistor connected between DR and DVDD) in 3-phase energy meter designs to reduce microcontroller pin count. A single device on the bus does not require a pull-up resistor. After a data ready pulse has occurred, the ADC output data can be read through SPI communication. Two sets of latches at the output of the ADC prevent the communication from outputting corrupted data (see Section B.5.9.1 "Data Ready Latches And Data Ready Modes (DRMODE<1:0>)"). The CS pin has no effect on the DR pin, which means even if CS is high, data ready pulses will be provided (except when the configuration prevents from outputting data ready pulses). The DR pin can be used as an interrupt when connected to an external microcontroller. When the ARESET pin is low, the DR pin is not active.
Data Ready Pin (DR) Control Using DRMODE Bits
There are four modes that control the data ready pulses and these modes are set with the DRMODE<1:0> bits in the STATUS/COM register. For power metering applications, DRMODE<1:0> = 00 is recommended (Default mode). The position of DR pulses vary with respect to this mode, to the OSR and to the PHASE settings: * DRMODE<1:0> = 11: Both Data Ready pulses from ADC Channel 0 and ADC Channel 1 are output on the DR pin. * DRMODE<1:0> = 10: Data Ready pulses from ADC Channel 1 are output on the DR pin. DR pulses from ADC Channel 0 are not present on the pin. * DRMODE<1:0> = 01: Data Ready pulses from ADC Channel 0 are output on the DR pin. DR pulses from ADC Channel 1 are not present on the pin. * DRMODE<1:0> = 00: (Recommended and Default mode). Data Ready pulses from the lagging ADC, between the two, are output on the DR pin. The lagging ADC depends on the PHASE register and on the OSR. In this mode, the two ADCs are linked together so their data is latched together when the lagging ADC output is ready.
B.5.9.3
DR Pulses with Shutdown or Reset Conditions
B.5.9.1
Data Ready Latches And Data Ready Modes (DRMODE<1:0>)
To ensure that both channel ADC data are present at the same time for SPI read, regardless of phase delay settings for either or both channels, there are two sets of latches in series with both the data ready and the `read start' triggers. The first set of latches holds each output when data is ready and latches both outputs together when DRMODE<1:0> = 00. When this mode is on, both ADCs work together and produce one set of available data after each data ready pulse (that corresponds to the lagging ADC data ready). The second set of latches ensures that when reading starts on an ADC output, the corresponding data is latched so that no data corruption can occur. If an ADC read has started, in order to read the following ADC output, the current reading needs to be completed (all bits must be read from the ADC output data registers).
There will be no DR pulses if DRMODE<1:0> = 00 when either one or both of the ADCs are in Reset or Shutdown. In Mode 00, a DR pulse only happens when both ADCs are ready. Any DR pulse will correspond to one data on both ADCs. The two ADCs are linked together and act as if there was only one channel with the combined data of both ADCs. This mode is very practical when both ADC channel data retrieval and processing need to be synchronized, as in power metering applications. Note: If DRMODE<1:0> = 11, the user will still be able to retrieve the DR pulse for the ADC not in shutdown or Reset (i.e., only one ADC channel needs to be awake).
Figure B-13 represents the behavior of the Data Ready pin with the different DRMODE and DR_LTY configurations, while shutdown or Resets are applied.
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3*DRCLK Period 3*DRCLK Period DRCLK Period 1 DMCLK Period DRCLK Period
DRCLK Period Internal Reset Synchronisation (1 DMCLK Period)
RESET
RESET<0> or SHUTDOWN<0>
RESET<1> or SHUTDOWN<1>
DRMODE = 00; DR D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11
D12
D13
D14
PHASE > 0
DRMODE = 01; DR D0 DRMODE = 10; DR D0 DRMODE = 11; DR D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13
D14
D15
D16
D15
D16
D17
DRMODE = 00; DR D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10
D11
D12
D13
PHASE = 0
DRMODE = 01; DR D0 DRMODE = 10; DR D0 DRMODE = 11; DR D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13
D14
D15
D16
FIGURE B-13: DATA READY BEHAVIOR
D14
D15
D16
D17
D18
D19
DRMODE = 00; DR D0 DRMODE = 01; DR D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11
D12
D13
D14
PHASE < 0
D0 DRMODE= 10; DR D0 DRMODE = 11; DR D0 D1 D2 D1
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
D16
D17
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
D16
D3 D4
D5 D6
D7
D8
D9 D10
D11 D12
D13 D14
D15 D16
D17
D18
D19
D20 D21
D22 D23
D24 D25
D26 D27
D28
D29
D30 D31
D32 D33
D34
DRMODE = 00 : Select the lagging Data Ready DRMODE = 01 : Select the Data Ready on Channel 0 DRMODE = 10 : Select the Data Ready on Channel 1 DRMODE = 11 : Select both Data ready
Data Ready pulse that appears only when DR_LTY = 0
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D29
D30 D31
D32 D33
D34
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B.6 Internal Registers
The addresses associated with the internal registers are listed below. A detailed description of the registers follows. All registers are 8 bits long and can be addressed separately. Read modes define the groups and types of registers for continuous read communication or looping on address sets.
.
TABLE B-13:
Address 0x00 0x03 0x06 0x07 0x08 0x09 0x0A 0x0B
REGISTER MAP
Name DATA_CH0 DATA_CH1 reserved PHASE GAIN STATUS/COM CONFIG1 CONFIG2 Bits 24 24 8 8 8 8 8 8 R/W R R -- Description Channel 0 ADC Data<23:0>, MSB First Channel 1 ADC Data<23:0>, MSB First Reserved; Ignore Reads, Do Not Write
R/W Phase Delay Configuration Register R/W Gain Configuration Register R/W Status/Communication Register R/W Configuration Register 1 R/W Configuration Register 2
TABLE B-14:
REGISTER MAP GROUPING FOR CONTINUOUS READ MODES
Address 0x00 READ<1:0> "01" GROUP TYPE GROUP Loop Entire Register Map "10" "11"
Function
DATA_CH0
0x01 0x02 0x03
DATA_CH1 PHASE GAIN STATUS/COM CONFIG1 CONFIG2
0x04 0x05 0x07 0x08 0x09 0x0A 0x0B
GROUP TYPE GROUP
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B.6.1 ADC CHANNEL DATA OUTPUT REGISTERS
The ADC Channel Data Output registers always contain the most recent A/D conversion data for each channel. These registers are read-only. They can be accessed independently as three 8-bit registers or linked together (with READ<1:0> bits). These registers are latched when an ADC read communication occurs. When a data ready event occurs during a read communication, the most current ADC data is also latched to avoid data corruption issues. The three bytes of each channel are updated synchronously at a DRCLK rate. The three bytes can be accessed separately if needed but are refreshed synchronously.
REGISTER B-1:
R-0 DATA_CHn <23> bit 23 R-0 DATA_CHn <15> bit 15 R-0 DATA_CHn <7> bit 7 Legend: R = Readable bit -n = Value at POR
DATA_CHn: CHANNEL OUTPUT REGISTERS (CH0, ADDRESSES 0x00-0x02; CH1; 0x03-0x05)
R-0 R-0 DATA_CHn <21> R-0 DATA_CHn <20> R-0 DATA_CHn <19> R-0 DATA_CHn <18> R-0 DATA_CHn <17> R-0 DATA_CHn <16> bit 16 R-0 R-0 DATA_CHn <13> R-0 DATA_CHn <12> R-0 DATA_CHn <11> R-0 DATA_CHn <10> R-0 DATA_CHn <9> R-0 DATA_CHn <8> bit 8 R-0 R-0 DATA_CHn <5> R-0 DATA_CHn <4> R-0 DATA_CHn <3> R-0 DATA_CHn <2> R-0 DATA_CHn <1> R-0 DATA_CHn <0> bit 0
DATA_CHn <22>
DATA_CHn <14>
DATA_CHn <6>
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
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B.6.2 PHASE REGISTER B.6.2.1 Phase Resolution from OSR
The PHASE register (PHASE<7:0>) is a 7 bits + sign, MSB first, two's complement register that indicates how much phase delay there should be between Channel 0 and Channel 1. The reference channel for the delay is Channel 1 (typically, the voltage channel when used in energy metering applications) i.e., when PHASE register code is positive, Channel 0 is lagging Channel 1. When PHASE register code is negative, Channel 0 is leading versus Channel 1. The delay is give by the following formula: The timing resolution of the phase delay is 1/DMCLK or 1 s in the default configuration (MCLK = 4 MHz). The PHASE register coding depends on the OSR setting, as shown in Table B-15.
TABLE B-15:
PHASE ENCODING RESOLUTION BY OVERSAMPLING RATIO
Encoding # Significant Digits 7 <6:0> 6 <5:0> 5 <4:0> 4 <3:0> Sign Bit <7> <6> <5> <4>
Oversampling Ratio OSR <1:0> 00 01 10 11 Value 32 64 128 256
Range -128 to +127 -64 to +63 -32 to +31 -16 to +15
EQUATION B-17:
Phase Register Code Delay = ------------------------------------------------DMCLK
REGISTER B-2:
R/W-0 PHASE<7> bit 7 Legend: R = Readable bit -n = Value at POR bit 7-0
PHASE: PHASE REGISTER (ADDRESS 0x07)
R/W-0 R/W-0 PHASE<5> R/W-0 PHASE<4> R/W-0 PHASE<3> R/W-0 PHASE<2> R/W-0 PHASE<1> R/W-0 PHASE<0> bit 0
PHASE<6>
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
PHASE<7-0>: CH0 Relative to CH1 Phase Delay bits Delay = PHASE register two's complement code/DMCLK (Default PHASE = 0)
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B.6.3 GAIN CONFIGURATION REGISTER
This registers contains the settings for the PGA gains for each channel, as well as the BOOST options for each channel.
REGISTER B-3:
R/W-0 PGA_CH1 <2> bit 7 Legend: R = Readable bit -n = Value at POR bit 7-5
GAIN: GAIN CONFIGURATION REGISTER (ADDRESS 0x08)
R/W-0 R/W-0 PGA_CH1 <0> R/W-0 BOOST<1> R/W-0 BOOST<0> R/W-0 PGA_CH0 <2> R/W-0 PGA_CH0 <1> R/W-0 PGA_CH0 <0> bit 0
PGA_CH1 <1>
W = Writable bit `1' = Bit is set
U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
PGA_CH1<2:0>: PGA Setting for Channel 1 bits 111 = Reserved (Gain = 1) 110 = Reserved (Gain = 1) 101 = Gain is 32 100 = Gain is 16 011 = Gain is 8 010 = Gain is 4 001 = Gain is 2 000 = Gain is 1 BOOST<1:0>: Current Scaling for High-Speed Operation bits 11 = Both channels have current x 2 10 = Channel 1 has current x 2 01 = Channel 0 has current x 2 00 = Neither channel has current x 2 PGA_CH0<2:0>: PGA Setting for Channel 0 bits 111 = Reserved (Gain = 1) 110 = Reserved (Gain = 1) 101 = Gain is 32 100 = Gain is 16 011 = Gain is 8 010 = Gain is 4 001 = Gain is 2 000 = Gain is 1
bit 4-3
bit 2-0
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B.6.4 STATUS AND COMMUNICATION REGISTER
This register contains all settings related to the communication, including data ready settings and status, and Read mode settings. This mode is very useful for power metering applications because the data from both ADCs can be retrieved using this single data ready event which is processed synchronously, even in case of a large phase difference. This mode works as if there was one ADC channel and its data would be 48 bits long, and contain both channel data. As a consequence, if one channel is in Reset or shutdown when DRMODE = 00, no data ready pulse will be present at the outputs (if both channels are not ready in this mode, the data is not considered as ready). See Section B.5.9 "Data Ready Pin (DR)" for more details about Data Ready pin behavior.
B.6.4.1
Data Ready (DR) Latency Control - DR_LTY
This bit determines if the first data ready pulses correspond to settled data, or unsettled data, from each SINC3 filter. Unsettled data will provide DR pulses every DRCLK period. If this bit is set, unsettled data will wait for 3 DRCLK periods before giving DR pulses and will then give DR pulses every DRCLK period.
B.6.4.4
DR Status Flag - DRSTATUS<1:0>
B.6.4.2
Data Ready (DR) Pin High-Z - DR_HIZN
This bit defines the non-active state of the Data Ready pin (logic `1' or high-impedance). Using this bit, the user can connect multiple chips with the same DR pin with a pull-up resistor (DR_HIZN = 0) or a single chip with no external component (DR_HIZN = 1).
These bits indicate the DR status of both channels, respectively. These flags are set to logic high after each read of the STATUS/COM register. These bits are cleared when a DR event has happened on its respective ADC channel. Writing these bits has no effect. Note: These bits are useful if multiple devices share the same DR output pin (DR_HIZN = 0) in order to understand from which device the DR event has happened. This configuration can be used for three-phase power metering systems where all three phases share the same Data Ready pin. In case the DRMODE = 00 (linked ADCs), these data ready status bits will be updated synchronously upon the same event (lagging ADC is ready). These bits are also useful in systems where the DR pin is not used to save MCU I/O.
B.6.4.3
Data Ready Mode - DRMODE<1:0>
If one of the channels is in Reset or shutdown, only one of the data ready pulses is present and the situation is similar to DRMODE = 01 or 10. In the `01', `10' and `11' modes, the ADC channel data to be read is latched at the beginning of a reading, in order to prevent the case of erroneous data when a DR pulse happens during a read. In these modes the two channels are independent. When these bits are equal to `11', `10' or `01', they control which ADC's data ready is present on the DR pin. When DRMODE = 00, the Data Ready pin output is synchronized with the lagging ADC channel (defined by the PHASE register) and the ADCs are linked together. In this mode, the output of the two ADCs are latched synchronously at the moment of the DR event. This prevents having bad synchronization between the two ADCs. The output is also latched at the beginning of a reading in order not to be updated during a read and not to give erroneous data.
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REGISTER B-4:
R/W-1 READ<1> bit 7 Legend: R = Readable bit -n = Value at POR bit 7-6 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
STATUS AND COMMUNICATION REGISTER (ADDRESS 0x09)
R/W-0 R/W-1 DR_LTY R/W-0 DR_HIZN R/W-0 R/W-0 R-1 DRSTATUS <1> R-1 DRSTATUS <0> bit 0 DRMODE<1> DRMODE<0>
READ<0>
READ: Address Loop Setting bits 11= Address counter loops on entire register map 10= Address counter loops on register TYPES (default) 01= Address counter loops on register GROUPS 00= Address not incremented, continually read same single register DR_LTY: Data Ready Latency Control bit 1 = "No Latency" conversion, DR pulses after 3 DRCLK periods (default) 0 = Unsettled data is available after every DRCLK period DR_HIZn: Data Ready Pin Inactive State Control bit 1 = The Data Ready pin default state is a logic high when data is NOT ready 0 = The Data Ready pin default state is high impedance when data is NOT ready (default) DRMODE<1:0>: Data Ready Pin (DR) Control bits 11= Both data ready pulses from ADC0 and ADC Channel 1 are output on the DR pin 10= Data ready pulses from ADC Channel 1 are output on the DR pin; DR from ADC Channel 0 are not present on the pin 01= Data ready pulses from ADC Channel 0 are output on the DR pin; DR from ADC Channel 1 are not present on the pin 00= Data ready pulses from the lagging ADC between the two are output on the DR pin; the lagging ADC selection depends on the PHASE register and on the OSR (default) DRSTATUS<1:0>: Data Ready Status bits 11= ADC Channel 1 and Channel 0 data not ready (default) 10= ADC Channel 1 data not ready, ADC Channel 0 data ready 01= ADC Channel 0 data not ready, ADC Channel 1 data ready 00= ADC Channel 1 and Channel 0 data ready
bit 5
bit 4
bit 3-2
bit 1-0
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B.6.5 CONFIGURATION REGISTERS
The Configuration registers contain settings for the internal clock prescaler, the oversampling ratio, the Channel 0 and Channel 1 width settings, the state of the channel Resets and shutdowns, the dithering algorithm control (for Idle tones suppression), and the control bits for the external VREF and external CLK.
REGISTER B-5:
R/W-0 PRESCALE <1> bit 7 Legend: R = Readable bit -n = Value at POR bit 7-6
CONFIG1: CONFIGURATION REGISTER 1: (ADDRESS 0x0A)
R/W-0 R/W-0 OSR<1> R/W-1 OSR<0> R/W-0 WIDTH<1> R/W-0 WIDTH<0> r-0 r r-0 r bit 0 r = Reserved bit W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
PRESCALE <0>
PRESCALE<1:0>: Internal Master Clock (AMCLK) Prescaler Value bits 11 = AMCLK = MCLK/8 10 = AMCLK = MCLK/4 01 = AMCLK = MCLK/2 00 = AMCLK = MCLK (default) OSR<1:0>: Oversampling Ratio for Delta-Sigma A/D Conversion bits (all channels, DMCLK/DRCLK) 11 = 256 10 = 128 01 = 64 (default) 00 = 32 WIDTH<1:0>: ADC Channel Output Data Word Width bits 11 = 24-bit mode on both channels 10 = 24-bit mode on Channel 1, 16-bit mode on Channel 0 01 = 16-bit mode on Channel 1, 24-bit mode on Channel 0 00 = 16 bit mode on both channels (default) Reserved: Maintain as `0'
bit 5-4
bit 3-2
bit 1-0
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REGISTER B-6:
R/W-0
CONFIG2: CONFIGURATION REGISTER 2 (ADDRESS 0x0B)
R/W-0 R/W-0 R/W-0 R/W-1 DITHER<1> R/W-1 DITHER<0> R/W-0 VREFEXT r-0 r bit 0 r = Reserved bit W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown
RESET_CH1 RESET_CH0 SHUTDOWN SHUTDOWN <1> <0> bit 7 Legend: R = Readable bit -n = Value at POR bit 7-6
RESET<1:0>: Reset Mode Setting for ADCs bits 11 = Both CH0 and CH1 ADC are in Reset mode 10 = CH1 ADC in Reset mode 01 = CH0 ADC in Reset mode 00 = Neither Channel in Reset mode (default) SHUTDOWN<1:0>: Shutdown Mode Setting for ADCs bits 11 = Both CH0 and CH1 ADC are in Shutdown 10 = CH1 ADC is in Shutdown 01 = CH0 ADC is in Shutdown 00 = Neither Channel in Shutdown(default) DITHER<1:0>: Control for Dithering Circuit bits 11 = Both CH0 and CH1 ADC have dithering circuit applied (default) 10 = Only CH1 ADC has dithering circuit applied 01 = Only CH0 ADC has dithering circuit applied 00 = Neither channel has dithering circuit applied VREFEXT: Internal Voltage Reference Shutdown Control bit 1 = Internal Voltage reference disabled; an external voltage reference must be placed between REFIN+/OUT and REFIN0 = Internal voltage reference enabled (default) Reserved: Resets as `0'; program as `1' after any Reset event
bit 5-4
bit 3-2
bit 1
bit 0
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NOTES:
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INDEX
A
A/D A/D Converter Interrupt, Configuring ........................ 277 Acquisition Requirements ......................................... 278 ADCAL Bit................................................................. 281 ADCON0 Register..................................................... 273 ADCON1 Register..................................................... 273 ADCON2 Register..................................................... 273 ADRESH Register............................................. 273, 276 ADRESL Register ..................................................... 273 Analog Port Pins, Configuring................................... 279 Associated Registers ................................................ 281 Configuring the Module............................................. 277 Conversion Clock (TAD) ............................................ 279 Conversion Status (GO/DONE Bit) ........................... 276 Conversions .............................................................. 280 Converter Calibration ................................................ 281 Converter Characteristics ......................................... 421 Operation in Power-Managed Modes ....................... 281 Overview ................................................................... 273 Selecting and Configuring Automatic Acquisition Time ............................................... 279 Special Event Trigger (CCP)..................................... 280 Use of the CCP2 Trigger........................................... 280 Absolute Maximum Ratings .............................................. 389 AC (Timing) Characteristics .............................................. 404 Load Conditions for Device Timing Specifications.................................................... 405 Parameter Symbology .............................................. 404 Temperature and Voltage Specifications .................. 405 Timing Conditions ..................................................... 405 ACKSTAT ......................................................................... 229 ACKSTAT Status Flag ...................................................... 229 ADCAL Bit ......................................................................... 281 ADCON0 Register............................................................. 273 GO/DONE Bit............................................................ 276 ADCON1 Register............................................................. 273 ADCON2 Register............................................................. 273 ADDFSR ........................................................................... 377 ADDLW ............................................................................. 340 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART). See AUSART. ADDULNK ......................................................................... 377 ADDWF ............................................................................. 340 ADDWFC .......................................................................... 341 ADRESH Register............................................................. 273 ADRESL Register ..................................................... 273, 276 AFE Analog Inputs ............................................................ 284 Block Diagram........................................................... 435 Boost Mode............................................................... 444 Data Ready Pin (DR) ................................................ 454 Delta-Sigma ADC Architecture ................................. 284 Block Diagram .................................................. 444 Delta-Sigma Modulator ............................................. 444 Electrical Characteristics................................... 423-425 External Voltage Reference ...................................... 447 Internal Clock Chain.................................................. 449 Internal Registers...................................................... 456 Internal Voltage Reference ............................... 284, 447 Output Coding........................................................... 445 Output Data Rates (table) ......................................... 439 Phase Delay Block............................................ 284, 448 Power-On Reset ....................................................... 447 Programmable Gain Amplifiers................................. 284 Register Map .................................................... 285, 456 Registers CONFIG1.......................................................... 462 CONFIG2.......................................................... 463 DATA_CHn....................................................... 457 GAIN................................................................. 459 PHASE ............................................................. 458 STATUS/COM .................................................. 461 Required Connections .............................................. 287 Resolution................................................................. 446 Serial Interface ................................................. 286, 449 Continuous Communication ............................. 452 Serial Interface Characteristics................................. 426 SINC3 Filter ...................................................... 284, 444 Terminology...................................................... 438-443 Using ........................................................................ 288 Voltage Reference.................................................... 447 Analog-to-Digital Converter. See A/D. ANDLW............................................................................. 341 ANDWF............................................................................. 342 Assembler MPASM Assembler .................................................. 386 AUSART Asynchronous Mode................................................. 264 Associated Registers, Receive......................... 267 Associated Registers, Transmit........................ 265 Receiver ........................................................... 266 Setting up 9-Bit Mode with Address Detect......................................... 266 Transmitter ....................................................... 264 Baud Rate Generator (BRG) .................................... 262 Associated Registers........................................ 262 Baud Rate Error, Calculating............................ 262 Baud Rates, Asynchronous Modes .................. 263 High Baud Rate Select (BRGH Bit) .................. 262 Operation in Power-Managed Modes............... 262 Sampling .......................................................... 262 Synchronous Master Mode....................................... 268 Associated Registers, Receive......................... 270 Associated Registers, Transmit........................ 269 Reception ......................................................... 270 Transmission .................................................... 268 Synchronous Slave Mode......................................... 271 Associated Registers, Receive......................... 272 Associated Registers, Transmit........................ 271 Reception ......................................................... 272 Transmission .................................................... 271
B
Baud Rate Generator ....................................................... 225 BC..................................................................................... 342 BCF .................................................................................. 343 BF ..................................................................................... 229 BF Status Flag .................................................................. 229 Bias Generation (LCD) Charge Pump Design Considerations ...................... 177 Block Diagrams A/D............................................................................ 276 AFE, Required Connections ..................................... 287 Analog Input Model................................................... 277 AUSART Receive ..................................................... 266 AUSART Transmit .................................................... 264
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Baud Rate Generator ................................................ 225 Capture Mode Operation .......................................... 160 Comparator Analog Input Model ............................... 297 Comparator I/O Operating Modes............................. 294 Comparator Output ................................................... 296 Comparator Voltage Reference ................................ 300 Comparator Voltage Reference Output Buffer Example ................................................. 301 Compare Mode Operation ........................................ 161 Connections for On-Chip Voltage Regulator............. 327 CTMU........................................................................ 303 CTMU Current Source Calibration Circuit ................. 306 CTMU Typical Connections and Internal Configuration for Pulse Delay Generation ........ 314 CTMU Typical Connections and Internal Configuration for Time Measurement ............... 313 Delta-Sigma ADC (Simplified)................................... 444 Device Clock ............................................................... 25 Dual-Channel AFE .................................................... 435 EUSART Receive ..................................................... 250 EUSART Transmit .................................................... 248 External Power-on Reset Circuit (Slow VDD Power-up).......................................... 45 Fail-Safe Clock Monitor (FSCM) ............................... 329 Generic I/O Port Operation ....................................... 105 Interrupt Logic ............................................................. 90 LCD Clock Generation .............................................. 172 LCD Driver Module ................................................... 167 LCD Regulator Connections (M0 and M1) ................ 174 MSSP (I2C Master Mode) ......................................... 223 MSSP (I2C Mode) ..................................................... 204 MSSP (SPI Mode)..................................................... 195 On-Chip Reset Circuit ................................................. 43 PIC18F8XJ72.............................................................. 12 PLL.............................................................................. 30 PWM Operation (Simplified) ..................................... 163 Reads From Flash Program Memory.......................... 81 Resistor Ladder Connections for M2 Configuration............................................... 175 Resistor Ladder Connections for M3 Configuration............................................... 176 RTCC ........................................................................ 139 Single Comparator .................................................... 295 SPI Master/Slave Connection ................................... 199 Table Read Operation................................................. 77 Table Write Operation ................................................. 78 Table Writes to Flash Program Memory ..................... 83 Timer0 in 16-Bit Mode............................................... 124 Timer0 in 8-Bit Mode................................................. 124 Timer1 (16-Bit Read/Write Mode) ............................. 128 Timer1 (8-Bit Mode) .................................................. 128 Timer2 ....................................................................... 134 Timer3 (16-Bit Read/Write Mode) ............................. 136 Timer3 (8-Bit Mode) .................................................. 136 Watchdog Timer........................................................ 325 BN ..................................................................................... 343 BNC................................................................................... 344 BNN................................................................................... 344 BNOV ................................................................................ 345 BNZ ................................................................................... 345 BOR. See Brown-out Reset. BOV................................................................................... 348 BRA................................................................................... 346 Break Character (12-Bit) Transmit and Receive ............... 253 BRG. See Baud Rate Generator. BRGH Bit TXSTA1 Register...................................................... 243 TXSTA2 Register...................................................... 262 Brown-out Reset (BOR)...................................................... 45 and On-Chip Voltage Regulator................................ 328 Detecting .................................................................... 45 BSF................................................................................... 346 BTFSC .............................................................................. 347 BTFSS .............................................................................. 347 BTG .................................................................................. 348 BZ ..................................................................................... 349
C
C Compilers MPLAB C18 .............................................................. 386 CALL................................................................................. 349 CALLW ............................................................................. 378 Capture (CCP Module) ..................................................... 160 Associated Registers ................................................ 162 CCP Pin Configuration.............................................. 160 CCPR2H:CCPR2L Registers.................................... 160 Software Interrupt ..................................................... 160 Timer1/Timer3 Mode Selection................................. 160 Capture/Compare/PWM (CCP) ........................................ 157 Capture Mode. See Capture. CCP Mode and Timer Resources............................. 158 CCPRxH Register..................................................... 158 CCPRxL Register ..................................................... 158 Compare Mode. See Compare. Configuration ............................................................ 158 Interaction of CCP1 and CCP2 for Timer Resources .............................................. 159 Interconnect Configurations...................................... 158 Charge Time Measurement Unit (CTMU)......................... 303 Associated Registers ................................................ 317 Calibrating the Module.............................................. 305 Creating a Delay ....................................................... 314 Effects of a Reset ..................................................... 314 Measuring Capacitance with the CTMU ................... 311 Measuring Time ........................................................ 313 Module Initialization .................................................. 305 Operation .................................................................. 304 During Sleep and Idle Modes ........................... 314 CLKIA ................................................................................. 20 Clock Sources..................................................................... 27 Default System Clock on Reset .................................. 28 Selection Using OSCCON Register............................ 28 CLRF ................................................................................ 350 CLRWDT .......................................................................... 350 Code Examples 16 x 16 Signed Multiply Routine ................................. 88 16 x 16 Unsigned Multiply Routine ............................. 88 8 x 8 Signed Multiply Routine ..................................... 87 8 x 8 Unsigned Multiply Routine ................................. 87 AFE Clock Source and Interrupt Configuration......... 290 Capacitance Calibration Routine .............................. 310 Changing Between Capture Prescalers.................... 160 Computed GOTO Using an Offset Value.................... 59 Current Calibration Routine ...................................... 308 Erasing a Flash Program Memory Row...................... 82 Fast Register Stack .................................................... 59 How to Clear RAM (Bank 1) Using Indirect Addressing . 71
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Implementing a Real-Time Clock Using a Timer1 Interrupt Service ................................... 131 Initializing PORTA..................................................... 106 Initializing PORTB..................................................... 108 Initializing PORTC..................................................... 111 Initializing PORTD..................................................... 114 Initializing PORTE..................................................... 116 Initializing PORTF ..................................................... 118 Initializing PORTG .................................................... 121 Initializing the MSSP Module for Using the AFE....... 290 Loading the SSPBUF (SSPSR) Register.................. 198 Overall Structure for Using the AFE.......................... 289 Reading a Flash Program Memory Word ................... 81 Reading Data From AFE During Interrupt................. 292 Routine for Capacitive Touch Switch ........................ 312 Saving STATUS, WREG and BSR Registers in RAM .............................................. 104 Setting the RTCWREN Bit ........................................ 151 Setup for CTMU Calibration Routines....................... 307 Single-Word Write to Flash Program Memory ............ 85 Writing and Reading AFE Registers Through MSSP ................................................. 291 Writing to Flash Program Memory .............................. 84 Code Protection ................................................................ 319 COMF ............................................................................... 351 Comparator ....................................................................... 293 Analog Input Connection Considerations.................. 297 Associated Registers ................................................ 297 Configuration............................................................. 294 Effects of a Reset...................................................... 296 Interrupts................................................................... 296 Operation .................................................................. 295 Operation During Sleep ............................................ 296 Outputs ..................................................................... 295 Reference ................................................................. 295 External Signal.................................................. 295 Internal Signal ................................................... 295 Response Time......................................................... 295 Comparator Specifications ................................................ 403 Comparator Voltage Reference ........................................ 299 Accuracy and Error ................................................... 300 Associated Registers ................................................ 301 Configuring................................................................ 299 Connection Considerations....................................... 300 Effects of a Reset...................................................... 300 Operation During Sleep ............................................ 300 Compare (CCP Module) ................................................... 161 Associated Registers ................................................ 162 CCP Pin Configuration.............................................. 161 CCPR2 Register ....................................................... 161 Software Interrupt ..................................................... 161 Special Event Trigger................................ 137, 161, 280 Timer1/Timer3 Mode Selection................................. 161 Computed GOTO ................................................................ 59 Configuration Bits.............................................................. 319 Configuration Mismatch (CM) ............................................. 45 Configuration Register Protection ..................................... 331 Core Features Easy Migration .............................................................. 9 Extended Instruction Set............................................... 9 Memory Options............................................................ 9 nanoWatt Technology ................................................... 9 Oscillator Options and Features ................................... 9 CPFSEQ ........................................................................... 351 CPFSGT ........................................................................... 352 CPFSLT ............................................................................ 352 Crystal Oscillator/Ceramic Resonator................................. 29 Customer Change Notification Service............................. 475 Customer Notification Service .......................................... 475 Customer Support............................................................. 475
D
Data Addressing Modes ..................................................... 71 Comparing Addressing Modes with the Extended Instruction Set Enabled ...................... 75 Direct .......................................................................... 71 Indexed Literal Offset ................................................. 74 BSR .................................................................... 76 Instructions Affected ........................................... 74 Mapping Access Bank ........................................ 76 Indirect........................................................................ 71 Inherent and Literal..................................................... 71 Data Memory ...................................................................... 62 Access Bank............................................................... 64 Bank Select Register (BSR) ....................................... 62 Extended Instruction Set ............................................ 74 General Purpose Registers ........................................ 64 Memory Maps PIC18F86J72/87J72 Devices ............................. 63 Special Function Registers................................. 65 Special Function Registers......................................... 65 DAW ................................................................................. 353 DC Characteristics............................................................ 400 Power-Down and Supply Current ............................. 392 Supply Voltage ......................................................... 391 DCFSNZ ........................................................................... 354 DECF ................................................................................ 353 DECFSZ ........................................................................... 354 Default System Clock ......................................................... 28 Details on Individual Family Members ................................ 11 Development Support ....................................................... 385 Device Overview................................................................... 9 Features (80-Pin Devices).......................................... 11 Direct Addressing ............................................................... 72 Dual-Channel Analog Front End (AFE) ............................ 434 Dual-Channel Analog Front End (AFE). See AFE.
E
Effect on Standard PIC18 Instructions.............................. 381 Effects of Power-Managed Modes on Various Clock Sources ............................................................ 33 Electrical Characteristics .................................................. 389 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART). See EUSART. ENVREG Pin .................................................................... 327 Equations A/D Acquisition Time ................................................ 278 A/D Minimum Charging Time ................................... 278 Calculating the Minimum Required Acquisition Time ............................................... 278 LCD Static and Dynamic Current ............................. 177 Errata .................................................................................... 7 EUSART Asynchronous Mode................................................. 248 12-Bit Break Transmit and Receive.................. 253 Associated Registers, Receive......................... 251 Associated Registers, Transmit........................ 249 Auto-Wake-up on Sync Break Character ......... 252 Receiver ........................................................... 250 Setting up 9-Bit Mode with Address Detect ...... 250 Transmitter ....................................................... 248
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Baud Rate Generator (BRG)..................................... 243 Auto-Baud Rate Detect ..................................... 246 Baud Rate Error, Calculating ............................ 243 Baud Rates, Associated Registers ................... 243 Baud Rates, Asynchronous Modes................... 244 High Baud Rate Select (BRGH Bit)................... 243 Operation in Power-Managed Modes ............... 243 Sampling ........................................................... 243 Synchronous Master Mode ....................................... 254 Associated Registers, Receive ......................... 256 Associated Registers, Transmit ........................ 255 Reception.......................................................... 256 Transmission..................................................... 254 Synchronous Slave Mode ......................................... 257 Associated Registers, Receive ......................... 258 Associated Registers, Transmit ........................ 257 Reception.......................................................... 258 Transmission..................................................... 257 Extended Instruction Set ADDFSR ................................................................... 377 ADDULNK ................................................................. 377 CALLW...................................................................... 378 MOVSF ..................................................................... 378 MOVSS ..................................................................... 379 PUSHL ...................................................................... 379 SUBFSR ................................................................... 380 SUBULNK ................................................................. 380 External Oscillator Modes Clock Input (EC and ECPLL Modes) .......................... 30 HS ............................................................................... 29
H
Hardware Multiplier............................................................. 87 8 x 8 Multiplication Algorithms .................................... 87 Operation .................................................................... 87 Performance Comparison (table)................................ 87
I
I/O Ports............................................................................ 105 Input Voltage Considerations.................................... 105 Open-Drain Outputs.................................................. 106 Output Pin Drive ....................................................... 105 Pin Capabilities ......................................................... 105 Pull-up Configuration ................................................ 106 I2C Mode (MSSP) ............................................................. 204 Acknowledge Sequence Timing ............................... 232 Associated Registers ................................................ 238 Baud Rate Generator ............................................... 225 Bus Collision During a Repeated Start Condition................... 236 During a Stop Condition ................................... 237 Clock Arbitration ....................................................... 226 Clock Stretching........................................................ 218 10-Bit Slave Receive Mode (SEN = 1) ............. 218 10-Bit Slave Transmit Mode ............................. 218 7-Bit Slave Receive Mode (SEN = 1) ............... 218 7-Bit Slave Transmit Mode ............................... 218 Clock Synchronization and the CKP Bit.................... 219 Effects of a Reset ..................................................... 233 General Call Address Support .................................. 222 I2C Clock Rate w/BRG.............................................. 225 Master Mode............................................................. 223 Baud Rate Generator ....................................... 225 Operation.......................................................... 224 Reception ......................................................... 229 Repeated Start Condition Timing ..................... 228 Start Condition Timing ...................................... 227 Transmission .................................................... 229 Multi-Master Communication, Bus Collision and Arbitration .................................................. 233 Multi-Master Mode .................................................... 233 Operation .................................................................. 209 Read/Write Bit Information (R/W Bit) ................ 209, 211 Registers .................................................................. 204 Serial Clock (SCK/SCL)............................................ 211 Slave Mode............................................................... 209 Address Masking .............................................. 210 Addressing........................................................ 209 Reception ......................................................... 211 Transmission .................................................... 211 Sleep Operation........................................................ 233 Stop Condition Timing .............................................. 232 INCF ................................................................................. 355 INCFSZ............................................................................. 356 In-Circuit Debugger........................................................... 331 In-Circuit Serial Programming (ICSP)....................... 319, 331 Indexed Literal Offset Addressing and Standard PIC18 Instructions.............................. 381 Indexed Literal Offset Mode.............................................. 381 Indirect Addressing ............................................................. 72 INFSNZ............................................................................. 356 Initialization Conditions for all Registers ....................... 49-54 Instruction Cycle ................................................................. 60 Clocking Scheme........................................................ 60 Flow/Pipelining............................................................ 60
F
Fail-Safe Clock Monitor............................................. 319, 329 Exiting Fail-Safe Operation ....................................... 330 Interrupts in Power-Managed Modes ........................ 330 POR or Wake-up From Sleep ................................... 330 WDT During Oscillator Failure .................................. 329 Fast Register Stack............................................................. 59 Firmware Instructions........................................................ 333 Flash Configuration Words................................................ 319 Flash Program Memory....................................................... 77 Associated Registers .................................................. 86 Control Registers ........................................................ 78 EECON1 and EECON2 ...................................... 78 TABLAT (Table Latch) Register.......................... 80 TBLPTR (Table Pointer) Register ....................... 80 Erase Sequence ......................................................... 82 Erasing ........................................................................ 82 Operation During Code-Protect .................................. 86 Reading....................................................................... 81 Table Pointer Boundaries Based on Operation......................... 80 Table Pointer Boundaries ........................................... 80 Table Reads and Table Writes ................................... 77 Write Sequence .......................................................... 83 Write Sequence (Word Programming) ........................ 85 Writing ......................................................................... 83 Unexpected Termination..................................... 86 Write Verify ......................................................... 86 FSCM. See Fail-Safe Clock Monitor.
G
GOTO................................................................................ 355
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Instruction Set ................................................................... 333 ADDLW ..................................................................... 340 ADDWF..................................................................... 340 ADDWF (Indexed Literal Offset Mode) ..................... 382 ADDWFC .................................................................. 341 ANDLW ..................................................................... 341 ANDWF..................................................................... 342 BC ............................................................................. 342 BCF........................................................................... 343 BN ............................................................................. 343 BNC .......................................................................... 344 BNN .......................................................................... 344 BNOV........................................................................ 345 BNZ........................................................................... 345 BOV .......................................................................... 348 BRA........................................................................... 346 BSF ........................................................................... 346 BSF (Indexed Literal Offset Mode) ........................... 382 BTFSC ...................................................................... 347 BTFSS ...................................................................... 347 BTG........................................................................... 348 BZ ............................................................................. 349 CALL ......................................................................... 349 CLRF......................................................................... 350 CLRWDT................................................................... 350 COMF ....................................................................... 351 CPFSEQ ................................................................... 351 CPFSGT ................................................................... 352 CPFSLT .................................................................... 352 DAW.......................................................................... 353 DCFSNZ ................................................................... 354 DECF ........................................................................ 353 DECFSZ.................................................................... 354 Extended Instructions ............................................... 376 Considerations when Enabling ......................... 381 Syntax ............................................................... 376 Use with MPLAB IDE Tools .............................. 383 General Format......................................................... 336 GOTO ....................................................................... 355 INCF.......................................................................... 355 INCFSZ ..................................................................... 356 INFSNZ ..................................................................... 356 IORLW ...................................................................... 357 IORWF ...................................................................... 357 LFSR......................................................................... 358 MOVF........................................................................ 358 MOVFF ..................................................................... 359 MOVLB ..................................................................... 359 MOVLW .................................................................... 360 MOVWF .................................................................... 360 MULLW ..................................................................... 361 MULWF..................................................................... 361 NEGF ........................................................................ 362 NOP .......................................................................... 362 Opcode Field Descriptions........................................ 334 POP .......................................................................... 363 PUSH ........................................................................ 363 RCALL ...................................................................... 364 RESET ...................................................................... 364 RETFIE ..................................................................... 365 RETLW ..................................................................... 365 RETURN ................................................................... 366 RLCF......................................................................... 366 RLNCF ...................................................................... 367 RRCF ........................................................................ 367 RRNCF ..................................................................... 368 SETF ........................................................................ 368 SETF (Indexed Literal Offset Mode) ......................... 382 SLEEP ...................................................................... 369 Standard Instructions................................................ 333 SUBFWB .................................................................. 369 SUBLW..................................................................... 370 SUBWF..................................................................... 370 SUBWFB .................................................................. 371 SWAPF..................................................................... 371 TBLRD...................................................................... 372 TBLWT ..................................................................... 373 TSTFSZ .................................................................... 374 XORLW .................................................................... 374 XORWF .................................................................... 375 INTCON Register RBIF Bit .................................................................... 108 Inter-Integrated Circuit. See I2C Mode. Internal LCD Voltage Regulator Specifications................. 403 Internal Oscillator Block ...................................................... 31 Adjustment.................................................................. 32 INTIO Modes .............................................................. 31 INTOSC Frequency Drift ............................................ 32 INTOSC Output Frequency ........................................ 32 INTPLL Modes............................................................ 31 Internal RC Oscillator Use with WDT........................................................... 325 Internal Voltage Regulator Specifications......................... 403 Internet Address ............................................................... 475 Interrupt Sources .............................................................. 319 A/D Conversion Complete ........................................ 277 Capture Complete (CCP) ......................................... 160 Compare Complete (CCP) ....................................... 161 Interrupt-on-Change (RB7:RB4)............................... 108 TMR0 Overflow......................................................... 125 TMR2 to PR2 Match (PWM)..................................... 163 TMR3 Overflow......................................................... 137 Interrupts ............................................................................ 89 During, Context Saving............................................. 104 Interrupt-on-Change (RB7:RB4) Flag (RBIF Bit).......................................................... 108 INTx Pin.................................................................... 104 PORTB, Interrupt-on-Change................................... 104 TMR0........................................................................ 104 INTOSC, INTRC. See Internal Oscillator Block. IORLW .............................................................................. 357 IORWF.............................................................................. 357
L
LCD Associated Registers................................................ 193 Bias Generation........................................................ 173 Bias Configurations .......................................... 174 M0 and M1 ............................................... 174 M2 ............................................................ 175 M3 ............................................................ 176 Bias Types........................................................ 173 Voltage Regulator............................................. 173 Charge Pump ................................................... 174, 177 Clock Source Selection ............................................ 172 Configuring the Module ............................................ 192 Frame Frequency ..................................................... 178 Interrupts .................................................................. 190 LCDCON Register .................................................... 168 LCDDATA Register .................................................. 168
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LCDPS Register........................................................ 168 LCDREG Register..................................................... 168 LCDSE Register........................................................ 168 Multiplex Types ......................................................... 177 Operation During Sleep ............................................ 191 Pixel Control.............................................................. 177 Segment Enables...................................................... 177 Waveform Generation ............................................... 178 LCD Driver .......................................................................... 10 LCDCON Register............................................................. 168 LCDDATA Register ........................................................... 168 LCDPS Register................................................................ 168 LCDREG Register............................................................. 168 LCDSE Register................................................................ 168 LFSR ................................................................................. 358 Liquid Crystal Display (LCD) Driver .................................. 167 Low-Voltage Detection ...................................................... 327 Oscillator Transitions .......................................................... 28 Oscillator, Timer1...................................................... 127, 137 Oscillator, Timer3.............................................................. 135
P
Packaging ......................................................................... 429 Details....................................................................... 430 Marking ..................................................................... 429 Pin Functions AVDD........................................................................... 19 AVSS ........................................................................... 19 CH0+/CH0- ................................................................. 20 CH1+/CH1- ................................................................. 20 CSA ............................................................................ 20 DR .............................................................................. 20 ENVREG .................................................................... 19 MCLR ......................................................................... 13 OSC1/CLKI/RA7 ......................................................... 13 OSC2/CLKO/RA6 ....................................................... 13 RA0/AN0..................................................................... 13 RA1/AN1/SEG18 ........................................................ 13 RA2/AN2/VREF- .......................................................... 13 RA3/AN3/VREF+ ......................................................... 13 RA4/T0CKI/SEG14 ..................................................... 13 RA5/AN4/SEG15 ........................................................ 13 RB0/INT0/SEG30 ....................................................... 14 RB1/INT1/SEG8 ......................................................... 14 RB2/INT2/SEG9/CTED1............................................. 14 RB3/INT3/SEG10/CTED2........................................... 14 RB4/KBI0/SEG11 ....................................................... 14 RB5/KBI1/SEG29 ....................................................... 14 RB6/KBI2/PGC ........................................................... 14 RB7/KBI3/PGD ........................................................... 14 RC0/T1OSO/T13CKI .................................................. 15 RC1/T1OSI/CCP2/SEG32 .......................................... 15 RC2/CCP1/SEG13 ..................................................... 15 RC3/SCK/SCL/SEG17................................................ 15 RC4/SDI/SDA/SEG16................................................. 15 RC5/SDO/SEG12 ....................................................... 15 RC6/TX1/CK1/SEG27 ................................................ 15 RC7/RX1/DT1/SEG28 ................................................ 15 RD0/SEG0/CTPLS ..................................................... 16 RD0/SEG1 .................................................................. 16 RD2/SEG2 .................................................................. 16 RD3/SEG3 .................................................................. 16 RD4/SEG4 .................................................................. 16 RD5/SEG5 .................................................................. 16 RD6/SEG6 .................................................................. 16 RD7/SEG7 .................................................................. 16 RE0/LCDBIAS1 .......................................................... 17 RE1/LCDBIAS2 .......................................................... 17 RE2/LCDBIAS3 .......................................................... 17 RE3/COM0 ................................................................. 17 RE4/COM1 ................................................................. 17 RE5/COM2 ................................................................. 17 RE6/COM3 ................................................................. 17 RE7/CCP2/SEG31...................................................... 17 REFIN-........................................................................ 20 REFIN+/OUT .............................................................. 20 RESET........................................................................ 20 RF1/AN6/C2OUT/SEG19 ........................................... 18 RF2/AN7/C1OUT/SEG20 ........................................... 18 RF3/AN8/SEG21/C2INB............................................. 18 RF4/AN9/SEG22/C2INA............................................. 18 RF5/AN10/CVREF/SEG23/C1INB ............................... 18 RF6/AN11/SEG24/C1INA........................................... 18
M
Master Clear (MCLR) .......................................................... 45 Master Synchronous Serial Port (MSSP). See MSSP. Memory Organization.......................................................... 55 Data Memory .............................................................. 62 Program Memory ........................................................ 55 Memory Programming Requirements ............................... 402 Microchip Internet Web Site .............................................. 475 MOVF................................................................................ 358 MOVFF.............................................................................. 359 MOVLB.............................................................................. 359 MOVLW............................................................................. 360 MOVSF ............................................................................. 378 MOVSS ............................................................................. 379 MOVWF ............................................................................ 360 MPLAB ASM30 Assembler, Linker, Librarian ................... 386 MPLAB Integrated Development Environment Software............................................... 385 MPLAB PM3 Device Programmer..................................... 388 MPLAB REAL ICE In-Circuit Emulator System................. 387 MPLINK Object Linker/MPLIB Object Librarian ................ 386 MSSP ACK Pulse......................................................... 209, 211 Control Registers (general) ....................................... 195 Module Overview ...................................................... 195 SSPBUF Register ..................................................... 200 SSPSR Register ....................................................... 200 MULLW ............................................................................. 361 MULWF ............................................................................. 361
N
NEGF ................................................................................ 362 NOP .................................................................................. 362
O
Oscillator Configuration....................................................... 25 EC ............................................................................... 25 ECPLL......................................................................... 25 HS ............................................................................... 25 HSPLL......................................................................... 25 Internal Oscillator Block .............................................. 31 INTIO1 ........................................................................ 25 INTIO2 ........................................................................ 25 INTPLL1 ...................................................................... 25 INTPLL2 ...................................................................... 25 Oscillator Selection ........................................................... 319 Oscillator Start-up Timer (OST) .......................................... 33 Oscillator Switching............................................................. 27
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RF7/AN5/SS/SEG25................................................... 18 RG0/LCDBIAS0 .......................................................... 19 RG1/TX2/CK2 ............................................................. 19 RG2/RX2/DT2/VLCAP1................................................ 19 RG3/VLCAP2................................................................ 19 RG4/SEG26/RTCC ..................................................... 19 SAVDD......................................................................... 20 SAVSS ......................................................................... 20 SCKA .......................................................................... 20 SDIA............................................................................ 20 SDOA.......................................................................... 20 SVDD ........................................................................... 20 SVSS ........................................................................... 20 VDD ............................................................................. 19 VDDCORE/VCAP............................................................ 19 VSS.............................................................................. 19 Pinout I/O Descriptions ....................................................... 13 PLL...................................................................................... 30 HSPLL and ECPLL Oscillator Modes ......................... 30 Use with INTOSC........................................................ 30 POP .................................................................................. 363 POR. See Power-on Reset. PORTA Associated Registers ................................................ 107 LATA Register........................................................... 106 PORTA Register ....................................................... 106 TRISA Register ......................................................... 106 PORTB Associated Registers ................................................ 110 LATB Register........................................................... 108 PORTB Register ....................................................... 108 RB7:RB4 Interrupt-on-Change Flag (RBIF Bit)......... 108 TRISB Register ......................................................... 108 PORTC Associated Registers ................................................ 113 LATC Register .......................................................... 111 PORTC Register ....................................................... 111 RC3/SCK/SCL/SEG17 Pin........................................ 211 TRISC Register......................................................... 111 PORTD Associated Registers ................................................ 115 LATD Register .......................................................... 114 PORTD Register ....................................................... 114 TRISD Register......................................................... 114 PORTE Associated Registers ................................................ 117 LATE Register........................................................... 116 PORTE Register ....................................................... 116 TRISE Register ......................................................... 116 PORTF Associated Registers ................................................ 120 LATF Register........................................................... 118 PORTF Register ....................................................... 118 TRISF Register ......................................................... 118 PORTG Associated Registers ................................................ 122 LATG Register .......................................................... 121 PORTG Register....................................................... 121 TRISG Register......................................................... 121 Power-Managed Modes ...................................................... 35 and SPI Operation .................................................... 203 Clock Sources............................................................. 35 Clock Transitions and Status Indicators...................... 36 Entering....................................................................... 35 Exiting Idle and Sleep Modes ..................................... 41 By Interrupt ......................................................... 41 By Reset ............................................................. 41 By WDT Time-out ............................................... 41 Without an Oscillator Start-up Delay .................. 41 Idle Modes .................................................................. 39 PRI_IDLE ........................................................... 40 RC_IDLE ............................................................ 41 SEC_IDLE .......................................................... 40 Multiple Sleep Commands.......................................... 36 Run Modes ................................................................. 36 PRI_RUN............................................................ 36 RC_RUN............................................................. 38 SEC_RUN .......................................................... 36 Selecting..................................................................... 35 Sleep Mode ................................................................ 39 OSC1 and OSC2 Pin States............................... 33 Summary (table) ......................................................... 35 Power-on Reset (POR)....................................................... 45 Power-up Delays ................................................................ 33 Power-up Timer (PWRT) .............................................. 33, 46 Time-out Sequence .................................................... 46 Prescaler, Capture............................................................ 160 Prescaler, Timer0 ............................................................. 125 Prescaler, Timer2 ............................................................. 164 PRI_IDLE Mode.................................................................. 40 PRI_RUN Mode .................................................................. 36 Program Counter ................................................................ 57 PCL, PCH and PCU Registers ................................... 57 PCLATH and PCLATU Registers ............................... 57 Program Memory Extended Instruction Set ............................................ 73 Flash Configuration Words ......................................... 56 Hard Memory Vectors................................................. 56 Instructions ................................................................. 61 Two-Word ........................................................... 61 Interrupt Vector........................................................... 56 Look-up Tables........................................................... 59 Memory Maps............................................................. 55 Hard Vectors and Configuration Words.............. 56 Reset Vector............................................................... 56 Program Verification and Code Protection ....................... 331 Programming, Device Instructions.................................... 333 Pulse-Width Modulation. See PWM (CCP Module). PUSH................................................................................ 363 PUSH and POP Instructions............................................... 58 PUSHL.............................................................................. 379 PWM (CCP Module) Associated Registers................................................ 165 Duty Cycle ................................................................ 164 Example Frequencies/Resolutions ........................... 164 Period ....................................................................... 163 Setup for PWM Operation ........................................ 165 TMR2 to PR2 Match ................................................. 163
Q
Q Clock ............................................................................. 164
R
RAM. See Data Memory. RC_IDLE Mode................................................................... 41 RC_RUN Mode................................................................... 38 RCALL .............................................................................. 364 RCON Register Bit Status During Initialization..................................... 48
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Reader Response ............................................................. 476 Real-Time Clock and Calendar Operation .................................................................. 149 Registers ................................................................... 140 Real-Time Clock and Calendar (RTCC)............................ 139 Register File ........................................................................ 64 Register File Summary.................................................. 66-69 Registers ADCON0 (A/D Control 0) .......................................... 273 ADCON1 (A/D Control 1) .......................................... 274 ADCON2 (A/D Control 2) .......................................... 275 ALRMCFG (Alarm Configuration) ............................. 143 ALRMDAY (Alarm Day Value) .................................. 147 ALRMHR (Alarm Hours Value) ................................. 148 ALRMMIN (Alarm Minutes Value) ............................. 148 ALRMMNTH (Alarm Month Value)............................ 147 ALRMRPT (Alarm Calibration) .................................. 144 ALRMSEC (Alarm Seconds Value)........................... 148 ALRMWD (Alarm Weekday Value) ........................... 147 BAUDCON1 (Baud Rate Control) ............................. 242 CCPxCON (CCPx Control) ....................................... 157 CMCON (Comparator Control) ................................. 293 CONFIG1 (AFE Configuration 1) .............................. 462 CONFIG1H (Configuration 1 High) ........................... 321 CONFIG1L (Configuration 1 Low)............................. 321 CONFIG2 (AFE Configuration 2) .............................. 463 CONFIG2H (Configuration 2 High) ........................... 323 CONFIG2L (Configuration 2 Low)............................. 322 CONFIG3H (Configuration 3 High) ........................... 324 CONFIG3L (Configuration 3 High) ............................ 323 CTMUCONH (CTMU Control High) .......................... 315 CTMUCONL (CTMU Control Low)............................ 316 CTMUICON (CTMU Current Control) ....................... 317 CVRCON (Comparator Voltage Reference Control)............................................ 299 DATA_CHn (AFE Channel Output)........................... 457 DAY (Day Value)....................................................... 145 DEVID1 (Device ID Register 1)................................. 324 DEVID2 (Device ID Register 2)................................. 324 EECON1 (EEPROM Control 1)................................... 79 GAIN (AFE Gain Configuration) ................................ 459 HOUR (Hour Value) .................................................. 146 INTCON (Interrupt Control) ......................................... 91 INTCON2 (Interrupt Control 2) .................................... 92 INTCON3 (Interrupt Control 3) .................................... 93 IPR1 (Peripheral Interrupt Priority 1)......................... 100 IPR2 (Peripheral Interrupt Priority 2)......................... 101 IPR3 (Peripheral Interrupt Priority 3)......................... 102 LCDCON (LCD Control)............................................ 168 LCDDATAx (LCD Data) ............................................ 171 LCDPS (LCD Phase) ................................................ 169 LCDREG (LCD Voltage Regulator Control) .............. 173 LCDSEx (LCD Segment Enable) .............................. 170 MINUTE (Minute Value) ............................................ 146 MONTH (Month Value) ............................................. 145 OSCCON (Oscillator Control) ..................................... 26 OSCTUNE (Oscillator Tuning) .................................... 27 PADCFG1 (Pad Configuration) ................................. 142 PHASE (AFE Phase Delay) ...................................... 458 PIE1 (Peripheral Interrupt Enable 1) ........................... 97 PIE2 (Peripheral Interrupt Enable 2) ........................... 98 PIE3 (Peripheral Interrupt Enable 3) ........................... 99 PIR1 (Peripheral Interrupt Request (Flag) 1) .............. 94 PIR2 (Peripheral Interrupt Request (Flag) 2) .............. 95 PIR3 (Peripheral Interrupt Request (Flag) 3) .............. 96 RCON (Reset Control)........................................ 44, 103 RCSTA1 (EUSART Receive Status and Control)...................................................... 241 RCSTA2 (AUSART Receive Status and Control)...................................................... 261 Reserved .................................................................. 144 RTCCAL (RTCC Calibration).................................... 142 RTCCFG (RTCC Configuration) ............................... 141 SECOND (Second Value)......................................... 146 SSPCON1 (MSSP Control 1, I2C Mode) .................. 206 SSPCON1 (MSSP Control 1, SPI Mode).................. 197 SSPCON2 (MSSP Control 2, I2C Master Mode) ............................................. 207 SSPCON2 (MSSP Control 2, I2C Slave Mode) ........ 208 SSPSTAT (MSSP Status, I2C Mode) ....................... 205 SSPSTAT (MSSP Status, SPI Mode)....................... 196 STATUS ..................................................................... 70 STATUS/COM (AFE Status/Communications)......... 461 STKPTR (Stack Pointer)............................................. 58 T0CON (Timer0 Control) .......................................... 123 T1CON (Timer1 Control) .......................................... 127 T2CON (Timer2 Control) .......................................... 133 T3CON (Timer3 Control) .......................................... 135 TXSTA1 (EUSART Transmit Status and Control)...................................................... 240 TXSTA2 (AUSART Transmit Status and Control)...................................................... 260 WDTCON (Watchdog Timer Control) ....................... 326 WEEKDAY (Weekday Value) ................................... 145 YEAR (Year Value)................................................... 144 RESET .............................................................................. 364 Reset .................................................................................. 43 Brown-out Reset (BOR).............................................. 43 Configuration Mismatch (CM) ..................................... 43 MCLR Reset, During Power-Managed Modes ........... 43 MCLR Reset, Normal Operation................................. 43 Power-on Reset (POR)............................................... 43 RESET Instruction ...................................................... 43 Stack Full Reset.......................................................... 43 Stack Underflow Reset ............................................... 43 Watchdog Timer (WDT) Reset ................................... 43 Resets............................................................................... 319 Brown-out Reset (BOR)............................................ 319 Oscillator Start-up Timer (OST) ................................ 319 Power-on Reset (POR)............................................. 319 Power-up Timer (PWRT) .......................................... 319 RETFIE ............................................................................. 365 RETLW ............................................................................. 365 RETURN........................................................................... 366 Return Address Stack......................................................... 57 Return Stack Pointer (STKPTR) ......................................... 58 Revision History................................................................ 433 RLCF ................................................................................ 366 RLNCF .............................................................................. 367 RRCF ................................................................................ 367 RRNCF ............................................................................. 368 RTCC Alarm ........................................................................ 152 Configuring ....................................................... 152 Interrupt ............................................................ 154 Mask Settings ................................................... 153 Alarm Value Registers (ALRMVAL).......................... 147 Control Registers ...................................................... 141
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Operation Calibration......................................................... 152 Clock Source .................................................... 150 Digit Carry Rules............................................... 150 General Functionality ........................................ 151 Leap Year ......................................................... 151 Register Mapping.............................................. 151 ALRMVAL ................................................. 152 RTCVAL.................................................... 151 Safety Window for Register Reads and Writes................................................. 151 Write Lock ......................................................... 151 Register Interface...................................................... 149 Register Maps........................................................... 155 Reset......................................................................... 154 Device ............................................................... 154 Power-on Reset (POR) ..................................... 154 Sleep Mode............................................................... 154 Value Registers (RTCVAL) ....................................... 144 RTCEN Bit Write ............................................................... 149
T
Table Pointer Operations (table)......................................... 80 Table Reads/Table Writes .................................................. 59 TBLRD .............................................................................. 372 TBLWT ............................................................................. 373 Timer0 .............................................................................. 123 Associated Registers................................................ 125 Clock Source Select (T0CS Bit) ............................... 124 Operation.................................................................. 124 Overflow Interrupt ..................................................... 125 Prescaler .................................................................. 125 Switching Assignment ...................................... 125 Prescaler Assignment (PSA Bit)............................... 125 Prescaler Select (T0PS2:T0PS0 Bits) ...................... 125 Prescaler. See Prescaler, Timer0. Reads and Writes in 16-Bit Mode............................. 124 Source Edge Select (T0SE Bit) ................................ 124 Timer1 .............................................................................. 127 16-Bit Read/Write Mode ........................................... 129 Associated Registers................................................ 131 Interrupt .................................................................... 130 Operation.................................................................. 128 Oscillator........................................................... 127, 129 Layout Considerations...................................... 130 Oscillator, as Secondary Clock................................... 27 Resetting, Using the CCP Special Event Trigger .................................................... 130 TMR1H Register....................................................... 127 TMR1L Register ....................................................... 127 Use as a Clock Source ............................................. 129 Use as a Real-Time Clock ........................................ 130 Timer2 .............................................................................. 133 Associated Registers................................................ 134 Interrupt .................................................................... 134 Operation.................................................................. 133 Output....................................................................... 134 PR2 Register ............................................................ 163 TMR2 to PR2 Match Interrupt................................... 163 Timer3 .............................................................................. 135 16-Bit Read/Write Mode ........................................... 137 Associated Registers................................................ 137 Operation.................................................................. 136 Oscillator........................................................... 135, 137 Overflow Interrupt ..................................................... 137 Special Event Trigger (CCP) .................................... 137 TMR3H Register....................................................... 135 TMR3L Register ....................................................... 135 Timing Diagrams A/D Conversion ........................................................ 422 Acknowledge Sequence ........................................... 232 AFE Continuous Read.............................................. 452 AFE Data Ready Behavior ....................................... 455 AFE Data Ready Pulse............................................. 427 AFE Read/Write (SPI Mode 0,0) .............................. 451 AFE Read/Write (SPI Mode 1,1) .............................. 450 AFE Recommended Configuration Sequence.......... 453 AFE Serial Input ....................................................... 427 AFE Serial Output..................................................... 427 AFE Specific Diagrams............................................. 428 Asynchronous Reception.................................. 251, 267 Asynchronous Transmission ............................ 249, 265 Asynchronous Transmission (Back to Back) .......................................... 249, 265 Automatic Baud Rate Calculation............................. 247
S
SCK................................................................................... 195 SDI .................................................................................... 195 SDO .................................................................................. 195 SEC_IDLE Mode................................................................. 40 SEC_RUN Mode ................................................................. 36 Serial Clock, SCK ............................................................. 195 Serial Data In (SDI) ........................................................... 195 Serial Data Out (SDO) ...................................................... 195 Serial Peripheral Interface. See SPI Mode. SETF ................................................................................. 368 Slave Select (SS) .............................................................. 195 SLEEP .............................................................................. 369 Software Simulator (MPLAB SIM)..................................... 387 Special Event Trigger. See Compare (CCP Module). Special Features of the CPU ............................................ 319 SPI Mode (MSSP) Associated Registers ................................................ 203 Bus Mode Compatibility ............................................ 203 Effects of a Reset...................................................... 203 Enabling SPI I/O ....................................................... 199 Master Mode ............................................................. 200 Operation .................................................................. 198 Operation in Power-Managed Modes ....................... 203 Serial Clock............................................................... 195 Serial Data In ............................................................ 195 Serial Data Out ......................................................... 195 Slave Mode ............................................................... 201 Slave Select .............................................................. 195 Slave Select Synchronization ................................... 201 SPI Clock .................................................................. 200 Typical Connection ................................................... 199 SS ..................................................................................... 195 SSPOV.............................................................................. 229 SSPOV Status Flag .......................................................... 229 SSPSTAT Register R/W Bit.............................................................. 209, 211 Stack Full/Underflow Resets ............................................... 59 SUBFSR ........................................................................... 380 SUBFWB........................................................................... 369 SUBLW ............................................................................. 370 SUBULNK ......................................................................... 380 SUBWF ............................................................................. 370 SUBWFB........................................................................... 371 SWAPF ............................................................................. 371
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Auto-Wake-up Bit (WUE) During Normal Operation.............................................. 252 Auto-Wake-up Bit (WUE) During Sleep .................... 252 Baud Rate Generator with Clock Arbitration ............. 226 BRG Overflow Sequence .......................................... 247 BRG Reset Due to SDA Arbitration During Start Condition .................................................. 235 Bus Collision During a Repeated Start Condition (Case 1) ............................................ 236 Bus Collision During a Repeated Start Condition (Case 2) ............................................ 236 Bus Collision During a Start Condition (SCL = 0) .......................................................... 235 Bus Collision During a Stop Condition (Case 1) ............................................................ 237 Bus Collision During a Stop Condition (Case 2) ............................................................ 237 Bus Collision During Start Condition (SDA Only)........................................................ 234 Bus Collision for Transmit and Acknowledge............ 233 Capture/Compare/PWM............................................ 411 CLKO and I/O ........................................................... 408 Clock Synchronization .............................................. 219 Clock/Instruction Cycle ............................................... 60 EUSART/AUSART Synchronous Receive (Master/Slave)................................................... 420 EUSART/AUSART Synchronous Transmission (Master/Slave)................................................... 420 Example SPI Master Mode (CKE = 0) ...................... 412 Example SPI Master Mode (CKE = 1) ...................... 413 Example SPI Slave Mode (CKE = 0) ........................ 414 Example SPI Slave Mode (CKE = 1) ........................ 415 External Clock ........................................................... 406 Fail-Safe Clock Monitor (FSCM) ............................... 330 First Start Bit Timing ................................................. 227 I2C Bus Data ............................................................. 417 I2C Bus Start/Stop Bits.............................................. 416 I2C Master Mode (7 or 10-Bit Transmission) ............ 230 I2C Master Mode (7-Bit Reception) ........................... 231 I2C Slave Mode (10-Bit Reception, SEN = 0, ADMSK = 01001) .............................................. 216 I2C Slave Mode (10-Bit Reception, SEN = 0) ........... 215 I2C Slave Mode (10-Bit Reception, SEN = 1) ........... 221 I2C Slave Mode (10-Bit Transmission)...................... 217 I2C Slave Mode (7-Bit Reception, SEN = 0, ADMSK = 01011) .............................................. 213 I2C Slave Mode (7-Bit Reception, SEN = 0) ............. 212 I2C Slave Mode (7-Bit Reception, SEN = 1) ............. 220 I2C Slave Mode (7-Bit Transmission)........................ 214 I2C Slave Mode General Call Address Sequence (7 or 10-Bit Addressing Mode) .......................... 222 I2C Stop Condition Receive or Transmit Mode ......... 232 LCD Interrupt in Quarter Duty Cycle Drive................ 190 LCD Sleep Entry/Exit When SLPEN = 1 or CS1:CS0 = 00 ................................................... 191 MSSP I2C Bus Data .................................................. 418 MSSP I2C Bus Start/Stop Bits .................................. 418 PWM Output ............................................................. 163 Repeated Start Condition.......................................... 228 Reset, Watchdog Timer (WDT), Oscillator Start-up Timer (OST) and Power-up Timer (PWRT) ...... 409 Send Break Character Sequence ............................. 253 Slave Synchronization .............................................. 201 Slow Rise Time (MCLR Tied to VDD, VDD Rise > TPWRT) ............................................. 47 SPI Mode (Master Mode).......................................... 200 SPI Mode (Slave Mode, CKE = 0) ............................ 202 SPI Mode (Slave Mode, CKE = 1) ............................ 202 Synchronous Reception (Master Mode, SREN) ...................................................... 256, 270 Synchronous Transmission .............................. 254, 268 Synchronous Transmission (Through TXEN) ....................................... 255, 269 Time-out Sequence on Power-up (MCLR Not Tied to VDD), Case 1 ....................... 46 Time-out Sequence on Power-up (MCLR Not Tied to VDD), Case 2 ....................... 47 Time-out Sequence on Power-up (MCLR Tied to VDD, VDD Rise TPWRT) ............... 46 Timer Pulse Generation............................................ 154 Timer0 and Timer1 External Clock ........................... 410 Transition for Entry to Idle Mode................................. 40 Transition for Entry to SEC_RUN Mode ..................... 37 Transition for Entry to Sleep Mode ............................. 39 Transition for Two-Speed Start-up (INTRC to HSPLL)............................................ 328 Transition for Wake From Idle to Run Mode............... 40 Transition for Wake From Sleep (HSPLL) .................. 39 Transition From RC_RUN Mode to PRI_RUN Mode.................................................. 38 Transition From SEC_RUN Mode to PRI_RUN Mode (HSPLL) ................................... 37 Transition to RC_RUN Mode ...................................... 38 Type-A in 1/2 MUX, 1/2 Bias Drive ........................... 180 Type-A in 1/2 MUX, 1/3 Bias Drive ........................... 182 Type-A in 1/3 MUX, 1/2 Bias Drive ........................... 184 Type-A in 1/3 MUX, 1/3 Bias Drive ........................... 186 Type-A in 1/4 MUX, 1/3 Bias Drive ........................... 188 Type-A/Type-B in Static Drive .................................. 179 Type-B in 1/2 MUX, 1/2 Bias Drive ........................... 181 Type-B in 1/2 MUX, 1/3 Bias Drive ........................... 183 Type-B in 1/3 MUX, 1/2 Bias Drive ........................... 185 Type-B in 1/3 MUX, 1/3 Bias Drive ........................... 187 Type-B in 1/4 MUX, 1/3 Bias Drive ........................... 189 Timing Diagrams and Specifications A/D Conversion Requirements ................................. 422 Capture/Compare/PWM Requirements .................... 411 CLKO and I/O Requirements.................................... 408 EUSART/AUSART Synchronous Receive Requirements ................................................... 420 EUSART/AUSART Synchronous Transmission Requirements ................................................... 420 Example SPI Mode Requirements (Master Mode, CKE = 0)................................... 412 Example SPI Mode Requirements (Master Mode, CKE = 1)................................... 413 Example SPI Mode Requirements (Slave Mode, CKE = 0)..................................... 414 Example SPI Slave Mode Requirements (CKE = 1).......................................................... 415 External Clock Requirements ................................... 406 I2C Bus Data Requirements (Slave Mode) ............... 417 I2C Bus Start/Stop Bits Requirements |(Slave Mode)..... 416 Internal RC Accuracy (INTOSC and INTRC)............ 407 MSSP I2C Bus Data Requirements .......................... 419 MSSP I2C Bus Start/Stop Bits Requirements........... 418 PLL Clock ................................................................. 407
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Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements ......................................... 409 Timer0 and Timer1 External Clock Requirements ......................................... 410 Top-of-Stack Access ........................................................... 57 TSTFSZ ............................................................................ 374 Two-Speed Start-up .................................................. 319, 328 Two-Word Instructions Example Cases........................................................... 61
W
Watchdog Timer (WDT)............................................ 319, 325 Associated Registers................................................ 326 Control Register........................................................ 325 During Oscillator Failure ........................................... 329 Programming Considerations ................................... 325 WCOL ....................................................... 227, 228, 229, 232 WCOL Status Flag.................................... 227, 228, 229, 232 WWW Address ................................................................. 475 WWW, On-Line Support ....................................................... 7
V
VDDCORE/VCAP Pin............................................................ 327 Voltage Reference Specifications ..................................... 403 Voltage Regulator (On-Chip) ............................................ 327 Brown-out Reset (BOR) ............................................ 328 Low-Voltage Detection (LVD) ................................... 327 Operation in Sleep Mode .......................................... 328 Power-up Requirements ........................................... 328
X
XORLW ............................................................................ 374 XORWF ............................................................................ 375
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NOTES:
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THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives
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READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________
From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Literature Number: DS39979A FAX: (______) _________ - _________
Device: PIC18F87J72 Family Questions:
1. What are the best features of this document?
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PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package XXX Pattern Examples:
a) b) PIC18F87J72-I/PT 301 = Industrial temperature, TQFP package, QTP pattern #301. PIC18F87J72T-I/PT = Tape and reel, Industrial temperature, TQFP package.
Device(1,2)
PIC18F86J72, PIC18F86J72T PIC18F87J72, PIC18F87J72T I= -40C to +85C (Industrial)
Temperature Range Package Pattern
PT = TQFP (Thin Quad Flatpack) QTP, SQTP, Code or Special Requirements (blank otherwise) Note 1: F 2: T = Standard Voltage Range = In tape and reel
2010 Microchip Technology Inc.
Preliminary
DS39979A-page 479
WORLDWIDE SALES AND SERVICE
AMERICAS
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ASIA/PACIFIC
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ASIA/PACIFIC
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EUROPE
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01/05/10
DS39979A-page 480
Preliminary
2010 Microchip Technology Inc.


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